Panasonic SA-HT740GCP User manual

lGeneral
Power Source:
A
C 110V-127V/ 220V-240V,
50/ 60Hz
Power consumption: 155 W
Dimensions (W×H×D): 430×70×439.2 mm
Mass: 5kg
lAmplifier section
RMS Output Power: Dolby Digital Mode
lTotal RMS Dolby Digital
mode Power: 1000 W
At 1kHz and total harmonic of 10%
lFront: 90 W/ Channel (4Ω)
lCenter: 320 W/ Channel (4Ω)
lSurround: 90 W/ Channel (4Ω)
At 100Hz and total harmonic of 10%
lSubwoofer: 320 W/ Channel (4Ω)
PMPO Output Power: 7500W
DIN Output Power: Dolby Digital Mode
lTotal DIN Dolby Digital
mode Power 740 W
At 1kHz and total harmonic of 1%
lFront: 65 W/ Channel (4Ω)
lCenter: 240 W/ Channel (4Ω)
©2006 Panasonic AVC Networks Singapore Pte.
Ltd. All rights reserved. Unauthorized copying and
distribution is a violation of law.
SA-HT740GCP
Colour
(S).......................Silver Type
lSurround: 65 W/ Channel (4Ω)
At 100Hz and total harmonic of 1%
lSubwoofer: 240 W/ Channel (4Ω)
DIN Output Power Stereo Mode
lTotal DIN Stereo mode
Power 360 W
At 1kHz and total harmonic of 1%
lFront: 60 W/ Channel (4Ω)
At 100Hz and total harmonic of 1%
lSubwoofer: 240 W/ Channel (4Ω)
lPreset Memory FM 15 stations
AM/ MW 15 stations
lFM tuner section (FM)
Frequency Range: 87.5-108.0MHz
(50kHz step)
Sensitivity: 2.5µV (IHF)
S/N 26dB 2.2µV
Antenna Terminals: 75Ω(unbalanced)
lAM tuner section (AM/MW)
Frequency Range: 522-1629kHz (9kHz step)
520-1630kHz (10kHz step)
AM Sensitivity S/N 20dB at
999kHz: 560µV/m
DVD Home Theater Sound System
Specifications
ORDER NO.MD0605182C3

lPhone Jack:
Terminal: Stereo 3.5 mm jack
lFront M. Port:
Sensitivity: 100mV (4.7kΩ)
Terminal (Input): Stereo 3.5 mm jack
lDisc section
Discs played [8 cm or 12 cm]:
(1) DVD [DVD-Video, DVD-Audio]
(2) DVD-RAM [DVD-VR, MP3(*2,5), JPEG(*4,5)]
(3) DVD-R [DVD-Video, DVD-VR, MP3(*2,5), JPEG(*4,5)]
(4) DVD-R DL [DVD-Video, DVD-VR]
(5) DVD-RW [DVD-Video, DVD-VR, MP3(*2,5), JPEG(*4,5)]
(6) +R, +RW [Video]
(7) +R DL [Video]
(8) CD, CD-R/RW [CD-DA, Video-CD, SVCD(*1), MP3(*2,5),
WMA(*3,5), JPEG(*4,5), HighMAT Level 2 (Audio and
Image)]
*1 Conforming to IEC62107
*2 MPEG-1 Layer 3, MPEG-2 Layer 3
*3 Windows Media Audio Ver.9.0 L3
lNot compatible with Multiple Bit Rate (MBR)
*4 Exif Ver 2.1 JPEG Baseline files
lPicture resolution: between 160 x 120 and 6144 x 4096
pixels (Sub sampling is 4:0:0, 4:2:0, 4:2:2 or 4:4:4).
Extremely long and thin pictures may not be displayed.
*5 The total combined maximum number of recognizable audio
and picture contents and groups: 4000 audio and picture
contents and 400 groups.
Pick up:
Wavelength:
lCD: 785nm
lDVD: 662nm
Laser power:
lCD/DVD: CLASS 1M/CLASS 1
Audio output (DISC):
Number of channels: 5.1 ch (FL, FR, C, SL, SR,
SW)
Audio performance:
Frequency response:
DVD (linear audio): 4 Hz-22 kHz (48 kHz sampling)
4 Hz-44 kHz (96 kHz sampling)
DVD-Audio: 4 Hz-88 kHz (192 kHz
sampling)
CD-Audio: 4 Hz-20 kHz
S/N ratio:
CD-Audio: 105 dB
Dynamic range:
DVD (linear audio): 95 dB
CD-Audio: 95 dB
Total harmonic distortion:
CD-Audio: 0.005 %
lVideo section
V
ideo system:
Signal system: NTSC
Composite video output:
Output level: 1 Vp-p (75 Ω)
Terminal: Pin jack (1 system)
S-video output:
Y
output level: 1 Vp-p (75 Ω)
C output level: NTSC; 0.286 Vp-p (75 Ω)
Terminal S terminal (1 system)
Component video output (480p/480i):
Y
output level: 1 Vp-p (75 Ω)
PBoutput level: 0.7 Vp-p (75 Ω)
PRoutput level: 0.7 Vp-p (75 Ω)
Terminal: Pin jack (Y: green, PB: blue,
PR: red) (1 system)
HDMI AV output: 19 pin type A connector, HDMI
Ver.1.2a (EDID Ver.1.3)
Power consumption in standby mode:
approx 0.9W
Note:
1. Specifications are subject to change without notice.
Mass and dimensions are approximate.
2. Total harmonic distortion is measured by the digital spectrum
analyzer.
Solder:
This model uses lead free solder (PbF).
Mechanism:
This model uses RC1 (Rotary Tray) mechanism.
Refer to the original service manual for *1, *2, *3, *4.
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SA-HT740GCP

