Philips HTS5540 User manual

1 - 1
HTS5540/12/05
HTS5550/12
©Copyright2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands
All rights reserved.No part of this publication may be reproduced, stored in a retrieval system or
transmitted, in any form or by any means, electronic, mechanical, photocopying, or otherwise
without the prior permission of Philips.
Published by RY1003Service Audio Printed in The Netherlands Subject to modification
DVD Home Theater System
Version1.1
TABLE OF CONTENTS
Location of PCB Boards ............................................ 1-2
Versions Variation ...................................................... 1-2
Measurement Setup .................................................. 1-4
Specifications............................................................ 1-3
Service Aids.............................................................. 1-5
ESD& Safety Instruction .......................................... 1-6
Lead-free soldering Information................................1-7
Setting procedure & Repair Instructions........................ 2
Disassembly Instructions & Service positions .............. 3
Block & Wiring Diagram ................................................ 4
VFD Board.................................................................... 5
Main Board.................................................................... 6
Power Board.................................................................. 7
Service Manual
Service
TfswjdfTfswjdf
AMP Board .................................................................... 8
Scart Board .................................................................... 9
VOL+USB+MP3 Board ................................................ 10
Touch Board ................................................................ 11
Jack Board .................................................................. 12
Mechanical Exploded view .......................................... 13
Revision List ................................................................ 14
GB
Chapter
3139 785 35200

1 - 2
LOCATION OF PCB BOARDS
VERSION VARIATION:
Type/Versions
Features
HTS5540
Output Power - 1200W
Voltage (220~240V)
Scart
Main Board
VOL+USB+MP3 Board
Scart Board
Type/Versions
Board in used
HTS5540
C
C
C
/12
SERVICE SCNARIO MATRIX:
/12
x
x
x
*C = Component Level Repair
Power Board
C
AMP Board C
C
C
VFD Board
Touch Board
C
Jack Board
MAIN PCB
AMP PCB
POWER PCB
TOUCH PCB
VFD PCB
VOL PCB
MP3 PCB
USB PCB
SCART PCB
JACK PCB
HTS5550
C
C
C
/05
C
C
C
C
C
C
C
C
/12
C
C
C
C
C
HTS5550
/05
x
x
x
/12
x
x
x

1 - 3
SPECIFICATIONS
Playback media
DVD-Video, DVD+R/+RW, DVD-R/-RW, DVD+RDL, CD-R/CD-
RW, Audio CD, Video CD/SVCD,Picture CD, MP3-CD, WMA-
CD, DivX-CD, USB storage device
File Format
Audio: .mp3, .wma
Video: .divx, .divx ultra, .mpeg, .mpg, .wmv (simple prole)
Picture: .jpeg, .jpg
Amplifier
Total output powe............................... 1200 W RMS (30%THD)
Frequency response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Hz-20 kHz / ±3dB
Signal-to-noise ratio. . . . . . . . . . . . . . . . . . . > 65 dB (CCIR) /(A-weighted)
Input sensitivity:
..............................................................................AUX: 900 mV
.....................................................................MP3 LINK: 500 mV
Video
Signal system ........................................................ PAL / NTSC
HDMI output ............. 480i/576i, 480p/576p, 720p,1080i, 1080p
Audio
S/PDIF Digital audio input:
Coaxial. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IEC 60958-3
Sampling frequency:
MP3 .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. 32 kHz, 44.1 kHz, 48 kHz
WMA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44.1 kHz, 48 kHz
Constant bit rate:
MP3 .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . .. . . 112 kbps - 320 kbps
WMA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 kbps - 192 kbps
Radio
Tuning range .................................. FM 87.5-108 MHz (50 kHz)
Signal-to-noise ratio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FM 50 dB
Frequency response. . . . . . . . . . . . . . . . . . . . . . . . . FM 180 Hz-10 kHz /±6dB
USB
Compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hi-Speed USB (2.0)
Class support. . . . . . . . . . . . . . . . . . . . . . . . UMS (USB Mass Storage Class)
File system ............................................ FAT12, FAT16, FAT32
Maximum memory support.......................................... < 160GB
Main Unit
Power supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220-240V; ~50 Hz
Power consumption......................................................... 150 W
Standby power consumption ... .... .... .... .... .... .... .... .... .... . < 0.9 W
Dimensions (WxHxD) ...... . ...... . ...... . ...... . ... 435 x 58 x 358(mm)
Weight ............................................................................3.56 kg
Speakers
System.......................................................... full range satellite
Speaker impedance. . . . . . . . . . 3 ohm (center), 4 ohm (Front/Rear)
S peaker drivers ............................................... 2 x 3” full range
Frequency response. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Hz-20 kHz
Dimensions (WxHxD):
Center......................................................... 280 x 95 x 92 (mm)
Speaker ................................................. 100 x 280 x 115 (mm)
Tall speaker.......................................... 260 x 1101 x 260 (mm)
Weight:
Center............................................................................ 1.40 kg
Speaker .................................................................1.05 kg/each
Tall speaker..................................................3.73~3.81 kg/each
Cable length:
Center.................................................................................. 3 m
Front .................................................................................... 4 m
Rear................................................................................... 10 m
Subwoofer
Impedance....................................................................... 3 ohm
Speaker drivers ...................................... 165 mm (6.5”) woofer
Frequency response.......................................... 40 Hz-150 kHz
Dimensions (WxHxD) .............................. 196 x 395 x 342(mm)
Weight ............................................................................5.25 kg
Cable length ........................................................................ 4 m
Laser specification
Type.....................................Semiconductor laser GaAIAs (CD)
Wave length................ 645 - 665 nm (DVD), 770 -800 nm (CD)
Output power.............................6 mW (DVD), 7 mW (VCD/CD)
Beam divergence................................................... 60 degrees.
Specications subject to change without prior notice.

