Primes MSM+ User manual

Revision 00 EN – 06/2021
MicroSpotMonitor MSM+
MSM+ 35, MSM+ 120
LaserDiagnosticsSoftware LDS
35,0(6
Original Instructions

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IMPORTANT!
READ CAREFULLY BEFORE USE.
KEEP FOR FUTURE USE.

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Table of contents
1 Basic safety notes 8
2 Symbols and conventions 9
3 About this operating manual 10
4 Device description 10
4.1 Functional description .............................................................................................................10
4.2 Measuring principle .................................................................................................................12
5 Short overview installation 13
6 Transport and storage 14
7 Selection and change of measuring objectives 16
7.1 Selection of the measuring objective .......................................................................................16
7.2 Exchanging the measuring objective .......................................................................................18
7.3 Damage thresholds .................................................................................................................19
8 Installation 22
8.1 Conditions at the installation site .............................................................................................22
8.2 Preparation and mounting position..........................................................................................22
8.3 Manually aligning the device....................................................................................................23
8.3.1 Important conditions for the position of the focused laser beam..................................23
8.3.2 Moving camera housing to axis center position (optional)............................................24
8.3.3 Selecting measuring objective and attaching associated alignment tool ......................25
8.3.4 Aligning device to laser beam......................................................................................26
8.4 Mounting the device................................................................................................................27
9 Cooling circuit (500 W device versions only) 28
9.1 Water quality ...........................................................................................................................28
9.2 Water pressure........................................................................................................................28
9.3 Humidity..................................................................................................................................29
9.4 Water connections and water flow rate....................................................................................30
10 Electrical connection 31
10.1 Connections............................................................................................................................31
10.2 Pin assignment .......................................................................................................................32
10.2.1 Power supply.............................................................................................................32
10.2.2 Input external trigger ...................................................................................................32
10.2.3 Output internal trigger .................................................................................................32
10.2.4 External safety circuit (interlock) .................................................................................32
10.3 Monitoring of the inspection chamber by external safety circuit (interlock)................................33
10.4 Connection to the PC and power supply.................................................................................35
11 Status display 36
12 Measurement 37
12.1 Warning messages..................................................................................................................37
12.2 Switching on the device and connecting it to the LaserDiagnosticsSoftware LDS....................38
12.2.1 Switching on and connecting device...........................................................................38
12.2.2 If the device does not appear in the connections window ...........................................40
12.2.3 Changing the network address of a connected device ................................................40
12.3 Disconnecting the device from the LaserDiagnosticsSoftware LDS and switching it off............41

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12.4 General procedure for measuring ............................................................................................43
12.4.1 Opening the „Device control“ menu.............................................................................43
12.4.2 Moving camera housing to desired z-position .............................................................43
12.4.3 Opening a measuring mode with adapted toolbench ..................................................44
12.4.4 Configuring and saving measurement settings ............................................................45
12.4.5 Performing a measurement.........................................................................................47
12.4.6 Considering messages in the LaserDiagnosticsSoftware LDS during measurement ....48
12.4.7 Checking the quality of the measurement results in the adapted toolbench.................48
12.4.8 Remeasuring a caustic or plane (optional) ...................................................................49
12.5 Performing single plane measurement.....................................................................................51
12.5.1 Preparatory steps .......................................................................................................51
12.5.2 Configuring settings ....................................................................................................52
12.5.3 Configuring advanced settings....................................................................................55
12.5.4 Measuring a plane.......................................................................................................58
12.5.5 Measuring further planes.............................................................................................60
12.6 Performing continuous plane measurement.............................................................................61
12.6.1 Preparatory steps .......................................................................................................61
12.6.2 Configuring settings ....................................................................................................61
12.6.3 Configuring advanced settings....................................................................................64
12.6.4 Measuring a plane continuously ..................................................................................65
12.7 Performing manual caustic measurement................................................................................67
12.7.1 Preparatory steps .......................................................................................................67
12.7.2 Configuring settings ....................................................................................................67
12.7.3 Configuring advanced settings....................................................................................69
12.7.4 Measuring a caustic manually .....................................................................................72
12.8 Performing automatic caustic measurement............................................................................73
12.8.1 Preparatory steps .......................................................................................................73
12.8.2 Configuring settings ....................................................................................................74
12.8.3 Configuring advanced settings....................................................................................75
12.8.4 Measuring a caustic automatically...............................................................................78
12.9 Monitoring beam pointing stability ...........................................................................................79
12.9.1 Preparatory steps .......................................................................................................79
12.9.2 Configuring settings ....................................................................................................79
12.9.3 Configuring advanced settings....................................................................................80
12.9.4 Measuring beam pointing stability ...............................................................................81
12.9.5 Logging beam pointing stability...................................................................................83
13 Troubleshooting 84
14 Maintenance and service 85
14.1 Maintenance intervals..............................................................................................................85
14.2 Cleaning..................................................................................................................................85
14.3 Exchanging the protective window..........................................................................................85
14.3.1 Warning messages .....................................................................................................85
14.3.2 Replacing the protective window.................................................................................86
14.3.3 Replacing the protective window for cyclone...............................................................87
15 Measures for the product disposal 87
16 Declarations of conformity 88
17 Technical data 90
18 Dimensions 91
19 Appendix 92
19.1 Insert fixed OD filter (option) in the inspection chamber ...........................................................92
19.2 Optical components................................................................................................................93

