Philips TDA2614 User manual

DATA SHEET
Product specification
File under Integrated Circuits, IC01 July 1994
INTEGRATED CIRCUITS
TDA2614
6 W hi-fi audio power amplifier

July 1994 2
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
FEATURES
•Requires very few external components
•No switch-on/switch-off clicks
•Input mute during switch-on and switch-off
•Low offset voltage between output and ground
•Hi-fi in accordance with IEC 268 and DIN 45500
•Short-circuit proof and thermal protected
•Mute possibility.
GENERAL DESCRIPTION
TheTDA2614isapoweramplifierina9-leadsingle-in-line
(SIL9) plastic medium power package. It has been
especiallydesignedformainsfedapplications,suchasTV
and radio.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT110-1; 1996 August 21.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VPpositive supply voltage range 15 −42 V
POoutput power VS= 24 V; THD = 0.5% −6.5 −W
Gvinternal voltage gain −30 −dB
SVRR supply voltage ripple rejection −45 −dB
Vno noise output voltage −70 −µV
EXTENDED TYPE
NUMBER PACKAGE
PINS PIN POSITION MATERIAL CODE
TDA2614 9 SIL plastic SOT110(1)

July 1994 3
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
handbook, full pagewidth
MCD371 - 1
5
voltage
comparator
4 kΩ
10 kΩ
P
– V
THERMAL
PROTECTION
5 kΩ
10 kΩ
VAB V
P
+ V
ref1
V
ref3
V
ref2
+ V
ref2
– V
P
+ V
CM
20 kΩ
VA
B
V
P
– V
680 Ω
20 kΩ
ref1
V
6
P
GND / V
8
9
3
2
substrate
TDA2614
P
+ V
7
MUTE
1/2 V / GND
INV
INV
n.c.
n.c.
1
4
OUT
P
Fig.1 Block diagram.

July 1994 4
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
PINNING
SYMBOL PIN DESCRIPTION
n.c. 1 not connected
MUTE 2 mute input
1/2VP/GND 3 1/2 supply (or ground at
symmetrical power supplies)
n.c. 4 not connected
GND/−VP5 ground (or negative supply rail at
symmetrical power supplies)
OUT 6 output
VP7 supply voltage
INV 8 inverting input
−INV 9 non-inverting input
Fig.2 Pin configuration.
handbook, halfpage
MCD367 - 1
1
2
3
4
5
6
7
8
9
P
V
OUT
MUTE
INV
TDA2614
/ GND
P
GND / – V
n.c.
– INV
n.c.
P
1/2 V
FUNCTIONAL DESCRIPTION
The TDA2614 is a hi-fi power amplifier designed for mains
fed applications, such as radio and TV. The circuit is
optimallydesignedfor asymmetrical power supplies, but is
also well-suited to symmetrical power supply systems.
An output power of 6 W (THD = 0.5%) can be delivered
intoan 8 Ωload withasupplyof 24 V.Thegainis internally
fixed at 30 dB, thus offering a low gain spread.
A special feature is the input mute circuit. This circuit
disconnects the non-inverting input when the supply
voltagedrops below10 V,while theamplifierstill retainsits
DCoperating adjustment. Thecircuitfeaturessuppression
of unwanted signals at the input, during switch-on and
switch-off.
The mute circuit can also be activated via pin 2. When a
current at 300 µA is present at pin 2, the circuit is in the
mute condition.
Thedevice is provided with two thermal protectioncircuits.
One circuit measures the average temperature of the
crystalandthe other measure themomentarytemperature
of the power transistors. These control circuits attack at
temperatures in excess of 150 °C, so a crystal operating
temperature of max. 150 °C can be used without extra
distortion.
With the derating value of 8 K/W, the heatsink can be
calculated as follows:
at RL=8Ωand VS= 24 V, dissipation is 4.1 W.
With a maximum ambient temperature of 60 °C, the
thermal resistance of the heatsink is:
Rth 150 60–
4.1
---------------------- 8–14 K/W.==

July 1994 5
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
Note to the limiting values
1. For asymmetrical power supplies (with the load short-circuited), the maximum unloaded supply voltage is limited to
VP= 28 V, and with an internal supply resistance of RS≥4Ω, the maximum unloaded supply voltage is limited to
32 V (with the load short-circuited). For symmetrical power supplies, the circuit is short-circuit-proof up to
VP=±21 V.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPpositive supply voltage −42 V
IOSM non-repetitive peak output current −4A
P
tot total power dissipation see Fig.3 −15 W
Tstg storage temperature range −55 +150 °C
TXTAL crystal temperature −+150 °C
Tamb ambient operating temperature range −25 +150 °C
tsc short circuit time short circuit to ground; note 1 −1h
Fig.3 Power derating curve.
handbook, halfpage
– 25 0 50 150
16
12
4
0
8
MGA091 - 2
100
T ( C)
o
amb
P
(W)
tot
infinite heatsink
R = 14 K/W
th-hs
THERMAL RESISTANCE
SYMBOL PARAMETER THERMAL
RESISTANCE
Rth j-c from junction to case 8 K/W

