Pickering 40-412 User manual

pickeringtest.com
Issue 4.4 January 2020
40-412 User Manual
PXI 32 Channel Digital I/O Module With Programmable
Threshold

Page (II) 32-CHANNEL DIGITAL I/O MODULE 40-412
pickering
Page (II) REED RELAY MODULE 40-110/115/120/125
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© COPYRIGHT (2020) PICKERING INTERFACES. ALL RIGHTS RESERVED.
No part of this publication may be reproduced, transmitted, transcribed, translated or stored in any form, or by
any means without the written permission of Pickering Interfaces.
Technical details contained within this publication are subject to change without notice.
ISO 9001
Reg No. FM38792

Page (III)
32-CHANNEL DIGITAL I/O MODULE 40-412
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Page (III)
REED RELAY MODULE 40-110/115/120/125
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TECHNICAL SUPPORT
For Technical Support please contact Pickering Interfaces either by phone, the website or via e-mail.
WARRANTY
All products manufactured by Pickering Interfaces are warranted against defective materials and workmanship for a period of
three years, excluding programmable power supplies, from the date of delivery to the original purchaser. Any product found to be
defective within this period will, at the discretion of Pickering Interfaces be repaired or replaced.
Products serviced and repaired outside of the warranty period are warranted for ninety days.
Extended warranty and service are available. Please contact Pickering Interfaces by phone, the website or via e-mail.
ENVIRONMENTAL POLICY
Pickering Interfaces operates under an environmental management system similar to ISO 14001.
Pickering Interfaces strives to full all relevant environmental laws and regulations and reduce wastes and releases to the
environment. Pickering Interfaces aims to design and operate products in a way that protects the environment and the health and
safety of its employees, customers and the public. Pickering Interfaces endeavours to develop and manufacture products that can
be produced, distributed, used and recycled, or disposed of, in a safe and environmentally friendly manner.
Worldwide Technical Support and Product Information
pickeringtest.com
Germany
Tel: [phone]
E-mail: [email protected]
Sweden
Tel: [phone]
E-mail: [email protected]
USA
Tel: (West) [phone]
Tel: (East) [phone]
E-mail: [email protected]
Czech Republic
Tel: [phone]
E-mail: [email protected]
France
Tel [phone]
E-mail [email protected]
Pickering Interfaces Headquarters
Stephenson Road Clacton-on-Sea CO15 4NL United Kingdom
Tel: [phone]
E-Mail: [email protected]
China
Tel: [phone]
E-mail: [email protected]

Page (IV) 32-CHANNEL DIGITAL I/O MODULE 40-412
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Page (IV) REED RELAY MODULE 40-110/115/120/125
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MEANING / DESCRIPTION SYMBOL SIGNIFICATION / DESCRIPTION
PROTECTIVE EARTH (GROUND)
To identify any terminal which is intended
for connection to an external conductor for
protection against electric shock in case of
a fault, or the terminal of a protective earth
(ground) electrode.
MISE À LA TERRE
Pour identier les bornes destinées à être
raccordées à un conducteur externe de
protection contre les chocs électriques en cas
de défaut d’isolement, ou pour marquer la
borne de mise à la terre.
DANGEROUS VOLTAGE
To indicate hazards arising from dangerous
voltages.
TENSION DANGEREUSE
Pour indiquer les dangers découlant des
tensions dangereuses.
WARNING / CAUTION
An appropriate safety instruction should
be followed or caution to a potential hazard
exists.
Refer to the relevent instructions detailed
within the product manual.
AVERTISSEMENT - ATTENTION
Des consignes de sécurité appropriées
doivent être suivies. En cas de danger
potentiel existant, prendre des précautions.
Consulter les instructions détaillées dans le
manuel du produit.
HEAVY
If this product is heavy reference should be
made to the safety instructions for provisions
of lifting and moving.
CHARGE LOURDE
Si ce produit est lourd il convient de se
référer aux consignes de sécurité pour les
dispositions de levage et de déplacement.
STATIC SENSITIVE
To indicate that static sensitive devices are
present and handling precautions should be
followed.
SENSIBILITÉ STATIQUE
Pour indiquer que des appareils sensibles
statiques sont présents et les précautions de
manipulation doivent être suivies.
!
kg
The following safety symbols may be used on the
product and throughout the product documentation.
Les symboles de sécurité suivants peuvent être
utilisés sur le produit et dans l’ensemble de la
documentation produit.
SAFETY SYMBOLS SYMBOLES DE SÉCURITÉ
PRODUCT SAFETY LA SÉCURITÉ DES PRODUITS

Page (V)
32-CHANNEL DIGITAL I/O MODULE 40-412
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Copyright Statement ...................................................................II
Technical Support and Warranty................................................III
Product Safety .............................................................................IV
Contents (this page)....................................................................V
Warnings and Cautions ..............................................................VII
Section 1
Technical Specication...............................................................1.1
Section 2
Technical Description .................................................................2.1
Functional Description.......................................................2.1
Guidance on Using The 40-412 .........................................2.2
Section 3
Installation....................................................................................3.1
Pre Operation Checks........................................................3.1
Hardware Installation .........................................................3.1
Software Installation ..........................................................3.3
Testing Operation ...............................................................3.4
Section 4
Programming Guide....................................................................4.1
Programming Options for PXI Modules ...........................4.1
40-412 Digital Input-Output Sub-Units..............................4.2
Using The Direct I/O Driver or VISA Driver ......................4.4
Input Threshold Voltage Bit Patterns ...............................4.7
Section 5
Connector Information................................................................5.1
Section 6
Troubleshooting ..........................................................................6.1
Section 7
Maintenance Information............................................................7.1
Verication Procedure .......................................................7.2
Verication Test Results ....................................................7.5
Input/Output Look-Up Tables - 40-412-001.......................7.6
Input/Output Look-Up Tables - 40-412-111 .......................7.8
CONTENTS