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19.2.1 NA limit value, typical magnification and measuring plane distance ............................94
19.2.2 Measuring objective ....................................................................................................95
19.2.3 Prisms ........................................................................................................................97
19.2.4 Fixed filter and filter wheel ...........................................................................................99
19.2.5 Beam path extension (BPE).......................................................................................100
19.2.6 Field objektive (FO)....................................................................................................100
19.2.7 Absorber...................................................................................................................101
19.2.8 Trigger diode.............................................................................................................101
19.3 Measuring pulsed irradiation..................................................................................................101
19.3.1 Trigger operation.......................................................................................................101
19.3.2 Measuring configuration selection .............................................................................102
19.3.3 Influence of the pulse parameters on the integration time control ..............................102
19.3.4 Examples for trigger operation ..................................................................................106
19.3.5 Summary ..................................................................................................................106

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PRIMES - The Company
PRIMES manufactures measuring devices used to analyze laser beams. These devices are employed for
the diagnostics of high-power lasers ranging from CO2lasers and solid-state lasers to diode lasers. A wave-
length range from infrared through to near UV is covered, offering a wide variety of measuring devices to
determine the following beam parameters:
• Laser power
• Beam dimensions and position of an unfocused beam
• Beam dimensions and position of a focused beam
• Beam quality factor M²
Development, production and calibration of the measuring devices is performed at PRIMES. This guarantees
optimum quality, excellent service, and a short reaction time, providing the basis for us to meet all of our
customers’ requirements quickly and reliably.
PRIMES GmbH
Max-Planck-Str. 2
64319 Pfungstadt
Germany
Tel [phone]
[email protected]
www.primes.de

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1 Basic safety notes
Intended use
The device has been designed exclusively for measurements in the beam of high-power lasers.
Use for any other purpose is considered as not intended and is strictly prohibited. Furthermore, intended use
requires that you observe all information, instructions, safety notes and warning messages in this operating
manual. The specifications given in chapter “17 Technical data” on page 90 apply. Any given limit values
must be complied with.
If not used as intended, the device or the system in which the device is installed can be damaged or de-
stroyed. In addition, there is an increased risk to health and life. Only use the device in such a way that there
is no risk of injury.
This operating manual is an integral part of the device and must be kept in the immediate vicinity of the place
of use, accessible to personnel at all times.
Every person who is responsible for the installation, start-up or operation of the device must have read and
understood the operating manual and, in particular, the safety instructions.
If you still have questions after reading this operating manual, please contact PRIMES or your supplier for
your own safety.
Observing applicable safety regulations
Observe the safety-relevant laws, guidelines, standards and regulations in the current editions published by
the state, standardization organizations, professional associations, etc. In particular, observe the regulations
on laser safety and comply with their requirements.
Necessary safety measures
The device measures direct laser radiation, but does not emit any radiation itself. However, during the mea-
surement the laser beam is directed at the device. This produces scattered or directed reflection of the laser
beam (laser class 4). The reflected beam is usually not visible.
Protect yourself from direct and reflected laser radiation while working with the device by taking the following
measures:
• Never leave the device unattended when taking measurements.
• If the device is moved from its aligned position, increased scattered or directed reflection of the laser beam
occurs during measuring operation. Fix the device in such a way that it cannot be moved by unintentional
bumping or pulling on the cables.
• Connect the laser control’s safety interlock to the device. Check that the safety interlock will switch off the
laser properly in case of error.
• Install safety switches or emergency safety mechanisms that allow the laser to be switched off immediately.
• Use suitable beam guidance and beam absorber elements which do not emit any hazardous substances
when irradiated.
• Wear safety goggles adapted to the power, power density, laser wavelength and operating mode of the
laser beam source in use.
• Wear suitable protective clothing or protective gloves if necessary.
• If possible, also protect yourself from direct laser radiation and scattered radiation by using separating
protective devices that block or attenuate the radiation.
Employing qualified personnel
The device may only be operated by qualified personnel. The qualified personnel must have been instructed
in the installation and operation of the device and must have a basic understanding of working with high-
power lasers, beam guiding systems and focusing units.