July 1994 6
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPsupply voltage range −24 42 V
IORM repetitive peak output current −2.2 −A
Operating position; note 1
VPsupply voltage range 15 24 42 V
IPtotal quiescent current 10 20 35 mA
POoutput power THD = 0.5% 5 6.5 −W
THD = 10% 6.5 8.5 −W
THD = 0.5%; RL= 4 Ω− 10 −W
THD = 10%; RL= 4 Ω− 14 −W
THD total harmonic distortion Po= 4 W −0.15 0.2 %
B power bandwidth THD = 0.5%; note 2 −30 to −Hz
20 000
Gvvoltage gain 29 30 31 dB
|∆V3-6| DC output offset voltage −30 200 mV
Vno noise output voltage note 3 −70 140 µV
|Zi| input impedance 14 20 26 kΩ
SVRR supply voltage ripple rejection note 4 35 45 −dB
Ibias input bias current −0.3 −µA
MUTE POSITION (AT IMUTE ≥300 µA)
VOoutput voltage VI= 600 mV −0.1 1.0 mV
Z2-7 mute input impedance −9−kΩ
IPtotal quiescent current 10 20 35 mA
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 35 44 −dB
|∆V3-6| DC output offset voltage −40 200 mV
|∆Voff| offset voltage with respect to
operating position −4 150 mV
I2current if pin 2 is connected to pin 5 −− 6mA
Mute position; note 5
VPpositive supply voltage range 4 −10 V
IPtotal quiescent current RL= ∞515 20mA
V
Ooutput voltage VI= 600 mV −0.1 1.0 mV
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 35 44 −dB
|∆V3-6| DC output offset voltage −40 200 mV

July 1994 7
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
Notes to the characteristics
1. VP= 24 V; RL= 8 Ω; Tamb = 25 °C; f = 1 kHz; asymmetrical power supply IMUTE < 30 µA. See Fig.5
2. The power bandwidth is measured at an output power of PO max − 3 dB.
3. The noise output voltage (RMS value) is measured at RS= 2 kΩ, unweighted (20 Hz to 20 kHz).
4. The ripple rejection is measured at RS= 0 and f = 100 Hz to 20 kHz, at a ripple voltage of 200 mV. With symmetrical
power supplies, the ripple (200 mV) is applied in phase to the positive and the negative supply rails.
With asymmetrical power supplies, the ripple rejection is measured at f = 1 kHz.
5. VP= 8 V; RL= 8 Ω; Tamb = 25 °C; f = 1 kHz; asymmetrical power supply. See Fig.5
6. ±VP= 12 V; RL= 8 Ω; Tamb = 25 °C; f = 1 kHz; symmetrical power supply IMUTE < 30 µA. See Fig.4
7. The internal network at pin 2 is a resistor devider of typical 4 kΩand 5 kΩto the positive supply rail. At the connection
of the 4 kΩand 5 kΩresistor a zener diode of typical 6.6 V is also connected to the positive supply rail. The spread
of the zener voltage is 6.1 to 7.1 V.
Operating position; note 6
±VPsupply voltage range 7.5 12 21 V
IPtotal quiescent current 10 20 35 mA
POoutput power THD = 0.5% 5 6.5 −W
THD = 10% 6.5 8 −W
THD total harmonic distortion Po= 4 W −0.13 0.2 %
B power bandwidth THD = 0.5%; note 2 −40 to −Hz
20000
Gvvoltage gain 29 30 31 dB
Vno noise output voltage note 3 −70 140 µV
|Zi| input impedance 14 20 26 kΩ
SVRR supply voltage ripple rejection 40 55 −dB
Ibias input bias current −0.3 −µA
|VGND| DC output offset voltage −30 200 mV
MUTE POSITION (AT IMUTE ≥300 µA)
VOoutput voltage VI= 600 mV −0.1 1.0 mV
Z2-7 mute input impedance note 7 6.7 9 11.3 kΩ
IPtotal quiescent current RL= ∞10 20 35 mA
Vno noise output voltage note 3 −70 140 µV
SVRR supply voltage ripple rejection note 4 40 55 −dB
|∆VGND| DC output offset voltage −40 200 mV
|∆Voff| offset voltage with respect to
operating position −4 150 mV
I2current if pin 2 is connected to pin 5 −− 6mA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

July 1994 8
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
handbook, full pagewidth
6
20 kΩ
5
8
3TDA2614
MCD370
20 kΩ680 Ω
100 nF
680 µF
7
220 nF 9
2
mute input
R = 8 Ω
L
22 nF
8.2 Ω
P
+ V
I
V
P
– V
680 µF
Fig.4 Test and application circuit with symmetrical power supply.
handbook, full pagewidth
6
20 kΩ
5
8
3
TDA2614
MCD369
20 kΩ
680 Ω
100 nF 680 µF
7
220 nF 9
2
100 µF
mute input S
V
S
R
R = 8 Ω
L
22 nF 680 µF
8.2 Ω
P
V
I
V
P
1/2
internal
Fig.5 Test and application circuit with asymmetrical power supply.

July 1994 9
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
PACKAGE OUTLINE
UNIT AA
max.
2A3b1D1
b2 bcD
(1) E(1) Z
max.
(1)
eLPP
1q 1
q
2
q
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 18.5
17.8 3.7 8.7 8.0
A4
15.8
15.4 1.40 1.14 0.67 0.50 1.40 1.14 0.48
0.38 21.8
21.4 21.4 20.7 6.48 6.20 3.4 3.2
2.54 1.0
5.9
5.7
4.4
4.2
3.9
3.4 15.1 14.9
Q
1.75
1.55
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2.75
2.50
SOT110-1 92-11-17
95-02-25
0 5 10 mm
scale
0.25
w
D
E
A
A
c
A2
3
A4
q1q2
L
Q
wM
b
b1
b2
D1
P
q
1
Ze
19
P
seating plane
pin 1 index
SIL9MPF: plastic single in-line medium power package with fin; 9 leads SOT110-1

July 1994 10
Philips Semiconductors Product specification
6 W hi-fi audio power amplifier TDA2614
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Thistext gives averybriefinsight toacomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.