Page (VI) 32-CHANNEL DIGITAL I/O MODULE 40-412
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THIS PAGE INTENTIONALLY BLANK

Page (VII)
32-CHANNEL DIGITAL I/O MODULE 40-412
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Page (VII)
GENERAL PURPOSE 2A RELAY MODULE 40-131/132
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!
WARNINGS
AND CAUTIONS
AVERTISSEMENTS
ET PRÉCAUTIONS
WARNING
HAZARDOUS ENVIRONMENTS SYMBOL AVERTISSEMENT ENVIRONNEMENTS DANGEREUX
This product is not specically designed for use in
hazardous environments, for example in explosive
atmospheres. If the product is to be used in
hazardous environments we recommend that the
user ensures suitable protective measures are
taken.
Ce produit n’est spéciquement pas conçu pour un
usage dans des environnements dangereux, par
exemple en atmosphères explosives. Si le produit doit
être utilisé dans des environnements dangereux, nous
recommandons à l’utilisateur de s’assurer que des
mesures de protection appropriées soient prises.
WARNING
DANGER OF ELECTRIC SHOCK SYMBOL AVERTISSEMENT DANGER DE CHOC ELECTRIQUE
This module may contain hazardous voltages.
Before removing the module from the rack remove
all supplies and disconnect user I/O signals.
Unused slots in the PXI/LXI chassis are populated
with blanking plates to prevent access to user I/O
signals that may be present. Blanking panels are
available to order from Pickering in a variety of slot
widths. If the product is not used in this manner for
example by using an extender card then additional
care must be taken to avoid contact with exposed
signals.
Not to be used in safety critical circuits, refer to the
Pickering Interfaces’ terms & conditions of sale.
This module must not be used for the switching of
Mains Circuits. For the switching of voltages up to
the module’s full specication, Secondary Circuit
power supplies and the Device Under Test must be
fully isolated from the Mains Circuit and the safety
earth.
The host chassis must be correctly installed and
be connected to mains or factory safety ground,
please refer to your chassis installation manual.
Ce module peut contenir des tensions dangereuses.
Avant de retirer le module de la baie, enlever toutes les
fournitures et déconnecter les signaux d’E/S utilisateur.
Les slots non utilisés dans le châssis PXI/LXI sont
peuplées d’obturateurs pour empêcher l’accès aux
signaux d’E/S utilisateur qui peuvent être présents.
Les obturateurs sont disponibles sur commande chez
Pickering dans une variété de largeur de fente. Si le
produit est utilisé sans obturateur, par exemple en
utilisant une carte d’extension, alors des précautions
supplémentaires doivent être prises pour éviter tout
contact avec les signaux exposés.
Ne pas utiliser dans des circuits critiques de sécurité, se
référer à nos Conditions Générales de Ventes.
Ce module ne doit pas être utilisé pour la commutation
des circuits principaux. Pour la commutation de
tensions jusqu’à la spécication complète du module,
les alimentations des circuits secondaires et l’appareil
sous test doivent être complètement isolés des circuits
principaux et de la terre de sécurité.
Le châssis hôte doit être correctement installé et
connecté à la terre ou au réseau de sécurité d’usine.
Veuillez-vous reporter au manuel d’installation de votre
châssis.
Diagram Showing Separation Between The
Mains Circuit and Secondary Circuit / DUT
Diagramme Montrant la Séparation Entre
le Circuit Principal et le Circuit Secondaire
For the purposes of this document, a Mains Circuit is
an installation classied as Overvoltage Category II up
to 300V. Separation between the Secondary Circuit and
Mains Circuit is achieved by a transformer in which the
primary windings are separated from the secondary
windings by reinforced insulation, double insulation, or a
screen connected to the protective conductor terminal.
Aux ns du présent document, un circuit principal est une
installation classée dans la Catégorie de Surtension Groupe
II jusqu’à 300V. la séparation entre le circuit secondaire et le
circuit principal est réalisée par un transformateur dans lequel
les enroulements primaires sont séparés des enroulements
secondaires par une isolation renforcée, une double isolation
ou un blindage relié à la borne de conducteur de protection.
PXI
Switching
Module
Device
Under
Test
Host Chassis
Secondary Circuit
Mains
Circuit
Mains
Circuit Power
Supply
Power
Supply
Mains/Factory
safety ground
Module
Commutation
PXI
Appareil
Sous
Test
Châssis Hôte
Circuit Secondaire
Circuit
Principal
Circuit
Principal
Alimentation
Alimentation
Secteur/Réseau
de sécurité au
sol de l’usine

