Philips HTR5204/12 User manual

HTR5204/12
7
1-2
1-2
1-3
1-4
1-5
1-6
1-7
2
3
4
5
6
7
Digital A/V Surround Receiver
8
Control & Vol & Phone Board
313 9785 32660

LOCATION OF PCB BOARDS
VERSION VARIATION:
1-2
ROL PCB
VOL PCB
PHONE PCB
POWER PCB
MAIN PCB
Type/Version
Feature & Board in used
HTR5200
/12
Main PCB ( Power Output 600W)
Power Voltage ( 230V )
X
X
X
RDS

1-3
Specifications
AMPLIFIER
Total MAX Output Power
Home Theater Mode: 600W
Front: 75W x 2 / Channel
Centre: 150W / Channel
Surround: 75W x 2 / Channel
Subwoofer: 150W / Channel
Frequency Response: 150 Hz –18 kHz / ±3 dB
Signal–to–Noise Ratio:> 60 dB (A–weighted)
Input Sensitivity:
– TV In: 500 mV
– AUX In: 500 mV
RADIO
Tuning Range: FM 87.5 –108 MHz (50 kHz)
AM/MW 531 –1602 kHz
(9 kHz)
26 dB Quieting
Sensitivity: FM 22 dBf
AM/MW 5000 µV/m
Signal–to–Noise Ratio:FM 55 dB
AM/MW 40 dB
Harmonic Distortion: FM Mono 3%
FM Stereo 3%
AM/MW 5%
Frequency Response: FM 180 Hz – 10 kHz / ±6 dB
Stereo Threshold: FM 23.5dB
MAIN UNIT
Power Supply Rating: 220 – 240 V; 50 Hz
Power Consumption: 100 W
Standby Power Consumption: < 1 W
Dimensions: 435 x 56 x 325 mm
(w x h x d)
Weight: 3.2kg
CENTRE SPEAKER
System Full range satellite
Impedance: 8 Ω
Speaker drivers: 2 x 2.5” woofer,
1 x 2” tweeter
Frequency response: 150Hz – 20 kHz
Dimensions: 435 x 93.5 x 67 mm
(w x h x d)
Weight: 1.28 kg
PASSIVE SUBWOOFER
Frequency response: 40 Hz – 150 Hz
Impedance: 8 Ω
Subwoofer driver: 8” sub–woofer,
Dimensions: 159.5 x 355.5 x 370 mm
(w x h x d)
Weight: 4.712kg
Specifications subject to change without prior
notice.
FRONT AND REAR SPEAKERS
System Full range satellite
Impedance: 4 Ω
Speaker drivers: 3” full–range speaker
Frequency response: 150 Hz – 20 kHz
Dimensions: 95.6 x 198.3 x 75 mm
(w x h x d)
Weight: 0.62 kg /each

Measurement Setup
Tuner AM (MW,LW)
Tuner FM
Bandpass
Bandpass
1-4

Service Tools:
Universal Torx driver holder .................................4822 395 91019
Torxbit T10 150mm ...........................................4822 395 50456
Torx driver set T6-T20 .........................................4822 395 50145
Torx driver T10 extended .....................................4822 395 50423
Compact Disc:
SBC426/426A Testdisc5 +5A ...........................4822 397 30096
SBC442Audio Burn-in test disc 1kHz .................4822 397 30155
SBC429 Audio Signals disc .................................4822 397 30184
Dolby Pro-logic TestDisc ....................................4822 395 10216
SERVICE AIDS
HANDLING CHIP COMPONENTS
1-5