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Conversions and modifications
The device may not be modified in terms of design or safety without the explicit consent of the manufacturer.
The same applies to unauthorised opening, dismantling and repair. The removal of covers is only permitted
within the scope of the intended use.
Liability disclaimer
Manufacturer and distributor exclude any liability for damages and injuries which are direct or indirect con-
sequences of using the device not as intended or modifying the device or the associated software without
authorization.
2 Symbols and conventions
Warning messages
The following symbols and signal words indicate possible residual risks in the form of warnings:
DANGER
Means that death or serious physical injuries will occur if necessary safety precautions are not
taken.
WARNING
Means that death or serious physical injuries may occur if necessary safety precautions are not
taken.
CAUTION
Means that minor physical injury may occur if necessary safety precautions are not taken.
NOTICE
Means that property damage may occur if necessary safety precautions are not taken.
Product safety labels
The following symbols are used on the device itself to indicate imperatives and possible dangers:
Hand injuries warning
Electrostatic sensitive devices
Read and observe the operating instructions and safety guidelines before startup!

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Further symbols and conventions in this operating manual
Here you can find useful information and helpful tips.
Indicates a simple instruction.
If several such instructions appear one below the other, then the order of their execution is irrel-
evant or they are alternative procedures.
1.
2.
...
A numbered list identifies a sequence of instructions that must be executed in the specified order.
Indicates the result of an action to explain processes that take place in the background.
Indicates an observation prompt to draw attention to visible feedback from the device or the soft-
ware.
Observation prompts make it easier to check whether an instruction was executed successfully.
Often they also guide to the next instruction.
Points to a control element that is to be pressed/ clicked.
Points to an element described in the text (for example an input field).
3 About this operating manual
This manual describes the installation and operation of the device and how to perform measurements with
the LaserDiagnosticsSoftware LDS 1.1.2.
For measurement operation with a PC, the LaserDiagnosticsSoftware LDS must be installed on the PC. The
LDS is included in the scope of delivery.
The software description includes a brief introduction on using the device for measurements.
For a detailed description of the software installation, file management and evaluation of the measurement
data, please refer to the separate instructions for the LaserDiagnosticsSoftware LDS.
This operating manual describes the software version valid at the time of printing. Since the user
software is continuously being developed further, the supplied data medium may have a different
version number.
If you have questions, please let us know the software version you are using. The software version can be
found under the following menu item: Help > About LaserDiagnosticsSoftware.
4 Device description
4.1 Functional description
The device determines beam geometry data of focused laser beams with a diameter of 10µm to 1mm
directly within the process zone. It is air-cooled and allows measurements in a power range from 1mW to
200W. A device version with water cooling for the power range up to 500W is also available.
The device operates camera-based. The beam cross sections to be measured along the beam propagation
axis are located outside the device. This non-contact measurement has the advantage that even very high

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power densities can be measured. The beam cross sections are imaged on a CCD sensor in the device −
enlarged by a measuring objective. Before hitting the sensor, the laser beam is attenuated by beam splitters
and neutral-density filters inside the device. From the determined power density distribution of the beam
cross-section, beam position and beam radius at this position are obtained.
The camera housing of the device can be moved by a motor on all axes of the device coordinate system.
The travel range along the z-axis is 35mm (MSM+ 35) or 120mm (MSM+ 120). The travel range along the
x-axis/ y-axis is 2mm. This allows fully automatic plane and caustic measurements.
The device uses interchangeable objectives with the magnification 3.3/ 5/ 10. The selection of the suitable
measuring objective is essential for the quality of the measurement. The measuring objective should be opti-
mally matched to the wavelength, the numerical aperture and the radius to be measured.
The dynamic range of the integrated CCD sensor is amplified via an irradiation time control. This enables
caustic measurements over more than four Rayleigh lengths, as demanded in the standard ISO11146.
Optionally, the device can be equipped with a motor-driven filter wheel with neutral-density filters (OD1 to
OD5). This filter wheel enables measurements of power densities between several W/cm² up to several
MW/cm².
Absorber with
water cooling Lever to adjust the
magnification
Traversing motor
Beam path extension (BPE)
Field objective (FO)
Standard
Beam entrance
Movable camera
housing
Handle
Cover of the inspection chamber for
filter wheel (optional)
and fixed OD filter (optional)
x-axis
y-axis
z-axis
Knurled screw
Measuring objec-
tive with cover
Water connections
Fig. 4.1: System components (example: MSM+ 120, 500 W device version with water cooling)

