Rohm BD7836EFV Specification sheet

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Class-AB Speaker Amplifiers
1.9W+1.9W
Stereo Speaker Amplifier
BD7836EFV
●Description
BD7836EFV is a Class-AB stereo speaker amplifier, developed for note-book PC, desktop PC, portable devices and others.
Class-AB amplifier has no EMI noise. Power package HTSSOP-B20 can realize high output power.
Low circuit current at active mode reduce consumption of battery. Shutdown current is 0.1µA typically, and pop noise level
when shutdown turns on and off is very small. This device is suitable for the application that often changes mode between
“shutdown state” and “active state”.
●Features
1) High power 1.9W typ. (VDD=5V, RL=4Ω, THD+N=1%, stereo input)
High power 1.2W typ. (VDD=5V, RL=8Ω, THD+N=1%, stereo input)
2) Gain selectable by the external control (6,10,15.6,21.6dB)
3) Pop noise suppression circuitry
4) Shutdown function (also Mute function) [Isd=0.1µA(typ.)]
5) Protection circuitry (Thermal shutdown, Under voltage lockout)
6) Power Package with thermal pad HTSSOP-B20
●Applications
Note-book PC, Desktop PC, etc.
●Absolute maximum ratings (Ta=+25℃)
Parameter Symbol Ratings Unit
Power Supply Voltage VDDmax 7.0 V
Power Dissipation Pd 1 *1 W
3.2
*2 W
Storage Temperature Tstg -55 ～+150 ℃
Input Terminal Input Voltage Range *3 Vin -0.3～VDD+0.3 V
Control Terminal Input Voltage Range *4 Vctl -0.3～VDD+0.3 V
*1 70mm×70mm×1.6mm FR4 1-layer glass epoxy board(Copper on top layer 0%)
Derating in done at 8mW/℃for operating above Ta=25℃. There are thermal via on the board.
*2 70mm×70mm×1.6mm FR4 4-layer glass epoxy board (Copper on bottom 2 and 3 layer 100%)
Derating in done at 25.6mW/℃for operating above Ta=25℃. There are thermal via on the board.
*3 Input Terminal (LIN+, LIN-, RIN+, RIN-)
*4 Control Terminal ( SHUTDOWN , GAIN0, GAIN1)
●Operating conditions
Parameter Symbol Range Unit
Power Supply Voltage VDD +4.5 ～+5.5 V
Temperature Topr -40 ～+85 ℃
* These products aren’t designed for protection against radioactive rays.
No.10077EAT07

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●Electric characteristic (Unless otherwise specified, Ta=+25℃, VDD=+5.0V, RL=8Ω, AC stereo input)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
Circuit current (Active) Icc ―5 10 mA
IC active, No load
SHUTDOWN =Hi
Circuit current (Shutdown) Isd ―0.1 2.0 µA
IC Shutdown
SHUTDOWN =Lo
<Speaker amplifier>
Output power 1 PO1 0.7 1.2 ―W RL=8Ω, BTL, f=1kHz, THD+N=1% *1
Output power 2 PO2 ―1.9 ―W RL=4Ω, BTL, f=1kHz, THD+N=1% *1
Gain GV
5.5 6.0 6.5 dB BTL, GAIN0=GAIN1=L
9.5 10 10.5 dB BTL, GAIN0=L, GAIN1=H
14.6 15.6 16.5 dB BTL, GAIN0=H, GAIN1=L
20.6 21.6 22.6 dB BTL, GAIN0=GAIN1=H
Input resistance RIN
63 90 117 kΩGAIN0=GAIN1=L
49 70 91 kΩGAIN0=L, GAIN1=H
31 45 59 kΩGAIN0=H, GAIN1=L
17 25 33 kΩGAIN0=GAIN1=H
Supply ripple rejection ratio PSRR 62 68 ―dB Vripple=0.2Vp-p,CBYP=0.47µF
f=1kHz, BTL
Output noise Vnoise ―16 80 µVrms BTL, f=1kHz, 20-20kHz
S/N SN―105 ―dB BTL, Po=1W, BTL, f=1kHz, 20-20kHz
Output DC offset voltage ⊿Vo ―0 ±25 mV
<Control terminal (SHUTDOWN ,GAIN0,GAIN1)>
Control terminal
Input voltage Hi level VIH 2.0 ―VDD V
Lo level VIL 0 ―0.8 V
*1: B.W.=400～30kHz，BTL：The voltage between 4pin and 8pin, 14pin and 18pin.
●Control terminal’s settings
SHUTDOWN IC condition
Hi Active
Lo Shutdown
GAIN0 GAIN1 Gain Input resistance
Lo Lo 6dB 90kΩ(TYP.)
Lo Hi 10dB 70kΩ(TYP.)
Hi Lo 15.6dB 45kΩ(TYP.)
Hi Hi 21.6dB 25kΩ(TYP.)

