Rorke Data Galaxy A16F-R2422 Assembly Instructions

Galaxy Raid
Model A16F-R2422
FC-4G to SATA-II RAID Subsystem
Redundant Controller
Installation and Hardware
Reference Manual
Version 0906
Version 1.0 (08, 2005)

Galaxy Raid Installation and Hardware Reference Manual
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Contact Information
Americas
Rorke Data Inc
9700 West 76th St
Eden Prairie, MN 55344
USA
Tel: [phone]
Fax: [phone]
[email protected]
[email protected]
http://www.rorke.com

Galaxy Raid Installation and Hardware Reference Manual
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Copyright 2006
This Edition First Published 2006
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Rorke Data , Inc.
Disclaimer
Rorke Data makes no representations or warranties with respect to the
contents hereof and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. Furthermore, Rorke
Data reserves the right to revise this publication and to make changes from
time to time in the content hereof without obligation to notify any person of
such revisions or changes. Product specifications are also subject to change
without prior notice.
Trademarks
Galaxy and the Galaxy logo are registered trademarks of Rorke Data , Inc.
PowerPC®is a trademark of International Business Machines Corporation
and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.

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Warnings and Certifications
FCC (applies in the U.S. and Canada)
FCC Class A Note
This device complies with Part 15 of the FCC rules. Operation is subject to
the following two conditions: (1) this device may not cause harmful
interference, and (2) this device may accept any interference received,
including interference that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This
equipment generates, uses, and can radiate radio frequency energy and, if
not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference in which case the
user will be required to correct the interference at his own expense.
The changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
WARNING:
Use only shielded cables to connect I/O devices to this equipment.
You are cautioned that changes or modifications not expressly approved by
the party responsible for compliance could void your authority to operate the
equipment.
This device is in conformity with the EMC.

Galaxy Raid Installation and Hardware Reference Manual
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CB
This device meets the requirements of the CB standard for electrical
equipment with regard to establishing a satisfactory level of safety for
persons using the device and for the area surrounding the apparatus. This
standard covers only safety aspects of the above apparatus; it does not cover
other matters, such as style or performance.
ITE BSMI Class A, CNS 13438 (for Taiwan)
This device is in conformit
y
with the CB safet
y
specifications.

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Table of Contents
CHAPTER 1 INTRODUCTION
1.1. PRODUCT OVERVIEW ................................................................................................1-1
1.1.1 Product Introduction........................................................................................1-1
1.1.2 Enclosure Chassis ............................................................................................1-2
1.1.2.1 Chassis Overview........................................................................................................... 1-2
1.1.2.2 Physical Dimensions...................................................................................................... 1-3
1.1.2.3 Front Panel Overview .................................................................................................... 1-3
1.1.2.4 Hard Drive Numbering .................................................................................................. 1-4
1.1.2.5 Rear Panel Overview ..................................................................................................... 1-4
1.1.2.6 Back-plane Board........................................................................................................... 1-5
1.2. GALAXY COMPONENTS ..........................................................................................1-5
1.2.1 LCD Panel........................................................................................................1-5
1.2.2 Drive Trays.......................................................................................................1-6
1.2.3 RAID Controller Modules ................................................................................1-6
1.2.4 Controller Module Interfaces...........................................................................1-7
1.2.5 DIMM Modules ................................................................................................1-9
1.2.6 BBU..................................................................................................................1-9
1.2.7 PSUs...............................................................................................................1-10
1.2.8 Cooling Modules ............................................................................................1-11
1.3. GALAXY MONITORING .........................................................................................1-12
1.3.1 I2C bus ...........................................................................................................1-12
1.3.2 LED Indicators...............................................................................................1-12
1.3.3 Firmware (FW) and RAIDWatch GUI ...........................................................1-13
1.3.4 Audible Alarms...............................................................................................1-13
1.4. HOT-SWAPPABLE COMPONENTS..............................................................................1-13
1.4.1 Hot-swap Capabilities....................................................................................1-13
1.4.2 Components....................................................................................................1-13
1.4.3 Normalized Airflow ........................................................................................1-14
CHAPTER 2 HARDWARE INSTALLATION
2.1. INSTALLATION OVERVIEW...............................................................................2-1
2.2. INSTALLATION PRE-REQUISITES.....................................................................2-1
2.3. SAFETY PRECAUTIONS:......................................................................................2-2
2.3.1 Precautions and Instructions............................................................................2-2
2.3.2 Static-free Installation......................................................................................2-3
2.4. GENERAL INSTALLATION PROCEDURE.........................................................2-3
2.4.1 Installation Procedure Flowchart....................................................................2-4
2.5. UNPACKING THE SUBSYSTEM..........................................................................2-5
2.6. INSTALLATION OVERVIEW...............................................................................2-5
2.6.1 Pre-installed Components................................................................................2-5
2.6.2 Uninstalled Components ..................................................................................2-5
2.7. INSTALLING THE OPTIONAL BBU....................................................................2-6
2.7.1 BBU Installation Overview...............................................................................2-6
2.7.2 BBU Warnings and Precautions.......................................................................2-6