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4.2 Measuring principle
The device is a camera-based measuring system. Depending on the application, up to 7 different optical
components can be placed within the beam path. The purpose and functionality of individual components
are described in chapter19.2, „Optical components“, on page93.
Mirrors
Trigger
Filter wheel (option)
Measuring
objective
Beam path extension (BPE)
Absorber
Laser beam
Absorber
Field objective (FO)
CCD sensor
Fixed OD-filter (option)
Prisms
Measuring
plane Permissible mea-
suring range
Upper limit
Lower limit
Fig. 4.2: Optomechanical design

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5 Short overview installation
1. Installing the LaserDiagnosticsSoftware LDS on the PC
• Software is part of the scope of delivery
See separate Operating Manual
of the LaserDiagnosticsSoftware
LDS
2. Taking safety precautions Chapter 1 on page 8
3. Transport and storage
• Prepare device for transport/ storage
Chapter 6 on page 14
4. Measuring objective
• Select appropriate measuring objective for the application
• Insert/ change measuring objective
• Observe damage thresholds
Chapter 7 on page 16
5. Installation
• Make preparations
• Set installation position
• Align device manually
• Mount device firmly
Chapter 8 on page 22
6. Connect the water-cooling (500W version only)
• Connection diameter
• Observe flow rate
Chapter 9 on page 28
7. Power supply
• Connect safety interlock
• Connect power supply
Chapter 10 on page 31
8. Connection with the PC
• Via Ethernet or LAN
Chapter 10.4 on page 35
9. Measurement
• Observe warning messages
• Select appropriate measurement mode for the measurement task
• Perform measurement
Chapter 12 on page 37

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6 Transport and storage
WARNING
Injuries caused by lifting or dropping the device
Lifting and positioning heavy devices can lead, for example, to overstressed intervertebral
discs and chronic changes in the lumbar or cervical spine. The device may fall down.

If possible, use a lifting device or work in pairs to lift and position the unit.
NOTICE
Damaging/ destroying the device
Contamination can damage or destroy the optical components. Components may be dam-
aged if the device is subjected to hard shocks or is allowed to fall.

Move the camera housing to home position before transporting/ storing the device.

Handle the device with care when transporting it.

To avoid contamination, close the measuring objective with the supplied cover before trans-
porting/ storing the device.

If possible, transport/ store the device in the original PRIMES transport case (optional).
NOTICE
Damaging/ destroying the device

Store the device in a closed room where it is protected from moisture and dirt.

Only store the device within the permissible environmental conditions specified in chapter
“17 Technical data” on page 90.
NOTICE
Damaging/ destroying the device
If the unit is water-cooled, it can be damaged by leaking or freezing cooling water.
Even if the pipe system of the cooling circuit has been drained, a small amount of water
always remains in the device. This can leak out and enter the interior of the device.

Drain the pipe system of the cooling circuit thoroughly before transporting/ storing the de-
vice. Do not use compressed air for draining.

Before transporting/ storing the device, close the water connections of the cooling circuit
with the sealing plugs provided.
The device only fits into the original PRIMES transport case (optional) when the camera housing is
in home position.

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To prepare the device for transport/ storage:
1. Disconnect the device from the LaserDiagnosticsSoftware LDS and switch it off according to chapter
12.3 on page 41. Make sure that the camera housing is in home position before switching it off.
2. Close the measuring objective with the supplied cover.
3. Disconnect the electrical connections.
4. Only for water-cooled device versions: Drain the cooling circuit thoroughly. Close the water connections
of the cooling circuit with the supplied sealing plugs.
5. Lift the device by the handle. If you are not using a lifting device, we recommend that two people lift the
device.
6. If possible, pack the device in the original PRIMES transport case (optional).

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7 Selection and change of measuring objectives
7.1 Selection of the measuring objective
The selection of the suitable measuring objective is essential for the quality of the measurement. The measur-
ing objective should be optimally matched to the wavelength, the numerical aperture and the radius to be
measured.
Furthermore, the possible fields of application are limited by the sensor- and pixel size (see chapter19.2.2,
„Measuring objective“, on page95).
10x + BPE
5x + BPE
3.3x + BPE
10x
5x
3.3x
Beam diameter in μm
1 10 100 1000 10000
3,3x
3,3x+SWV
5x
5x+SWV
10x
10x+SWV
Spotdurchmesser in µm
1 10 100 1000
Fig. 7.1: Fields of application of the measuring objectives
Fig. 7.1 shows the field of application of different measuring objectives. The diagramm enables a quick first
selection of the suitable measuring objective.