Page (VIII) 32-CHANNEL DIGITAL I/O MODULE 40-412
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Page (VIII) GENERAL PURPOSE 2A RELAY MODULE 40-131/132
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CAUTION - HANDLING OF
ELECTROSTATIC-SENSITIVE
SEMICONDUCTOR DEVICES
SYMBOL
ATTENTION - MANIPULATION DES
APPAREILS SENSIBLES
ELECTROSTATIQUES
Certain semiconductor devices used in
this equipment are liable to damage due
to static voltage. Observe the following
precautions when handling these devices in
their unterminated state, or sub-assemblies
containing these devices:
1. Persons removing sub-assemblies from
equipment using these devices must be
earthed by a wrist strap and a resistor at
the point provided on the equipment.
2. Soldering irons used during the repair
operations must be low voltage types with
earthed tips and isolated from the mains
voltage by a double insulated transformer.
3. Outer clothing worn must be unable to
generate static charges.
4. Printed Circuit Boards (PCBs) tted
with these devices must be stored and
transported in anti-static bags.
Certains appareils semi-conducteurs utilisés
dans cet équipement sont susceptibles d’être
endommager en raison de la tension statique.
Respectez les précautions suivantes lorsque
vous manipulez ces appareils dans leur état
non terminé, ou sous-ensembles contenant ces
appareils :
1. Les personnes démontant partiellement
l’équipement à l’aide de ces appareils doivent
être mises à la terre par bracelet antistatique et
une résistance au point prévu sur l’équipement.
2. Les fers à souder utilisés pendant les
opérations de réparation doivent être de type
“basse tension” avec des bouts reliés à la terre
et isolés à partir de la tension du réseau par un
transformateur à double isolation.
3. Les vêtements externes ne doivent pas générer
des charges électrostatiques.
4. Les cartes de circuits imprimés (PCB) équipées
de ces appareils doivent être entreposées et
transportées dans des sacs antistatiques.
CAUTION
PRODUCT DOCUMENTATION SYMBOL ATTENTION DOCUMENTATION PRODUIT
Suitably qualied & trained users should
ensure that the accompanying documentation
is fully read and understood before
attempting to install or operate the product.
Les utilisateurs qualiés et formés doivent veiller
à ce que la documentation soit entièrement lue
et comprise avant l’installation ou l’utilisation du
produit.
SAFETY INSTRUCTIONS
SAFETY INSTRUCTIONS CONSIGNES DE SÉCURITÉ
All cleaning and servicing requires the equipment
to be isolated and disconnected from the
power source and user I/O signals (refer to the
Maintenance Section).
• Appropriate manual handling procedures should
be followed as dictated by the weight of the
individual module or the combined weight of the
modules & chassis.
• Should a fault occur with the module or chassis,
immediately isolate and disconnect the incoming
power to the chassis and the user I/O signals.
• Ensure the equipment is installed, operated and
maintained by trained and authorised personnel.
• For suitably equipped products in the event of
an emergency press the red “emergency stop”
button situated on the front of the unit.
Les travaux de nettoyage et de réparation nécessitent
que l’équipement soit isolé et déconnecté de la source
d’alimentation et des signaux d’E/S utilisateur (voir la
section Entretien).
•Les procédures de manipulation manuelle appropriées
doivent être suivies en fonction du poids du module
seul ou le poids combiné des modules et du châssis.
•En cas de défaut avec le module ou le châssis, isoler
immédiatement et débrancher l’alimentation entrant au
châssis et les signaux d’E/S utilisateur.
•S’assurer que le matériel est installé, utilisé et entre-
tenu par du personnel formé et autorisé.
•Pour les produits convenablement équipés, en
cas d’urgence, appuyez sur le bouton rouge “arrêt
d’urgence” situé sur l’avant de l’unité.
!

Page 1.1
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 1 - TECHNICAL SPECIFICATION
SECTION 1 - TECHNICAL SPECIFICATION
pickeringtest.com
PXI 32 Channel I/O - Programmable Threshold 40-412
ISSUE 5.1 SEP 2019
• 32-Channel Input
• Dual Programmable Voltage Threshold, 0.3 to 50V
• Serial or Parallel Acquisition Versions
• High Input Voltage Tolerance
• 32-Channel Output
• High Side or Low Side Driving
• 0.5A Low Side Sink Capability
• 0.4A High Side Source Capability
• Fully Protected Outputs
• High Side External Voltage Input
• VISA, IVI & Kernel Drivers Supplied for Windows
• Supported by PXI or LXI Chassis
• 3 Year Warranty
The 40-412 is a 32-channel Digital I/O module with high output
voltage and current capability and a dual variable threshold input.
The 32 outputs can be used for high or low drive and each channel
is capable of sourcing 0.4A from the high side or 0.5A sink on the
low side. Accidental operation of both high and low side driver on
the same channel is prevented by the supplied driver. Outputs
are fully protected against over-voltage, over-current and thermal
overload, ensuring robust and reliable operation in the toughest
test environments. For high side driving, the voltage source is
supplied externally, allowing the module to drive high capacity
loads separate from the PXI chassis power supply. For low side
driving, the external source is not used and the module’s output
operates an open collector or open drain driver.
The built in protection systems include an over-voltage clamp so
the module can drive relay coils without the use of y back diodes.
The states of the 32 input channels are read via the PXI interface
by comparing the input level to two threshold voltages. These can
be set between 0.3V and 50V and have a resolution of 12.5mV.
This allows the input to be tested against system limits that dene a
logic low or logic high.
The module is available in two versions with different read back
methods. The 40-412-001 uses series acquisition to capture
the input status using a single set of comparators. The driver
includes a facility to capture the status of all 32 inputs with a single
command. The 40-412-111 has parallel acquisition using 32 sets
of comparators to synchronously capture all input states and read
them in a single operation.
Each input can withstand the accidental application of voltage
greater than 100V. The inputs can be user connected to the
outputs without risk of damage, allowing the module to operate as
32 channels of independent input and output or as 32 channels of
congurable I/O.
Connection to the module’s input and outputs is via an easy to
use 78-pin D-type connector which is fully supported by a range of
connector accessories.

