Panasonic PT53TW53G - 53" PROJECTION TV HD User manual

MTNC030835A1
B19 Canada:B02
HDTVMonitor
PT-53TW53G / PT-56TW53G
P8
Please fileand use thismanual togetherwiththeservice manual for
PT-53WX53G ordernumberMTNC030518C1.
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1. Safetyprecautions
General guidelines
Anisolation transformershouldalways beusedduring theservicing ofareceiverwhose chassis
isnotisolatedfrom ACpowerline. Use atransformerofadequatepowerrating as thisprotects
thetechnicianfrom accidentsresulting inpersonal injuryfrom electrical shocks. Itwill also
protectthereceiverfrom being damagedbyaccidental shorting thatmay occur during servicing.
Whenservicing, observe theoriginal leaddress, especiallyinthehigh voltagecircuit. Replace all
damagedparts(alsopartsthatshowsignsofoverheating.)
Always replace protective devices, suchas fishpaper, isolation resistorsand capacitors, and
shieldsafterservicing thereceiver. Use onlymanufacturer’srecommendedrating for fuses,
circuitsbreakers, etc.
High potentialsarepresentwhenthisreceiverisoperating. Operation ofthereceiverwithoutthe
rearcoverintroduces dangerfor electrical shock. Servicing shouldnotbeperformedbyanyone
who isnotthoroughlyfamiliarwiththenecessaryprecautionswhenservicing high voltage
equipment.
Extremecareshouldbepracticedwhenhandling thepicturetube. Rough handling may cause it
toimplodeduetoatmosphericpressure. (14.7lbspersq. in.). Donotnick or scratchtheglass or
subjectittoanyunduepressure. Whenhandling, usesafetygoggles and heavy gloves for
protection. Dischargethepicturetubebyshorting theanodetochassisground (nottothe
cabinetor toothermounting hardware). Whendischarging connectcoldground (i.e. dagground
lead)totheanodewithawellinsulatedwireor use agrounding probe.Avoidprolongedexposure
atclose rangetounshieldedareas ofthepicturetubetopreventexposuretoxray radiation.
Thetestpicturetubeusedfor servicing thechassisatthebenchshouldincorporatesafetyglass
and magneticshielding. Thesafetyglass provideshielding for thetubeviewing area againstx
ray radiation as well as implosion. Themagneticshieldlimitsthexray radiation around thebell of
thepicturetubeinaddition totherestricting magneticeffects. Whenusing apicturetubetestjig
for service, ensurethatthejigiscapableofhandling 50kV withoutcausing xray radiation.
Beforereturning aservicedreceivertotheowner, theservice technicianmustthoroughlytest
theunittoensurethatiscompletelysafetooperate. Donotuse alineisolation transformerwhen
testing.
Leakagecurrentcoldcheck
Unplug theA.C. cord and connectajumperbetweenthetwoplug prongs.Measuretheresistance
betweenthejumperedACplug and expose metallicpartssuchas screwheads, antenna
terminals, control shafts, etc. Iftheexposedmetallicparthas areturnpathtothechassis, the
reading shouldbebetween240k and 5.2M . Iftheexposedmetallicpartdoes nothave a
return pathtothechassis, thereading shouldbeinfinite.
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Leakagecurrenthotcheck
Plug theACcord directlyintotheACoutlet. Donotuse anisolation transformerduring thecheck.
Connecta1.5k 10 watt resistor inparallel witha0.15 Fcapacitor betweenanexposed
metallicpartand ground. Use earthground, for exampleawaterpipe.
Using aDVMwitha1000 ohms/voltsensitivityor higher, measuretheACpotential across the
resistor.
Repeattheprocedureand measurethevoltagepresentwithall otherexposedmetallicparts.
Verifythatanypotential does notexceed0.75 voltRMS. Aleakagecurrenttester(sucha
Simpson model 229, Sencoremodel PR57 or equivalent) may beusedintheabove procedure, in
whichcase anycurrentmeasuremustnotexceed0.5milliampere.Ifanymeasurementisoutof
thespecifiedlimits, thereisapossibilityofashock hazard and thereceivermustberepairedand
recheckedbeforeitisreturnedtothecustomer.