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2.7.3 Installation Procedure......................................................................................2-7
2.8. HARD DRIVE INSTALLATION............................................................................2-9
2.8.1 Hard Drive Installation Prerequisites..............................................................2-9
2.8.2 SATA Drive Installation ...................................................................................2-9
2.9. DRIVE TRAY INSTALLATION ..........................................................................2-10
2.10. RACK/CABINET INSTALLATION.....................................................................2-12
CHAPTER 3 SUBSYSTEM MONITORING
3.1. SUBSYSTEM MONITORING OVERVIEW ......................................................................3-1
3.2. STATUS-INDICATING LEDS.......................................................................................3-2
3.2.1 Brief Overview of the LEDs..............................................................................3-2
3.2.2 LCD Panel........................................................................................................3-3
3.2.3 Drive Tray LEDs ..............................................................................................3-4
3.2.4 Controller Module LEDs..................................................................................3-5
3.2.5 LAN Port LEDs ................................................................................................3-6
3.2.6 BBU LED..........................................................................................................3-7
3.2.7 PSU LEDs.........................................................................................................3-8
3.2.8 Cooling Module LEDs......................................................................................3-9
3.3. AUDIBLE ALARM ....................................................................................................3-10
3.3.1 Default Threshold Values...............................................................................3-10
3.3.2 Failed Devices................................................................................................3-11
3.4. I2C MONITORING....................................................................................................3-11
CHAPTER 4 SUBSYSTEM CONNECTION AND OPERATION
4.1 FC HOST CONNECTION PREREQUISITES ........................................................4-1
4.1.1 Choosing the Fibre Cables...............................................................................4-1
4.1.2 FC Lasers.........................................................................................................4-2
4.1.3 FC Speed Auto-detection..................................................................................4-2
4.1.4 SFP Transceivers..............................................................................................4-2
4.2 TOPOLOGY AND CONFIGURATION CONSIDERATIONS ..............................4-3
4.2.1 Basic Configuration Rules................................................................................4-3
4.2.2 Fibre Channel Topologies................................................................................4-3
4.2.3 Host-side Topologies........................................................................................4-4
4.2.4 Unique Identifier ..............................................................................................4-4
4.2.5 ID/LUN Mapping..............................................................................................4-4
4.3 SAMPLE TOPOLOGIES.........................................................................................4-5
4.3.1 Sample Topology – Clustered Hosts.................................................................4-5
4.3.2 Sample Topology – Direct-Attached.................................................................4-6
4.4 POWER ON .............................................................................................................4-6
4.4.1 Check List.........................................................................................................4-7
4.4.2 Power On Procedure........................................................................................4-7
4.4.3 Power On Status Check....................................................................................4-8
4.4.4 LCD Screen ......................................................................................................4-9
4.5 POWER OFF PROCEDURE .................................................................................4-10
CHAPTER 5 SUBSYSTEM MAINTENANCE
5.1. OVERVIEW.............................................................................................................5-1
5.1.1 Maintenance.....................................................................................................5-1

