Panasonic TH-42PE30B User manual

© 2004 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-37PE30B
TH-42PE30B
GP6DE Chassis
Digital Progressive Plasma Television
Specifications
Power Source 220 V -240 V 50 Hz /60 Hz A.C.
Power Consumption
Normal use 253 W (TH-37PE30B), 323 W (TH-42PE30B)
Standby 1.8 W (TV only), 15.0 W (TV + DVB system set to record Timer programmes)
Power-OFF 1.0 W
Plasma Display panel
Drive method AC type
Aspect Ratio 16:9
Contrast Ratio 4000:1
Screen size (No.of pixels) 37-inch (TH-37PE30B)
818 mm (W) × 461 mm (H) × 939 mm (diagonal)
42-inch (TH-42PE30B)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal)
408,960 (852 (W) × 480 (H)) [2,556 × 480 dots ]
Sound
Speaker Woofer 80 mm × 2, Tweeter 16 mm × 73 mm × 8
Audio Output 26W[8W+8W,5W+5W]((10%THD)
Headphone M3 (3.5 mm) Jack × 1
Applicable signals
Colour System NTSC, PAL, PAL60, SECAM, Modified NTSC
Scanning format 525 (480) /60i 60p, 625 (575) /50i 50p
PC signals VGA display
VGA
SVGA, XGA, SXGA, UXGA ..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Receiving Systems/Band namePAL I
UHF E21 - 68.
ORDER NO. EXP0403007C2

1 Applicable signals 5
2 Safety Precautions 6
2.1. General Guidelines 6
2.2. Touch-Current Check 6
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 7
4 About lead free solder (PbF) 8
5 Service Hint 9
6 P.C.Board and Plasma panel replacement method 10
7 Location of Lead Wiring 15
7.1. Lead of Wiring (1) 15
7.2. Lead of wiring (2) 16
7.3. Lead of wiring (3) 17
7.4. Lead of wiring (4) 18
PAL 525/60 Playback of NTSC tape from some PAL Video recorders (VCR)
DVB Digital terrestrial services via UHF aerial input.
M.NTSC Playback from M.NTSC Video recorders (VCR)
NTSC (AV INPUT ONLY) Playback from NTSC Video recorders (VCR)
OUTPUT
AUDIO OUT AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
INPUT
AV3-Front VIDEO (RCA Pin Type × 2) 1.0 Vp-p (75 9)
S-VIDEO (MINI DIN 4-pin) Y: 1.0 Vp-p (75 9) C:0.286 Vp-p (75 9)
AUDIO L-R (RCA Pin Type × 2) 0.5 Vrms
AV4C-Rear Y1.0 Vp-p (including synchronization)
PB/PR±0.35 Vp-p
PC (HIGH-DENSITY D-SUB 15PIN) R, G, B/ 0.7 Vp-p (75 9)
HD, VD / 1.0 - 5.0 Vp-p (high impedance)
Others SD Card slot × 1, PC Card slot × 1
INPUT/OUTPUT
AV1-Rear 21 Pin terminal (Audio/Video in, TV out, RGB in)
AV2-Rear 21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, Q-Link)
AV4-Rear 21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, RGB in, Q-Link)
ANT-Rear UHF / VHF
Operating Conditions Temperature :0 ° - 40 °C
Humidity :20 % - 80 %RH (non-condensing)
Accessories Supplied
Operating Instructions TQBC0719-1
Mains Lead K2CT3DH00017
Remote Control Transmitter EUR7635010
Batteries 2×R6Size
Clamper TMME206 × 2
Ferrite core Large size × 2, Small size × 5
Dimensions ( W × H × D ) 1,040 mm × 697 mm × 139 mm (TH-37PE30B)
1,140 mm × 757 mm × 139 mm (TH-42PE30B)
Mass (Weight) 34.5 kg (TH-37PE30B)
41.0 kg (TH-42PE30B)
Notes:
·
· ·
· Design and specifications are subject to change without notice.Mass and dimensions shown are approximate.
·
· ·
· This equipment complies with the EMC standards listed below.
EN55013,EN61000-3-2,EN61000-3-3,EN55020.
CONTENTS Page Page
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TH-37PE30B / TH-42PE30B