Technical Note
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Lot No.
(unit : mm)
BD7836
●Package outlines
Fig.1 HTSSOP-B20
●Block diagram ●Pin assignment table
Pin
No. Terminal name Function
1 GND Ground
2 GAIN0 Bit 0 of gain select
3 GAIN1 Bit 1 of gain select
4 LOUT+ Left channel positive output
5 LIN- Left channel negative differential input
6 PVDD Supply voltage terminal
7 RIN+ Right channel negative differential input
8 LOUT- Left channel negative output
9 LIN+ Left channel positive differential input
10 BYPASS Tap to voltage divider for internal
midsupply bias generator
11 GND Ground
12 NC No connection
13 GND Ground
14 ROUT- Right channel negative output
15 PVDD Supply voltage terminal
16 VDD Supply voltage terminal
17 RIN- Right channel negative differential input
18 ROUT+ Right channel positive output
19 SHUTDOWN Places IC in shutdown mode when
held low
20 GND Ground
Power
Management
Depop
Circuitry
Gain
Control
RIN-
RIN+
ROUT+
ROUT-
GAIN0
GAIN1
PVDD
VDD
BYPASS
GND
SHUTDOWN
LIN+
LIN-
LOUT-
LOUT+
Fig.2

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●Measurement circuit diagram
Fig.3
Gain
Control
Power
Management
+
-
+
-
ROUT+ 18
ROUT- 14
RIN-
RIN+
GAIN0
GAIN1
LIN-
LIN+
Right
Line
Input
Signal
CRIN-
0.47µＦ
17
CRIN+
0.47µＦ7
2
3
5
98
4
19
10
16
6.15
VDD
BYPASS
SHUT-
DOWN
GND To
System Control
CSR
0.47µＦ
CBYP
0.1µＦ
0.1µＦ
CSR
1,11,
13,20
LOUT+
LOUT-
Left
Line
Input
Signal
CLIN-
CLIN+
0.47µＦ
0.47µＦ
VDD
VDD
PVDD
RL
RL

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●Application circuit example
Fig.4 Single Ended inputs
Fig.5 Differential inputs
Gain
Control
Power
Management
+
-
+
-
ROUT+ 18
ROUT- 14
RIN-
RIN+
GAIN0
GAIN1
LIN-
LIN+
Right
Line
Input
Signal CRIN-
0.47µＦ
17
CRIN+
0.47µＦ7
2
3
5
98
4
19
10
16
6.15
VDD
BYPASS
SHUT-
DOWN
GND ToSystem Control
CSR
0.47µＦ
CBYP
0.1µＦ
0.1µＦ
CSR
1,11,
13,20
LOUT+
LOUT-
Left
Line
Input
Signal CLIN-
CLIN+
0.47µＦ
0.47µＦ
VDD
VDD
PVDD
Gain
Control
Power
Management
+
-
+
-
ROUT+ 18
ROUT- 14
RIN-
RIN+
GAIN0
GAIN1
LIN-
LIN+
Right
Line
Input
Signal CRIN-
0.47µＦ17
CRIN+
0.47µＦ7
2
3
5
98
4
19
10
16
6.15
VDD
BYPASS
SHUT-
DOWN
GND ToSystem Control
CSR
0.47µＦ
CBYP
0.1µＦ
0.1µＦ
CSR
1,11,
13,20
LOUT+
LOUT-
Left
Line
Input
Signal CLIN-
CLIN+
0.47µＦ
0.47µＦ
VDD
VDD
PVDD

