Premier Farnell Embest MINI4357 User manual

MINI4357
Core Board
User Manual
Version 1.1
15th Jan 2014

Copyright Statement:
MINI4357 and its related intellectual property are owned by
Shenzhen Embest Technology Co., Ltd.
Shenzhen Embest Technology has the copyright of this document and
reserves all rights. Any part of the document should not be modified,
distributed or duplicated in any approach and form without prior
written permission issued by Embest Technology Co., Ltd.
Revision History:
Version
Date
Description
1.0
10/04/2013
Original Version
1.1
15/01/2014
Localisation

Table of Contents
1 Product Overview .............................................................. 1
1.1 Introduction....................................................................1
1.2 Kit Contents....................................................................1
1.3 Board Interfaces..............................................................2
1.4 System Block Diagram .....................................................3
1.5 Physical Dimensions.........................................................3
2 Hardware Features ............................................................ 4
2.1 Processor .......................................................................4
2.2 On-Board Memory ...........................................................5
2.3 Communication Interfaces ................................................5
2.4 Operational Parameters....................................................5
3 Software Features ............................................................. 7
3.1 System Features .............................................................7
3.2 Development Environments ..............................................7
3.3 Debugging Tools..............................................................7
4 Hardware Details............................................................... 8
4.1 Interfaces.......................................................................8
4.1.1 CON1 Interface ......................................................................... 8
4.2 CON2 Interface ............................................................. 11
4.3 SPI Flash Interface ........................................................ 15
Appendix 1: ESD Precautions & Handling Procedures......... 16
Appendix 2: Technical support & Warranty ........................ 17

2.1 Technical support service................................................ 17
2.2 Maintenance service clause............................................. 18
2.3 Basic guidelines for protection and maintenance of LCDs ....19
2.4 Value Added Services..................................................... 20

Page | 1
1Product Overview
1.1 Introduction
The MINI4357 is an embedded core module built on the LPC4357FET256 -
a 32bit ARM Cortex-M4/M0 dual-core microcontroller. By combining the
MINI4357 with an expansion board from Embest (EDM1070xx or
EDM1043xx) or other specifically designed boards built according to the
hardware interfaces of the MINI4357, users can implement quick function
trimming so as to create a shorter time to market.
1.2 Kit Contents
MINI4357 Core Board
CD-ROM
Four hex head cap screws
Four brass tube plugs
Optional
EDM1070B-01
EDM1070BR-01 (with 4 wire resistive touchscreen)
EDM1043B-01
EDM1043BR-01 (with 4 wire resistive touchscreen)

Page | 2
1.3 Board Interfaces
Figure 1: MINI4357 Board Interfaces

Page | 3
1.4 System Block Diagram
Figure 2: MINI4357 System Block Diagram
1.5 Physical Dimensions
Figure 3: MINI4357 Physical Dimensions

Page | 4
2Hardware Features
2.1 Processor
NXP LPC4357FET256 dual-core microcontroller based on 32-bit ARM
Cortex-M4/M0, operating at up to 204MHz
Floating-point unit
1024KB Flash
136 KB SRAM
16KB EEPROM
LCD controller with support for 24bpp true-colour mode and a
resolution of up to 1024×768
USB 2.0 high-speed Host/Device/OTG interface with on-chip PHY
and support for DMA transmission
USB 2.0 high-speed Host/Device interface with on-chip PHY and
ULPI which supports external high-speed PHY
10/100 Mbps Ethernet MAC MII/RMII interface
Four-wire SPI flash interface (SPIFI) with data transfer rate of up to
40Mbps per channel
Two CAN 2.0B
Four UARTs
Two I2S’
Two I2Cs
Two SSPs
SPI bus
Four 32-bit general purpose timers
Two standard PWMs
Motor control PWM with Quadrature encoder interface
Two 10-bit ADCs operating at up to 400KHz

Page | 5
10-bit DAC operating at up to 400KHz
Serial GPIO interface (SGPIO)
164 general-purpose I/O interfaces
Two watchdog timers
2.2 On-Board Memory
128MB NAND Flash
32MB SDRAM
2KB EEPROM
4MB SPI Flash (spare solder pads)
2.3 Communication Interfaces
Two SPI interfaces
Three 3-wire UART interfaces
Touch-screen interface (16-bit 256RGB)
I2C interface
I2S interface
Two USB interfaces
Two CAN interfaces
SDIO interface
10/100Mbps Ethernet interface
2.4 Operational Parameters
Operating Temperature: 0 °C ~ 70 °C
Storage Temperature: -40 °C ~ 85 °C
Operating Humidity: 0% ~ 90% (Non-condensing)
Power Supply: 5V @ 0.8A, DC
PCB Layers: 6