Page 1.2 32-CHANNEL DIGITAL I/O MODULE 40-412
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SECTION 1 - TECHNICAL SPECIFICATION
32 Channel Digital I/O – 40-412
pickeringtest.com
Overview
PCI
INTERFACE
PXI
BUS
Vext
1
2
32
1
2
32
Digital Outputs
Digital Inputs
High Side
Driver
Low Side
Driver
Vext
GND
En
En
Output 1
Output 2
Output 32
32-Channel
Attenuator
32-Channel
Dual
Threshold
Detector
Ref1
Ref2
Functional Diagram for
40-412-111 32-Channel
Digital I/O Module With
Parallel Input Acquisition
Functional Diagram for
40-412-001 32-Channel
Digital I/O Module With
Serial Input Acquisition
PCI
INTERFACE
PXI
BUS
Vext
1
2
32
1
2
32
Digital Outputs
Digital Inputs
High Side
Driver
Low Side
Driver
Vext
GND
En
En
Output 1
Output 2
Output 32
32
Attenuator
MUX
1
Dual
Threshold
Detector
Ref1
Ref2

Page 1.3
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 1 - TECHNICAL SPECIFICATION
32 Channel Digital I/O – 40-412
pickeringtest.com
Specifications
Output Specification
No. of Output Channels: 32
Output States: Driven high, driven low or off.
Low Side Driver Output
Resistance: 0.6Ωat 0.5A
High Side Driver Output
Voltage: Vext less 1.5V at 0.4A
Maximum Current: 0.5A for Low Side drivers,
0.4A for High Side drivers,
10A module total (40-412-001),
8A module total (40-412-111),
Maximum Voltage: +50V*
Output Protection: Current limited, overvoltage limited,
thermal protection. Overvoltage
limit can be used to limit back emf
generated from inductive loads such
as relay coils.
Vext: User supplied +5V to +50V, applied
to multiple pins of user connector,
relative to front panel ground.
* For full voltage rating, signal sources must be fully isolated from
mains supply and safety earth.
Power Requirements
+3.3V +5V +12V -12V
0 0.1A 0.05A 0.05A
Operating/Storage Conditions
Operating Conditions
Operating Temperature:
Humidity:
Altitude:
0°C to +55°C
Up to 90% non-condensing
5000m
Storage and Transport Conditions
Storage Temperature:
Humidity:
Altitude:
-20°C to +75°C
Up to 90% non-condensing
15000m
PXI & CompactPCI Compliance
The module is compliant with the PXI Specication 2.2. Local Bus,
Trigger Bus and Star Trigger are not implemented.
Uses a 33MHz 32-bit backplane interface.
Safety & CE Compliance
All modules are fully CE compliant and meet applicable EU
directives: Low-voltage safety EN61010-1:2010, EMC Immunity
EN61326-1:2013, Emissions EN55011:2009+A1:2010.
Mechanical Characteristics
Single slot 3U PXI (CompactPCI card).
Module weight: 180g.
3D models for all versions in a variety of popular le formats are
available on request.
Connectors
PXI bus via 32-bit P1/J1 backplane connector.
Signals via front panel 78-pin male D-Type connector, for pin outs
please refer to the operating manual.
Input Specification
No. of Input Channels: 32
Logic Threshold: Compares selected input voltage
against two reference voltages,
each of which can be set from
0.3 to 50V with 12.5mV setting
resolution.
40-412-001 uses serial acquisition
40-412-111 uses faster parallel
acquisition from a common pair of
threshold voltages.
Settling Time (40-412-001): 50µs following a state change or
channel selection.
Typical read back time for all 32
states 1.3ms.
Settling Time (40-412-111): 5μs following a state change.
Read back time for all 32 states
50μs typical.
Channel Selection: Single channel selection or
automated sequential access to all
32 channels.
Maximum Input Voltage: 100V*
Input Impedance: 1MΩ
* For full voltage rating, signal sources must be fully isolated from
mains supply and safety earth.

Page 1.4 32-CHANNEL DIGITAL I/O MODULE 40-412
pickering
SECTION 1 - TECHNICAL SPECIFICATION
32 Channel Digital I/O – 40-412
pickeringtest.com
Ordering Information
Mating Connectors & Cabling
For connection accessories for the 40-412 series please refer
to the 90-006D 78-pin D-Type Connector Accessories data
sheet where a complete list and documentation can be found for
accessories, or refer to the Connection Solutions catalog.
Product Order Codes
32-Channel Digital I/O Module - Serial Input
Acquisition, Programmable Threshold
40-412-001
32-Channel Digital I/O Module - Parallel
Input Acquisition, Programmable Threshold
40-412-111
Product Customization
Pickering PXI modules are designed and manufactured on our own
exible manufacturing lines, giving complete product control and
enabling simple customization to meet very specic requirements.
All customized products are given a unique part number, fully
documented and may be ordered at any time in the future. Please
contact your local sales ofce to discuss.