1 - 4
LEVEL METER
e.g. Sennheiser UPM550
with FF-filter
S/N and distortion meter
e.g. Sound Technology ST1700B
L
R
DUT
CD
Use Audio Signal Disc
(replaces test disc 3)
SBC429 4822 397 30184
Bandpass
250Hz-15kHz
e.g. 7122 707 48001
LF Voltmeter
e.g. PM2534
DUT
RF Generator
e.g. PM5326
S/N and distortion meter
e.g. Sound Technology ST1700B
Use a bandpass filter to eliminate hum (50Hz, 100Hz) and disturbance from the pilottone (19kHz, 38kHz).
Ri=50
Tuner FM
MEASUREMENT SETUP

1 - 5
Service Tools:
Universal Torx driver holder .................................4822 395 91019
Torx bit T10 150mm ...........................................4822 395 50456
Torx driver set T6-T20 .........................................4822 395 50145
Torx driver T10 extended .....................................4822 395 50423
Compact Disc:
SBC426/426A Test disc 5 + 5A ...........................4822 397 30096
SBC442 Audio Burn-in test disc 1kHz .................4822 397 30155
SBC429 Audio Signals disc .................................4822 397 30184
Dolby Pro-logic Test Disc ....................................4822 395 10216
SERVICE AIDS
HANDLING CHIP COMPONENTS

1 - 5
NL
WAARSCHUWING
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat utijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
I
AVVERTIMENTO
TuttiIC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allostesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsiche i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
GB
Safety regulations require that the setbe restored to its original
condition and thatparts which are identical with those specified,
be used.
Safety components are marked by the symbol
!
.
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebrachten dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid methetsymbol
!
.
F
Les normes de sécurité exigentque l’appareil soitremis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sontmarqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage currentmustnot
exceed 0.5mA.
CLASS 1
LASER PRODUCT
3122 110 03420
GB
Warning !
Invisible laser radiation when open.
Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
SF
Varoitus !
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katsosäteeseen!
GB
WARNING
All ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
F
ATTENTION
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations,s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
ESD
D
WARNUNG
AlleICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie,dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doiventêtre utilisés par
des spécialistes agréés,seuls habilités à réparer votre
appareil en panne".
GB
ESD PROTECTION EQUIPMENT
Complete KitESD3 (small tablemat, wristband,
connection box, estention cable and earth cable.......4822 310 10671
Wristbandtester ................................................................. 4822 344 13999

1 - 6
Pb(Lead) Free Solder
When soldering ,be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (notalways indicated)
one musttreat all sets from1 Jan 2005onwards, according
next rules:
Important note:In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solder-
alloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong tothis.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
•Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
noteasy to store and to handle.
•Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least asolder-temperature of 400?C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature around
360?C – 380?C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400?C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un-
used equipment, or reduce heat.
•Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
•Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased atexternal companies.
•Special information for BGA-ICs:
–Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature profile,
in case of doubt)
–Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
•On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+baking instructions)
•Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.

