Radstone PowerPact User manual

PowerPact6 Processors
Family Product Manual
Publication No. CP-0HH
1st Edition, October 2005
© Radstone Technology PLC

Copyright Notice
© Radstone Technology PLC 2005. All rights reserved.
This publication is issued to provide outline information only which (unless agreed by the Company in
writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or
be regarded as a representation relating to products or services concerned. The Company reserves the
right to alter without notice the specification, design, price or conditions of supply of any product or
service.
Trademarks
Radstone, the Radstone logo and PowerPact6 are trademarks of Radstone Technology PLC.
All other company and product names are acknowledged as being the trademarks or registered
trademarks of their respective companies.
Document History
EDITION DATE COMMENTS
1st Edition October 2005 CP1A boards rev 1 and up

PowerPact6 Processors Family Product Manual
1st Edition Contents i
Contents
1. Introduction..............................................................................................................................1-1
PowerPact6 Family Overview..................................................................................................................1-1
Build Styles ..............................................................................................................................................1-1
Add-on Functionality ...............................................................................................................................1-1
Input/Output Capability............................................................................................................................1-2
Software Support......................................................................................................................................1-3
Built In Test ..................................................................................................................................1-3
Background Condition Screening (BCS) ......................................................................................1-3
PPCBoot Firmware .......................................................................................................................1-3
Operating System Support ............................................................................................................1-3
VxWorks/Tornado .............................................................................................................1-4
LynxOS.............................................................................................................................. 1-4
Integrity..............................................................................................................................1-4
Safety Notices ..........................................................................................................................................1-5
Safety Summary............................................................................................................................1-5
Ground the Equipment ..................................................................................................................1-5
Power Supplies..............................................................................................................................1-5
Backplane Requirements...............................................................................................................1-5
Flammability .................................................................................................................................1-5
EMI/EMC Regulatory Compliance............................................................................................... 1-5
Handling........................................................................................................................................1-6
Heatsink ........................................................................................................................................1-6
About This Manual...................................................................................................................................1-7
Objectives .....................................................................................................................................1-7
Audience .......................................................................................................................................1-7
Scope.............................................................................................................................................1-7
Structure........................................................................................................................................1-7
Conventions ..................................................................................................................................1-8
Associated Documents .............................................................................................................................1-9
World Wide Web Sites.............................................................................................................................1-9
2. Unpacking and Inspection......................................................................................................2-1
Unpacking ................................................................................................................................................2-1
Identifying Your Board ............................................................................................................................2-1
Product Code Breakdown .............................................................................................................2-2
Board Artwork Version.................................................................................................................2-2
Inspection .................................................................................................................................................2-2
3. Configuration and Installation................................................................................................3-1
PMC Installation ......................................................................................................................................3-1
Link Configuration................................................................................................................................... 3-2
Chassis Configuration ..............................................................................................................................3-2
Board Installation .....................................................................................................................................3-3
4. System Set-up..........................................................................................................................4-1
Connection ...............................................................................................................................................4-1
Connection Using I/O Modules.....................................................................................................4-1
Development System................................................................................................................................4-3
System Software Setup .................................................................................................................4-4
Network Settings...........................................................................................................................4-4
Embedded Software Setup .......................................................................................................................4-5