Page 1.5
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 1 - TECHNICAL SPECIFICATION
32 Channel Digital I/O – 40-412
pickeringtest.com
Supporting Products & Software
We also offer customized cabling and have a free online Cable Design Tool that can be
used to create custom cable solutions for many applications.
Visit: pickeringtest.com/cdt to start your design.
Mass Interconnect
We recommend the use of a mass interconnect solution when an Interchangeable Test
Adapter (ITA) is required for a PXI or LXI based test system. Our modules are fully
supported by both Virginia Panel and MacPanel.
Pickering Reed Relays
We are the only switch provider with in-house reed relay manufacturing capability via
our sister company, Pickering Electronics. These instrument grade reed relays feature
SoftCenter® technology, ensuring long service life and repeatable contact performance.
To learn more, please go to: pickeringrelay.com
Chassis Compatibility
This PXI module must be used in a suitable chassis. It is compatible with the following chassis types:
• All chassis conforming to the 3U PXI and 3U Compact PCI (cPCI) specication
• Legacy and Hybrid Peripheral slots in a 3U PXI Express (PXIe) chassis
• Pickering Interfaces LXI or LXI/USB Modular Chassis
Chassis Selection Guide
Standard PXI or hybrid PXIe Chassis from any Vendor:
• Mix our 1000+ PXI switching & simulation modules with any
vendor’s PXI instrumentation
• Embedded or remote Windows PC control
• Real-time Operating System Support
• High data bandwidths, especially with PXI Express
• Integrated module timing and synchronization
Pickering LXI or LXI/USB Modular Chassis—only accept
our 1000+ PXI Switching & Simulation Modules:
• Ethernet or USB control enables remote operation
• Low-cost control from practically any controller
• LXI provides manual control via Web browsers
• Driverless software support
• Power sequencing immunity
• Ethernet provides chassis/controller voltage isolation
• Independence from Windows operating system
Connectivity Solutions
We provide a full range of supporting cable and connector solutions for all our switching products—20 connector families with 1200+
products. We offer everything from simple mating connectors to complex cables assemblies and terminal blocks. All assemblies are
manufactured by Pickering and are guaranteed to mechanically and electrically mate to our modules.
Connectors & Backshells Multiway Cable Assemblies RF Cable Assemblies Connector Blocks

Page 1.6 32-CHANNEL DIGITAL I/O MODULE 40-412
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SECTION 1 - TECHNICAL SPECIFICATION
32 Channel Digital I/O – 40-412
pickeringtest.com
Supporting Products & Software
© Copyright (2020) Pickering Interfaces. All Rights Reserved Pickering Interfaces maintains a commitment to continuous product development, consequently we reserve the right to vary from the description given in this data sheet.
Programming
Pickering provide kernel, IVI and VISA (NI & Keysight) drivers which are compatible with all Microsoft supported versions of Windows and
popular older versions. For a list of all supporting operating systems, please see: pickeringtest.com/os
The VISA driver is also compatible with Real-Time Operating Systems such as LabVIEW RT. For other RTOS support contact Pickering.
These drivers may be used with a variety of programming environments and applications including:
• Pickering Interfaces Switch Path Manager
• National Instruments products (LabVIEW, LabWindows/CVI, Switch Executive, MAX, TestStand, VeriStand, etc.)
• Microsoft Visual Studio products (Visual Basic, Visual C+)
• Keysight VEE and OpenTAP
• Mathworks Matlab
• Marvin ATEasy
• MTQ Testsolutions Tecap Test & Measurement Suite
Drivers for popular Linux distributions are available, other environments are also supported, please contact Pickering with specic enquiries.
We provide Soft Front Panels (SFPs) for our products for familiarity and manual control, as well as comprehensive documentation and
example programs to help you develop test routines with ease.
To learn more about software drivers and development environments, please go to:
pickeringtest.com/software
Signal Routing Software
Our signal routing software, Switch Path Manager, automatically selects and energizes switch
paths through Pickering switching systems. Signal routing is performed by simply dening test
system endpoints to be connected together, greatly accelerating Test System software
development. To learn more, please go to: pickeringtest.com/spm
Diagnostic Relay Test Tools
eBIRST Switching System Test Tools are designed specically for our PXI, PCI or LXI
products, these tools simplify switching system fault-nding by quickly testing the system
and graphically identifying the faulty relay.
To learn more, please go to: pickeringtest.com/ebirst
Three Year Warranty & Guaranteed Long-Term Support
All standard products manufactured by Pickering Interfaces are warranted against defective materials and workmanship for a period of three
years from the date of delivery to the original purchaser. Extended warranty and service agreements are available for all our modules and
systems with various levels to suit your requirements. Although we offer a 3-year warranty as standard, we also include guaranteed long-
term support—with a history of supporting our products for typically 15-20 years. To learn more, please go to: pickeringtest.com/support
Available Product Resources
We have a large library of product resources including success stories, product and support videos, articles, as well as complete product
catalogs and product reference maps to assist when looking for the switching, simulation and cable and connector solutions you need.
We have also published handy reference books on Switching Technology and for the PXI and LXI standards.
To view, download or request any of our product resources, please visit: pickeringtest.com/resources