Hotcheck circuit
Insulation test
Connectaninsulation testerbetweenanexposedmetallicpartand A.C. line. Apply1080VAC/
60Hzfor 1second. Confirm thatthecurrentmeasurementis0.5mA~2.0mA. Repeattestwith
othermetallicexposedparts.
X ray radiation
WARNING
Thepotential source ofxray radiation inthePTV setisinthehigh voltagesection and the
picturetube.
NOTE
Itisimportanttouse anaccurate, calibratedhigh voltagemeter.
Applyall black videosignals(1080i)and confirm high voltagemeasures 31.5±1.0kV. Ifthehigh
voltageisnotwithintherange, changeC514 to1800pF, 2000pF, 2400pF or 2700pF until the
desiredvalueisobtained.ApplyNTSCwhitepattern and confirm thehigh voltagemeasures 30.1±
1.5kV. ApplyHD 1080i whitepattern and confirm thehigh voltagemeasures 30.1±1.5kV.
3

2. About lead free solder(PbF)
NOTE
Leadislistedas (Pb)intheperiodictableofelements. / Intheinformation below, Pbwill referto
leadsolder, and PbF will refertoLeadFree Solder. / Theleadfree solderusedinour
manufacturing process and discussedbelowis(Sn+Ag+Cu). / ThatisTin(Sn), Silver(Ag)and
Copper(Cu)although othertypes areavailable.
Thismodel uses PbFree solderinit’smanufactureduetoenvironmental conservation issues. For
/ service and repairwork, we’dsuggesttheuse ofPbfree solderas well, although Pbsoldermay
be/ used. / PCBsmanufacturedusing leadfree solderwill have the“PbF”or aleafsymbol
stampedon the/ back ofPCB.
CAUTION
-Pbfree solderhas ahighermelting pointthanstandardsolder.
Typicallythemelting pointis50 ~70 °F(30 ~40 °C)higher. Please
use ahigh temperaturesoldering iron and set itto700 ±20 °F(370
±10 °C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about1100
°For600 °C). / Ifyou must use Pbsolder, please completely
removeall ofthePbfree solderon thepinsorsolderarea before
applying Pbsolder. Ifthisisnotpractical, besuretoheat thePb
free solderuntil itmelts, beforeapplying Pbsolder.
-Afterapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess solderwhichmayflow ontothe
opposite side.
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SuggestedPbfree solder
Thereareseveral kindsofPbfree solderavailablefor purchase. Thisproductuses Sn+Ag+Cu
(tin, silver, copper)solder. However, Sn+Cu(tin, copper), Sn+Zn+Bi (tin, zinc, bismuth)soldercan
alsobeused.
3. Important safetytests
Measuring H.V.
TheanodecapsarecementedtotheCRTs. Togainaccess for high voltagemeasurement,
remove theredCRT’sanodeleadfrom theflyback transformerdistributor. Grasptheanodelead
protective capatitsbottom and squeezeitagainstthelocking capbodyinside, rotate1/4turn
counterclockwise and pull theanodeleadsleeve outoftheFBTdistributor. Connectahigh
voltagepositive leadfrom your H.V. metertotheFBTdistributor, and thecommon negative lead
tocoldground
FBTleadsremoval
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Note:
ReinserttheanodeleadintotheFBTdistributor until itistightlyand fullyseated. Turn the
locking capclockwise tolock inplace.
(EHT)Protector operation check
Withthecabinetback removed, applyanominal 120V A.C. tothePTV.
Overvoltagetest
Preparation:
1. TurnPTV“OFF”
2. Connect aNTSCsignal generatortotheantennaterminal.
3. Connect DVMpositiveleadtoD31 pin2and negativeleadtoD31
pin1on D-Board H.V. measurement
4. Connect aH.V. meter(statictype, class 0.1) withhigh voltage
leadstohigh voltagedistributoron FBT.
DVMand powersupplyconnection
5. Connect the15 ~25 VDC variablepowersupplypositiveleadto
D34 orIC802 pin2(DBoard)and negativeleadtoheat sinkof
Q551 orD825
Procedures:
1. ApplyaNTSCwhite pattern.
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2. TurnPTVON.
3. Adjust thepictureorbrightness controlssothat theDVMreads
12.4±0.4volts.
4. Increase thevariablepowersupplyuntil set turnsoff. Theset
shouldturnoff at 12.4±0.4volts (DVM)and high voltageless than
36.4kV.
