Panasonic PT-52DL52 User manual

ORDERNO. ITD0210030C1
B02
DLP Technology-BasedProjection TV
PT-52DL52
LR2chassis
SPECIFICATIONS
Specification
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PowerSource: AC120 V, 60 Hz
PowerConsumption: Averageuse:310 W
Stand-bycondition:0.65 W (when cooling fan isstopped)
Display: 52-inch, 16 :9aspectratio
Screen Size: 45.31 "(1151 mm)(W)×25.49 "(647.5mm)(H)×52 "(1321 mm)(diagonal)
Sound:
Speaker 4 Speakers
Audio Output 30 W [15 W +15 W](10 %THD)
HIDLamp: 200 W HID(High IntensityDischarge)Lamp (recommended replacementperiod approximately
5000 hours)
Channel Capability-181: VHF-12 :UHF-56 :Cable-125
Accessories Supplied: Remotecontrol Transmitter EUR7603Z70
R6(AA)Battery×2
RGBcable:K1HA30DA0003
DIGITAL INcable:K1HA24DA0005
Inputsignals: RGBinput D-SUB 15pin Analog RGB
AVINPUT1-4 VIDEO 1.0Vp-p (75 )
(RCAPin Jack Type)
S-VIDEO Y:1Vp-p (75 ), C:0.286 Vp-p (75
)
(notsupplied forAVINPUT3)
(Mini DIN4pin)
AUDIOL-R 0.5Vrms
(RCAPin Jack Type×2)
COMPONENTVIDEO Y 1.0Vp-p (including synchronization)
INPUT1-2 PB/PR±0.35 Vp-p
AUDIOL-R 0.5Vrms
(RCAPin Jack Type×2)
DIGITAL INPUT DVI 1.0 24 pin
AUDIOL-R 0.5Vrms
(RCAPin Jack Type×2)
Outputsignals: AVPROG. OUT VIDEO 1.0Vp-p (75 )
(RCAPin Jack TYPE)
S-VIDEO Y:1Vp-p (75 ), C:0.286 Vp-p (75
)
(Mini DIN4pin)
AUDIOL-R 0.5Vrms
(RCAPin Jack Type×2)
Dimensions(W×D×H): 47.7"(1211 mm)×17.7"(450 mm)×39.2"(995 mm)
Weight(Mass): 108 lbs. (49 kg)Net
Note:
Design and Specificationsaresubjecttochangewithoutnotice. Weightand Dimensionsshownare
approximate.
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TrademarkAcknowledgements:
-DLPand DMDareregistered trademarks oftheTexas Instruments.
-VGAand XGAaretrademarks ofInternational Business Machines Corporation.
-S-VGAisaregistered trademarkoftheVideo Electronics StandardsAssociation.
All othertrademarks arethepropertyofthevarioustrademarkowners.
1. SafetyPrecautions
1.1. General Guidelines
1. Itisadvisabletoinsertanisolation transformerintheACpower
linebeforeservicing ahotchassis.
2. Whenservicing, observetheoriginal leaddress, especiallythe
leaddress inthehigh voltagecircuits. Ifashortcircuitisfound,
replace all parts whichhavebeenoverheatedordamagedbythe
shortcircuit.
3. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papers, shields, and isolation R-C
combinations, areproperlyinstalled.
4. Beforeswitching thepoweron, measuretheresistance betweenB
+lineand coldsidechassisground. Connect the“-”sideofan
ohmmetertotheB+ line, and the“+”sidetochassisground. Each
linemust havemoreresistance valuethanthespecifiedoneas
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follows:
B+line Minimum
Resistance
+31.2±1.5V (PA-Board :L844) 10k
+17.5±1.5V (PA-Board :L854) 10k
-17.5±1.5V (PA-Board :L853) 10k
+2.5±0.5V (DG-Board :
TP9101) 1k
+3.3±0.5V (DG-Board :
TP9102) 1k
+3.3±0.5V (DG-Board :
TP9104) 1k
+2.5±0.5V (DG-Board :
TP9105) 1k
5. Whentheset isnotusedforalong period oftime, unplug theAC
powercordplug fromtheAClineoutlet.
6. Afterservicing make thefollowing leakagecurrentchecks to
preventthecustomerfromdangerouselectrical shock.
1.2. LeakageCurrentColdCheck
1. Unplug theACpowercordand shortbetweenthetwoprongsof
theACplug withajumperwire.
2. Set thepowerswitchofthisset toONposition.
3. Measuretheresistance valuewithanohmmeterbetweenthe
shortedACplug and eachexposedmetallicpartoftheset cabinet
suchas screwheads, connectors, and control shafts. Whenthe
exposedmetallicparthas areturnpathtothechassis,thereading
shouldbemorethan4M .
Whentheexposedmetal partdoes nothaveareturnpathtothe
chassis, thereading must beinfinity.
1.3. LeakageCurrentHotCheck (See Fig. 1 )
1. Plug theACpowercorddirectlyintotheAClineoutlet. Donotuse
anisolation transformerforthischeck.
2. Connect themeasuring circuitas shownin Fig. 1 . betweeneach
exposedmetallicpartoftheset and anearthground suchas a
waterpipe.
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3. Use ahigh impedance ACvoltagemetertomeasurethevoltage
across theresistor.
4. Measurethevoltageat eachexposedmetallicpart.
5. Reverse theACplug inserting direction at theAClineoutlet and
repeat eachoftheabovemeasurements.
