Primes MSM User manual

Revision 01/2019 EN
MicroSpotMonitor MSM
LaserDiagnosticsSoftware LDS 2.98
35,0(6
Translation of the original instructions
Operating Manual

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IMPORTANT!
READ CAREFULLY BEFORE USE.
KEEP FOR FUTURE USE.

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Table of Contents
1 Basic safety instructions 9
2 Symbol explanations 11
3 About this operating manual 12
4 Conditions at the installation site 12
5 Introduction 13
5.1 System description .................................................................................................................13
5.2 Measuring principle .................................................................................................................14
5.3 Short overview installation .......................................................................................................15
6 Transport 16
6.1 Disassemble the transport lock ...............................................................................................16
6.2 Assemble the transport lock....................................................................................................17
7 Installation 17
7.1 Preparation and mounting position..........................................................................................17
7.2 Manually aligning the MicroSpotMonitor MSM.........................................................................18
7.2.1 Important conditions for the position of the focused laser beam................................18
7.2.2 Positioning the focused laser beam above the measuring objective ..........................19
7.2.3 Positioning the focused laser beam above the optional cyclone ................................20
7.3 Install the MicroSpotMonitor MSM...........................................................................................21
8 Connect cooling circuit (500W version only) 22
8.1 Water quality ...........................................................................................................................22
8.2 Water pressure........................................................................................................................22
8.3 Humidity..................................................................................................................................23
8.4 Water connections and water flow rate....................................................................................24
9 Electrical connection 25
9.1 Connections............................................................................................................................25
9.2 Pin assignment .......................................................................................................................26
9.2.1 Power supply............................................................................................................26
9.2.2 Inlet external trigger ..................................................................................................26
9.2.3 Outlet internal trigger.................................................................................................26
9.2.4 Outlet internal data-transfer signal.............................................................................26
9.3 Connection to the PC and connect power supply ...................................................................27
10 Status LEDs 28
11 Installation and configuration of the LaserDiagnosticsSoftware LDS 29
11.1 System requirements ..............................................................................................................29
11.2 Installing the software..............................................................................................................29
11.3 Ethernet configuration .............................................................................................................30
11.3.1 Enter IP address .......................................................................................................30
11.3.2 Establishing a connection to PC (menu Communication > Free Communication)..31
11.3.3 Changing the standard IP address of the device (menu Communication > Free
Communication)......................................................................................................32