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The following table specifies the limits that apply to standard objectives. On the basis of this table, a suitable
measuring objective can be selected. The values apply for a wavelength of 1 064nm (the values are slightly
different for other wavelengths).
Standard
Objective NA F Max. measuring window Min. resolution Min. beam diameter Max. beam diameter
3.3x 0.11 5 1.4mm 1.4 μm 30μm 1mm
5x 0.19 910μm 0.9μm 20μm 650μm
10x 0.24 2 510μm 0.5μm 11μm 350μm
With beam path extension (BPE)
Objective NA F Max. measuring window Min. resolution Min. beam diameter Max. beam diameter
3.3x 0.11 5 800μm 0.8μm 17.5μm 550μm
5x 0.19 550μm 0.5μm 12μm 380μm
10x 0.24 2 320μm 0.3μm 7μm 220μm
With field objective (FO)
Objective NA F Max. measuring window Min. resolution Min. beam diameter Max. beam diameter
3.3x 0.11 5 4mm 3.9µm 90µm 2.8mm
5x 0.19 2.75mm 2.7µm 60µm 2mm
10x 0.24 2 1.6mm 1.6µm 35µm 1.1mm
Tab. 7.1: Measuring objective data
NA = numerical aperture
F = focusing value (see Formula 7.2 on page 20)

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7.2 Exchanging the measuring objective
1. Unscrew the two knurled screws.
2. Remove the measuring objective upwards. Note that the measuring objective is fixed by two dowel pins
and will not tilt during removal.
Knurled screw
Dowel pins 2x
Fig. 7.2: Measuring objective inserted
NOTICE
Component susceptible to electrostatic discharge
The EEPROM can be destroyed by an electrostatic discharge.

Do not touch the contacts of the EEPROM as well as the contact pin.

Put on an ESD armband before changing the measuring objective.
There is an EEPROM in the mount of the measuring objectives, which contains all the objective data neces-
sary.
Contact pins
Dowel pins 2x
Fig. 7.3: Measuring objective removed
3. Place the measuring objective from above on the two dowel pins.
4. Press the measuring objective down vertically as far as it will go. When inserting, make sure that it does
not tilt.

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7.3 Damage thresholds
The operating limits of the device are determined by the damage thresholds of the optical components.
NOTICE
Damaging/ destroying the measuring objective
Measuring objectives can be destroyed by an excessive power/ energy density.

Observe the following maximum values on the first lens:
• Max. power density with CW: 10 MW/cm²
• Max. energy density at pulse length > 10 ns: 3 J/cm²

The maximum average power for the wavelength range 1030 nm to 1090 nm (NIR) is 200 W
(500 W for water-cooled device versions). The permissible power decreases for shorter
wavelengths.
The power density I is calculated according to the following formula:
Formula 7.1: Formula for calculating the power density I
• If the beam focus is placed below the measurement range (too close to the measuring objective), the power
density rises at the first lens of the measuring objective.
• If the focus is above the measuring plane, an intermediate focus develops inside the device. If the laser
beam focus is too far above the measurement range, the intermediate focus can develop in areas in which
the beam power has not been sufficiently decreased. This can damage the image-sided beam path.
The size and position of the area in which the beam focus is to be positioned before the first measurement
depends on the choice of the measuring objective, the used wavelength as well as on the beam path.
The diagram in Fig. 7.4 on page 20 shows that the upper limits for high-magnification measuring objec-
tives are much narrower than those with a 3.3-fold magnification.
The lower limit for convergent beams depends on the power density of the laser beam on the first lens. This
is a function of laser power, amount of focusing, M², as well as raw beam diameter.

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The graphs in Fig. 7.4 and Fig. 7.5 can be used to estimate the minimum distance.
Measuring plane distance
PRIMES 10x without BPE
Distance between focus and measuring objective in mm
F = 5
F = 10
F = 15
F = 20
F = 30
20
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
30 40 50 60 70 80
Beam radius on the first lens in mm
Measuring plane distance
PRIMES 3,3x without BPE
Fig. 7.4: Estimatation by the focusing value F for 1 064 nm and 532 nm
The diagram in Fig. 7.4 shows the dependence of the beam radius on the first lens with the focusing value F
and the distance of the focal plane to the first lens of the measuring objective.
The focusing value F can be determined by means of the following formula:
Formula 7.2: Formula for calculating the focusing value F
f = Focal length of the focusing lens
ds= Raw beam diameter
Θ = Full divergence angle