BIT ................................................................................................................................................4-6
PPCBoot........................................................................................................................................4-7
VxWorks .......................................................................................................................................4-8

PowerPact6 Processors Family Product Manual
1st Edition Contents ii
5. Standard Interfaces .................................................................................................................5-1
CompactPCI Interface ..............................................................................................................................5-1
J1 Connector Pinout ......................................................................................................................5-2
Signal Descriptions............................................................................................................5-3
J2 Connector Pinout ......................................................................................................................5-5
Signal Descriptions............................................................................................................5-6
Geographical Address Pin Assignments .......................................................................................5-7
PMC Interface ..........................................................................................................................................5-8
PMC Sites .....................................................................................................................................5-8
Jx1 (32-bit PCI) Connector Pinout................................................................................................5-9
Jx2 (32-bit PCI) Connector Pinout................................................................................................5-9
Jx3 (64-bit PCI) Connector Pinout.............................................................................................. 5-10
J14 (User I/O) Connector Pinout.................................................................................................5-11
J24 (User I/O) Connector Pinout.................................................................................................5-11
PCI/PMC Signal Descriptions.....................................................................................................5-12
AFIX Interface ....................................................................................................................................... 5-13
AFIX Connector Pinout ..............................................................................................................5-14
AFIX Signal Descriptions...........................................................................................................5-15
6. Build Styles and Dimensions .................................................................................................6-1
Build Styles ..............................................................................................................................................6-1
Environmental Specifications...................................................................................................................6-2
Dimensions...............................................................................................................................................6-3
7. Technical Support....................................................................................................................7-1
Troubleshooting .......................................................................................................................................7-2
Appendix A - CP1A ...........................................................................................................................A-1
Glossary..................................................................................................................................................i
Index........................................................................................................................................................i

PowerPact6 Processors Family Product Manual
1st Edition 1-1
1.Introduction
PowerPact6 Family Overview
Radstone’s PowerPact6 family of 6U rugged CompactPCI products builds on the established 3U
PowerPact3 family and the proven designs of its latest VME SBCs, but takes full advantage of the
enhanced features of CompactPCI, such as support for hot swap, and much higher pin count to give the
most flexible single slot solution currently in the defense and aerospace market space.
The general purpose processors feature an extensive range of I/O, coupled with two PMC sites and
Radstone’s new AFIX (Additional Flexible Interface Xtension) pluggable module. Latest generation
PowerPC processors and Integrated System Controllers, combined with Radstone’s industry-leading
software support and experience in designing and manufacturing rugged electronics for over four
decades, give the PowerPact6 family the edge in embedded computing performance.
Build Styles
Like Radstone’s VME products, the PowerPact6 family is available in a range of build styles, from
Level 1 (Standard), suitable for a benign office-like environment, right through to Level 5 (Rugged
Conduction-cooled), capable of withstanding the harshest of environments. All products are COTS/NDI,
and make maximum use of low cost plastic packaged integrated circuits to ensure the most cost effective
solution, whatever the market.
Add-on Functionality
PowerPact6 processors have two on-board IEEE P1386.1 PMC sites, with PMC I/O available through
the J3 and J5 connectors, allowing direct backplane connection to I/O.
Radstone is a key member of the VITA standards committee, setting the standards for rugged
conduction-cooled PMCs.
A range of PMCs is available from Radstone in both conduction-cooled and air-cooled build standards.
More details on these can be found at http://www.radstone.com or product literature can be obtained
from your nearest Sales Office or Radstone directly.
$Note:Air-cooled build levels (1, 2 and 3) can accept any build level of air- or conduction-cooled PMCs
(from Radstone or third parties), as long as adequate cooling is provided. However, conduction-
cooled build levels (4 and 5) can only accept conduction-cooled PMCs.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-2
Input/Output Capability
The PowerPact6 processor provides high-density rear I/O for systems requiring sealed box operation and
simple card replacement routines for field maintenance. Using rear I/O minimizes the effort required to
remove boards from a rack, so improving maintainability and reliability.
The PowerPact6 processors use 6-row CompactPCI J1, J2, J3, J4 and J5 connectors. PowerPact6
processor rear I/O connectivity, via the J3, J4 and J5 connectors, includes Ethernet, serial, GPIO and
access to the on-board PMC and AFIX sites. Front I/O connectivity (only available on build levels 1 to 3)
includes serial and USB, plus access to the on-board PMC sites.
To maximize the flexibility of connecting to the rear I/O, backplane modules and a range of breakout
panels are available (see below).
Figure 1-1. PowerPact6 I/O
I/O Modules
For use in chassis, Radstone offers backplane modules to convert the condensed J3/J4/J5 pinouts to
industry-standard formats, plus 3U breakout panels offering a variety of industry standard connectors
such as serial I/O. Internal cables and a basic set of external cables are available. These backplane
modules and breakout panels are intended for development use in a benign environment, and so are only
available in level 1 or 2 build standards.
