
Raisecom
ISCOM RAX711 (B) Product Description
Raisecom Technology Co., Ltd.
Contents
1Overview.........................................................................................................................................1
1.1 Introduction......................................................................................................................................................1
1.2 Characters.........................................................................................................................................................1
1.3 Features............................................................................................................................................................2
1.4 Ordering information........................................................................................................................................4
1.4.1 Naming convention.................................................................................................................................4
1.4.2 Ordering information about device .........................................................................................................4
1.4.3 Ordering information about auxiliary parts.............................................................................................5
2Networking applications.................................................................................................................7
2.1 SME access and mobile backhaul networking .................................................................................................7
2.2 Typical end-to-end ELPS networking ..............................................................................................................8
2.3 Typical ERPS networking ................................................................................................................................9
3System structure............................................................................................................................10
3.1 Appearance.....................................................................................................................................................10
3.2 Interfaces........................................................................................................................................................ 11
3.2.1 Service interfaces.................................................................................................................................. 11
3.2.2 Management interfaces .........................................................................................................................13
3.2.3 Power interfaces....................................................................................................................................14
3.3 LEDs ..............................................................................................................................................................15
3.4 Hardware logic structure ................................................................................................................................16
4Device installation.........................................................................................................................19
4.1 Installing hardware.........................................................................................................................................19
4.2 Safety precautions ..........................................................................................................................................19
4.2.2 Preparing for installation.......................................................................................................................20
4.2.3 Installing device....................................................................................................................................20
4.2.4 Connecting cables ................................................................................................................................. 22
4.3 Installing software..........................................................................................................................................26
5Technical specifications.................................................................................................................27
5.1 Integrated machine parameters.......................................................................................................................27
5.2 Laser security class ........................................................................................................................................28
5.3 Reliability specifications................................................................................................................................28