Page 2.1
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 2 - TECHNICAL DESCRIPTION
SECTION 2 - TECHNICAL DESCRIPTION
FUNCTIONAL DESCRIPTION
A functional block diagram is provided in Figure 2.1. The Module is powered by the +5V, +12V and -12V supplies
from the PXI backplane via Compact PCI connector J1. The interface to the user’s equipment is via the front panel
mounted 78-pin D-type connector, J2.
The module’s 32 channel output section comprises High Side and Low Side drivers U26 to U89 and Shift Registers
U18 to U25. The shift registers control the output drivers and are supplied with serial data from the PCI Bridge, U1,
via the control logic. Each output can be switched to either sink current to the GND terminal via a Low Side driver
device, or source current from the Vext terminal via a High Side driver device.
For the 40-412-001 version with serial input acquisition, the module’s 32 input channels are rst fed through an
attenuator circuit, then multiplexed to a single analog stream using U13 and U14. A programmable threshold detector
circuit, U15 and U16, converts the analog signal into a digital data stream determined by the high and low thresholds
programmed by the user. The input data is then read by the PCI Bridge via the control logic.
For the 40-412-111 version with parallel input acquisition, the input circuitry is tted to a daughter board which is
mounted on top of the mother board. The module’s 32 input channels are rst fed through an attenuator circuit, then
comparator devices U17 to U32 determine whether each input signal is greater than the two thresholds programmed
by the user. The resultant 64 data bits are latched by U33 to U40 and read by the PCI Bridge.
The PCI Bridge is congured by EEPROM U2, the module conguration is stored in EEPROM U11.
78-PIN D-TYPE
CONNECTOR
J2
MODULE
CONFIGURATION
U11
PCI
BRIDGE
FPGA
U1
PCI BRIDGE
CONFIGURATION
U2
TERMINATING
RESISTORS
R1 TO R12
COMPACT PCI
BUS
CONNECTOR
J1
+5V
0V
HIGH SIDE &
LOW SIDE
DRIVERS
U26 to U89
SHIFT
REGISTERS
U18 to U25
CONTROL
LOGIC
U2 to U10
+12V
-12V
VOLTAGE
REGULATOR
U17
+2.5V
INPUT
ATTENUATOR
R50 to R145
ANALOG
MUX
U13 & U14
PROGRAMMABLE
THRESHOLD
DETECTOR
U15 & U16
Vext
GND
INPUT
ATTENUATOR
R50 to R145
COMPARATORS
U17 & U32
DATA
LATCHES
U33 & U40
40-412-111 PARALLEL INPUT ACQUISITION - DAUGHTER BOARD
40-412-001 SERIAL INPUT ACQUISITION - MOTHER BOARD
Figure 2.1 - Digital I/O Module 40-412: Functional Block Diagram

Page 2.2 32-CHANNEL DIGITAL I/O MODULE 40-412
pickering
SECTION 2 - TECHNICAL DESCRIPTION
GUIDANCE ON USING THE 40-412
Output Drivers
The 40-412 provides two output driver types on each of the 32 channels:
•High Side Driver. The high side driver allows the user to set the output voltage actively high to an externally
supplied voltage source. The external voltage source can be between +5V and +50V relative to ground.
•Low side driver. The low side driver actively connects the output to ground.
The software driver inhibits both the high and low side drivers being turned on at the same time.
Each driver output is fully protected from thermal, voltage or current overloads. However, continuous operation at
voltages beyond the stated ratings may cause damage.
Each driver contains overvoltage protection that can be used to protect the driver from inductive back EMF spikes
generated when turning coil currents off. Using this protection to manage the back EMF will not cause damage to
the driver, however the sudden current change can generate EMC events. Pickering Interfaces recommends that
where possible the user should provision local measures (such as a ywheel diode) to limit the back EMF current
ow through the cables.
The user can select both drivers to be inactive to provide a tri-state (open) output voltage.
The external voltage source needs to be applied only if the high side driver is required to be used, it can grounded
or left unconnected if the high side driver is not required to be used.
Driving Inductive Loads
Users can use the high/low side drivers to drive highly inductive loads such as the coils of relays or solenoids, the
protection circuits in the 40-412 will ensure the drivers are not easily damaged. However, it is recommended that
precautions are taken to manage the resulting EMC issues that might arise.
High Side
Driver
Vext
FP_GND
En
40-412
GND
D1
D3
D2
Output
External Voltage
Figure 2.2 - Using the 40-412: Driving an inductive load with a High Side Driver
When using the high side driver, on driver closure, current will build in the coil until it reaches a steady state. When
the driver is opened, the energy in the inductor will need to be discharged. This discharge can be through the diode
inside the 40-412 (D1, Figure 2.2) - this will not damage the 40-412. However, the discharge may cause a ground
spike that may result in EMC emission. We recommend that where possible a local diode is tted (D2, Figure 2.2)
which will reduce the ground current owing and reduce the EMC emissions.