For more details see the I/O Modules Manual, publication number RT5154.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-3
Software Support
PowerPact6 software support options include Built In Test (BIT) and PPCBoot firmware, plus BSPs and
ESPs for VxWorks/Tornado from Wind River Systems, LynxOS from LynuxWorks and Integrity from
Green Hills Software Inc.
Built In Test
BIT provides initialization test for all on-board functional areas of the PowerPact6 processors. Highest
possible coverage (95%) is achieved by the use of intrusive testing, with BIT assuming exclusive use of
device resources. BIT executes before any COTS O/S, and passes control to the O/S on completion.
Testing in conjunction with a COTS O/S is accomplished by BCS (see below).
BIT is a highly configurable component, with options for individual tests and sub-tests. System-wide
coverage to Radstone PMCs or other Radstone VME boards is supported. Custom tests for bespoke
equipment can readily be added. In addition to visual indication, test results can be stored in Flash for
later analysis by the application.
Background Condition Screening (BCS)
BCS provides continuous, on-line health monitoring. It runs as a task thread, featuring non-intrusive tests
that are specifically designed to be co-operative with the normal functioning of the COTS O/S that is
running the application. In addition to having minimal impact on system latency, this method avoids a
difficulty that arises when ‘calling back’ into a traditional, stand-alone test firmware, written in
ignorance of the O/S and probably assuming exclusive use of board resources. Such firmware may not
guarantee the restoration of the entire and complex machine state as the O/S left it. BCS works chiefly
through O/S mechanisms and does not compromise the machine state imposed by the O/S.
Radstone’s BCS for VxWorks is downloadable or can be linked to the VxWorks executable image. It can
be launched from the VxWorks shell or from an application. Configuration is via the Tornado Project
Tool. Configurable parameters include the BCS task priority, plus various test options and other
characteristics. An error log is stored in Flash, in addition to visual indication of a detected failure. An
application interface is provided for immediate invocation of individual tests in addition to the default
running of tests in background mode.
PPCBoot Firmware
The PPCBoot firmware provides a foundation layer to interface between the raw Radstone board
hardware, with its highly programmable device set-ups and flexibility, and the supported Operating
Systems, which require a straight-forward booting and device interface model.
The PPCBoot Firmware allows booting from a range of device types and includes comprehensive
configuration facilities and other valuable features for system integrators.
Operating System Support
In-house porting expertise for PowerPC based boards is focused on key operating systems, including
Wind River Systems’ VxWorks/Tornado, LynuxWorks’ LynxOS and Green Hills’ Integrity. Other
operating system ports, drivers for third party hardware and layered products are provided through
strategic partnerships with dedicated third party vendors, able to offer high quality products and services
complementary to the Radstone range. In this way, state of the art development environments and debug
tools that are part of these software-products are made available for use on Radstone’s flexible hardware
architectures.
Please contact Radstone for availability of other operating systems in addition to the standard VxWorks,
LynxOS and Integrity offerings.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-4
VxWorks/Tornado
Tornado: A highly scaleable and deterministic run-time system, Tornado offers distributed backplane and
networking support and has a large base of third-party support. Tornado includes a comprehensive suite
of core and optional cross-development tools and utilities, and a full range of communications options
for the target connection to the host. Support for Wind River’s next generation product VxWorks 6 with
the WorkBench IDE is available. This adds powerful new features with a focus on open standards,
performance, reliability and interoperability, and includes MMU-based memory protection and enhanced
error management.
VxWorks: Deployed in over 30 million devices, VxWorks forms the foundation for Wind River
platforms, which also include the Tornado Integrated Development Environment (IDE). The run-time
component of the Tornado embedded development platform, VxWorks is the most widely adopted real-
time operating system (RTOS) in the embedded industry. With a focus on performance, scalability, and
footprint, VxWorks enables device software to run faster, better, and more reliably.
Board support packages (BSPs) containing Wind River defined support, and enhanced support packages
(ESPs) providing extra Radstone defined support, are both available direct from Radstone.