Technical Note
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●Evaluation board circuit diagram
Fig .6
●Evaluation board partts list
Number Part name Type, Value SMD size Manufacturer/
Part number
4 CLIN+/-,CRIN+/- Capacitor, 0.47μF 1608 Murata
GRM188R71C474KA01D
2 CSR Capacitor, 0.1μF 1608 Murata
GRM188R71C104KA01D
1 CBYP Capacitor, 0.47μF 1608 Murata
GRM188R71C474KA01D
1 U1 IC, BD7836EFV,
Class-AB stereo speaker Amplifier PKG:HTSSOP-B20 ROHM
BD7836EFV-E2
1 PCB1 Printed-circuit board
BD7836EFV ――
Please connect to GND.
Please connect to
Power Supply
(VDD=+4.5～5.5V) line.
Please connect ito
input signal line.
Please connect speaker.
Please connect speaker.
Use these solder jumper
for connecting the control
terminal to GND.
Use these solder jumper
for connecting the control
terminal to VDD.
Gain
Control
Power
Management
+
-
+
-
ROUT+ 18
ROUT- 14
RIN-
RIN+
GAIN0
GAIN1
LIN-
LIN+
CRIN-
0.47μＦ
17
CRIN+
0.47μＦ 7
2
3
5
98
4
19
10
16
6.15
VDD
BYPASS
SHUT-
DOWN
GND
CSR
0.47μＦ
CBYP
0.1μＦ
0.1μＦ
CSR
1,11,
13,20
LOUT+
LOUT-
CLIN-
CLIN+
0.47μＦ
0.47μＦ
PVDD

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●Description of external parts
①Input coupling capacitors Ci (CLIN+/-,CRIN+/-)
It sets cutoff frequency fc by the following formula by input coupling capacitors Ci(CLIN+/-,CRIN+/-) and input impedance Zi.
It makes an input coupling capacitors of evaluation board 0.47μF on evaluation board..
Input impedance Zi and cutoff frequency fc in each gain settings are given in Table1.
Table1. The relations in the gain settings and cutoff frequency fc.
GAIN0 GAIN1 Gain [dB] Ri Ω] Zi [Ω] fc [Hz]
Lo Lo 6 90k 45k 7.5
Lo Hi 12 70k 35k 9.7
Hi Lo 18 45k 22.5k 15
Hi Hi 24 25k 12.5k 27
②The power decoupling capacitors (CSR)
It makes a power decoupling capacitors 0.1μF. Because power decoupling capacitors influences total harmonic distortion
(THD) and some audio characteristics, please place a good low equivalent-series-resistance (ESR) capacitors as close
as possible to IC.
③BYPASS capacitor (CBYP)
Because BYPASS capacitor influences THD, PSRR and some audio characteristics, please place good low
equivalent-series-resistance (ESR) capacitor as close as possible to IC.
The value of BYPASS capacitor determines the turn on time and turn off time.
Refer to the following section of “Turn ON and Turn OFF”.
It makes BYPASS capacitor of evaluation board 0.47μF.
④Control terminal
Each control terminal (SHUTDOWN , GAIN0, GAIN1) don’t have pull-down resistance internal circuit.
Connect to GND line or VDD line or input Low or high level voltage to terminals in order to avoid the terminals
made high Impedance.
Using IC under the control terminal let high impedance, operation fault may occur.
[Hz]
CiiZ2π
1
fc  