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5.1.2 General Notes on Component Replacement.....................................................5-1
5.2. REPLACING CONTROLLER MODULE COMPONENTS...................................5-2
5.2.1 Overview...........................................................................................................5-2
5.2.2 Notes on Controller Module Maintenance.......................................................5-3
5.2.3 Removing the Controller Module .....................................................................5-3
5.2.4 Replacing the Controller Module.....................................................................5-4
5.3. DIMM MODULE REPLACEMENT.......................................................................5-6
5.3.1 DIMM Module Considerations.........................................................................5-6
5.3.2 DIMM Module Replacement Procedure...........................................................5-6
5.4. REPLACING AFAULTY BBU ..............................................................................5-7
5.5. REPLACING AFAULTY PSU MODULE..............................................................5-9
5.5.1 PSU Module Overview .....................................................................................5-9
5.5.2 Replacing the PSU Module.............................................................................5-10
5.6. COOLING MODULE MAINTENANCE ..............................................................5-13
5.6.1 Cooling Module Overview..............................................................................5-13
5.6.2 Replacing a Cooling Module..........................................................................5-13
5.7. REPLACING AFAILED HARD DRIVE..............................................................5-14
5.7.1 Hard Drive Maintenance Overview................................................................5-14
5.7.2 Replacing a Hard Drive .................................................................................5-15
APPENDIX A UNINTERRUPTIBLE POWER SUPPLY
A.1. UNINTERRUPTIBLE POWER SUPPLY OVERVIEW ..................................................... A-1
A.2. COMPATIBLE UPS SUPPLIES ..................................................................................A-1
A.3. SERIAL COMMUNICATION CABLES......................................................................... A-1
A.4. CONNECTING THE UPS TO THE SUBSYSTEM...........................................................A-2
A.4.1 Connect the PSU Module Power Cords .........................................................A-2
A.4.2 Set the Baud Rate............................................................................................A-2
A.4.3 Connect COM2...............................................................................................A-2
A.5. POWER ON.............................................................................................................A-3
A.6. UPS STATUS MONITORING ....................................................................................A-3
A.6.1 Normal Operational Status.............................................................................A-3
A.6.2 UPS Messages................................................................................................A-3
A.6.3 UPS Message Summary..................................................................................A-4
APPENDIX B SPECIFICATIONS
B.1. TECHNICAL SPECIFICATIONS.................................................................................. B-1
B.2. CONTROLLER SPECIFICATIONS............................................................................... B-3
B.2.1 Configuration .................................................................................................B-3
B.2.2 Architecture....................................................................................................B-3
B.3. DRIVE TRAY SPECIFICATIONS ................................................................................ B-4
B.4. POWER SUPPLY SPECIFICATIONS............................................................................ B-4
B.5. COOLING MODULE SPECIFICATIONS ...................................................................... B-5
B.6. RAID MANAGEMENT............................................................................................. B-5
B.7. FAULT TOLERANCE MANAGEMENT........................................................................ B-6
APPENDIX C SPARE PARTS AND ACCESSORIES
C.1. SPARE PARTS ......................................................................................................... C-1
C.2. ACCESSORIES......................................................................................................... C-2