LynxOS
This fully deterministic real-time UNIX offers complete memory management support, including MMU-
based protected address-spaces for tasks. With comprehensive POSIX API conformance 1003.1, .1b and
.1c, LynxOS also exhibits true linear scalability, and a Linux application binary interface (ABI)
personality. Linux binaries run unchanged on LynxOS v4.0.
Radstone provides direct support for BSPs containing LynuxWorks defined support, and ESPs providing
extra Radstone defined support.
Linux has, in recent years, formed an increasingly attractive alternative to proprietary operating systems
for underpinning applications on embedded systems. A range of Linux distributions, targeted at cut-down
embedded operation up to large-scale server operation, has increased choice still further, with free and
added-value commercial distributions sharing the market and catering for different program needs.
An Open Source package for the PowerPact6 CP1A, released under the terms of the General Public
License (GPL) and supporting the Linux 2.6.x kernel, can be downloaded from the Radstone website.
Radstone intends to provide confidence of operation with a number of free and commercial distributions,
including Yellow Dog, Fedora Core (PowerPC version) and BlueCat from LynuxWorks.
Integrity
This maximum reliability, real-time operating system is royalty-free. The Integrity RTOS uses hardware
memory protection to isolate and protect itself, and user tasks, from incorrect operation caused by
accidental errors or malicious tampering.
Support for Radstone boards including the CP1A is available direct from Green Hills Software Inc.,
Radstone’s technology partner.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-5
Safety Notices
Safety Summary
Observe the following general safety precautions during operation of this equipment. Failure to comply
with these precautions or with specific Warnings and/or Cautions elsewhere in this manual violates
safety standards of design, manufacture and intended use of the equipment. Radstone Limited trading as
Radstone Digital Processing assumes no liability for the user’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Radstone is aware.
Take note of these warnings and take all other safety precautions necessary for the safe operation of the
equipment in your operating environment.
Ground the Equipment
To minimize shock hazard, connect the equipment chassis and rack/enclosure to an electrical ground. If
AC power is supplied to the rack/enclosure, the power jack and mating plug of the power cable must
meet International Electrotechnical Commission (IEC) safety standards.
Power Supplies
!WARNING
Do not exceed the maximum rated input voltages or apply reversed bias to the assembly.
If such conditions occur, toxic fumes may be produced due to the destruction of components.
Power supply problems must only be dealt with by qualified personnel.
Backplane Requirements
"CAUTION
For optimum performance, PowerPact6 processors have been designed for use with 64-bit
CompactPCI backplanes. They may also be used with 32-bit backplanes, but with a
corresponding performance loss.
Flammability
All Radstone circuit boards are manufactured by UL-recognized/approved manufacturers and have a
flammability rating of 94V-0.
EMI/EMC Regulatory Compliance
"CAUTION
This equipment generates, uses and can radiate electromagnetic energy. It may cause or be
susceptible to electromagnetic interference (EMI) if not installed and used in a cabinet with
adequate EMI protection.
Radstone boards are designed using good EMC practices and, when used in a suitably EMC-compliant
chassis, should maintain the compliance of the total system.
Radstone boards also comply with EN60950 (product safety), which is essentially the requirement for the
Low Voltage Directive (73/23/EEC).
Air-cooled PowerPact6 processors are designed for use in systems meeting VDE class B, EN and FCC
regulations for EMC emissions and susceptibility.
Conduction-cooled PowerPact6 processors are designed for integration into EMC hardened
cabinets/boxes.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-6
Handling
"CAUTION
Handle PowerPact6 processors using the board edges or front panel.
Incorrect handling may cause component damage
Heatsink
"CAUTION
Do not remove the heatsink.
There are no PROMs or other user-alterable components
underneath the heatsink, so users should have no reason to
remove it.
Users should not attempt reattachment of the heatsink, as this
requires precise torque on the screws attaching the heatsink
to the PCB. Over-tightening the screws may cause the
heatsink to damage components beneath it (e.g. the main
PowerPC processor). Removal and re-attachment of the
heatsink should only be carried out by Radstone.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-7
About This Manual
Objectives
•To guide the reader through configuration, installation and power-up of PowerPact6 processors
•To provide the user with reference information on the specific PowerPact6 processors (CP1A etc.)