Page 2.3
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 2 - TECHNICAL DESCRIPTION
When using the low side driver a similar effect occurs when the driver is opened. The inductive energy stored is
discharged by the voltage on the 40-412 output becoming positive and a clamp diode (D1, Figure 2.3) acting to
protect the driver. It is recommended that the user ts a ywheel diode (D2, Figure 2.3) to discharge the inductive
energy. If a ywheel diode is not tted, the 40-412 will clamp the output at a voltage between 60V and 80V relative
to the front panel ground, the voltage being dependent upon the breakdown voltage of D1, Figure 2.3.
Driving Capacitive Loads
The 40-412 can be used to drive capacitive loads. When the driver is closed, the current limit protection circuit will
limit the current owing into the capacitive load. Continuous rapid connection and disconnection to a capacitive load
may result in the thermal protection circuits preventing further operation. If this occurs, simply allow the 40-412 to
cool down, after which normal operation will resume.
Vext Connection
When using the high side drivers, Vext is required to provide the current to the 40-412 output circuits. The Vext
connection is made using multiple pins on the D-type connector. It is strongly recommended that if high load
currents are expected, then all the available pins are used to spread the current load in order to avoid damaging the
connector. The connections to Vext are internally linked together in the 40-412, so specic pins are not required to
be used for a particular bank of drivers. To maximize connector life we suggest using 5 Amps per pin or less. Users
should not apply negative voltages (relative to ground) to Vext or apply voltages greater than +50V.
FP_GND Connection
When using the low side drivers, FP_GND is required to sink the current from the 40-412 output circuits. The FP_
GND connection is made using multiple pins on the D-type connector. It is strongly recommended that if high load
currents are expected, then all the available pins are used to spread the current load in order to avoid damaging
the connector. The connections to FP_GND are internally linked together in the 40-412, so specic pins are not
required to be used for a particular bank of drivers. To maximize connector life we suggest using 5 Amps per pin
or less. Spare FP_GND Connections can be used for the purpose of screening or shielding in cable assemblies or
connector blocks
Using High and Low Side Drivers
The user can select on an individual channel basis whether a high side or low side driver is used. In Figure 2.2, D3
prevents the discharge of energy into Vext when the low side driver is operated.
Low Side
Driver
Vext
FP_GND
En
40-412
GND
D1
D2
Output
C
Figure 2.3 - Using the 40-412: Driving an inductive load with a Low Side Driver

Page 2.4 32-CHANNEL DIGITAL I/O MODULE 40-412
pickering
SECTION 2 - TECHNICAL DESCRIPTION
INPUT CONNECTION
Each of the 32 channels can be compared to two voltage references levels. The reference level is set by a 12 bit
digital word with full scale corresponding to 50V and zero to 0V. In the case of the 40-412-001, the user selects the
channel to be monitored by setting the input MUX to the required channel. The use of two threshold levels makes
it easier for a user to determine the status of the input. For example, a typical application might be in a system
operating from 28V supplies where the state needs to be established using a criteria equivalent to 20% of the supply:
• First threshold is set to 5.6V (20% of 28V), a low condition will indicate the state is low.
• Second threshold is set to 22.4V (80% of 28V) to conrm a high state.
• Intermediate conditions can be detected since the input is above the rst threshold but below the second
threshold.
Since the state is read at the same instant against each threshold, measurements are not confused by dynamically
changing voltages.
With the 40-412-001, all 32 channels can be monitored by checking each input in turn, but the user should be aware
that with dynamically changing signals these measurements are not made at the same instant in time. A command
is also available to extract the state of all 32 channels by automated sequential sampling.
As the 40-412-111 has parallel input sampling, all inputs are compared to the programmable voltage reference levels
at the same time.
Vext and GND Break Detection
Some applications require a test to ensure that an input connection is not broken. For a connection that is set be at
Vext the 1MΩ input impedance to the input will drag the voltage down to ground in the event of a break. To detect a
break to a signal that is supposed to be at ground potential this will not give a good indication. However, if the input
is connected by an external 1MΩ resistor to Vext then in the event that there is a break the signal will go to 0.5 of
Vext and the dual detection thresholds can be set to detect this.
Example:
Vext is 28V, the thresholds are set at 4V and 24V. The input will appear to be in the mid voltage state of 14V,
greater than 4V but less than 24V and the signal break can be detected.
Settling Time 40-412-001
The input monitoring is designed for operation with static or relatively infrequently changing inputs, such as those
associated with relay coils, alarms and visual indicators.
The input circuits exhibit an input time constant of approximately 10µs (measured as an RC time constant). Allowing
5 RC time constants is sufcient for a changed state to be accurately returned. For the 40-412-001, a state of change
at a rate of greater than 10kHz may result in an intermediate condition being regularly returned. No damage can
result from operation above 10kHz.
Settling Time 40-412-111
The 40-412-111 uses a synchronous acquisition process that samples all the 32 states at the same time, eliminating
the settling time constants associated with the switching system. The 40-412-111 is more suited to applications
where states may be changing and users wish the states to be sampled at the same instant in time. The input
states are captured and then read back to the PXI control system through a serial process. The read back speed
is dependent on the speed of the controller, modern controllers will read back the 32 states in between about 10µs
and 30µs.
CONNECTING INPUT AND OUTPUT
It is permitted for a user to connect an input and output channel together using external wiring (for example in a
connector block). In this way the input can be used to check that the output connection is being correctly driven.
It should be noted that if the output is set tri-state (both drivers off) the input impedance to the input channel will drag
the output voltage to a low state in the absence of any external source of voltage or current.
Note that when the inputs and outputs are wired together by the user and both the high side and low side drivers are
off, the input/output state will be asserted low. This is due to the impedance of the input connection.