Page | 6
Top Layer Component Height MAX = 2 mm
Bottom Layer Component Height MAX = 5 mm
Board Thickness =1.6mm

Page | 7
3Software Features
3.1 System Features
Supports:
uC/OS-II_v2.91 operating system
emWin5.18 graphic interface
FatFs_vR0.08a filesystem
LWIP _v1.4.0 protocol stack
3.2 Development Environments
IAR EWARM Integrated Development Environment
All drivers can work with IAR EWARM V6.40 or higher;
Keil MDK-ARM Integrated Development Environment
All drivers and applications can work with Keil MDK-ARM V4.60 or higher.
3.3 Debugging Tools
ULINK2
ULINK2 is recommended to be used under Keil MDK-ARM for the best
debugging performance;
JLINK-V9.1
JLINK-V9.1 is recommended to be used under IAR EWARM for the best
debugging performance

Page | 8
4Hardware Details
4.1 Interfaces
4.1.1 CON1 Interface
Pin
Name
Function
1
VDD5V
+5V power
2
VDD5V
+5V power
3
VBAT_IN
VBAT In
4
GND
GND
5
TDI
Test data input
6
nTRST
Test system reset
7
TCK
Test clock
8
TMS
Test mode select
9
nRESET
Test system reset
10
TDO
Test data output
11
P1_4
GPIO
12
PC_2
GPIO
13
PC_3
GPIO
14
PC_9
GPIO
15
PC_11
GPIO
16
PC_12
GPIO
17
PC_13
GPIO
18
PC_14
GPIO
19
SD_DAT2
GPIO
20
SD_DAT3
GPIO

Page | 9
Pin
Name
Function
21
SD_CMD
GPIO
22
GND
GND
23
SD_DAT0
Card data 0
24
SD_CLK
Card Clock
25
SD_DAT1
Card data 1
26
SD_CD
Card Command Signal
27
PD_0
GPIO
28
PD_1
GPIO
29
PD_2
GPIO
30
PD_3
GPIO
31
PD_4
GPIO
32
PD_5
GPIO
33
PD_6
GPIO
34
PD_7
GPIO
35
PD_8
GPIO
36
PD_9
GPIO
37
PD_10
GPIO
38
PD_11
GPIO
39
PD_12
GPIO
40
PD_13
GPIO
41
SPIFI_SIO2
SPIFI Data 2
42
P9_0
GPIO
43
P9_1
GPIO
44
P9_2
GPIO

Page | 10
Pin
Name
Function
45
P9_3
GPIO
46
P9_4
GPIO
47
USB_PWR_FAULT
USB power fail
48
USB1_PWR_EN
USB1 power enable
49
USB1_DM
USB1 bidirectional D+ line
50
USB0_PWR_EN
USB0power enable
51
USB1_DP
USB0 bidirectional D-line
52
P3_0
GPIO
53
USB0_PWR_FAULT
USB0 power fail
54
USB1_VBUS
VBUS drive signal
55
GND
GND
56
I2C_SCL
I2C clock input/output
57
U1_TXD
UART1Transit data
58
I2C_SDA
I2C data input/output
59
U1_RXD
UART1 Receive data
60
U3_TXD
UART3 Transit data
61
U1_TDR
Data Terminal Ready
62
U3_RXD
UART3 Receive data
63
U0_TXD
UART0 Transit data
64
EMC_A9
EMC address line 9
65
U0_RXD
UART0 Receive data
66
U2_TXD
UART2 Transit data
67
CAN0_TD
C_CAN transmit output
68
U2_RXD
UART2 Receive data

Page | 11
Pin
Name
Function
69
CAN0_RD
C_CAN receive input
70
CAN1_TD
C_CAN transmit output
71
PE_2
GPIO
72
CAN1_RD
C_CAN receive input
73
PE_4
GPIO
74
PE_3
GPIO
75
PE_6
GPIO
76
PE_5
GPIO
77
PE_8
GPIO
78
PE_7
GPIO
79
PE_14
GPIO
80
PE_9
GPIO
4.2 CON2 Interface
Pin
Name
Function
1
LED1_LINK/ACK
LINK LED
2
ENET_TXN
Ethernet Transmit Data
3
LED2_SPEED
SPEED LED
4
ENET_TXP
Ethernet Transmit Data
5
USB0_ID
USB0 ID pin
6
ENET_RXN
Ethernet Receive Data
7
USB0_VBUS
VBUS pin
8
ENET_RXP
Ethernet Receive Data
9
GND
GND
10
GND
GND