$Note:On-board firmware and other software (e.g. drivers, BSPs, ESPs etc.) are described in separate user
guides.
Audience
This manual is written to cover, as far as possible, the range of people who will handle or use the
PowerPact6 processors including (but not limited to):
•Inspectors
•Installation technicians
•Hardware and software engineers
•System managers
While every effort has been made to keep the description of configuration, installation and power-up as
simple and user-friendly as possible, a certain amount of background knowledge on these subjects is
assumed.
Scope
This manual describes:
•All build standards of the PowerPact6 processors
•All variants of the PowerPact6 processors
This manual mentions, but does not describe in detail:
•PMCs and AFIX modules
•Carrier cards
•PowerPact6 on-board firmware
•Other firmware such as drivers, BSPs, ESPs etc.
•Application software
Structure
This manual is divided into two main parts: the first part contains all the information common to the
PowerPact6 family, and the second part (the appendices) contains the information specific to the family
constituents (CP1A etc.)
Included in the first part is a hardware set-up section that reflects the sequence of operations from receipt
of a PowerPact6 processor up to getting it working in your system.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-8
Conventions
All numbers are expressed in decimal, except addresses and memory or register data, which are
expressed in hexadecimal. Where confusion may occur, decimal numbers have a ‘D’ subscript and
binary numbers have a ‘b’ subscript. The prefix ‘0x’ shows a hexadecimal number, following the ‘C’
programming language convention. Thus:
One dozen = 12D= 0x0C = 1100b
The multipliers ‘k’, ‘M’ and ‘G’ have their conventional scientific and engineering meanings of *103,
*106and *109respectively. The only exception to this is in the description of the size of memory areas,
when ‘K’, ‘M’ and ‘G’ mean *210, *220 and *230 respectively.
$Note:When describing transfer rates, ‘k’ ‘M’ and ‘G’ mean *103, *106and *109not *210, *220 and *230.
In PowerPC terminology, multiple bit fields are numbered from 0 to n, where 0 is the MSB and n is the
LSB. PCI and VMEbus terminology follows the more familiar convention that bit 0 is the LSB and bit n
is the MSB.
Signal names follow the PICMG 2.0 R3.0 CompactPCI Specification. Signal names ending with a hash
(~) are active low; all other signals are active high.
This manual uses the following types of notice:
1) Notes call attention to important features or instructions, and are shown as follows:
$Note:This is an example note entry.
2) Cautions call attention to actions that may cause system damage or loss of data, and are shown as
follows:
"CAUTION
This is an example caution entry.
3) Warnings call attention to actions that may cause risk of personal injury, and are shown as follows:
!WARNING
This is an example warning entry.
4) Recommendations give guidance on procedures that may be tackled in a number of ways, and are
shown as follows:
£RECOMMENDATION
This is an example recommendation
entry.

PowerPact6 Processors Family Product Manual
Introduction
1st Edition 1-9
Associated Documents
CompactPCI Bus Specification PICMG 2.0 R3.0.
ANSI/VITA 30.1-2002 – 2mm Connector Equipment Practice for Conduction-Cooled Eurocards.
IEEE P1386 Draft Standard for a Common Mezzanine Card Family.
IEEE P1386.1 Draft Standard Physical and Environmental Layers for PCI Mezzanine Cards.
ANSI/VITA 20 – 2001 Standard for Conduction-cooled PMCs.
Associated Radstone Documents
I/O Modules Manual, publication number RT5154.
PMC Installation Note, publication number HN4/3-99.
PPCBIT User Guide, publication number PPCBIT-0HU.
PowerPact6 User Guide (Tornado/Platforms/VxWorks Edition), publication number CPBSP-TOR0HU.
VxWorks ESP for PowerPact6 Manual, publication number CPESP-TOR0HU.
LynxOS BSP for PowerPact6 Installation Manual, publication number CPBSP-LNXxHL.