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12 Description of the LaserDiagnosticsSoftware LDS 34
12.1 Graphical user interface...........................................................................................................34
12.1.1 The menu bar ...........................................................................................................36
12.1.2 The toolbar ...............................................................................................................37
12.1.3 Menu overview..........................................................................................................38
12.2 File ..........................................................................................................................................41
12.2.1 New (menu File > New)............................................................................................41
12.2.2 Open (menu File > Open).........................................................................................41
12.2.3 Close/Close all (menu File > Close/Close all)...........................................................41
12.2.4 Save (menu File > Save)...........................................................................................41
12.2.5 Save as (menu File > Save As).................................................................................41
12.2.6 Export (menu File > Export).....................................................................................41
12.2.7 Load measurement preferences (menu File > Load measurement preferences)....42
12.2.8 Save measurement preferences (menu File > Save measurement preferences).....42
12.2.9 Protocol (menu File > Protocol)...............................................................................42
12.2.10 Print (menu File > Print)...........................................................................................42
12.2.11 Print preview (menu File > Print preview).................................................................42
12.2.12 Recently opened files (menu File > Recently opened Files).....................................42
12.2.13 Exit (menu File > Exit)...............................................................................................42
12.3 Edit .........................................................................................................................................43
12.3.1 Copy (menu Edit > Copy).........................................................................................43
12.3.2 Clear plane (menu Edit > Clear plane).....................................................................43
12.3.3 Clear all planes (menu Edit > Clear all planes).........................................................43
12.3.4 Change user level (menu Edit > Change User Level)...............................................43
12.4 Measurement..........................................................................................................................44
12.4.1 Measuring environment (menu Measurement > Environment)................................44
12.4.2 Sensor parameters (menu Measurement > Sensor parameter)..............................45
12.4.3 Beam find settings (menu Measurement > BeamFind Settings: Beamfind ...........46
12.4.4 CCD info (menu Measurement > CCD Info)............................................................47
12.4.5 CCD settings (menu Measurement > CCD Settings)..............................................48
12.4.6 LQM adjustment (menu Measurement > LQM Adjustment)....................................50
12.4.7 Power measurement (menu Measurement > Power Measurement).......................50
12.4.8 Single (menu Measurement > Single)......................................................................50
12.4.9 Caustic measurement (menu Measurement > Caustic)...........................................54
12.4.10 Start adjust mode (menu Measurement > Start Adjust mode)................................55
12.4.11 Option (advanced user only) (menu Measurement > Option)...................................56
12.5 Presentation............................................................................................................................58
12.5.1 False colors (menu Presentation > False colors).....................................................59
12.5.2 False colors (filtered) (menu Presentation > False colors (filtered)).........................60
12.5.3 Isometry (menu Presentation > Isometry)...............................................................60
12.5.4 Isometry 3D (menu Presentation > Isometry 3D) ...................................................61
12.5.5 Review 86% or 2. moment (menu Presentation > Review (86%)/(2. moment)) ....62
12.5.6 Caustic (menu Presentation > Caustic) ..................................................................63
12.5.7 Raw beam (menu Presentation > Raw-beam) .......................................................67
12.5.8 Symmetry check (menu Presentation > SymmetryCheck)......................................68
12.5.9 Fixed contour lines (menu Presentation > Fixed Contour Lines).............................69
12.5.10 Variable contour lines (menu Presentation > Variable Contour Lines).....................70
12.5.11 Graphical review (menu Presentation > Graphical Review).....................................72
12.5.12 Systemstate (menu Presentation > Systemstate)...................................................72
12.5.13 Evalution parameter view (menu Presentation > Evalution Parameter View)..........73
12.5.14 Evaluate document (menu Presentation > Evaluate doc)........................................74
12.5.15 Color tables (menu Presentation > Color Tables)....................................................76
12.5.16 Toolbar (Menu Presentation > Toolbar)...................................................................76
12.5.17 Position (menu Presentation > Position).................................................................77
12.5.18 Evaluation (option) (menu Presentation > Evaluation)..............................................77

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12.6 Communication.......................................................................................................................79
12.6.1 Rescan bus (menu Communication > Rescan bus)................................................79
12.6.2 Free communication (menu Communication > Free Communication)...................79
12.6.3 Scan device list (menu Communication > Scan device list) ...................................80
12.7 Script (menu Script) ...............................................................................................................81
12.7.1 Editor (menu Script > Editor) ..................................................................................81
12.7.2 List (menu Script > List) ..........................................................................................81
12.7.3 Python (menu Script > Python) ...............................................................................81
13 Measurement 82
13.1 Safety instructions...................................................................................................................82
13.2 Selection and change of measuring objectives ........................................................................83
13.2.1 Selection of the measuring objective .........................................................................83
13.2.2 Exchanging the measuring objective .........................................................................85
13.2.3 Damage thresholds...................................................................................................86
13.3 Prepare measurement.............................................................................................................89
13.3.1 Check list measurement settings...............................................................................89
13.3.2 Check list measurement settings...............................................................................89
13.4 Flowchart of a measurement...................................................................................................90
13.4.1 Prepare measurement...............................................................................................90
13.4.2 Set caustic limits.......................................................................................................90
13.4.3 Perform caustic measurement ..................................................................................91
13.5 Perform measurement settings in the LaserDiagnosticsSoftware LDS .....................................92
13.5.1 Sensor parameters (menu Measurement > Sensor parameter)..............................93
13.5.2 Measuring environment (menu Measurement > Environment)................................94
13.5.3 Measurement settings (menu Measurement > Single).............................................95
13.5.4 Caustic settings (menu Measurement > Caustic) ....................................................96
13.5.5 CCD settings (menu Measurement > CCD Settings)..............................................98
13.5.6 Option (advanced user only) (menu Measurement > Option).................................100
13.5.7 CCD info (menu Measurement > CCD Info)..........................................................101
13.5.8 Single measurement (menu Measurement > Single)..............................................102
13.5.9 Caustic measurement (menu Measurement > Caustic).........................................104
14 Troubleshooting 108
14.1 Error during a measurement..................................................................................................108
14.2 No measurement signal at the MicroSpotMonitor MSM.........................................................108
15 Maintenance and service 109
15.1 Exchanging the protective window........................................................................................109
15.1.1 Safety instructions ..................................................................................................109
15.1.2 Replacing the protective window ............................................................................110
15.1.3 Replacing the protective window for cyclone...........................................................111
16 Storage 112
17 Measures for the product disposal 112
18 Declaration of conformity 113
19 Technical data 114