Galaxy Raid Installation and Hardware Reference Manual
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APPENDIX D PIN OUTS
D.1. SFP CONNECTOR PIN OUTS ...................................................................................D-1
D.2. COM1 CABLE:DB9 AUDIO JACK PIN OUTS..........................................................D-3
D.3. COM2 CABLE:DB9 AUDIO JACK PIN OUTS..........................................................D-3
D.4. GAL-9011 NULL MODEM........................................................................................D-4
D.5. ETHERNET PORT PIN OUTS.....................................................................................D-5
D.6. MAIN POWER .........................................................................................................D-5
Safety Precautions
Precautions and Instructions
•Prior to powering on the subsystem, ensure that the correct power range is being
used.
•The GALAXY subsystem comes with sixteen (16) drive bays. Leaving any of
these drive bays empty will greatly affect the efficiency of the airflow within the
enclosure, and will consequently lead to the system overheating, which can
cause irreparable damage.
•If a module fails, leave it in place until you have a replacement unit and you are
ready to replace it.
•Airflow Consideration: The subsystem requires an airflow clearance, especially
at the front and rear.
•Handle subsystem modules using the retention screws, eject levers, and the metal
frames/face plates. Avoid touching PCB boards and connector pins.
•To comply with safety, emission, or thermal requirements, none of the covers or
replaceable modules should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
•Be sure that the rack cabinet into which the subsystem chassis will be installed
provides sufficient ventilation channels and airflow circulation around the
subsystem.
•Provide a soft, clean surface to place your subsystem on before working on it.
Servicing on a rough surface may damage the exterior of the chassis.
•If it is necessary to transport the subsystem, repackage all disk drives separately.
•Dual redundant controller models come with two controller modules that must
be installed into the subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the lower controller bay at the
rear of the subsystem. Since single controller modules cannot be upgraded, this
metal sheet should NEVER be removed.

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ESD Precautions
Observe all conventional anti-ESD methods while handling system
modules. The use of a grounded wrist strap and an anti-static work pad are
recommended. Avoid dust and debris in your work area.
About This Manual
This manual:
•Introduces the GALAXY RAID subsystem series.
•Describes all the active components in the subsystem.
•Provides recommendations and details about the hardware installation
process.
•Briefly describes how to monitor the subsystem.
•Describes how to maintain the subsystem.
This manual does not:
•Describe components that are not user-serviceable.
•Describe the configuration options of firmware, using terminal
emulation programs, or the RAIDWatch GUI software that came with
your subsystem.
•Give a detailed description of the RAID controllers embedded within
the subsystem.
Revision History
♦Initial release
Who should read this manual?
This manual assumes that its readers are experienced with computer
hardware installation and are familiar with storage enclosures.

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Related Documentation
•User’s Operation Manual
•RAIDWatch User’s Manual
These two documents can be found in the product utility CD included with
your subsystem package.
Conventions
Naming
From this point on and throughout the rest of this manual, the GALAXY
series is referred to as simply the “subsystem” or the “system” and
GALAXY is frequently abbreviated as “GAL.”
Lists
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They
can be read in any order. Each statement is preceded by a round black dot
“•.”
Numbered Lists: Numbered lists are used to describe sequential steps you
should follow in order.
Important information that users should be aware of is indicated with the
following icons:
NOTE:
These messages inform the reader of essential but non-critical
information. These messages should be read carefully as any directions
or instructions contained therein can help you avoid making mistakes.
CAUTION!
Cautionary messages should also be heeded to help you reduce the
chance of losing data or damaging the system.
IMPORTANT!
The Important messages pertain to use the GALAXY subsystem
introduced in this manual.

Galaxy Raid Installation and Hardware Reference Manual
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WARNING!
Warnings appear where overlooked details may cause damage to the
equipment or result in personal injury. Warnings should be taken
seriously.
Software and Firmware Updates
Please contact Rorke Data’s tech support (techs[email protected]om) for the
latest software or firmware updates.
Problems that occur during the updating process may cause unrecoverable
errors and system down time. Always consult technical personnel before
proceeding with any firmware upgrade.
NOTE:
The firmware version installed on your system should provide the
complete functionality listed in the specification sheet/user’s manual.
We provide special revisions for various application purposes.
Therefore, DO NOT upgrade your firmware unless you fully understand
what a firmware revision will do.