5. IftheDVMreading isotherthan12.4±0.4volts, readjust pictureor
brightness control and repeat steps3.
6. Turnoff thevariablesupplyand confirm that theset will turnon
withtheremote control.
4. Service notes
NOTE
These componentsareaffixedwithglue. Becareful nottobreak or damageanyfoil underthe
componentor atthepinsoftheICswhenremoving. Usuallyapplying heattothecomponentfor a
shorttimewhiletwisting withtweezerswill break thecomponentloose.
Leadless chipcomponent(surface mount)
Chipcomponentsmustbereplacedwithidentical chipsduetocritical foil track spacing. There
areno holes intheboard tomountstandard transistorsor diodes. Somechipscapacitor or
resistor board solderpadsmay have holes through theboard,howevertheholediameterlimits
standard resistor replacementto1/8watt. Standard capacitor may alsobelimitedfor thesame
reason. Itisrecommendedthatidentical componentsbeused.
Chipresistor have athree digitnumerical resistance code, 1stand 2nd significantdigitsand a
multiplier. Example:162 =1600 or 1.6k resistor, 0=0 (jumper).
Chipcapacitorsgenerallydo nothave thevalueindicatedon thecapacitor. Thecolor ofthe
componentindicates thegeneral rangeofthecapacitance.
Chiptransistorsareidentifiedbyatwolettercode. Thefirstletterindicates thetypeand the
second letter, thegradeoftransistor.
Chipdiodes have atwoletteridentification codeas perthecodechartand areadual diodepack
witheithercommon anodeor common cathode. Check thepartslistfor correctdiodenumber.
Componentremoval
1. Use solderwick toremovesolderfromcomponentend capsor
terminal.
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2. Withoutpulling up, carefullytwist thecomponentwithtweezersto
break theadhesive.
3. Donotreuse removedleadless orchipcomponents since theyare
subject tostress fractureduring removal.
Chipcomponentinstallation
1. Putasmall amountofsolderon theboardsoldering pads.
2. Holdthechipcomponentagainst thesoldering padswithtweezers
orwithaminiaturealligatorclipand applyheat tothepadarea
witha30 watt iron until solderflows. Donotapplyheat formore
than3seconds.
Howtoreplace flatic(requiredtools)
1. Removethesolderfromall ofthepinsofaFlat ICbyusing a
desolderbraid
2. Puttheiron wireunderthepinsoftheFlat ICand pull itinthe
direction indicatedwhileheating thepinsusing asoldering iron. A
small awl canbeusedinsteadoftheiron wire.
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3. Removethesolderfromall thepadsoftheFlat ICbyusing ade
solderbraid
4. Position thenew Flat ICinplace (applythepinsoftheFlat ICto
thesoldering padswherethepinsneedtobesoldered). Properly
determinethepositionsofthesoldering padsand pinsby
correctlyaligning thepolaritysymbol
5. Solderall pinstothesoldering padsusing afinetippedsoldering
iron
6. Check withamagnifierforsolderbridgebetweenthepinsorfor
dryjointbetweenpinsand soldering pads. To removeasolder
bridge, use adesolderbraidas showninthefigurebelow
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IMPORTANT
To protect against possibledamagetothesolidstate devices dueto
arcing orstaticdischarge, make certainthat all ground wires are
securelyconnected
CAUTION
Thepowersupplycircuitisaboveearthground and thechassis
cannotbepolarized. Use anisolation transformerwhenservicing
thereceivertoavoiddamagetothetest equipmentortothe
chassis. Connect thetest equipmenttotheproperground(HOTor
COLD)whenservicing, orincorrect voltages will bemeasured.
WARNING
Thisreceiverhas beendesignedtomeet orexceedapplicablesafety
and xrayradiation protection as specifiedbygovernmentagencies
and independenttesting laboratories.
To maintainoriginal product safetydesign standardsrelativetox
rayradiation and shock and firehazard, parts indicatedwiththe
symbol on theschematicmust bereplacedwithidentical parts.
Orderparts fromthemanufacturer’sparts centerusing theparts
numbersshowninthisservice manual, orprovidethechassis
numberand thepartreference number.
Foroptimumperformance and reliability, all otherparts shouldbe
replacedwithcomponents ofidentical specification.
