Premier Farnell Embest MINI4357 User manual

MINI4357
Core Board
User Manual
Version 1.1
15th Jan 2014

Copyright Statement:
MINI4357 and its related intellectual property are owned by
Shenzhen Embest Technology Co., Ltd.
Shenzhen Embest Technology has the copyright of this document and
reserves all rights. Any part of the document should not be modified,
distributed or duplicated in any approach and form without prior
written permission issued by Embest Technology Co., Ltd.
Revision History:
Version
Date
Description
1.0
10/04/2013
Original Version
1.1
15/01/2014
Localisation

Table of Contents
1 Product Overview .............................................................. 1
1.1 Introduction....................................................................1
1.2 Kit Contents....................................................................1
1.3 Board Interfaces..............................................................2
1.4 System Block Diagram .....................................................3
1.5 Physical Dimensions.........................................................3
2 Hardware Features ............................................................ 4
2.1 Processor .......................................................................4
2.2 On-Board Memory ...........................................................5
2.3 Communication Interfaces ................................................5
2.4 Operational Parameters....................................................5
3 Software Features ............................................................. 7
3.1 System Features .............................................................7
3.2 Development Environments ..............................................7
3.3 Debugging Tools..............................................................7
4 Hardware Details............................................................... 8
4.1 Interfaces.......................................................................8
4.1.1 CON1 Interface ......................................................................... 8
4.2 CON2 Interface ............................................................. 11
4.3 SPI Flash Interface ........................................................ 15
Appendix 1: ESD Precautions & Handling Procedures......... 16
Appendix 2: Technical support & Warranty ........................ 17

2.1 Technical support service................................................ 17
2.2 Maintenance service clause............................................. 18
2.3 Basic guidelines for protection and maintenance of LCDs ....19
2.4 Value Added Services..................................................... 20

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1Product Overview
1.1 Introduction
The MINI4357 is an embedded core module built on the LPC4357FET256 -
a 32bit ARM Cortex-M4/M0 dual-core microcontroller. By combining the
MINI4357 with an expansion board from Embest (EDM1070xx or
EDM1043xx) or other specifically designed boards built according to the
hardware interfaces of the MINI4357, users can implement quick function
trimming so as to create a shorter time to market.
1.2 Kit Contents
MINI4357 Core Board
CD-ROM
Four hex head cap screws
Four brass tube plugs
Optional
EDM1070B-01
EDM1070BR-01 (with 4 wire resistive touchscreen)
EDM1043B-01
EDM1043BR-01 (with 4 wire resistive touchscreen)

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1.3 Board Interfaces
Figure 1: MINI4357 Board Interfaces

Page | 3
1.4 System Block Diagram
Figure 2: MINI4357 System Block Diagram
1.5 Physical Dimensions
Figure 3: MINI4357 Physical Dimensions

Page | 4
2Hardware Features
2.1 Processor
NXP LPC4357FET256 dual-core microcontroller based on 32-bit ARM
Cortex-M4/M0, operating at up to 204MHz
Floating-point unit
1024KB Flash
136 KB SRAM
16KB EEPROM
LCD controller with support for 24bpp true-colour mode and a
resolution of up to 1024×768
USB 2.0 high-speed Host/Device/OTG interface with on-chip PHY
and support for DMA transmission
USB 2.0 high-speed Host/Device interface with on-chip PHY and
ULPI which supports external high-speed PHY
10/100 Mbps Ethernet MAC MII/RMII interface
Four-wire SPI flash interface (SPIFI) with data transfer rate of up to
40Mbps per channel
Two CAN 2.0B
Four UARTs
Two I2S’
Two I2Cs
Two SSPs
SPI bus
Four 32-bit general purpose timers
Two standard PWMs
Motor control PWM with Quadrature encoder interface
Two 10-bit ADCs operating at up to 400KHz

Page | 5
10-bit DAC operating at up to 400KHz
Serial GPIO interface (SGPIO)
164 general-purpose I/O interfaces
Two watchdog timers
2.2 On-Board Memory
128MB NAND Flash
32MB SDRAM
2KB EEPROM
4MB SPI Flash (spare solder pads)
2.3 Communication Interfaces
Two SPI interfaces
Three 3-wire UART interfaces
Touch-screen interface (16-bit 256RGB)
I2C interface
I2S interface
Two USB interfaces
Two CAN interfaces
SDIO interface
10/100Mbps Ethernet interface
2.4 Operational Parameters
Operating Temperature: 0 °C ~ 70 °C
Storage Temperature: -40 °C ~ 85 °C
Operating Humidity: 0% ~ 90% (Non-condensing)
Power Supply: 5V @ 0.8A, DC
PCB Layers: 6

Page | 6
Top Layer Component Height MAX = 2 mm
Bottom Layer Component Height MAX = 5 mm
Board Thickness =1.6mm