LynxOS ESP for PowerPact6 Manual, publication number CPESP-LNX0HL.
PPCBoot User Guide, publication number PPCBOOT-0HL.
World Wide Web Sites
The Radstone Product Manuals CD-ROM allows privileged access to an Internet resource containing the
latest updated documents.
Radstone on the world-wide-web is available at http://www.radstone.com
Manufacturers of many of the devices used on the PowerPact6 processors maintain FTP or world-wide-
web sites. Some useful sites are:
http://www.picmg.org CompactPCI data is available through this site.
http://www.freescale.com Freescale PowerPC data is available through this site.
http://www.marvell.com Marvell data is available through this site.
$Note:At the time of writing, Discovery GT64460 data is under NDA (Non-Disclosure Agreement). Contact
Marvell for more details.

PowerPact6 Processors Family Product Manual
1st Edition 2-1
2. Unpacking and Inspection
Unpacking
•When you receive the shipping container, inspect it for any evidence of physical damage
•If you see any damage, refer to the Terms and Conditions of Sale (provided with your delivery)
for further instructions. If you need to return the product, please contact your local Radstone Sales
Office or Agent
PowerPact6 processors are sealed into an antistatic bag and housed in a padded cardboard box. Retain
this packaging and use it whenever the board is stored or shipped. Failure to use the correct packaging
may invalidate the warranty.
Box contents checklist:
1) PowerPact6 Single Board Computer in antistatic packaging.
2) Manual CD-ROM (colour may vary).
3) Embedded Software License Agreement (RT5087).
4) Where to find the latest product manuals leaflet (only included
with the very latest hardware products).
$Note:Configuration links (jumpers) may be separately packaged inside
the box.
Identifying Your Board
PowerPact6 processors are identified by labels at strategic positions. You can cross-check these against
the Advice Note provided with your delivery.
Identification labels, similar to
this, attached to the shipping box
and the antistatic bag provide
identical information:
PowerPact6 product code,
product description, equipment
number and board revision.
On the board within the antistatic bag, there is an identifying label
similar to this attached to the printed wiring board.
On conduction-cooled versions of the board (build levels 4 and
5), there is also a label similar to this attached to the front panel.
A label, similar to this, giving the board’s hardware Ethernet or MAC address is also attached
to the printed wiring board.
00-80-8E
00-50-93

PowerPact6 Processors Family Product Manual
Unpacking and Inspection
1st Edition 2-2
Product Code Breakdown
Referring to the example labels shown previously, an alpha-numeric code (CP1A-100040 in the above
examples) is printed on the top line of the packaging label, the top middle line of the board mounted
label and the metal label (build level 4 and 5). This indicates the board’s build specification and
configuration. Relevant code details are shown below:
CP1A-100040
See also the Product Codes section in the appropriate appendix.
Board Artwork Version
The board artwork version may be identified as follows:
•The numeric prefix given in the product label’s Rev code - see previous page
•The revision number given in BIT and PPCBoot startup banners
•The revision number given when a VxWorks -->sysBoardShow command is executed
Inspection
"CAUTION
PowerPact6 processors are subject to damage by static electricity. Observe antistatic
precautions (wear an antistatic wrist-strap connected to an Earth point and work at an
approved antistatic work station) when handling the board.
1) Visually inspect the board for any damage and loose or dislodged components.
2) As soon as possible, report to Radstone any defects you detect.
3) Referring to the specific appendix, visually inspect the board to ensure that the default
configuration is correct and that there are no loose or missing jumpers.
"CAUTION
Handle PowerPact6 processors using
the board edges or front panel. Incorrect
handling may cause component
damage.
PowerPact6
Board T
yp
e
Embedded Software
(5th character)
3 = VxWorks
4 = BIT/VxWorks
5 = PPCBoot
6 = BIT/PPCBoot
Build Level
(1st character)

PowerPact6 Processors Family Product Manual
1st Edition 3-1
3. Configuration and Installation
PMC Installation
Two single width (or one double-width) PMCs may be fitted to the PowerPact6 processor. There are no
PMC keying pins, as the board can be user-configured for 5V or 3.3V signaling. Figure 3-1 shows the
positions of the PMC sites.