1 Safety Precautions 5
1.1. GENERAL GUIDELINES 5
1.2. Before Repair and Adjustment 5
1.3. Protection Circuitry 6
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
3 Precaution of Laser Diode 8
4 About Lead Free Solder (PbF) 9
4.1. Service caution based on legal restrictions 9
5 Handling Precautions for Traverse Unit 10
5.1. Cautions to Be Taken in Handling the Optical Pickup Unit
10
5.2. Grounding for electrostatic breakdown prevention 10
6 Accessories 12
7 Operation Procedures 13
7.1. Remote Control Key Buttons Operations 13
7.2. Main Unit Key Buttons Operations (SA-HT740) 14
7.3. Disc information 15
8 New Features 17
8.1. About HDMI 17
9 Self-Diagnosis and special mode setting 19
9.1. Service Mode Summary Table 19
9.2. Service Mode Table 19
9.3. DVD Self Diagnostic Function-Error Code 24
9.4. Sales Demonstration Lock Function 26
9.5. Service Precautions 26
10 Assembling and Disassembling 28
10.1. Disassembly Flow Chart 29
10.2. Main Components and P.C.B. Locations 30
10.3. Disassembling the Top Cabinet 31
10.4. Disassembling the Front Panel Assembly 31
10.5. Disassembling the Tray Assembly 31
10.6. Disassembling the Rear Panel 32
10.7. Disassembling the Mechanism Base Assembly 32
10.8. Disassembling the FL & Head phone P.C.B. 32
10.9. Disassembling the HDMI Module P.C.B. 33
10.10. Disassembling the Regulator P.C.B. 33
10.11. Disassembling the Main P.C.B. 33
10.12. Disassembling the AC-Inlet, Power, Sub Power & Voltage
Selector P.C.B 33
10.13. Disassembly of Digital Amp IC 34
10.14. Disassembly of Regulator IC 34
CONTENTS
Page Page
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SA-HT740GCP

10.15. Disassembly of Switch Regulator IC (IC5701) 34
10.16. Disassembly of the Tray Base Guide (L) and Tray Base
Guide (R) 35
10.17. Disassembly of the Rotary Tray 35
10.18. Disassembly of the Traverse Unit 36
10.19. Assembly of Tray Assembly 38
11 Service Fixture and Tools 40
12 Service Positions 40
12.1. Checking & Repair Main P.C.B., Power P.C.B., HDMI
Module P.C.B., FL and Head phone P.C.B. 40
13 Measurements and Adjustments 41
13.1. Service Tools and Equipment 41
13.2. Important points in adjustment 41
13.3. Storing and handling of test discs 41
13.4. Optical adjustment 42
14 Abbrevations 43
15 Voltage and Waveform Chart 45
15.1. HDMI Module P.C.B. 45
15.2. Main P.C.B. 47
15.3. Power P.C.B. 48
15.4. FL P.C.B. 48
15.5. Loading Motor P.C.B., Tray Motor P.C.B., Sensor P.C.B.,
Regulator P.C.B. 49
15.6. Waveform Chart 50
16 Illustration of IC's, Transistors and Diodes 51
17 Wiring Connection Diagram 53
18 Block Diagram 55
19 Schematic Diagram Notes 61
20 Schematic Diagram 63
20.1. (A) Optical Pickup Unit & HDMI Module Circuit 63
20.2. (B) Main Circuit 70
20.3. (C) Power, AC-inlet, Sub power & Voltage Selector Circuit
75
20.4. (D) FL, Headphone, Loading Motor, Tray Motor, Sensor,
Regulator Circuit 78
21 Printed Circuit Board 81
21.1. (A) HDMI Module P.C.B. 81
21.2. (B) Main, AC-inlet & Sub Power P.C.B. 82
21.3. (C) Power P.C.B. 83
21.4. (E) FL, Headphone, Loading Motor, Tray Motor, Sensor,
Regulator & Voltage Selector P.C.B. 84
22 Basic Troubleshooting Guide 85
22.1. Basic Troubleshooting Guide for Traverse Unit (HDMI
Module P.C.B) 85
22.2. Basic Troubleshooting Guide for HDMI AV output 86
23 Overall Block for HT740 87
23.1. HT740 DVD Unit Block 88
23.2. HT740 Block (Analog Signal : DVD 5.1ch Play Back
Mode) 89
23.3. HT740 Block (Analog Signal : 2ch Analog Input Mode) 90
23.4. HT740 Power Supply Block 91
23.5. HT740 Power Block (SMPS) 92
24 Terminal Function of ICs 93
24.1. IC2001 (MN101C49GHF1): Micro-processor IC 93
25 Exploded Views 94
25.1. Cabinet Parts Location 94
25.2. Packaging 97
26 Replacement Parts List 98
26.1. Component Parts List 99
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SA-HT740GCP