NL
WAARSCHUWING
Alle IC’s en vele andere halfgeleiders zijn
gevoelig voor electrostatische ontladingen
(ESD).
Onzorgvuldig behandelen tijdens reparatie kan
de levensduur drastisch doen verminderen.
Zorg ervoor dat utijdens reparatie via een
polsband met weerstand verbonden bent met
hetzelfde potentiaal als de massa van het
apparaat.
Houd componenten en hulpmiddelen ook op
ditzelfde potentiaal.
I
AVVERTIMENTO
TuttiIC e parecchi semi-conduttori sono
sensibili alle scariche statiche (ESD).
La loro longevità potrebbe essere fortemente
ridatta in caso di non osservazione della più
grande cauzione alla loro manipolazione.
Durante le riparazioni occorre quindi essere
collegato allostesso potenziale che quello della
massa dell’apparecchio tramite un braccialetto
a resistenza.
Assicurarsiche i componenti e anche gli utensili
con quali si lavora siano anche a questo
potenziale.
GB
Safety regulations require that the setbe restored to its original
condition and thatparts which are identical with those specified,
be used.
Safety components are marked by the symbol
!
.
NL
Veiligheidsbepalingen vereisen, dat het apparaat bij reparatie in
zijn oorspronkelijke toestand wordt teruggebrachten dat onderdelen,
identiek aan de gespecificeerde, worden toegepast.
De Veiligheidsonderdelen zijn aangeduid methetsymbol
!
.
F
Les normes de sécurité exigentque l’appareil soitremis à l’état
d’origine et que soient utiliséés les piéces de rechange identiques
à celles spécifiées.
Less composants de sécurité sontmarqués
!
.
D
Bei jeder Reparatur sind die geltenden Sicherheitsvorschriften zu
beachten. Der Original zustand des Geräts darf nicht verändert werden;
für Reparaturen sind Original-Ersatzteile zu verwenden.
Sicherheitsbauteile sind durch das Symbol
!
markiert.
I
Le norme di sicurezza esigono che l’apparecchio venga rimesso
nelle condizioni originali e che siano utilizzati i pezzi di ricambio
identici a quelli specificati.
Componenty di sicurezza sono marcati con
!
.
GB
After servicing and before returning set to customer perform a leakage
current measurement test from all exposed metal parts to earth ground
to assure no shock hazard exist, The leakage currentmustnot
exceed 0.5mA.
CLASS 1
LASER PRODUCT
3122 110 03420
GB
Warning !
Invisible laser radiation when open.
Avoid direct exposure to beam.
S
Varning !
Osynlig laserstrålning när apparaten är öppnad och spärren
är urkopplad. Betrakta ej strålen.
SF
Varoitus !
Avatussa laitteessa ja suojalukituksen ohitettaessa olet alttiina
näkymättömälle laserisäteilylle. Älä katsosäteeseen!
GB
WARNING
All ICs and many other semi-conductors are
susceptible to electrostatic discharges (ESD).
Careless handling during repair can reduce life
drastically.
When repairing, make sure that you are
connected with the same potential as the mass
of the set via a wrist wrap with resistance.
Keep components and tools also at this
potential.
F
ATTENTION
Tous les IC et beaucoup d’autres
semi-conducteurs sont sensibles aux
décharges statiques (ESD).
Leur longévité pourrait être considérablement
écourtée par le fait qu’aucune précaution n’est
prise à leur manipulation.
Lors de réparations,s’assurer de bien être relié
au même potentiel que la masse de l’appareil et
enfiler le bracelet serti d’une résistance de
sécurité.
Veiller à ce que les composants ainsi que les
outils que l’on utilise soient également à ce
potentiel.
ESD
D
WARNUNG
AlleICs und viele andere Halbleiter sind
empfindlich gegenüber elektrostatischen
Entladungen (ESD).
Unsorgfältige Behandlung im Reparaturfall kan
die Lebensdauer drastisch reduzieren.
Veranlassen Sie,dass Sie im Reparaturfall über
ein Pulsarmband mit Widerstand verbunden
sind mit dem gleichen Potential wie die Masse
des Gerätes.
Bauteile und Hilfsmittel auch auf dieses gleiche
Potential halten.
DK Advarse !
Usynlig laserstråling ved åbning når sikkerhedsafbrydere er
ude af funktion. Undgå udsaettelse for stråling.
F
"Pour votre sécurité, ces documents doiventêtre utilisés par
des spécialistes agréés,seuls habilités à réparer votre
appareil en panne".
GB
ESD PROTECTION EQUIPMENT
Complete KitESD3 (small tablemat, wristband,
connection box, estention cable and earth cable.......4822 310 10671
Wristbandtester ................................................................. 4822 344 13999
1-6

