7
2.4GHz Bluetooth 4.2 & 5.0 Low Energy Module with Integrated Antenna
Copyright © 2018, REYAX TECHNOLOGY CO., LTD.
REFLOW SOLDERING
Consider the "IPC-7530 Guidelines for temperature profilin for mass solderin (reflow and wave)
processes, published 2001.
Preheat phase
Initial heatin of component leads and balls. Residual humidity will be dried out. Please note that
this preheat phase will not replace prior bakin procedures.
•
Temperature rise rate: max. 3 °C/s If the temperature rise is too rapid in the preheat phase it may
cause excessive slumpin .
•
Time: 60 - 120 s If the preheat is insufficient, rather lar e solder balls tend to be enerated.
Conversely, if performed excessively, fine balls and lar e balls will be enerated in clusters.
•
End Temperature: 150 - 200 °C If the temperature is too low, non-meltin tends to be caused in
areas containin lar e heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
•
Limit time above 217 °C liquidus temperature: 40 - 60 s
•
Peak reflow temperature: 245 °C
Cooling phase
A controlled coolin avoids ne ative metallur ical effects (solder becomes more brittle) of the
solder and possible mechanical tensions in the products. Controlled coolin helps to achieve bri ht
solder fillets with a ood shape and low contact an le.
•
Temperature fall rate: max 4 °C/s To avoid fallin off, the REYAX RYB070I module should be placed
on the topside of the motherboard durin solderin .
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50
100
150
200
250
0 50 100 150 200 250 300
Axis Title
Y 值
值值
值
Y 值
°
°
End Temp
150-200°C
Max 4°C/s
Solderin Profile
Elapsed Time
Recommended soldering profile
*Note: oes not support upside-down/bottom side reflow.