Page 3.1
32-CHANNEL DIGITAL I/O MODULE 40-412
pickering SECTION 3 - INSTALLATION
Page 3.1
REED RELAY MODULE 40-110/115/120/125
pickering SECTION 3 - INSTALLATION
!
!
kg
Refer to the Warnings and Cautions
at the front of this manual
Reportez-vous aux Avertissements et
Mises en garde au début du manuel.
Modular products require installation in a suitable
PXI/LXI chassis. The module is designed for indoor
use only.
Les produits modulaires nécessitent une installation
dans un châssis PXI/LXI approprié. Le module est
conçu pour une utilisation en intérieur.
PREOPERATION CHECKS
(UNPACKING)
CONTRÔLES AVANT UTILISATION
(DÉBALLAGE)
1. Check the module for transport damage and report
any damage immediately to Pickering Interfaces.
Do not attempt to install the product if any damage
is evident.
2. Position the chassis relative to any other equipment
the module(s) will connect with. Ensure the chassis
is not connected to the electrical supply.
3. Ensure that the designated area for the chassis
containing the module is of at and solid construction
to withstand and support the combined weight of
the module and chassis.
1. Vériez que le module n’est pas été endommagé
pendant le transport et signalez immédiatement tout
dommage à Pickering Interfaces. N’essayez pas
d’installer le matériel si des dégâts sont évidents.
2. Placez le châssis contenant le module par rapport
à tout autre équipement qui est censé se connecter
avec. Assurez-vous que le châssis n’est pas
connecté à l’alimentation électrique.
3. Assurez-vous que la zone désignée pour le châssis
contenant le module est de construction plate et
solide an de résister et supporter le poids du
module et le châssis.
HARDWARE INSTALLATION
ELECTRICAL CONNECTION
(CHASSIS)
INSTALLATION DU MATÉRIEL
RACCORDEMENT ÉLECTRIQUE
(CHASSIS)
1. The chassis containing the module must be
electrically installed in accordance with local
regional electrical codes by a qualied engineer.
2. The chassis containing the module must be
grounded.
1. Le châssis contenant le module doit être installé
électriquement en conformité aux normes en
vigueur par un ingénieur qualié.
2. Le châssis contenant le module doit être mis
à la terre.
Electrostatic discharge can damage the components
on the module. To avoid such damage in handling the
board refer to page VII.
Ensure that there is adequate ventilation.
Les décharges électrostatiques peuvent endommager
les composants du module. Pour éviter de tels
dommages en manipulant la carte se reporter
à la Page VII.
Assurez-vous que la ventilation est adéquate.
SECTION 3
INSTALLATION
SECTION 3
INSTALLATION
!
kg
!

Page 3.2 32-CHANNEL DIGITAL I/O MODULE 40-412
pickering
SECTION 3 - INSTALLATION
Page 3.2
SECTION 3 - INSTALLATION pickering
REED RELAY MODULE 40-110/115/120/125
The module should be installed in accordance with
the following procedure:
1. Ensure that the system is turned OFF but still
connected to mains so that it remains grounded.
2. Choose an appropriate slot in the rack.
3. Remove the blanking plate for the chosen slot.
4. Ensure that the injector/ejector handle is in its
downward position. Align the module with the card
guides on the top and bottom of the slot.
Do not raise the injector/ejector handle whilst
inserting the module as the module will not insert
properly.
5. Hold the handle whilst slowly sliding the module
into the card guides until the handle catches on the
injector/ejector rail (refer to Figure 3.1).
6. Raise the injector/ejector handle until the module
rmly seats into the backplane. The front panel of
the module should be ush with the front panel of
the chassis.
7. Secure the front panel of the module using both
screws to the chassis front panel mounting rails.
8. In a system employing a remote control interface
to connect an external controller to a PXI chassis
or to link multiple chassis, power-up the system as
follows:
a. For a system comprising an external controller
and one chassis, power up the chassis before
powering up the external controller.
b. For a system comprising more than one chassis,
turn ON the last chassis in the system followed
by the penultimate, etc, and nally turn ON the
external controller or chassis containing the
system controller.
9. For Pickering Interfaces modular LXI installation
there is no requirement to use any particular power
up sequence.
Le module doit être installé conformément à
la procédure suivante:
1. Assurez-vous que le système est éteint mais qu’il
reste connecté au réseau électrique an qu’il reste
relié à la terre.
2. Choisissez un emplacement approprié dans la baie.
3. Retirez la plaque d’obturation de l’emplacement
choisi.
4. Assurez-vous que la poignée insertion / éjection
est dans sa position vers le bas. Alignez le module
avec les guides de la carte sur le haut et le bas de
la fente.
Ne pas lever la poignée insertion / éjection tout en
insérant le module, sinon celui-ci ne sera pas inséré
correctement.
5. Tenez la poignée tout en glissant lentement le
module dans les guides de la carte jusqu’à la prise
des poignées sur le rail insertion / éjection (voir la
Figure 3.1).
6. Relevez la poignée insertion / éjection jusqu’à ce
que le module se place fermement dans le fond
de panier. Le panneau avant du module doit être
aligné avec le panneau avant du châssis.
7. Fixez le panneau avant du module en utilisant les
deux vis du panneau avant du rail de montage du
châssis.
8. Dans un système utilisant une interface de
commande à distance, pour connecter un
contrôleur externe à un châssis PXI ou pour relier
plusieurs châssis, faites la mise sous tension du
système comme suit:
a. Pour un système comprenant un contrôleur
externe et un châssis, mettez le châssis avant
d’allumer le contrôleur externe.
b. Pour un système comprenant plus d’un châssis,
allumez le dernier châssis dans le système
suivi par l’avant-dernier, etc, et enn activez le
contrôleur ou le châssis externe contenant le
contrôleur système.
9. Pour l’installation modulaire LXI de Pickering
Interfaces, il n’est pas nécessaire d’utiliser une
séquence de mise sous tension particulière.