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●Evaluation board PCB layer
Fig.7 Top layer
Fig.8 Bottom Layer

Technical Note
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●Turn on and Turn off
This IC has the circuit that reduces pop noise at “turn on” and “turn off”.
Reducing pop noise is realized in controlling to adjust the turn on and turn off time.
(a)TurnON (b)TurnOFF
Fig. 9
The following table show the Turn ON time and Turn OFF time when It makes the BYPASS capacitor 0.47uF.
CBYP Turn ON Turn OFF
0.47uF 280ms 340ms
Turn ON time is defined as the time until BYPASS terminal voltage reaches the 90% of VDD/2 after SHUTDOWN L→H.
Turn OFF time is defined as the time until BYPASS terminal voltage reaches the 10% of VDD/2 after SHUTDOWN H→L.
The values of above table are typical characteristics. These values will shift by 30% at some conditions.
●Input terminal
This IC can be inputed signal by differntial inputs or single ended inputs.
When sing the single ended inputs, connect the terminal of not signal inputed line to AC GND with input couppling
capacitors.
Please makes the value of all input capacitors same because of preventing pop noise.
If they are not same value, for example, LOUT+=0.47µF, LOUT-=0.33µF, it caused pop noise increase and characteristics
become worse.
SHUTDOWN
5V/div.
BYPASS
1V/div.
LOUT-
1V/div.
Turn ON time Turn OFF time

Technical Note
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●About the thermal design by the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation. Pay attention to points such as the following.
Since an maximum junction temperature (TjMAX.)or operating temperature range (Topr) is shown in the absolute maximum
ratings of the IC, to reference the value, find it using the Pd-Ta characteristic (temperature derating curve).
If an input signal is too great when there is insufficient radiation, TSD (thermal shutdown) may operate.
TSD, which operates at a chip temperature of approximately +180℃, is canceled when this goes below approximately
+100℃.
Since TSD operates persistently with the purpose of preventing chip damage, be aware that long-term use in the vicinity
that TSD affects decrease IC reliability.
Temperature Derating Curve
Fig.10 Power dissipation vs. Ambient temperature
Power dissipation values vary according to the board on which the IC is mounted. The Power dissipation of this IC when
mounted on a multilayer board designed to radiate is greater than the values in the graph above.
Note) Values are actual measurements and are not guaranteed.
Reference Data
HTSSOP-B20
2.5
2.0
1.0
0.5
0.0 0 25 50 75 100 125
150
Ambient Temperature Ta(℃)
Power dissipation Pd(W)
①1W
Measurement conditions: IC unit Rohm standard board mounted
Board ：70mm×70mm×1.6mmt
board①FR4 1-layer glass epoxy board (Copper on top layer 0%)
board②FR4 2-layer glass epoxy board (Copper on top layer 0%)
board③FR4 3-layer glass epoxy board (Copper on top layer 100%)
board④FR4 4-layer glass epoxy board (Copper on top layer 100%)
85
1.5
2.3 ③2.3W
3.5
3.2 ④3.2W
②1.45W

Technical Note
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●Typical Characteristics
TABLE OF GRAPHS
Items Parameter Figure number
Total harmonic distortion plus noise (THD+N) vs. Frequency 11, 12, 17, 18
vs. Output power 13, 14, 15, 16, 19, 20, 21, 22
Supply current (Icc) vs. Supply voltage 23
Shutdown current (Isd) vs. Supply voltage 24
Gain vs. Frequency 25
Crosstalk vs. Frequency 26
Supply ripple rejection ratio vs. Frequency 27
Shutdown attenuation vs. Frequency 28
Power dissipation vs. Output power 29
Efficiency vs. Output power 30
Output power vs. Load resistance 31