7.5. Lead of wiring (5) 18
7.6. Lead of wiring (7) 19
8SelfCheck 20
8.1. Power LED Blinking timing chart 21
8.2. No Power 22
8.3. No Picture 23
8.4. Local screen failure 23
9 Service Mode Function 24
9.1. How to enter SERVICE 1 24
9.2. How to enter SERVICE 2 24
9.3. Option Description 26
10 CAT (Computer Aided Test) mode 28
10.1. IIC mode 28
10.2. CD mode 29
10.3. SD mode 29
10.4. IIC mode structure (following items value is sample data.)
30
11 Adjustment Procedure 31
11.1. +B Set-up 31
11.2. Driver Set-up 31
11.3. Initialization Pulse Adjust 32
11.4. P.C.B. (Printed Circuit Board) exchange 33
11.5. Adjustment Volume Location 33
11.6. Test Point Location 33
12 Alignment 34
12.1. Pedestal setting 34
12.2. PAL panel white balance 35
12.3. PC panel white balance 36
12.4. Sub brightness setting 37
12.5. ABL Level 37
13 Hotel mode 38
14 Conductor Views 39
14.1. PF-Board 39
14.2. P-Board 41
14.3. PA-Board 43
14.4. D-Board 45
14.5. DG-Board 47
14.6. H and T-Board 49
14.7. C1-Board (For TH-37PE30B) 51
14.8. C1-Board (For TH-42PE30B) 52
14.9. C2-Board (For TH-37PE30B) 53
14.10. C2-Board (For TH-42PE30B) 54
14.11. SC-Board 55
14.12. SU-Board (For TH-37PE30B) 58
14.13. SU-Board (For TH-42PE30B) 59
14.14. SD-Board (For TH-37PE30B) 60
14.15. SD-Board (For TH-42PE30B) 61
14.16. SS-Board 62
14.17. SS2, SS3, SS4 and SS5-Board 64
14.18. K and S-Board 65
14.19. G-Board 66
14.20. JG-Board 67
14.21. XV-Board 69
15 Block and Schematic Diagrams 71
15.1. Schematic Diagram Notes 71
15.2. Main Block Diagram 72
15.3. PF-Board Block Diagram 73
15.4. PF-Board Schematic Diagram 74
15.5. P-Board Block Diagram 75
15.6. P-Board Schematic Diagram 76
15.7. PA-Board Block Diagram 77
15.8. PA-Board (1 of 2) Schematic Diagram 78
15.9. PA-Board (2 of 2) Schematic Diagram 79
15.10. H and T-Board Block Diagram 80
15.11. H-Board (1 of 2) Schematic Diagram 81
15.12. H-Board (2 of 2) and T-Board Schematic Diagram 82
15.13. DG-Board (1 of 2) Block Diagram 83
15.14. DG-Board (2 of 2) Block Diagram 84
15.15. DG-Board (1 of 9) Schematic Diagram 85
15.16. DG-Board (2 of 9) Schematic Diagram 86
15.17. DG-Board (3 of 9) Schematic Diagram 87
15.18. DG-Board (4 of 9) Schematic Diagram 88
15.19. DG-Board (5 of 9) Schematic Diagram 89
15.20. DG-Board (6 of 9) Schematic Diagram 90
15.21. DG-Board (7 of 9) Schematic Diagram 91
15.22. DG-Board (8 of 9) Schematic Diagram 92
15.23. DG-Board (9 of 9) Schematic Diagram 93
15.24. D-Board Block Diagram 94
15.25. D-Board (1 of 12) Schematic Diagram 95
15.26. D-Board (2 of 12) Schematic Diagram 96
15.27. D-Board (3 of 12) Schematic Diagram 97
15.28. D-Board (4 of 12) Schematic Diagram 98
15.29. D-Board (5 of 12) Schematic Diagram 99
15.30. D-Board (6 of 12) Schematic Diagram 100
15.31. D-Board (7 of 12) Schematic Diagram 101
15.32. D-Board (8 of 12) Schematic Diagram 102
15.33. D-Board (9 of 12) Schematic Diagram 103
15.34. D-Board (10 of 12) Schematic Diagram 104
15.35. D-Board (11 of 12) Schematic Diagram 105
15.36. D-Board (12 of 12) Schematic Diagram 106
15.37. C1, C2, G and K-Board Block Diagram 107
15.38. C1-Board Schematic Diagram (TH-37PE30B) 108
15.39. C1-Board Schematic Diagram (TH-42PE30B) 109
15.40. C2-Board (1 of 2) Schematic Diagram (TH-37PE30B) 110
15.41. C2-Board (2 of 2) Schematic Diagram (TH-37PE30B) 111
15.42. C2-Board Schematic Diagram (TH-42PE30B) 112
15.43. G-Board Schematic Diagram 113
15.44. K-Board Schematic Diagram 114
15.45. SC-Board Block Diagram 115
15.46. SC-Board (1 of 3) Schematic Diagram 116
15.47. SC-Board (2 of 3) Schematic Diagram 117
15.48. SC-Board (3 of 3) Schematic Diagram 118
15.49. SU-Board Block Diagram 119
15.50. SU-Board Schematic Diagram (TH-37PE30B) 120
15.51. SU-Board Schematic Diagram (TH-42PE30B) 121
15.52. SD-Board Block Diagram 122
15.53. SD-Board Schematic Diagram (TH-37PE30B) 123
15.54. SD-Board Schematic Diagram (TH-42PE30B) 124
3
TH-37PE30B / TH-42PE30B