2 - 12 - 1
System , Region Code , etc. Setting Produre
1)Restore factory setting
a) Press <SETUP> button on R/C
b) Select <preference setup> ,then press < OK >
c) Select <default>,then press <OK> to conrm
2)Version control change
a) Open the Door,then,press “1” “5” “9” on RC
b) Press <OK> button on RC
c) TV will show message as follow:
3)Password change
a) Press <SETUP> button on R/C
b) Select <preference setup> ,then press <OK>
c) Select <password> <change>,then press <OK> to conrm
“0000” is default password supplied.
4)Trade model
a) Press <Open/Close>button on R/C
b) Press “2” “5” “9” on R/C,VFD will display “TRA ON “ or “TRA
OFF“
5)Check on software version
a) Press <SETUP> button on R/C
b) Select <preference setup> ,then press <OK>
c) Select <version info>,then press <OK>
d) TV will show message as follow:
6) Upgrading new software
a) Copy the latest upgrading software onto a CD-R or USB storage
device
b) Insert the CD-R program disc or connect the USB storage device
to the home theater
c) TV will show message as follow
d) Select <OK>,the home theater will start to upgrading
automatically
Note: when upgrade in progress, please do not unplug or switch off
the device.
when the updated is complete ,the home theater automatically
switch to standby.
CAUTION!
This information is confidential and may not be
distributed.Only a qualified service person should
reprogram the Region Code.
Preference setup
Ver sion Info.
Current model: 5540-12
Version :00.08.00_0 Release: 2009.12.22
Region: 2 Servo: AE .57.F1.00
8032:05.00.04.06 Resc: AA.00.00.00
MCU: 07.00 Touch: 0009
TX: Error RX: Error
OK
Press SETUP to exit menu
Upgrade file detected
Do you wish to continue with
the software upgrade?
OK Cancel
Current model: 5540-12
Ver sion:00.08.00_0 Release:2009.12.22
Region: 2 Servo:AE.57.F1.00
8032: 05.00.04.06 Risc: AA.00.00.00
MCU: 07.00 Touch: 0009
TX: Error RX: Error
if current model does not match you set,
use down arrow key on the remote to change
OK

2 - 22 - 2
REPAIR INSTRUCTIONS (One)

2 - 32 - 3
REPAIR INSTRUCTIONS (Two)

2 - 42 - 4
REPAIR INSTRUCTIONS (Three)

3 - 1 3 - 1
DISASSEMBLY INSTRUCTIONS
3) Loosen 6 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.
-4 screws “A” at the back panel as shown in  g ure 4.
- 1 screw “B” each on the left & right side as shown in gure 5.
4) Loosen 10 screws remove the front panel.
- 6 screws “C” at the bracketl as shown in  g ure 8.
- 1 screw “D” each on the left & right side as shown in gure 6.
- 2 screw “E” as shown in gure 7.
24mm
mm2
Figure 2
Dismantling of theTop & Front Panel Assemble
1) Open the DVD Tray by using the Open/Close Button while the Set is ON and disconnect the mains supply after removing the Tray
Cover.
Note: If this is not possible, the DVD Tray has to be open manually.
Take a mini screw driver about 2mm diameter and make a marking 24mm from the tip as shown in gure 2 . Place the set on its
side, insert the mini screw driver till the marking and slide it towards the left as shown in gure 1 until the Tray moves out of the Front
Panel.
2) Return the set to its upright position and remove the Tray Cover as shown in Figure 3 and close the tray manually by pushing it back
in.
Figure 1
Figure 3
Figure 4
A
Figure 5
B
Dismantling of the DVD Module
1) Loosen 4 screws “ F “ at the DVD Module as shown in gure 9.
C
D
E
Figure 6
Figure 7
Figure 8
F
Figure 9

3 - 2 3 - 2
Dismantling of the MAIN Board
1) Loosen 2 screws “I” on the top of Main Board as shown in gure 12.
2) At the back panel, loosen 4 screws “J” as shown in gure 13.
Dismantling of the VFD Board
1) Loosen 3 screws “G” on the top of VFD Board as shown in gure 10.
Figure 10
G
Dismantling of the VOL+USB+MP3 Board and VOL Button
1) Loosen 7 screws “H” as shown in gure 11 to remove VOL+IUSB+MP3 Board.
2) After remove VOL Board ,pull out the VOL button .
J
Figure 13
Figure 11
H
I
Figure 12
Dismantling of the POWER Board
1) Loosen 5 screws “K” on the top of power Board as shown in gure 14.
K
Figure 14
Dismantling of the AMP Board
1) Loosen 2 screws “L” on the top of AMP Board as shown in  g ure 15.
2) Loosen 2 screws “M” at the back panel as shown in  g ure 16.
L
M
Figure 15
Figure 16