Pb(Lead) Free Solder
When soldering ,be sure to use the pb free solder.
INDENTIFICATION:
Regardless of special logo (notalways indicated)
one musttreat all sets from1 Jan 2005onwards, according
next rules:
Important note:In fact also products of year 2004 must
be treated in this way as long as you avoid mixing solder-
alloys (leaded/ lead-free). So best to always use SAC305
and the higher temperatures belong tothis.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
•Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solder-paste
is required, please contact the manufacturer of your
solder-equipment. In general use of solder-paste
within workshops should be avoided because paste is
noteasy to store and to handle.
•Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
– To reach at least asolder-temperature of 400?C,
– To stabilize the adjusted temperature at the solder-
tip
– To exchange solder-tips for different applications.
•Adjust your solder tool so that a temperature around
360?C – 380?C is reached and stabilized at the solder
joint. Heating-time of the solder-joint should not exceed
~ 4 sec. Avoid temperatures above 400?C otherwise
wear-out of tips will rise drastically and flux-fluid will
be destroyed. To avoid wear-out of tips switch off un-
used equipment, or reduce heat.
•Mix of lead-free solder alloy / parts with leaded solder
alloy / parts is possible but PHILIPS recommends
strongly to avoid mixed solder alloy types (leaded and
lead-free).
If one cannot avoid or does not know whether product
is lead-free, clean carefully the solder-joint from old
solder alloy and re-solder with new solder alloy
(SAC305).
•Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased atexternal companies.
•Special information for BGA-ICs:
–Always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for de-
soldering always use the lead-free temperature profile,
in case of doubt)
–Lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening,
dependent of MSL-level seen on indicator-label in the
bag, the BGA-IC possibly still has to be baked dry.
(MSL=Moisture Sensitivity Level). This will be
communicated via AYS-website.
Do not re-use BGAs at all.
•For sets produced before 1.1.2005 (except products
of 2004), containing leaded solder-alloy and
components, all needed spare-parts will be available
till the end of the service-period. For repair of such
sets nothing changes.
•On our website www.atyourservice.ce.Philips.com
you find more information to:
• BGA-de-/soldering (+baking instructions)
•Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information
within the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
1-7

2 - 1
2 - 1
System , Region Code , etc. Setting Produre
1)System Reset
a) switch source to DISC 6CH
b) press and hold buttom on front panel
c) VFD will display reset, then sysytem power down and return to
original default setting
2)Version & Region Code Change
a) switch source to DISC 6CH
b) press”9” “1“ “0“ on R/C
c) press volume + / - key on R/C to choose desired one
5 regions:
EU 12 / UK 05 / APAC 98 / US 37 / US 98
3)Check on the Sofeware Version
a) switch source to DISC 6CH
b) press “1“ “5“ “9“ buttom on R/C
c) VFD will display the version
6)Upgrading new sofeware
a) copy le HTR5200.ROM to root directory of USB disc
b) switch source to 6CH
c) insert USB disc to HTR520X USB socket
d) VFD will display UPGRADE
NOTE: during software upgrade ,you must not press any key and
power down.
After software upgrading completed ,move USB will display
on VFD ,now ,you must power down.
C A UT ION !
This information is con nc ial and ma y not
be distributed. Only a quadservice
person s hould reprogram the R egion Code.

2 - 2
2 - 2
REPAIR INSTRUCTION

2 - 3
2 - 3
REPAIR INSTRUCTION

3 - 1 3 - 1
DISASSEMBLY INSTRUCTIONS
Dismantling of the top cover Assembly
1) Loosen 5 screws and remove the Top Cover by lifting the rear portion upwards before sliding it out towards the rear.
- 3 screws ”A” on the back as show in gure 1
- 1 screws ”B” each on the left & right side as show in gure 2
Dismantling of the Main PCB
1) Loosen 4 screw “ F “ on the top of main board as shown in gure 6.
2) Loosen 5 screw “G” at the back panel as shown in gure 7.
F
Figure 6
Figure 7
Figure 1
G
A
B
Figure 2
C
D
E
Figure 3
Figure 4
Figure 5
Dismantling of the front panel Assembly
1) Loosen 6 screws & lift up the top edge of Front Panel assembly to free some catches before sliding it out towards the front.
-1 screw ”C” on the inside as show in gure 3
-1 screw “D“each on the left & right side as show in gure 4

3 - 2 3 - 2
Dismantling of the Power Board
1) Loosen 4 screws “D” at the top of the Power Board as shown in
gure 9
Dismantling of the Control Board
1) Loosen 11 screws “H” at the back pancle as shown in gure 8
Note:In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or
metallic parts. To prevent such short-circuit use a piece of hard paper or other insulating material between them.
Figure 9
Figure 8
H
Service Position
I
Service A
Service B