Page | 12
Pin
Name
Function
11
USB0_DM
- line
12
P4_3
GPIO
13
USB0_DP
USB0 bidirectional D+ line
14
P4_0
GPIO
15
P4_1
GPIO
16
P4_4
GPIO
17
P8_0
GPIO
18
P8_1
GPIO
19
P8_2
GPIO
20
P8_8
GPIO
21
LCD_HSYNC
Horizontal Sync Input
22
LCD_BL_EN
LCD backlight
23
LCD_VSYNC
Vertical Sync Input
24
LCD_DCLK
Sample clock
25
LCD_PWR
LCD power enable
26
GND
GND
27
LCD_VD4
LCD panel data4
28
LCD_DE
Data Input Enable
29
LCD_VD6
LCD panel data6
30
LCD_VD3
LCD panel data3
31
LCD_VD11
LCD panel data11
32
LCD_VD5
LCD panel data5
33
LCD_VD13
LCD panel data13
34
LCD_VD7
LCD panel data7

Page | 13
Pin
Name
Function
35
LCD_VD15
LCD panel data15
36
LCD_VD10
LCD panel data10
37
LCD_VD20
LCD panel data20
38
LCD_VD12
LCD panel data12
39
LCD_VD22
LCD panel data22
40
LCD_VD14
LCD panel data14
41
LCD_VD23
LCD panel data23
42
LCD_VD19
LCD panel data19
43
GND
GND
44
LCD_VD21
LCD panel data21
45
ADC0
ADC input channel 0
46
ADC1
ADC input channel 1
47
ADC2
ADC input channel 2
48
ADC3
ADC input channel 3
49
ADC4
ADC input channel 4
50
ADC5
ADC input channel 5
51
ADC6
ADC input channel 6
52
ADC7
ADC input channel 7
53
WAKEUP0
Wakeup pin 0
54
WAKEUP1
Wakeup pin1
55
WAKEUP2
Wakeup pin 2
56
WAKEUP3
Wakeup pin 3
57
SPIFI_SCK
Serial clock for
SPI/SSP0/SPIFI
58
SPIFI_SC
Slave Select for

Page | 14
Pin
Name
Function
SPI/SSP0/SPIFI
59
SPIFI_MISO
Master In Slave Out for
SPI/SSP0/SPIFI
60
SPIFI_MOSI
Master Out Slave In for
SPI/SSP0/SPIFI
61
GND
GND
62
SSP0_SSEL
Slave Select for SSP0
63
SSP0_SCK
Serial clock for SSP0
64
SSP0_MOSI
Master Out Slave In for SSP0
65
SSP0_MISO
Master In Slave Out for SSP0
66
TP_PENIRQ
LCD Touch IRQ
67
TP_BUSY
LCD Touch busy
68
PF_9
GPIO
69
P6_1
GPIO
70
P6_0
GPIO
71
P6_7
GPIO
72
P6_2
GPIO
73
SPIFI_SIO3
SPIFI Data 3
74
GND
GPIO
75
P7_2
GPIO
76
CLK1
Clock output pin 1
77
P7_4
GPIO
78
CLK2
Clock output pin 2
79
P7_5
GPIO
80
CLK3
Clock output pin 3

Page | 15
4.3 SPI Flash Interface
Pin
Name
Function
1
SSP1_SSEL
Slave Select for SSP1
2
SSP1_MISO
Master In Slave Out for SSP1
3
VDD3V3（WP）
+3.3V power
4
GND
GND
5
SSPI1_MOSI
Master Out Slave In for SSP1
6
SSP1_SCK
Serial clock for SSP1
7
P7_3（HOLD）
GPIO
8
VDD3V3
+3.3V power

Page | 16
Appendix 1: ESD Precautions &
Handling Procedures
Please note that the board comes without any case/box and all
components are exposed. Therefore, extra attention must be paid to ESD
(electrostatic discharge) precautions. To effectively prevent electrostatic
damage, please follow the steps below:
Avoid carpets in cool, dry areas. Leave development
kits in their anti-static packaging until ready to be
installed.
Dissipate static electricity before handling any system components
(development kits) by touching a grounded metal object, such as
the system unit unpainted metal chassis.
If possible, use antistatic devices, such as wrist straps and floor
mats.
Always hold an evaluation board by its edges. Avoid touching the
contacts and components on the board.
Take care when connecting or disconnecting cables. A damaged
cable can cause a short in the electrical circuit.
Prevent damage to the connectors by aligning connector pins before
you connect the cable. Misaligned connector pins can cause damage
to system components at power-on.
When disconnecting a cable, always pull on the cable connector or
strain-relief loop, not on the cable itself.
Warning:
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.