5. PTVLocation of controls
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6. Receiverfeaturetable
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FEATURE/MODEL PT-53TW53G/ PT-56TW53G
CHASSIS AP827
MICRO 256K
MENU LANGUAGE ENG/SPAN/FR
CLOSE CAPTION X
V-CHIP (USA/CANADA X
CHANNELINFOBANNER X
VIDEOINPUTSKIP SKIP
CHANNELCOUNT 181
PIP (1T), 2TPIP (2T), 2TSPLIT 2TSPLIT
2RF X
REMOTE CONTROL(W/LIGHT) EUR7603Z90
CRTSUPPLIER MDDA(CENTAUR)
SCREEN W/PROTSCREEN
CHASSIS P8W
COMBFILTER MOTIONADP, 3DY/C
HEC/VEC(X=BOTH) X
NEWYNR X
VM X (DIGITAL)
V/ANORM(X=BOTH) X
COLORTEMP X
AIP X
PRESET/INPUTLABELING X
VIDEOPICTURE MEMORY X
DIGITALSCANRATE 1080i, 480p
NTSCLINE DOUBLER 480pPROGRESSIVE (NEW)
MTS/SAP/DBX X
BUILT-INAUDIOPOWER 60W
No. OFSPEAKERS 6
BASS/BALANCE/TREBLE
CONTROL X
AISOUND X
SURROUND X
SPATIALIZER/BBE BBE
A/V IN(REAR/FRONT) 4(3/1)
A/V PROGRAMOUT X
AUDIOOUT(FAO:F, VAO:V) F, V
COMPONENTINPUT(Y, Pb, Pr) 2
S-VHS INPUT(REAR/FRONT) 2/1
HDMI/HDCP INPUT DVI/HDCP
Note:
Specificationsaresubjecttochangewithoutnotice or obligation.
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7. Boarddescription table
BOARD PARTNUMBER DESCRIPTION
A-BOARD TNP2AH045AA MAINCHASSIS
D-BOARD TNP2AH046 POWERSUPPLY
*DC-BOARD TNP2AA120 CONVERGENCE CIRCUIT
*DV-BOARD TNP2AA114 DVIBOARD
*DG-BOARD TNP2AA126 PIP PROCESSING, SPLIT, SEARCH,
FORMATS
LB-BOARD TNP2AA147 BLUE PRT
LR-BOARD TNP2AA145 REDPRT
LG-BOARD TNP2AA146 GREENPRT
K-BOARD TNP2AA138 FRONTKEYBOARD
G-BOARD TNP2AA137 FRONTA/V BOARD
R-BOARD TNPA0615AB IRBOARD
NOTE
Whenordering areplacementboard assembly, append an“S”totheboard number
EXAMPLE
ToordertheABoard, thereplacementboard isTNP2AH045AAS
*NOTE
TheDC-Board, DG-Board and DV-Board arenon-serviceableboards, exceptfor DV-Board audio
connector and DVIconnector. Ifanyofthese boardsor DV-Board componentsaredefective,
replace itwithanewone.
8. Disassemblyforservice
NOTE:
Board ground wires may have tobedisconnectedtodisassemblesomeboards. All ground wires
mustbereconnectedusing jumperleads, ifnecessary, beforepowerisappliedtoPTV for service.
Speakergrilleremoval
Thespeakergrille, itissecuredtothecabinetofthePTV. Grippanel from thesides and middle
upperpart, gentlypull forward toremove. Whenreassembling, make certaintofirmlypress on
thepanel wheretheinsertion points(6)arelocated,oneateachcornerand oneatthemiddletop
and bottom
Speakergrilleremoval (may vary)
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Speakersreplacement
1. Removethespeakergrille.
2. Eachspeakerissecuredtothecabinet with(4) screws.
3. Disconnect theRand Lspeakerleadconnectorsfromthespeaker
units.
Keyboard and frontA/V inputsremoval
1. Removethespeakergrille.
2. Removetheplasticframebyremoving thescrewsaround the
lowerspeakersarea. Unpplug theconnectorsfromKand G board.
3. Unplug theconnectorsfromthekeyboardand frontA/Vinputs
assemblies. Removethescrewsaffixing thekeyboardtothe
plasticframe;thefrontfrontA/Vinputs arelocatedscrewdon the
left sideoftheplasticframe.