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20 Dimensions 116
21 Appendix 117
21.1 Insert fixed OD filter (option) in the inspection chamber .........................................................117
21.2 File “laserds.ini” – an Example ...............................................................................................118
21.3 Description of the MDF file format .........................................................................................119
21.4 Optical components..............................................................................................................120
21.4.1 Measuring objective ................................................................................................121
21.4.2 Fixed filter and filter wheel .......................................................................................126
21.4.3 Beam path extension (BPE) ....................................................................................127
21.4.4 Alignment objective (JO)..........................................................................................127
21.4.5 Absorber.................................................................................................................128
21.4.6 Trigger diode...........................................................................................................128
21.4.7 Charge-coupled device sensor (CCD sensor)..........................................................128
21.5 Measuring pulsed irradiation .................................................................................................132
21.5.1 Measuring configuration selection ...........................................................................134
21.5.2 Influence of the pulse parameters on the integration time control ............................134
21.5.3 Examples for triggered measuring mode.................................................................138
21.5.4 Summary ................................................................................................................139
22 Basis of laser beam diagnosis 140
22.1 Laser beam parameter..........................................................................................................140
22.1.1 Rotationally symmetric beams.................................................................................141
22.1.2 Non rotationally symmetric beams ..........................................................................142
22.2 Calculation of beam data ......................................................................................................143
22.2.1 Determination of the zero level ................................................................................143
22.2.2 Determination of the beam position.........................................................................144
22.2.3
Radius determination with the 2. moment method of the power density distribution.. 144
22.2.4 Radius determination with the method of the 86% power inclusion .......................145
22.2.5 Further radius definitions (option).............................................................................146
22.3 Measurement errors ..............................................................................................................147
22.3.1 Error in determining zero level .................................................................................147
22.3.2 Saturating the signal ...............................................................................................147
22.3.3 Errors from incorrect measurement window size .....................................................148

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PRIMES - The Company
PRIMES manufactures measuring devices used to analyze laser beams. These devices are employed for
the diagnostics of high-power lasers ranging from CO2lasers and solid-state lasers to diode lasers. A wave-
length range from infrared through to near UV is covered, offering a wide variety of measuring devices to
determine the following beam parameters:
• Laser power
• Beam dimensions and position of an unfocused beam
• Beam dimensions and position of a focused beam
• Beam quality factor M²
PRIMES is responsible for both the development, production, and calibration of the measuring devices. This
guarantees optimum quality, excellent service, and a short reaction time, providing the basis for us to meet all
of our customers’ requirements quickly and reliably.
PRIMES GmbH
Max-Planck-Str. 2
64319 Pfungstadt
Germany
Tel [phone]
[email protected]
www.primes.de

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1 Basic safety instructions
Intended Use
The MicrsoSpotMonitor MSM has been designed exclusively for measurements carried out in or near the
optical path of high-power lasers. Please observe and adhere to the specifications and limit values given
in chapter19, „Technical data“, on page114. Other uses are considered to be improper. The information
contained in this operating manual must be strictly observed to ensure proper use of the device.
Using the device for unspecified use is strictly prohibited by the manufacturer. By usage other than intended
the device can be damaged or destroyed. This poses an increased health hazard up to fatal injuries. When
operating the device, it must be ensured that there are no potential hazards to human health.
The device itself does not emit any laser radiation. During the measurement, however, the laser beam is
guided onto the device which causes reflected radiation (laser class 4). That is why the applying safety regu-
lations are to be observed and necessary protective measures need to be taken.
Observing applicable safety regulations
Observing applicable safety regulations
Please observe valid national and international safety regulations as stipulated in ISO/CEN/TR standards as
well as in the IEC-60825-1 regulation, in ANSI Z 136 “Laser Safety Standards” and ANSI Z 136.1 “Safe Use
of Lasers”, published by the American National Standards Institute, and additional publications, such as the
“Laser Safety Basics”, the “LIA Laser Safety Guide”, the “Guide for the Selection of Laser Eye Protection”
and the “Laser Safety Bulletin”, published by the Laser Institute of America, as well as the “Guide of Control
of Laser Hazards” by ACGIH.
Necessary safety measures
DANGER
Serious eye or skin injury due to laser radiation
During the measurement the laser beam is guided on the device, which causes scattered or
directed reflection of the laser beam (laser class 4). The reflected beam is usually not visible.
X
Please take the following precautions.
If people are present within the danger zone of visible or invisible laser radiation, for example near laser
systems that are only partly covered, open beam guidance systems, or laser processing areas, the following
safety measures must be implemented:
• Please wear safety goggles adapted to the power, power density, laser wave length and operating
mode of the laser beam source in use.
• Depending on the laser source, it may be necessary to wear suitable protective clothing or protective
gloves.
• Protect yourself from direct laser radiation, scattered radiation, and beams generated from laser radiation
(by using appropriate shielding walls, for example, or by weakening the radiation to a harmless level).
• Use beam guidance or beam absorber elements that do not emit any hazardous substances when they
come in to contact with laser radiation and that can withstand the beam sufficiently.
• Install safety switches and/or emergency safety mechanisms that enable immediate closure of the laser
shutter.
• Ensure that the device is mounted securely to prevent any movement of the device relative to the beam
axis and thus reduce the risk of scattered radiation. This in the only way to ensure optimum performance
during the measurement.