Chapter 1: Introduction
Introduction
1-1
Chapter 1
Introduction
1.1 Product Overview
1.1.1 Product Introduction
This hardware manual briefly introduces the Galaxy A16F-R2422 FC-4G to
SATA-II storage subsystem shown in Figure 1-1. Through this manual, you
will gain the knowledge of each hardware components, installation
procedures, monitoring functions, connection topologies and hardware
maintenances. The A16F-R2422 subsystem comes with two (2) Fibre-to-
SATA RAID controllers
and provide two (2) 4Gbps
(FC-4G) host channels that
are routed to four (4)
external FC connectors on
two (2) separated host
connection modules. Two
(2) onboard SATA chips provide sixteen (16) 3Gbps SATA-II drive
channels that can support up to sixteen (16) SATA-II hard drives. The
controller board has a pre-installed 512MB DDR RAM DIMM module and
can support a memory module with a capacity up to 2GB.
A custom ASIC is designed in A24F-R2422 for RAID 6 acceleration.
Galaxy A24F-R2422 RAID subsystem allows two (2) drives failure at the
same time when its configuration is RAID level 6. This generates a higher
redundant level of data availability. On this system, the RAID level 6 and 60
are both ready for end users. Please refer to Fibre to SATA RAID
Subsystem Operation Manual for further description on RAID6.
The metal container in which the controller board is pre-installed is referred
to as the “controller module.” The controller module is accessed through the
rear of the A16F-R2422 and is comprised of a PCB board, a rear faceplate,
and a metal canister. A standard battery backup unit (BBU) is preinstalled in
the upper left side of each controller module when viewed from the rear of
the subsystem. The independent BBUs are also accessible and hot
swappable through the rear panel of A16F-R2422.
I/O signals/commands transmitted between the controller and drives at the
front of the subsystem pass through a non-user-serviceable backplane board.
The backplane is connected to a maximum of sixteen (16) hard drives that
you purchase separately and install into the sixteen (16) drive trays that
come with the subsystem. The drive trays, which must be installed in the
Figure 1-1: A16F-R2422 Subsystem

Galaxy A16F-R2422 Installation and Hardware Reference Manual
Introduction
1-2
drive bays, accommodate SATA-II hard drives (backward compatible to
SATA-I).
Two (2) redundant, hot-swappable, dual-fan cooling modules protect the
subsystem from overheating and two (2) redundant, hot-swappable, 2U
460W power supply units (PSUs) provide constant power to the subsystem.
The modular nature of the subsystem and the easy accessibility to all major
components ensure the ease of the subsystem maintenance.
NOTE:
On receiving and unpacking your subsystem, please check the package
contents against the included Unpacking Checklist. If any modules are
missing, please contact your subsystem vendor immediately.
1.1.2 Enclosure Chassis
1.1.2.1 Chassis Overview
The A16F-R2422 RAID storage subsystem chassis is an enhanced 3U metal
chassis divided into front and rear sections, which are respectively accessed
through front (see Figure 1-3) and rear (see Figure 1-5) panels. Pre-drilled
mounting holes in the sides of the 3U RAID subsystem enclosure allow you
to attach separately purchased slide rails so that you can install the enclosure
into a rack or cabinet. Please see Figure 1-2 for the components’ locations
in the subsystem and read the following sections for the front and rear
panels descriptions.
Figure 1-2: A16F-R2422 Subsystem Overview

Chapter 1: Introduction
Introduction
1-3
NOTE:
Components accessed through the front panel are referred to as “Front
Panel Components” and components accessed through the rear panel are
referred to as “Rear Panel Components.”
1.1.2.2 Physical Dimensions
The A16F-R2422 comes in an enhanced 3U chassis with the following
dimensions:
•With handles: 482.6mm x 131mm x 504.3mm (19 x 5.2 x 19.9
inches) (width x height x depth)
•Without handles: 445mm x 130mm x 488.2mm (17.5 x 5.1 x 19.2
inches) (width x height x depth)
1.1.2.3 Front Panel Overview
The front section of the subsystem features a 4x4 layout for sixteen (16) 3.5-
inch drives. The two (2) handles on the front of the subsystem enable you to
easily insert/extract the chassis into/from a rack or cabinet. The LCD panel
on the left handle provides an easy way for you to monitor and configure
your subsystem.
The front panel of the A16F-R2422 RAID subsystem described in this
manual is shown in Figure 1-3. A description of each front panel
component is given below:
Figure 1-3: A16F-R2422 Front View
The front panel shown in Figure 1-3 accommodates the following
components:
•Drive bays with drive tray canisters: The subsystem has sixteen
(16) drive bays in the front side of the chassis to house sixteen (16)
hard drives.
•Right handle and left handle with LCD panel: These front handles
are conveniently placed and simplify moving the subsystem
enclosure into and out of a rack or cabinet. The left side front-