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Figure.1 Figure.2
Figure.3 Figure.4
Figure.5 Figure.6
Figure.7 Figure.8
THD+N vs Output power VDD-5V, RL=4Ω
Gv=10dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Output power VDD=5V, RL=4Ω
Gv=15.6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Output power VDD=5V, RL=4Ω
Gv=21.6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W
400Hz-30kHz
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
6dB
10dB
15.6dB
21.6dB
THD+N vs Frequency VDD=5V, RL=4Ω, Po=1.5W
400Hz-30kHz
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
6dB
10dB
15.6dB
21.6dB
THD+N vs Frequency VDD=5V, RL=8Ω, Po=1W
400Hz-30kHz
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
Po=0.25W
Po=0.5W
Po=1W
THD+N vs Frequency VDD=5V, RL=4Ω
400Hz-30kHz
0.01
0.1
1
10
10 100 1k 10k 100k
Frequency [Hz]
THD+N [%]
Po=0.5W
Po=1W
Po=1.5W
THD+N vs Output power VDD=5V, RL=4Ω
Gv=6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
Fig.11 Fig.12
Fig.13 Fig.14
Fig.15 Fig.16
Fig.17 Fig.18

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Figure.9 Figure.10
Figure.11 Figure.12
Figure.13 Figure.14
Figure.15 Figure.16
THD+N vs Output power VDD=5V, RL=8Ω
Gv=6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Output power VDD=5V, RL=8Ω
Gv=10dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Outpupower [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Output power VDD-5V, RL=8Ω
Gv=15.6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Outpu power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
THD+N vs Output power VDD-5V, RL=8Ω
Gv=21.6dB, f=1kHz, 400Hz-30kHz
0.01
0.1
1
10
0.01 0.1 1 10
Output power [W]
THD+N [%]
f=100Hz (30kHz LPF)
f=1kHz (400Hz-30kHz)
f=10kHz (80kHz LPF)
Icc-VDD
Noload, No signal
0
1
2
3
4
5
6
7
8
9
10
0123456
VDD [V]
Icc [mA]
Isd vs VDD
Noload, No signal
0
0.1
0.2
0.3
0.4
0.5
0123456
VDD[V]
Icd [uA]
Gain vs Frequency VDD=5V, RL=8Ω
10Hz-500kHz
0
5
10
15
20
25
30
35
10 100 1k 10k 100k
Frequency [Hz]
gain [dB]
6dB
10dB
15.6dB
21.6dB
Cross talk vs Frequency VDD=5V, RL=8Ω,
Gv=6dB
80ｋHz LPF
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
gain [dB]
Left to Right
Right to Left
Fig.19 Fig.20
Fig.21 Fig.22
Fig.23 Fig.24
Fig.25 Fig.26

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Figure.17 Figure.18
Figure.19 Figure.20
Figure.20
PSRR vs Frequency VDD-5V, RL=8
Ω,CBYP=0.47uF
Vripple=0.2Vpp, 10Hz-500kHz Bandpass
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
PSRR [dB]
6ｄB
10ｄB
15.6ｄB
21.6ｄB
SHUTDOWN attenuation vs Frequency VDD=5V
RL=8Ω, Vin=1Vrms(2Vrms@BTL), 10Hz-500kHz
-120
-100
-80
-60
-40
-20
0
10 100 1k 10k 100k
Frequency [Hz]
SHUTDOWN attnuation [dB]
Output power vs Power Dissipation
VDD=5V, Gv=6dB, f=1kHz
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
00.511.522.5
Output power [W]
Power Dissipation [W]
RL=8Ω
RL=4Ω
RL=3Ω
Output power vs Efficiency
VDD=5V, Gv=6dB, f=1kHz
0
10
20
30
40
50
60
70
80
90
100
00.511.522.5
Outputpower [W]
Efficiency [%]
RL=8Ω
RL=4Ω
RL=3Ω
Output power vs Load Resisitance
VDD=5V, Gv=6dB, f=1kHz
0
0.5
1
1.5
2
2.5
3
3.5
0 8 16 24 32 40 48 56 64
Load Resistance[Ω]
Output power[%]
THD=1％
THD=10％
Fig.27 Fig.28
Fig.29 Fig.30
Fig.31