15.55. SS, S, SS2, SS3, SS4 and SS5-Board Block Diagram 125
15.56. SS-Board (1 of 2) and S-Board Schematic Diagram 126
15.57. SS-Board (2 of 2) SS2, SS3, SS4 and SS5-Board
Schematic Diagram 127
15.58. JG-Board Block Diagram 128
15.59. JG-Board (1 of 2) Schematic Diagram 129
15.60. JG-Board (2 of 2) Schematic Diagram 130
15.61. XV-Board Block Diagram 131
15.62. XV-Board (1 of 5) Schematic Diagram 132
15.63. XV-Board (2 of 5) Schematic Diagram 133
15.64. XV-Board (3 of 5) Schematic Diagram 134
15.65. XV-Board (4 of 5) Schematic Diagram 135
15.66. XV-Board (5 of 5) Schematic Diagram 136
16 Parts Location 137
17 Packing Exploded Views 138
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TH-37PE30B / TH-42PE30B

1 Applicable signals
5
TH-37PE30B / TH-42PE30B

2.2. Touch-Current Check
2 Safety Precautions
2.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3.Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reserve the AC plug in the AC outlet and repeat each of the above measure.
6.The potential at any point (TOUGH CURRENT) expressed as voltage U1and U2, does not exceed the following values:
For a. c.: U1= 35 V (peak) and U2= 0.35 V (peak);
For d. c.: U1=1.0V,
Note:
The limit value of U2= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
mA d. c.
The limit value U1= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
7.In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
Figure 1
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TH-37PE30B / TH-42PE30B

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-37PE30B / TH-42PE30B

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
8
TH-37PE30B / TH-42PE30B

Stand the unit used for pedestal.
Remove the Rear Cover.
Remove the AV Connector Cover.
Service position.
Board Name Function
C1 DATA DRIVER (RIGHT)
C2 DATA DRIVER (LEFT)
DDIGTAL SIGNAL PROCESS
DG DIGTAL CORE, MICOM
GFRONT TERMINAL, SWITCH
HREAR TERMINAL
JG SD CARD/PC CARD, JPEG I/F D/A
KLED, REMOTE, POWER SWITCH
PPOWER SUPPLY
PA DC/DC, AUDIO
PF LINE FILTER
SPOWER SWITCH
SC SCAN DRIVE
SD SCAN OUT (DOWN)
SS SUSTAIN DRIVE
SS2 SUSTAIN CONNECTION (UP)
SS3 SUSTAIN CONNECTION (DOWN)
SU SCAN OUT (UP)
TTUNER
XV DVB TUNER
5 Service Hint
9
TH-37PE30B / TH-42PE30B