Plasticframe
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Frontcabinetremoval
1. Removethespeakergrille.
2. Removetheplasticframebyremoving thescrewsaround the
lowerspeakerareas.
3. Removethescrewsfromthefrontcabinet locatedon thefront
bottom.
4. Removeall thescrewsfromtheback cabinet that holdsthefront
cabinet (top and sides).
Back lowercoverremoval
1. Removeall thescrewsaround theperimeter, markedwitharrows.
Back lowercabinetremoval
Back cabinetremoval
1. Removethespeakergrille.
2. Removetheplasticframebyremoving thescrewsaround the
lowerspeakerareas.
3. Removethescrewsfromthefrontcabinet locatedon thelower
side.
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4. Removeall thescrewsfromtheback cabinet that holdsthefront
cabinet (top and sides).
5. Removetheback lowercover
6. Removeall thescrewsfromthelowersides oftheback cabinet.
Mirror removal
Themirror isattachedinsidetheback cabinetcover. Carefullyremove thecabinetcoverto
access itsinterior surface and remove thescrewssecuring thebracketsthatholdthemirror at
thetop and sides tothemirror.
Mirror removal
Screenassembly
1. Removethefrontcabinet. See frontcabinet removal procedure
above.
2. Place screenframeface downon asoft surface.
3. Removeall screenbrackets
Note:
Thebracketsarepaintedblack (permanentmarker)on theedgetopreventreflection on image.
Screenassembly
16

Note:
TheProtective and lenticularscreensareinonescreen(Protective lenticular)
Mainchassisblock
1. Removetheback lowercabinet cover.
2. Themainchassisblock issecuredtothecabinet byscrewsat
front, behind theSpeakerGrill and insideon thebottomofthe
optical frame).
3. Removethehorizontal barrierpanel at theback ofthecabinet.
4. Unplug connectors(keyboard, frontA/Vand speakerconnectors)
and pull outthemainchassisblock.
Chassisremoval
17

8.1. Chassisassembly
Thechassisassemblyshowninfigureincludes all theelectrical and optical (lightbox)
components
Chassisfrontview
A-Board
1. A-Boardissecuredtothechassistraywithfivescrews.
2. TheA-BoardismatedtotheD-Boardbyfourflexibleconnectors
(malesideofconnectors):A1, A2, A3&A4. To removethisboard,
unplug theconnectorson theA-Boardpulling fromthesides of
eachconnector.
NOTE:
Sometiewrapsthatsecurethewiredressingsmay needtobeunfastenedfor chassisremoval.
18

D-Board
1. D-Boardissecuredtothechassistraywithfivescrews.
2. TheD-BoardismatedtotheA-Boardbyfourconnectors(female
sideofconnectors):D1, D2, D3&D4. To removethisboard,
unplug theconnectorson theA-Boardpulling fromthesides of
eachconnector.
NOTE:
Sometie-wrapsthatsecurethewiredressingsmay needtobeunfastenedfor chassisremoval.
DG-Board
1. PlugsontotheD-Boardat theA16, A17 and A18 (DG1, DG2and
DG3respectively)connectors.
NOTE:
Thisboard isnon-serviceable. / Whenremoving thisboard pull carefully.
DV-Board
1. PlugsontotheA-Boardat theA5(DV1) connectors.
2. Thisboardhas twoGrommet squares, becareful todo notscrew
too tight, otherwise thisgrommet screw holewill get stripped.
19

NOTE:
Thisboard isnon-serviceable. Exceptfor JK002 (DVIAUDIOCONNECTOR) and JK002 (DVI
CONNECTOR) / Whenremoving thisboard pull carefully.
DC-Board
1. PlugsontotheD-Boardat theD21, D22 and D23 (DC1, DC2and
DC3respectively)connectors.
NOTE:
Thisboard isnon-serviceable. / Whenremoving thisboard pull carefully.
R-Board
1. Thisboardissecuredtotheupperfrontsideofthelightboxby
onescrew, and pluggedtoR1connectorfromA51 on A-Board
LR, LGand LBBoard
1. Eachboardispluggedintothesocket on thePRTneck, LR-Board
on redPRT, LG-Boardon greenPRTand LB-Boardon bluePRT.
8.2. DisassemblyforCRTreplacement
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