$Note:PowerPact6 processors provide protection so that if a PMC card is fitted that shorts the +5 Volt rail to
the VIO supply, this is detected and the supply of 3.3 Volts to the VIO rail is inhibited. This protects
both the PowerPact6 processor and the PMC from burning up tracks or destroying parts.
Each PMC is supplied with a full kit of parts for mounting it, full fitting instructions and a manual. For
Radstone products, the PMC Installation Note, publication number HN4/3-99 contains the fitting
instructions. PMCs ordered with a PowerPact6 processor can be supplied factory fitted by Radstone, if
required.
It will usually be necessary to install driver software or implement other firmware configuration to
achieve full functionality of a PMC (see the specific PMC manual for the exact procedure).
Figure 3-1. PMC Position
£RECOMMENDATION
Where PMCs are not pre-installed,
prove PowerPact6 operation before
PMC installation.

PowerPact6 Processors Family Product Manual
Configuration and Installation
1st Edition 3-2
Link Configuration
Board configuration is carried out by the insertion and removal of jumpers (configuration links). Where
these links are factory fitted, a default setting is used. For link ID, default and recommended settings,
refer to appropriate appendix, BSP, BIT and/or PPCBoot manual(s) - listed below.
Appendix A – CP1A
PPCBIT User Guide, Publication No. PPCBIT-0HU
PPCBoot Firmware User Manual, Publication No. PPCBOOT-0HL
LynxOS BSP Manual
VxWorks BSP Release Notes
All available manuals can be found via the Manuals CD-ROM.
Chassis Configuration
Unlike VME backplanes, the CompactPCI backplane does not use daisy chains for bus requests or
interrupt acknowledgements, so no configuration of the backplane is required before use.
However, the position of the PowerPact6 processor in the backplane determines whether it is System
Controller (providing CompactPCI clocks and arbitration) or a peripheral. If the PowerPact6 processor is
required to be System Controller, fit it in the dedicated System Controller slot. If the PowerPact6
processor is required to be a peripheral, it can be fitted in any slot except the System Controller slot. The
following symbols are used to indicate CompactPCI device capabilities:
The position of the PowerPact6 processor in the backplane also determines its Board ID using
geographical addressing.

PowerPact6 Processors Family Product Manual
Configuration and Installation
1st Edition 3-3
Board Installation
Before installing the PowerPact6 processor, review the following warning and caution notices:
!WARNING
Do not exceed the maximum rated input voltages or apply reversed bias to the assembly.
If such conditions occur, toxic fumes may be produced due to the destruction of
components
Use extreme caution when handling, testing and adjusting this equipment. This device can
operate in an environment containing potentially dangerous voltages, capable of causing
death.
Refer to warnings contained in associated system equipment manuals before operating this
device. All warning instructions must be followed
Employ all other safety precautions that are deemed necessary for the safe operation of the
equipment in your operating environment.
Ensure that all power to the system is removed before installing any device.
"CAUTION
Before fitting your PowerPact6 processor into a CompactPCI rack, consult the
rack/enclosure documentation to ensure that the backplane power specifications are
compatible. PowerPact6 processors require power on both J1 and J2 backplane connectors.
Use of backplanes supplying power to the J1 connector alone may cause excessive current
to be drawn through the power pins.
This equipment generates, uses and can radiate electromagnetic energy. It may cause or be
susceptible to electromagnetic interference (EMI) if not installed and used in an enclosure
with adequate EMI protection.
Ensure that your PowerPact6 processor receives sufficient air-flow, even when operating on
an extender card – at least 300 foot/minute for build levels 1 and 2, 600 foot/minute for build
level 3. If you need to operate a conduction-cooled (level 4 or 5) board on an extender card,
maintain airflow of at least 300 feet/minute over it.
£RECOMMENDATION
To prove operation of your PowerPact6 processor and avoid any system configuration
issues, initially fit the board into a rack or enclosure in isolation.