n
nn
nTo replace the plasma panel (finished), place the unit on
the servicing stand, remove the front frame (finished), and
replace the panel, being careful not to scratch the plasma
panel surface.
1.Remove the rear cover and the AV connector cover.
2.Remove the P-Board.
a.Remove the couplers (P2, P5, P7, P9, P11, P12, P23,
P25, P27).
b.Remove the screws (×5) and remove the P-Board.
3.Remove the PA-Board.
a.Remove the couplers (PA1, PA2, PA3, PA4, PA5, PA6,
PA7, PA8, PA10A, PA12).
b.Remove the screws (×4 ) and remove the PA-Board
with the PA-Board Bracket.
c.Remove the screws (×6 ) and remove the PA-Board.
4.Remove the D-Board.
a.Disconnect the couplers (D3, D4, D6, D12, D22, D25)
and the flexible cables (D31, D32).
b.Remove the screws (×7) and remove the D-Board with
the bracket.
5.Remove the XV-Board.
6.Remove the DG-Board, the H-Board and the T-Board.
a.Remove the couplers (DG2, DG3, DG6, DG8, DG10,
DG12, H9), a flexible cable (DG7), and the screws (×5
).
b.Remove the DG-Board, the H-Board and the T-Board
with the bracket.
c.Remove the bridge connectors (DG1-H1, DG4-H4) and
remove the screws (×3 ) on the DG-Board.
d.Remove the DG-Board.
e.Remove the screws (×6 ) on the H-Board and the
screws (×2 ) on the T-Board bracket.
f.Remove the coupler (H10) and the antenna cable,
remove the T-Board with the T-Board bracket.
g.Remove the H-Board.
6 P.C.Board and Plasma panel replacement method
10
TH-37PE30B / TH-42PE30B

h.Remove the screws (×2) and remove the T-Board.
7.Remove the PF-Board.
a.Remove the couplers (PF2, PF10).
b.Remove the screws (×5 ), and remove the PF-Board
with the Bracket.
c.Remove the coupler (PF1) and remove the screws (×5
).
d.Remove the PF-Board.
8.Remove the SU-Board.
a.Remove the screws (×2).
b.Slide the SU-Board to the left and disconnect from the
couplers (SC41, SC42) on the SC-Board.
c.Remove the flexible cables (SU1, SU2, SU3) connected
to the SU-Board, and remove the SU-Board.
9.Remove the SD-Board.
a.Remove the screws (×2).
b.Slide the SD-Board to the left and disconnect from the
couplers (SC43, SC44) on the SC-Board.
11
TH-37PE30B / TH-42PE30B

c.Remove the flexible cables (SD1, SD2, SD3) connected
to the SD-Board, and remove the SD-Board.
10.Remove the SC-Board.
a.Remove the couplers (SC2, SC20, SC23), the screws
(×9) and remove the SC-Board.
11.Remove the SS2-Board.
a.Remove the coupler (SS47), and remove the flexible
cable (SS45).
b.Remove the screws (×2), and remove the SS2-Board.
12.Remove the SS3-Board.
a.Remove the coupler (SS40) and the flexible cable
(SS46).
b.Remove the screws (×2), and remove the SS3-Board.
12
TH-37PE30B / TH-42PE30B