Galaxy A16F-R2422 Installation and Hardware Reference Manual
Introduction
1-4
handle houses a 16x2 character LCD panel that can be used for
subsystem configuration, troubleshooting and status checking.
(Please refer to Section 1.2.1)
1.1.2.4 Hard Drive Numbering
The front panel of the A16F enclosure houses sixteen (16) hard drives in a
4x4 configuration as shown in Figure 1-4. When viewed from the front, the
drive bays (slots) are numbered 1 to 16 from top to bottom, from left to
right.
Figure 1-4: Hard Drive Numbering
1.1.2.5 Rear Panel Overview
The rear section of the A16F-R2422 subsystem is accessed through the rear
panel and is reserved for dual RAID controller modules, two (2) standard
BBUs, two (2) host connection modules, two (2) power supply units (PSUs),
two (2) cooling modules, and an enclosure configuration card.
The rear panel of the RAID subsystem described in this manual is shown in
Figure 1-5. A description of each rear panel component is given below:
Figure 1-5: A16F-R2422 Rear View
The rear panel shown in Figure 1-5 accommodates the following
components:
•RAID controller modules:Two (2) controller modules are
installed in the A16F-R2422. Each controller module contains a
RAID controller board, interface board, DDR RAM DIMM module
that provides the system RAID functionalities. (See Section 1.2.4.)
The upper controller module is identified as Controller A while
the lower controller module is identified as Controller B. By

Chapter 1: Introduction
Introduction
1-5
factory default, the Controller A is the primary controller and the
Controller B is the secondary controller that can be recognized by
the management tools such as LCD panel, hyper terminal and
RAIDWatch manager.
NOTE:
If the primary controller (controller A) should fail for any reason
(hardware error, software error, removal from system, etc.), the
secondary controller (controller B) will take over and become the new
primary controller.
If the original, failed primary controller (controller A) restarts and
successfully returns to service, it will become the new secondary
controller.
•BBUs: Two (2) independent BBUs sustain cache memory during a
power shortage to prevent data loss. (See Section 1.2.7.)
•PSUs: The hot-swappable PSUs provide power to the subsystem.
A power switch is located on the right of each PSU to turn the
system on and off. (See Section 1.2.8.)
•Cooling modules: The redundant cooling modules provide
ventilation to reduce the temperature within the subsystem. (See
Section 1.2.9.)
•Enclosure configuration card: The enclosure configuration card
houses a DIP switch that controls some of the system
functionalities. (See Section 1.2.10.)
•Host connection modules: Each host connection module contains
two (2) FC ports to connect the subsystem to the host(s) and/or
daisy-chain A16F-R2422 subsystems. (See Section 1.2.11.)
1.1.2.6 Backplane Board
Internal backplane boards separate the front and rear sections of the A16F-
R2422. The PCB board provides logic level signals and low voltage power
paths. They contain no user-serviceable components.
1.2 A16F-R2422 Components
The A16F-R2422 houses many active components and most of them can be
accessed through either the front or rear panel. The modular design of the
active components facilitates their easy installation and removal. Hot-swap
mechanisms are incorporated to eliminate power surges and signal glitches