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Employing qualified personnel
The device may only be operated by qualified personnel. The qualified personnel must have been instructed
in the installation and operation of the device and must have a basic understanding of working with high-
power lasers, beam guiding systems and focusing units.
Conversions and modifications
The device must not be modified, neither constructionally nor safety-related, without our explicit permission.
The device must not be opened e.g. to carry out unauthorized repairs. Modifications of any kind will result in
the exclusion of our liability for resulting damages.
Liability disclaimer
The manufacturer and the distributor of the measuring devices do not claim liability for damages or injuries
of any kind resulting from an improper use or handling of the devices or the associated software. Neither the
manufacturer nor the distributor can be held liable by the buyer or the user for damages to people, material
or financial losses due to a direct or indirect use of the measuring devices.

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2 Symbol explanations
The following symbols and signal words indicate possible residual risks:
DANGER
Means that death or serious physical injuries will occur if necessary safety precautions are not
taken.
WARNING
Means that death or serious physical injuries may occur if necessary safety precautions are not
taken.
CAUTION
Means that minor physical injury may occur if necessary safety precautions are not taken.
NOTICE
Means that property damage may occur if necessary safety precautions are not taken.
The following symbols indicating requirements and possible dangers are used on the device:
Hand injuries warning
Components susceptible to ESD
Read and observe the operating instructions and safety guidelines before startup!
Further symbols that are not safety-related:
Here you can find useful information and helpful tips.
With the CE designation, the manufacturer guarantees that its product meets the requirements of
the relevant EC guidelines.
X
Call for action

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3 About this operating manual
This documentation describes how to work with the MicroSpotMonitor MSM and operate it with the LaserDi-
agnosticsSoftware LDS 2.98.
The software description includes a brief introduction on using the device for measurements.
This operating manual describes the software version valid at the time of printing.
Since the user software is continuously being developed further, the supplied data medium may
have a different version number. Correct functioning of the device is, however, still guaranteed with
the software.
Should you have any questions, please specify the software version installed on your device. The software
version can be found under the following menu item: Help > About LaserDiagnosticsSoftware.
Fig. 3.1: Information regarding the current software version
4 Conditions at the installation site
• The device must not be operated in a condensing atmosphere.
• The ambient air must be free of organic gases.
• Protect the device from splashes of water and dust.
• Operate the device in closed rooms only.