4 - 1
4 - 1
BLOCK DIAGRAM

4 - 2
4 - 2
WIRING DIAGRAM
; ;
MAIN PCB
PHOEN PCB
VOL PCB
CONTROL PCB
POWER PCB

5 - 1 5 - 1
CONTROL BOARD
TABLE OF CONTENTS
FTD Display Pin Assignment............................................................. 5-1
Voltage .............................................................................................. 5-2
Circuit Diagram( control pcb )............................................................ 5-3
PCB Layout Top & Bottom View( control pcb ) ................................. 5-4
Circuit Diagram( phone & vol pcb ).................................................... 5-5
PCB Layout Top & Bottom View( phone & vol pcb ) .........................5-5
FTD DISPLAY PIN ASSIGNMENT

5 - 2 5 - 2
VOLTAGE
˜˖˅ˈ˄ʳʻʳ˩ˉˆ˄˄˄ʳʼ
PinNO 1 2 3 4 5 6 7 8 9 1011121314151617181920
Voltage 0 4.3 0 4.3 3.3 0 0 5 5 0 0 0 4.5 -13.9 -23 -27.1 -37.1 -23 -16.4 20
Pin NO 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Voltage 20 -18.5 -18.5 -27.1 -24 -27.1 -14.1 -25.1 0 -23.1 -25 -25 4.5 -27 0 -25.3 -25 0 -25.3 -25.3
Pin NO 41 42 43 44 45 46 47 48 49 50 51 52
Voltage ˀ˅ˈ ˀ˅ˈ ˀ˅ˈ ˀ˅ˈ ˀ˅ˈ ˇˁˈ ˃ ˃ ˃ ˃ ˃ ˅ˁ˅
Pin NO b c e Pin NO b c e
Voltage 3.9 3.6 0 Voltage 3.9 4.2 3.6
Q2051
Q2052

5 - 3 5 - 3
CIRCUIT DIAGRAM (control pcb )
1234
1234
A
B
C
A
B
C
C2501 A3
C2502 A4
C2504 B1
C2505 B2
C2506 B2
C2507 B2
C2509 A2
C2510 B3
C2511 B1
C2512 C2
C2513 A2
C2514 B1
C2515 B1
C2516 B2
C2521 B2
C2526 B1
C2527 B1
C2528 B1
C2529 A1
C2530 A1
C2531 A1
C2538 C3
C2539 C3
C2540 C3
C2541 B1
D2501 A2
D2503 C1
D2504 C2
D2507 C2
D2508 C2
D2509 C2
DP2501 A3
IC251 B2
JMP3 C4
JMP4 C4
JMP7 B3
LD2501 A2
Q2501 A2
Q2502 B1
R2253 C1
R2501 A1
R2502 A2
R2504 B1
R2505 B1
R2506 A1
R2507 B1
R2508 A1
R2509 A2
R2510 B2
R2511 B2
R2512 B2
R2513 A1
R2514 B2
R2515 B2
R2516 C2
R2517 C2
R2518 C2
R2519 C2
R2520 B2
R2521 B2
R2522 C2
R2523 C2
R2524 A2
R2525 A2
R2526 A2
R2528 A1
R2529 C1
R2532 A1
R2533 A1
R2534 A1
R2535 A1
R2539 A1
R2540 A1
R2541 B2
R2544 C1
R2545 C1
R2548 A1
R2549 A1
RB201 A1
RB903 A1
RB904 B4
SN251 B1
TA2501 C1
TA2502 C1
TA2503 C1
TA2504 C1
TA2505 C1
TA2506 C1
TA2507 C1
TA2508 C1
TA2509 C1
XL2501 B2
ZD251 B1
ZD252 B1
ZD253 B2
ZD254 A2
ZD255 A1

