1-8
Pb(Lead) Free Solder
When soldering , be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (not always indicated)
onemusttreatallsetsfrom1Jan2005onwards,according
next rules:
Important note: In fact also products of year 2004 must
betreatedinthiswayaslongasyouavoidmixingsolder-
alloys(leaded/lead-free).SobesttoalwaysuseSAC305
and the higher temperatures belong to this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
•Use only lead-free solder alloy Philips SAC305 with
ordercode 0622 14900106.If lead-freesolder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
withinworkshopsshouldbeavoidedbecausepasteis
not easy to store and to handle.
•Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
–To reach at least a solder-temperature of 400°C,
–Tostabilizetheadjustedtemperatureatthesolder-
tip
–To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature around
360°C–380°Cisreachedandstabilizedatthesolder
joint.Heating-timeofthesolder-jointshouldnotexceed
~ 4 sec.Avoid temperatures above 400°C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un-
used equipment, or reduce heat.
•Mixoflead-freesolderalloy / parts withleadedsolder
alloy / parts is possible but PHILIPS recommends
stronglytoavoidmixedsolderalloytypes(leadedand
lead-free).
Ifonecannotavoidordoesnotknowwhetherproduct
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
•Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
•Special information for BGA-ICs:
–Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
solderingalwaysusethelead-freetemperatureprofile,
in case of doubt)
–Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’(sealedpackincludingasilicagelpack)to
protect the IC against moisture. After opening,
dependentofMSL-levelseenonindicator-labelinthe
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•Forsets producedbefore 1.1.2005 (exceptproducts
of 2004), containing leaded solder-alloy and
components,all needed spare-partswillbe available
till the end of the service-period. For repair of such
sets nothing changes.
•Onourwebsitewww.atyourservice.ce.Philips.com
you find more information to:
•BGA-de-/soldering (+ baking instructions)
•Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.