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5 Introduction
5.1 System description
The MicroSpotMonitor MSM determines beam parameters of focused laser beams with medium powers up
to 200W in a range between 20micro meters and one millimeter directly in the processing zone.
The air-cooled system depicts the laser beam, which is attenuated by different beam splitter and neutral
density filters, on a CCD sensor. On the basis of the determined beam distribution of a plane, the beam posi-
tion as well as the beam radius can be derived. By means of the integrated z-axis and the measurement at
different positions of the laser beam the described beam parameters are determined and logged.
The measuring objectives of the MicroSpotMonitor MSM are selected individually, depending on the beam
source that is supposed to be measured. In this regard, the wavelength (248 up to 1 090 nm) as well as the
magnification (3.3:1, 5:1, 10:1), which is determined by the focus diameter, are the essential parameters.
The dynamic range of the integrated CCD sensor is amplified to more than 130dB via an irradiation time
control, which enables caustic measurements over more than four Rayleigh lengths, as demanded in the
standard ISO11146.
Optionally, the MicroSpotMonitor MSM can be equipped with a filter wheel with neutral density filters (OD1
to OD5). This filter wheel enables the measurement of power densities between several W/cm² up to several
MW/cm² without having to modify the system.
Ventilator
Absorber
Access (inspection chamber)
to filter wheel (option) and fixed OD-filter (option)
Cyclone (option)
Knurled screw
Beam entrance
Lever to adjust the
magnification
(option)
Transport lock
Traversing motor
Beam path extension (BPE)
Alignment objective (AO)
Standard
Fig. 5.1: Components of the MicroSpotMonitor MSM

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5.2 Measuring principle
The MicroSpotMonitor MSM is a camera-based measuring system. Depending on the application, up to 7
different optical components can be in the beam path. The purpose and functioning of individual compo-
nents is described in chapter21.4, „Optical components“, on page120.
Measuring plane
Upper limit
Mirrors
Trigger
Filter wheel (option)
Lower limit
Measuring
objective
Beam path extension (BPE)
Absorber
Laser beam
Absorber
Alignment objective (AO)
CCD sensor
Fixed OD-filter (option)
Prisms
Fig. 5.2: Optomechanical design

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5.3 Short overview installation
1. Taking safety precautions Chapter 1 on page 9
2. Transport
• Disassemble the transport lock
Chapter 6 on page 16
3. Installation
• Make preparations
• Set the installation position
• Align the device manually
• Mount the device firmly
Chapter 7 on page 17
4. Connect the water-cooling (500 W version only)
• Connection diameter
• Observe flow rate
Chapter 8 on page 22
5. Electrical connection
• Establish voltage supply
Chapter 9 on page 25
6. Connect with the PC
• Via Ethernet or LAN
Chapter 9.3 on page 27
7. Installing the LaserDiagnosticsSoftware LDS on the PC
• Software is part of the scope of delivery
• Connect the MicroSpotMonitor MSM with the LaserDiagnosticsSoftware LDS
Chapter 11 on page 29
8. Measure
• Follow the safety instructions
• Select and insert the measuring objective
• Observe damage thresholds
• Perform measurement
Chapter 13 on page 82

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6 Transport
WARNING
Risk of injury when lifting or dropping the device
Lifting and positioning heavy devices can, for example, stress intervertebral disks and cause
chronic changes to the lumbar or cervical spine. The device may fall.
X
Use a lifting device to lift and position the device.
NOTICE
Damaging/destroying the device
Optical components may be damaged if the device is subjected to hard shocks or is allowed
to fall.
X
Handle the measuring device carefully when transporting or installing it.
X
To avoid contamination, close the measuring objective with the cover provided.
X
Only transport the device in the original PRIMES transport box (option).
6.1 Disassemble the transport lock
After unpacking the device, the transport lock has to be removed first. The transport lock secures the linear
actuator of the z-axis. It is located on the bottom plate and is fastened by means of 3 screws (see Fig. 6.1 on
page 16).
Fig. 6.1: Position of the transport lock

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6.2 Assemble the transport lock
NOTICE
Damaging/destroying the device
The device must only be transported with a mounted transport lock.
X
Keep the transport lock for future use.
Before transportation, move the MicroSpotMonitor MSM into the parking position (see chapter12.5.17, „Po-
sition (menu Presentation > Position)“, on page77) and mount the transport lock.
7 Installation
7.1 Preparation and mounting position
Check the space available before mounting the device, especially the required space for the connection
cables and the movement range of the z-axis (see chapter20, „Dimensions“, on page116). The device
must be set up so that it is stable and fastened with screw (see chapter 7.3 on page 21).
The MicroSpotMonitor MSM is designed to operate in a horizontal position with a beam incidence from
above. With an optional side plate (order no. 801-004-060), operation with horizontal beam incidence is also
possible.
NOTICE
Damaging/destroying the device
Obstacles in the movement range of the MicroSpotMonitor MSM can lead to collisions and
damage the device.
X
Keep the movement range free of obstacles (cutting nozzle, pressure rolls, etc.).