1 Safety Precautions
1.1. GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, carry out the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the two prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MΩand 5.2MΩ.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
1.2. Before Repair and Adjustment
Disconnect AC power, discharge Power Supply Capacitors C5701, C5702, C5705, C5706, C5736, C5737, C5772 through a 10 Ω,
10 W resistor to ground.
DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.
After repairs are completed, restore power gradually using a variac, to avoid overcurrent.
Current consumption at AC 110-127V / 220-240 V, 50/ 60 Hz in NO SIGNAL mode volume minimal should be ~ 750 mA.
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SA-HT740GCP

1.2.1. Caution for fuse replacement
1.3. Protection Circuitry
The protection circuitry may have operated if either of the following conditions are noticed:
· No sound is heard when the power is turned on.
· Sound stops during a performance.
The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are
“shorted”, or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.
If this occurs, follow the procedure outlines below:
1. Turn off the power.
2. Determine the cause of the problem and correct it.
3. Turn on the power once again after one minute.
Note:
When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
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SA-HT740GCP

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SA-HT740GCP

3 Precaution of Laser Diode
CAUTION:
This unit utilizes a class 1 laser.
Invisible laser radiation is emitted from the optical pickup lens.
Wavelength: 662nm(DVD)/785nm(CD).
Maximum output radiation power from pickup: 100µW/VDE
When the unit is turned on:
1. Do not look directly into the pick up lens.
2. Do not use optical instruments to look at the pick up lens.
3. Do not adjust the preset variable resistor on the pickup lens.
4. Do not disassemble the optical pick up unit.
5. If the optical pick up is replaced, use the manufacturer’s specified replacement pick up only.
6. Use of control or adjustments or performance of procedures other than those specified herein may result in hazardous
radiation exposure.
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SA-HT740GCP

4 About Lead Free Solder (PbF)
4.1. Service caution based on legal restrictions
4.1.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
· The lead free solder has to be used when repairing the equipment for which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)
· To put lead free solder, it should be well molten and mixed with the original lead free solder.
· Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.
· Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt
the lead free solder.
· Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30
degrees C (662±86°F).
Recommended Lead Free Solder (Service Parts Route.)
· The following 3 types of lead free solder are available through the service parts route.
RFKZ03D01K-----------(0.3mm 100g Reel)
RFKZ06D01K-----------(0.6mm 100g Reel)
RFKZ10D01K-----------(1.0mm 100g Reel)
Note
* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%
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SA-HT740GCP

5 Handling Precautions for Traverse Unit
The laser diode in the optical pickup unit may break down due to static electricity of clothes or human body. Special care must be
taken avoid caution to electrostatic breakdown when servicing and handling the laser diode.
5.1. Cautions to Be Taken in Handling the Optical Pickup Unit
The laser diode in the optical pickup unit may be damaged due to electrostatic discharge generating from clothes or human body.
Special care must be taken avoid caution to electrostatic discharge damage when servicing the laser diode.
1. Do not give a considerable shock to the optical pickup unit as it has an extremely high-precise structure.
2. To prevent the laser diode from the electrostatic discharge damage, the flexible cable of the optical pickup unit removed should
be short-circuited with a short pin or a clip.
3. The flexible cable may be cut off if an excessive force is applied to it. Use caution when handling the flexible cable.
4. The antistatic FPC is connected to the new optical pickup unit. After replacing the optical pickup unit and connecting the flexible
cable, cut off the antistatic FPC.
5.2. Grounding for electrostatic breakdown prevention
Some devices such as the DVD player use the optical pickup (laser diode) and the optical pickup will be damaged by static
electricity in the working environment. Proceed servicing works under the working environment where grounding works is
completed.
5.2.1. Worktable grounding
1. Put a conductive material (sheet) or iron sheet on the area where the optical pickup is placed, and ground the sheet.
5.2.2. Human body grounding
1. Use the anti-static wrist strap to discharge the static electricity form your body.
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SA-HT740GCP