5 - 4 5 - 4
PCB LAYOUT - TOP VIEW ( control pcb )
PCB LAYOUT - BOTTOM VIEW ( control pcb )
1234
1234
AA
1 432
1 432
A
A
D2501 A1
JMP2 A1
JMP3 A1
JMP4 A1
LD2501 A1
R2253 A1
R2544 A1
TA2505 A1
TA2506 A1
TA2508 A1
TA2509 A1
D2508 A2
JMP10 A2
JMP5 A2
JMP6 A2
JMP7 A2
JMP8 A2
JMP9 A2
TA2503 A2
TA2504 A2
TA2507 A2
C2505 A3
D2503 A3
D2504 A3
D2507 A3
D2509 A3
DP2501 A3
JMP1 A3
JMP11 A3
JMP12 A3
JMP13 A3
JMP14 A3
JMP15 A3
JMP16 A3
JMP17 A3
JMP18 A3
JMP19 A3
JMP20 A3
R2528 A3
RB201 A3
TA2501 A3
C2504 A4
C2513 A4
C2531 A4
JMP21 A4
JMP22 A4
JMP23 A4
JMP24 A4
JMP25 A4
JMP26 A4
JMP27 A4
JMP28 A4
R2502 A4
R2508 A4
R2520 A4
R2532 A4
R2539 A4
R2540 A4
RB903 A4
RB904 A4
SN251 A4
TA2502 A4
XL2501 A4
C2501 A1
C2506 A1
C2507 A1
C2509 A1
C2512 A1
C2514 A1
C2515 A1
C2516 A1
C2541 A1
IC251 A1
Q2502 A1
R2504 A1
R2505 A1
R2506 A1
R2507 A1
R2510 A1
R2511 A1
R2512 A1
R2524 A1
R2525 A1
R2526 A1
ZD251 A1
ZD252 A1
ZD254 A1
ZD255 A1
C2502 A2
C2510 A2
C2511 A2
C2521 A2
C2526 A2
C2527 A2
C2528 A2
C2529 A2
C2530 A2
C2538 A2
C2539 A2
C2540 A2
R2513 A2
R2514 A2
R2515 A2
R2516 A2
R2517 A2
R2518 A2
R2519 A2
R2521 A2
R2522 A2
R2523 A2
R2529 A2
R2533 A2
R2534 A2
R2535 A2
R2541 A2
R2548 A2
R2549 A2
ZD253 A2
R2545 A3
Q2501 A4
R2501 A4
R2509 A4

5 - 5 5 - 5
CIRCUIT DIAGRAM (phone & vol pcb)
12
12
A
B
C
A
B
C
PCB LAYOUT - TOP VIEW ( phone&vol pcb )
1
A
1
A
5
1
1
BB
C2533 C2
C2534 C2
C320 B1
C322 B1
C4510 A1
C4511 A1
C4512 A1
C4513 B1
C4514 B1
CN904 C2
FB311 B1
FB312 B1
FB4501 A1
FB4502 A1
FB4503 A1
JK303 B1
JK401 A1
RB401 A2
VR2501 C2 C2533 A1
C2534 A1
C320 B1
C322 B1
C4510 B1
C4511 B1
C4512 B1
C4513 B1
C4514 B1
CN904 A1
FB311 B1
FB312 B1
FB4501 B1
FB4502 B1
FB4503 B1
JK303 B1
JK401 B1
JMP27 B1
PM9 B1
RB401 B1
VR2501 A1

6 - 1 6 - 1
MAIN BOARD
TABLE OF CONTENTS
Internal IC Diagram ...........................................................................6-1
Circuit Diagram(AMP Board) ............................................................. 6-2
Circuit Diagram(mian pcb)................................................................. 6-3
PCB Layout Top View .......................................................................6-4
PCB Layout Bottom View ..................................................................6-5
Voltage .............................................................................................. 6-6
28 27 26 25 21
2223
24 20 19 18 1516
17
MUTE
Thermal
Shut dowm
10k
10k
10k
10k
25k
25k
25k
15k
Vcc1
123456
78910 11 12 13 14
VINFC TRB-1 RSGO2 VINSL+ REGO1 FWD REV VCC1 VOTR- VOTR+ VOSL+ VOSL- VOFC- VOFC+
MUTE BLAS VINTK TRB-2 NC VINLD GND VCTL NC VCC2 VOLD- VOLD+ VOTK- VOTK+
RGND VCC1
Prc-DR V TRA Y
DRIVER
Sled
Driver(4X)
Actuator
Driver(6X)
Spindle
Driver(4X) Driver(6X)
Actuator
Vcc2
Vcc2
+
-
+
-
+ -
+ -
+ -
+ -
INTERNAL IC DIAGRAM - ES8380FAC
INTERNAL IC DIAGRAM - V5888S HOSP
DVD/CD
Motor
Motor Driver
OPU
SDRAM
(8/16-MB)
EEPROM
ROM/Flash
Video
Audio
Audio
S/P DIF
VFD Driver
TV Display
Speakers
Microphone In
A/V Receiver
VFD Panel
IR Remote
ES8380
Phoenix