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7.2 Manually aligning the MicroSpotMonitor MSM
7.2.1 Important conditions for the position of the focused laser beam
Due to the imaging characteristics of the measuring objective (see chapter21.4.1, „Measuring objective“, on
page121) it is necessary for the laser beam focus to be positioned in a certain range above the measuring
objective.
NOTICE
Damaging/destroying the device
The focus has to be in a defined range with reference to the measuring objective. In case it
is too close or too distant, the optics might be damage in case of high beam intensities.
X
Use the enclosed alignment tool for the alignment.
The size of the range in which the focus is to be positioned before the first measurement depends on the
chosen measuring objective, the used wavelength and the type of focusing. The measurement range lies
within an upper and a lower limit.
Upper limit
If the focus is located too high above the measuring objective, a focus on the image-sided beam path can
develop. Together with too high beam intensities, the optics might be damaged.
Measuring plane
The beam distribution of the measuring plane is displayed on the CCD sensor.
Lower limit
If the focus is too close to the measuring objective, it can – depending on the type of focusing and the power
used – damage the entrance lens.
Laser beam
Measuring plane
Measuring plane distance
Measuring objective
Upper limit
Lower limit
Fig. 7.1: Measuring range of the MicroSpotMonitor MSM

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7.2.2 Positioning the focused laser beam above the measuring objective
The measuring plane distance equals the distance of the measuring plane from the upper corner of the mea-
suring objective or the protective glass.
In order to be able to align the MicroSpotMonitor MSM beneath the laser, an associated alignment tool is
provided with each measuring objective. By means of this alignment tool and a pilot laser beam, you can
position the device with the necessary accuracy.
1. Place the alignment tool directly on the measuring objective (see Fig. 7.2 on page 19) or on the pro-
tective window holder on the measuring objective (see Fig. 7.3 on page 19).
• The upper edge of the measuring objective corresponds to the z position of the measuring plane.
• When using a protective window with a thickness of 1.5mm, the measuring plane moves upwards by
approx. 500µm.
2. Turn on the pilot laser. If the laser hits the marking in the alignment tool vertically, it is displayed centrally
on the CCD sensor.
Marking in the alignment tool
10x 5x 3.3x
Fig. 7.2: Alignment tools for direct placement on the measuring objective
Marking in the alignment tool
10x 5x 3.3x
Fig. 7.3: Alignment tools for placement on the protective window holder on the measuring objective

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The measuring plane distance equals the distance of the imaging plane from the upper corner of the mea-
suring objective. It does not only depend on the beam path (standard, beam path extension BPE, alignment
objective AO) but also on the wavelength (see Tab. 7.1 on page 20).
When using a protective window with a thickness of 1.5mm, the measuring plane moves upwards
by approx. 500µm.
Measuring ob-
jective MOB
NA limit
values
Typ. magnification Measuring plane distance in mm
Standard BPE AO Standard BPE AO
3.3x
1 064nm
532nm
355nm
1
0.1
0.09
3.12
3.23
3.36
5.65
5.81
6.02
1.12
1.11
*)
73
70.5
67.3
64.6
62.6
60.1
63.7
61.5
57.7
5x
1 064nm
532nm
355nm
0.19
0.18
0.14
4.96
5.15
5.35
8.31
8.6
8.92
1.63
1.59
*)
51.1
49.3
47.2
47.1
45.7
43.8
46.7
45.1
42.7
10x
1 064nm
532nm
355nm
0.24
0.24
0.17
8.84
9.17
9.62
14.39
14.91
15.6
2.77
2.72
*)
29.9
-
-
27.9
-
-
27.6
-
-
Tab. 7.1: Measuring plane distances
*) Only suitable for adjustment
Due to the production tolerances, the values of the measuring plane distance contain a deviation of
±800µm. However, it is possible to have the measuring distance of the measuring objective calibrated to
±50µm (TCP calibration).
7.2.3 Positioning the focused laser beam above the optional cyclone
For measuring objectives with a cyclone or a protective window special alignment aids are provided.
Cyclone with disassembled protective window
holder and attached alignment tool
Cyclone with mounted protective window
holder and removed alignment tool
Marking in the alignment tool
Alignment tool
Fig. 7.4: Alignment tool for an optional cyclone using the example of a measuring objective with 3.3x magnification