Galaxy A16F-R2422 Installation and Hardware Reference Manual
Introduction
1-6
that might occur while removing or installing these modules. Each
component is further described below:
1.2.1 LCD Panel
Figure 1-6: LCD Panel
PN: GAL-9273CHandLLCD
The LCD panel shown in Figure 1-6 consists of a 16x2-character LCD
screen with push buttons and LED status indicators. The LCD front panel
provides full access to all RAID configuration settings and monitoring
functions. After powering up the subsystem, the initial screen will show the
subsystem model name. A different name may be assigned for the
subsystem, controller or different logical drive. This will enable easier
identification in a topology with numerous arrays.
1.2.2 Drive Trays
Figure 1-7: Drive Tray Front View
PN: GAL-9273A2DT2S1S
The A16F-R2422 subsystem comes with sixteen (16) drive trays (see
Figure 1-7) designed to accommodate separately purchased, standard 1-inch
pitch, 3.5-inch SATA disk drives. The drive bays are easily accessible from
the front of the enclosure. Each drive tray is pre-installed with a MUX kit.
Two (2) LEDs on the front of the tray indicate the drive status. A key-lock
on each drive tray secures the hard drive in place, while an easily accessible
button ensures fast and efficient drive hot-swapping. Retention screw holes
are located on the sides of the drive tray. These holes are reserved for
securing hard drives to the tray.
WARNING!

Chapter 1: Introduction
Introduction
1-7
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by
dropping it or resting heavy objects on it). The drive tray has been
customized to fit into the drive bays in the A16F-R2422 subsystem. If the
drive bay superstructure is deformed or altered, the drive trays may not fit
into the drive bay.
1.2.3 MUX Kit
Figure 1-8: MUX Kit
PN: 9273A2N2S1S
The A16F-R2422 subsystem comes with sixteen (16) pre-installed SATA-II
to SATA multiplexer (MUX) kits (one in each drive tray). These MUX kits
facilitate the installation of separately purchased SATA-II or SATA-I
drives. When installing the drives into the drive tray, the connectors at the
back of the drive must be connected to the MUX kit SATA connector.
When installed into the enclosure, the SCA-II connector on the MUX kits
will connect to the controller board via backplane board. The MUX kits
communicate the combined drive signals to redundant controllers to prevent
a single point-of-failure.
WARNING!
The MUX kits are small, delicate components that must be handled with
care.

Galaxy A16F-R2422 Installation and Hardware Reference Manual
Introduction
1-8
1.2.4 The RAID Controller Module
Figure 1-9: Controller Module
PN: GAL-83AF24RD16M5 ( with 512MB DDR RAM DIMM memory)
The RAID controller module contains a metal bracket, a main circuit
controller board, a management rear panel, and a pre-installed 512MB
capacity or above DDR RAM DIMM module. (See Figure 1-9) The
controller module contains no user-serviceable components. Except when
installing/upgrading the cache memory inside, the controller module should
never be removed or opened.
WARNING!
Although the RAID controller can be removed, the only time you should
touch the controller itself is to install the memory modules. The RAID
controller is built of sensitive components and unnecessary tampering can
damage the controller.
The heart of the A16F-R2422 RAID controller subsystem is the FC-4G to
SATA-II controller board. The controller comes with two (2) pre-set FC-4G
host channels, CH0 and CH1. The subsystem connects to the external FC-
4G host computer(s) via eight (8) FC connectors, which are located on the
host connection modules. These FC connectors can auto-negotiate the speed
and determine whether the data transmission rate is 1Gbps, 2Gbps or 4Gbps.
The docking connector at the rear of the controller board is used to connect
the controller module to the backplane board. A DDR RAM DIMM socket
is strategically placed in an easily accessible location on the controller board
for easy insertion of the DDR RAM DIMM module.
FC speed detection: The FC-AL loop speed can be adjusted by using the
DIP switch on the subsystem rear panel. When auto speed is determined, the
speed auto-detection specified by the FC standard will detect the available
devices that connected to the subsystem and run at that speed. If a 1Gbps(or
2Gbps) host is connected to a 4Gbps port, it will negotiate down and run at
1Gbps(or 2Gbps). If there are two (2) 4Gbps ports on either end of the link,
the link will run at 4Gbps. For the FC speed setting, please refer to Section
4.3.2.