13.Remove the SS-Board.
a.Remove the couplers (SS11, SS12, SS23, SS34), and
remove the flexible cables (SS40, SS47) on the SS3-
Board and SS2-Board.
b.Remove the flexible cables (SS41, SS42, SS43, SS44).
c.Remove the screws (×6), and remove the SS-Board.
14.Remove the C1-Board.
a.Remove the flexible cable holder fastening screws (×6)
and remove the flexible cables (CB1, CB2, CB3).
b.Remove the flexible cables (C11, C12) release the
speaker cables from the clampers (×2) on the C1-
Board.
c.Remove the screws (×4), and remove the C1-Board.
15.Remove the C2-Board.
a.Remove the flexible cable holder fastening screws (×8),
and remove the flexible cables (CB4, CB5, CB6, CB7).
b.Remove the couplers (C23, C24), a flexible cable (C21)
and release the speaker cables from the clamper on the
C2-Board.
c.Remove the screws (×4), and remove the C2-Board.
16.Remove the JG-Board and G-Board.
a.Remove the screws (×7) fixing the woofer speakers, the
interconnecting couplers (×4, to woofer and tweeter)
and remove the woofer speakers (right and left).
b.Disconnect a coupler (DG10), a flexible cable (DG7)
and the couplers of interconnecting connector (from
DG18 to G18 and H9 to G5).
c.Remove the screws (×5 ) and remove the JG-Board
and G-Board with the Bracket.
d.Remove the screws (×7 ) and remove the JG-Board
with Bracket.
e.Remove the screws (×2 ) and remove the Shield
case of JG-Board.
f.Remove the screws (×5) and remove the JG-Board.
13
TH-37PE30B / TH-42PE30B

g.Remove the screws (×2) and remove the G-Board.
17.Remove the Front frame (glass).
a.Remove the front frame and the plasma panel fastening
screws (×10 ), and remove the front frame and the
stand braket fastening screws(×6 ).
b.Release all cables from the clamper on the bracket of
the front frame.
c.For leaving the the plasma panel from the front frame,
pull the bottom of the front frame forward, lift, and
remove.
18.Remove stand brackets.
a.Remove the plasma panel section from the servicing
stand and lay on a surface such as a table (covered),
with the plasma panel surface facing downward.
Spread a soft cloth or similar on the table for protection,
so the panel surface is not scratched.
b.Remove the stand bracket (left, right) fastening screws
(×4 each) and remove the stand brackets (left, right).
19.Replace the plasma panel (finished).
a.Place the new plasma panel (finished) on the flat
surface of the table (covered by a soft cloth), with the
plasma panel surface facing downward.
b.Fit the stand brackets (left, right) to the new plasma
panel.
c.Place the plasma panel section on the servicing stand.
d.Attach the front frame and the each P.C.Board and so
on, to the new plasma panel.
* When fitting the front frame, be careful not to allow
any debris, dust or handling residues to remain
between the front glass and plasma panel.
14
TH-37PE30B / TH-42PE30B

7 Location of Lead Wiring
7.1. Lead of Wiring (1)
15
TH-37PE30B / TH-42PE30B

7.2. Lead of wiring (2)
16
TH-37PE30B / TH-42PE30B

7.3. Lead of wiring (3)
17
TH-37PE30B / TH-42PE30B

7.4. Lead of wiring (4)
7.5. Lead of wiring (5)
18
TH-37PE30B / TH-42PE30B

7.6. Lead of wiring (7)
19
TH-37PE30B / TH-42PE30B

8SelfCheck
1.Self-Check is used to automatically check the bus lines and hexadecimal code of the TV set.
2.To get into the Self -Check mode press the Down ( ) button on the customer controls at the front of the set, at the same
time pressing the Status button on the remote control, and the screen will show :
If the CCU ports have been ked and found to be incorrect or not located then “--” will appear in place of “O.K.”.
Display Ref.No Description P.C.B.
MEM IC1008 EEPROM DG-BOARD
GC2M IC1301 GROBAL CORE MAIN DG-BOARD
GC2P IC1304 GROBAL CORE SUB DG-BOARD
GC2S IC1302 GROBAL CORE 3D Comb DG-BOARD
GC2V IC1350 GROBAL CORE V Scalar DG-BOARD
HAD IC1851 HD-AD CONVERTER DG-BOARD
LSYNC IC2652 SYNC PROCESSOR H-BOARD
AVSW IC3200 AV switch H-BOARD
YUVSW IC1270 YUV switch DG-BOARD
Tun1 TNR001 TUNER 1 TU-BOARD
VIF --- --- ---
DAC1 IC3003 Ext. DAC DG-BOARD
MSP IC2002 Multi Sound Processor H-BOARD
SOUND IC2401 AUDIO AMP PA-BOARD
PANEL --- PANEL ---
JPEG IC60 JPEG I/F PG-BOARD
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TH-37PE30B / TH-42PE30B