To prove operation of your PowerPact6 processor and avoid any board configuration
issues, use the default link configuration initially.
$Notes:
1) Ensure that the chassis power supply is within CompactPCI Specification limits (+5V +5% -3%, +3.3V +5% -
3%) and sufficient for the PowerPact6 processor’s requirements (typically 1.9A @ 3.3V and 4.1A @ 5V for
the CP1A).
2) Although the PowerPact6 processor does not use the ±12V supply lines, it will not work without these
supplies being present. This is because the hotswap device monitors all four (5V, 3.3V, +12V, -12V) supply
rails and holds the PowerPact6 processor in reset until they are within specified tolerances. It is a
requirement for CompactPCI systems to provide ±12V anyway.

PowerPact6 Processors Family Product Manual
Configuration and Installation
1st Edition 3-4
Observing all antistatic and handling precautions, carry out the following installation procedure:
1) Insert the processor into the required slot of the CompactPCI rack or enclosure.
$Notes:
a. If the PowerPact6 processor is required to be System Controller (providing CompactPCI
clocks and arbitration), fit it in the dedicated System Controller slot. If the PowerPact6
processor is required to be a Peripheral, it can be fitted in any slot except the System
Controller slot. The following symbols indicate CompactPCI device capability:
b. The position of the PowerPact6 processor in the backplane also determines its board ID using
geographical addressing.
2) Push the board firmly home to ensure that backplane connectors mate correctly.
3) For air-cooled boards, tighten the captive screws at the top and bottom of the front panel to secure
the board in position.
$Note:Pulling on any front panel cable connections could inadvertently disconnect the board
if it is not secured.
4) For conduction-cooled boards, tighten the 3/32” (2.38 mm) hexagon-head screw-driven wedgelocks
at the top and bottom of the board to secure it in position and ensure a correct mechanical/thermal
interface. Use a calibrated torque wrench set to between 0.6 and 0.8 Nm.
5) To ensure optimum EMC performance, maintain ground continuity when taking I/O connections
from the front/rear panel connectors, or when the board is operating on a bus extender card.
Your PowerPact6 processor should now be installed into a CompactPCI rack or enclosure.

PowerPact6 Processors Family Product Manual
1st Edition 4-1
4. System Set-up
Connection
To interact with embedded software (BIT, PPCBoot or VxWorks), an RS232 connection needs to be
made to a serial terminal or computer system (PC or XWindows host) running terminal emulation
software. To enable interaction with host system cross-development software (Tornado), an Ethernet
connection is also required.
For cross-development systems, connect the terminal or terminal emulator to the PowerPact6 processor’s
serial debug port (COM1). Connect the network to the PowerPact6 processor’s Ethernet
(10/100/1000BaseT) port (channel 0). Connection may be achieved with a rear I/O module that uses the
backs of the P3, P4 and P5 connectors - see the I/O Modules Manual. Documents are available through
the Manuals CD-ROM.
Connection Using I/O Modules
For detailed I/O module installation instructions, see the I/O Modules Manual. Observe antistatic and
safety precautions when handling and/or installing I/O Modules.
Figure 4-1 overleaf shows a typical cross-development system set-up. This example is for guidance only
and is not definitive of I/O connection. The following items are used:
•A CompactPCI rack/enclosure with P3/P4/P5 backplane pins projecting through the backplane
structure
•The PowerPact6 processor (CP1A)
•A suitable backplane module (CPCI6UX600). This must be installed directly behind the target
PowerPact6 processor and presents available PowerPact6 I/O ports as PCB male headers or
interface standard connectors. COM1 and Ethernet channel 0 are presented via industry standard
9-way D-type and RJ-45 connectors respectively. See the I/O Modules Manual for more details
•A suitable serial cable (i.e. a null-modem 9-way micro D to 9-way micro D-type cable) for
connection between the backplane module and a PC
$Note: Connection to COM1 may also be made via the front panel on build levels 1 to 3.
•A suitable Ethernet cable (RJ-45 connector terminated at one end at least) for connecting the
backplane module to the network