6. Thevoltageat anypointmust beless than0.25Vrms.
7. Aleakagecurrenttester(SIMPSONMODEL228 ortheequivalent)
maybeusedtomake thehotchecks. Inthiscase, thecurrentmust
beless than500 A.
8. Ifthereading ismorethantheabovevalue, theset must be
repairedand recheckedbeforeitisreturnedtothecustomer
because ofapossibilityofanelectrical shock.
1.4. Hot-Check Circuit
Preparethemeasuring circuitas shownin Fig. 1 .
Besuretouse avoltmeterhaving theperformance describedinTable1.
Fig. 1
Table1 Performance
Voltmeter
(rmsreading) Accuracy: 2%
Inputresistance: 1M
Inputcapacitance: 200pF
Frequency range:15Hzto1MHz
1.5. LampPrecautions
-Besuretounplug thepowercordfromthepoweroutlet when
replacing thelamp.
-Because thelampreaches averyhigh temperatureduring its
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operation, waituntil itcoolscompletelywhenreplacing thelamp.
-Thelampemits small amounts ofUV-radiation, avoiddiredt-eye
contact withthelight.
2. Functions forSafety
2.1. TemperatureDetection fortheLampUnit
Thisprojector has thebimetal contacting thelampunittoprojectthelamp. Ifthetemperatureof
thelampunitexceeds100°C, thebimetal will operatetoturn off thepower.
Theinstalledposition ofthebimetal isshownintheillustration.
Torecoverthebimetal from itsoff state, press theprotrusion ofthebimetal unityou hearitclick.
2.2. Interlock Switch
Toensuresafety, thisprojection TV isdesignedsothatthepowercannotbeturnedon without
theLampUnitCoveror underitsimperfectinstallation.
Ifremoving theLampUnitCoverduring theoperation oftheProjection TV, thepowerwill be
turnedoff.
3. About lead free solder(PbF)
Note:Leadislistedas (Pb)intheperiodictableofelements.
Intheinformation below, Pbwill refertoLeadsolder, and PbF will refertoLeadFree Solder.
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TheLeadFree Solderusedinour manufacturing process and discussedbelowis(Sn+Ag+Cu).
ThatisTin(Sn), Silver(Ag)and (Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues.
For service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsolder
may beused.
PCBsmanufacturedusing leadfree solderwill have thePbF withinaleafSymbol
stampedon theback ofPCB.
Caution
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30~40~C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C).
Ifyou must use Pbsolder, please completelyremoveall ofthePb
free solderon thepinsorsolderarea beforeapplying Pbsolder. If
thisisnotpractical, besuretoheat thePbfree solderuntil itmelts,
beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side. (see figurebelow)
SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
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4. ChassisBoardLayout
ChassisBlock
Board Name Function
A-Board Tuner, Audio
DG-Board MPU, GC, AMDP,
EEPROM
G-Board FrontTerminal
H-Board RearTerminal, AV SW
PA-Board Power
PB-Board Ballast
J-Board Digital in
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Control Block
Board Name Function
K-Board PowerSW, LED
V-Board FrontOperation
Optical Block
Board Name Function
L-Board DMD
S-Board Interlock SW
5. Location of Lead Wiring
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6. DisassembleforService
Frontand RearviewoftheCabinet
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General viewoftheOptical &ChassisBlock (OneBlock)
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6.1. Removal ofRearCover
Toaccess theOptical &ChassisBlock, remove RearCoverand ShieldPlate.
Note:
Whentheservicing thisPTV, TheLeft and RightCoverdose notneedtoberemovedunless the
speakersneedstoservice.
Removal ofRearCover.
Remove 15 screws.
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6.2. Removal ofFrontDecorativeSpeakerGrille
TheSpeakerGrilleisfastend tothePTV withhooks.
Romove theSpeakerGrilletoaccess theOptical Block, LampUnit, Control Panel and Projection
Screenremoval.
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6.3. Removal ofScreenFrameAssay
1. Remove7screwsat thetop and sideinrearside.
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2. RemovetheDecorativeSpeakerGrille.
3. Remove4screwsat bottomoftheScreeninfrontside.
4. RemovetheScreenFrameAssay.
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6.4. Projection ScreenAssembly
Theprojection screenunitconsistsScreenFrame, LenticularScreenand Fresnel Screen.
See theassembleas following figure.
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TofixthescreenstoScreenFrame, fixthescrewswiththesupportbraketsinorderthenumber
above.
6.5. Removal ofTop ShieldPlates
1. RemoveRearCover.
2. Remove11 screws.
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3. Lift up Top ShieldPlate alittleand pull forwardat topside. (There
are2hooks.)
4. Rotate theShieldPlate using thebothsidehooks as afulcrum.
5. RemoveTop ShieldPlate.
Note:
WhenassembletheTop shieldPlate, tightentwoscrew(A)atfirst.
6.6. Removal ofRightsideShieldPlate
1. RemoveRearcover.
2. Remove2screws.
3. Lift up RightsideShieldplate and pull forward.
4. RemoveACpowercablefromclampersat RightsideShieldPlate.
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Note:
DonotdisconnectACpowercablefrom Chassis.
6.7. Removal ofAVTerminal ShieldPlate
1. RemovetheRearCoverand Top ShieldPanel.
2. RemoveDVI Flat CablefromDG Board.
Note:
Whenassembling, confirm thefoil sideofFlatcableand insertcorrectly.
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