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●Notes for use
(1) Absolute maximum ratings
This IC may be damaged if the absolute maximum ratings for the applied voltage, temperature range, or other
parameters
are exceeded. Therefore, avoid using a voltage or temperature that exceeds the absolute maximum ratings.
if it is possible that absolute maximum ratings will be exceeded, use fuses or other physical safety measures and
determine ways to avoid exceeding the IC’s absolute maximum ratings.
(2) GND terminal’s potential
Try to set the minimum voltage for GND terminal’s potential, regardless of the operation mode.
(3) Shorting between pins and mounting errors
When mounting the IC chip on a board, be very careful to set the chip’s orientation and position precisely.
When the power is turned on, the IC may be damaged if it is not mounted correctly.
The IC may also be damaged if a short occurs (due to a foreign object, etc.) between two pins, between a pin and the
power supply, or between a pin and the GND.
(4) Operation in strong magnetic fields
Note with caution that operation faults may occur when this IC operates in a strong magnetic field.
(5) Thermal design
Ensure sufficient margins to the thermal design by taking in to account the allowable power dissipation during actual use
modes, because this IC is power amp. When excessive signal inputs which the heat dissipation is insufficient condition, it
is possible that thermal shutdown circuit is active
(6) Thermal shutdown circuit
This product is provided with a built-in thermal shutdown circuit. When the thermal shutdown circuit operates, the output
transistors are placed under open status. The thermal shutdown circuit is primarily intended to shutdown the IC avoiding
thermal runaway under abnormal conditions with a chip temperature exceeding Tjmax = +150℃, and is not intended to
protect and secure an electrical appliance
(7) Load of the output terminal
This IC corresponds to dynamic speaker load, and doesn't correspond to the load except for dynamic speakers.
(8) The short protection of the output terminal
This IC has short protection circuit. The function protects the IC from rash current on road.
(9) Operating ranges
The rated operating power supply voltage range (VDD=+4.5V～+5.5V) and the rated operating temperature range
(Ta=-40℃～+85℃) are the range by which basic circuit functions is operated. Characteristics and rated output power are
not guaranteed in all power supply voltage ranges or temperature ranges.
(10) Electrical characteristics
Electrical characteristics show the typical performance of device and depend on board layout, parts, power supply.
The standard value is in mounting device and parts on surface of ROHM’s board directly.
(11) Maximum output power
When stereo inputs at RL=4Ω, maximum output power may not achieve up to typical value because the device heats.
Ensure sufficient margins to the thermal design to get larger output power.

Technical Note
16/16
BD7836EFV
www.rohm.com 2010.07 - Rev.
A
© 2010 ROHM Co., Ltd. All rights reserved.
●Ordering part number
B D 7 8 3 6 E F V - E 2
Part No. Part No.
7836 Package EFV:HTSSOP-B20 Packaging and forming specification E2: Embossed tape ad reel
(Unit : mm)
HTSSOP-B20
S
0.08 S
1120
110
(MAX 6.85 include BURR)
6.5±0.1
(2.4)
4.4±0.1
0.325
6.4±0.2
(4.0)
0.17 +0.05
- 0.03
1.0±0.2
0.5±0.15
0.65
0.08±0.05
0.85±0.05
1.0MAX
0.24+0.05
- 0.04
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin

Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢCLASSⅢCLASSⅡb CLASSⅢ
CLASSⅣCLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification

Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.

Datasheet
Part Number bd7836efv
Package HTSSOP-B20
Unit Quantity 2500
Minimum Package Quantity 2500
Packing Type Taping
Constitution Materials List inquiry
RoHS Yes
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