3 - 3 3 - 3
o
P
Q
Dismantling of the SCART Board
1) Loosen 2 screws “O” at the back panel as shown in gure 17.
Figure 17
Dismantling of the JACK Board
1) Loosen 2 screws “P” on the top of JACK board as shown in gure 18.
Figure 18
Dismantling of the TOUCH Board
1) Loosen 3 screws “Q” on the top of TOUCH board as shown in gure 19.
Figure 19
SERVICE POSITIONS
Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or
metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them.

4 - 1 4 - 1
BLOCK DIAGRAM

4 - 2 4 - 2
WIRING DIAGRAM
POWER PCB
MAIN PCB
AMP PCB
TOUCH PCB
VFD PCB
VOL+USB+MP3
JACK PCB
SCART PCB
V1
V2
V3
V1

5 - 1 5 - 1
VFD BOARD
TABLE OF CONTENTS
FTD Display Pin Assignment............................................................. 5-1
Circuit Diagram . . . . . . . . . . . . . .................................................................... 5-2
PCB Layout Top & Bottom View........................................................ 5-3
FTD DISPLAY PIN ASSIGNMENT
PIN CONNECTION

5 - 2 5 - 2
CIRCUIT DIAGRAM
C392 A1
R3061 A1
RB355 A1
ZD312 A1
C387 A2
C390 A2
C391 A2
R3067 A2
C388 A3
DP351 A3
R3068 A3
C380 B1
C381 B1
C382 B1
C384 B1
C385 B1
C386 B1
CN360 B1
Q352 B1
Q352 B1
R3051 B1
R3052 B1
R3053 B1
R3054 B1
R3055 B1
R3056 B1
R3057 B1
R3058 B1
R3059 B1
RB356 B1
RB357 B1
SN351 B1
ZD310 B1
C389 B2
IC351 B2
IC351 B2
R3060 B2
R3069 B2
ZD311 B2
1 2 3
1 2 3
A
B
A
B
CN360

5 - 3 5 - 3
PCB LAYOUT - TOP VIEW
PCB LAYOUT - BOTTOM VIEW
1 2 3
1 2 3
A A
C385 A1
Q352 A1
Q352 A1
R3057 A1
R3058 A1
R3059 A1
R3060 A1
ZD310 A1
ZD311 A1
C380 A2
C381 A2
C382 A2
C384 A2
C388 A2
C390 A2
R3051 A2
R3052 A2
R3053 A2
R3054 A2
R3055 A2
R3056 A2
R3068 A2
ZD312 A2
C387 A3
IC351 A3
IC351 A3
R3067 A3
R3069 A3
3 2 1
321
AA
C386 A1
C389 A1
C391 A1
C392 A1
CN360 A1
JW7 A1
JW8 A1
JW9 A1
R3061 A1
RB355 A1
RB356 A1
RB357 A1
SN351 A1
ESD1 A1
JW3 A2
JW4 A2
JW5 A2
JW6 A2
DP351 A3
JW1 A3
JW2 A3
ESD2 A3

6 - 1 6 - 1
MAIN BOARD
TABLE OF CONTENTS
Internal IC Diagram ........................................................................... 6-1
Circuit Diagram(part one) .................................................................. 6-2
Circuit Diagram(part two)................................................................... 6-3
PCB Layout Top View ....................................................................... 6-4
PCB Layout Bottom View .............. .................................................... 6-5
INTERNAL IC DIAGRAM - MT1389FEX/SN
INTERNAL IC DIAGRAM - A641604L
CLK
CKE
Address
Clock
Generalor
Mode
Regisier
Command Decoder
Control Logic
Row
Address
Buffer
&
Refresh
Counter
Column
Address
Buffer
&
Refresh
Counter
Sense Amplifier
Column Decoder
Bank A
Bank B
Bank C
Bank D
Data Control Circuit
Latch Circuit
Input & Output Buffer
L(U)DQM
DQ
CS
RAS
CAS
WE
Row Decoder
DVD
PUH
Module
FLASH
Front-panel
Remote DRAM USB2.0/3 in 1 card
reader
MT1389S
HDMI1.2Tx
RGB video
CVBS
8ch Audio
SPDIF
DVB-T