Rorke Data Galaxy 16i User manual

Rorke DataTechnical Support
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Galaxy 16i
2Gb/s Fibre-to-SATA RAID Subsystem
SCSI-to-SATA RAID Subsystem
User Manual
Revision 1.1
596700

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Copyright © 2003
This Edition First Published 2003
All rights reserved. This publication may not be reproduced,
transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any
form or by any means, electronic, mechanical, magnetic,
optical, chemical, manual or otherwise, without the prior
written consent of Rorke Data, Inc.
Disclaimer
Rorke Data makes no representations or warranties with res-
pect to the contents hereof and specifically disclaims any
implied warranties of merchantability or fitness for any
particular purpose. urthermore, Rorke Data reserves the
right to revise this publication and to make changes from time
to time in the content hereof without obligation to notify any
person of such revisions or changes. Product specifications
are also subject to change without prior notice.
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Trademarks
Rorke Data and the Rorke Data logo are registered trademarks
of Rorke Data, Inc.. Galaxy 16i and other names prefixed
with “Galaxy” are trademarks of Rorke Data, Inc.
PowerPCis a trademark of International Business Machines
Corporation and Motorola Inc.
Solaris and Java are trademarks of Sun Microsystems, Inc.
All other names, brands, products or services are trademarks
or registered trademarks of its respective owners.
Printed in Taiwan

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Warnings and Certifications
FCC (applies in the U.S. and Canada)
This device complies with Part 15 of FCC Rules. Operation
of this device is subject to the following two conditions: 1)
this device may not cause harmful interference, and 2) this
device must accept any interference received, including
interference that may cause undesired operation.
Warning:
Use only shielded cables to connect I/O devices to this
equipment.
You are cautioned that changes or modifications not expressly
approved by the party responsible for compliance could void
your authority to operate the equipment.
This device is in conformity with the EMC

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Table of Contents
CHAPTER 1: INTRODUCTION............................................................. 1-1
1.1 MODEL VARIATIONS .................................................................... 1-1
1.1.1 Single-Controller Models ........................................................... 1-2
1.1.2 Dual Redundant Model............................................................... 1-2
1.2 ENCLOSURE CHASSIS.................................................................... 1-3
1.2.1 Front Section .............................................................................. 1-3
1.2.2 Rear Section................................................................................ 1-3
1.2.3 Midplane and Driveplane Boards............................................... 1-3
1.3 GALAXY 16I SUBSYSTEM COMPONENTS ...................................... 1-3
1.3.1 Front Panel Overview................................................................. 1-4
1.3.2 Rear Panel Overview.................................................................. 1-4
1.4 FRONT PANEL COMPONENTS ........................................................ 1-6
1.4.1 LCD Panel .................................................................................. 1-6
1.4.2 Drive Trays and Enclosure Bay ID Allocation ........................... 1-7
1.4.3 Dongle Kits ................................................................................. 1-7
1.5 REAR PANEL COMPONENTS.......................................................... 1-8
1.5.1 RAID Controller Modules........................................................... 1-8
1.5.2 Controller Module Interfaces ..................................................... 1-8
1.5.3 Power Supplies Units................................................................ 1-10
1.5.4 Cooling fan modules................................................................. 1-11
1.6 GALAXY 16I SUBSYSTEM MONITORING ..................................... 1-12
1.6.1 I2C bus...................................................................................... 1-12
1.6.2 LED Indicators ......................................................................... 1-13
1.6.3 Firmware (FW) and RAIDWatch GUI...................................... 1-13
1.6.4 Audible Alarms ......................................................................... 1-13
CHAPTER 2: HARDWARE INSTALLATION..................................... 2-1
2.1 INSTALLATION PRE-REQUISITES ................................................... 2-1
2.2 STATIC-FREE INSTALLATION ........................................................ 2-2
2.3 UNPACKING THE SUBSYSTEM ....................................................... 2-3
2.4 GENERAL INSTALLATION PROCEDURE ......................................... 2-4
2.5 MEMORY MODULE INSTALLATION ............................................... 2-4
2.5.1 Selecting the DIMMs .................................................................. 2-5
2.5.2 DIMM Module Installation Steps................................................ 2-6
2.6 BBU INSTALLATION..................................................................... 2-6
2.6.1 Installation Procedure ................................................................ 2-7
2.7 INSTALLING THE RAID CONTROLLER MODULE ......................... 2-10
2.8 HARD DRIVE INSTALLATION ...................................................... 2-11
2.8.1 Hard Drive Installation Pre-requisites..................................... 2-11
2.8.2 Dongle Kit Installation ............................................................. 2-12

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2.8.3 Drive Intstallation Without a Dongle/MUX Kit ........................ 2-13
2.8.4 Drive Installation with Dongle/MUX Kit .................................. 2-14
2.9 DRIVE TRAY INSTALLATION ....................................................... 2-16
CHAPTER 3: SYSTEM MONITORING................................................ 3-1
3.1 OVERVIEW .................................................................................... 3-1
3.2 SYSTEM MONITORING .................................................................. 3-1
3.3 FIRMWARE.................................................................................... 3-2
3.4 SYSTEM LEDS.............................................................................. 3-2
3.4.1 Controller Module on Single Controller..................................... 3-2
3.4.2 LCD Panel .................................................................................. 3-6
3.4.3 Drive Tray – Single Controller Model ........................................ 3-7
3.4.4 Drive Tray – Redundant Controller Model................................. 3-7
3.4.5 PSU LEDs ................................................................................... 3-8
3.4.6 Cooling module LEDs................................................................. 3-9
3.5 RAIDWATCH MANAGER.............................................................. 3-9
3.6 NOTIFICATION PROCESSING CENTER (NPC)............................... 3-10
3.7 AUDIBLE ALARM ........................................................................ 3-10
3.7.1 Default Threshold Values.......................................................... 3-11
3.7.2 Failed Devices .......................................................................... 3-11
3.8 I2C MONITORING ........................................................................ 3-12
CHAPTER 4: SYSTEM CONNECTION AND OPERATION ............. 4-1
4.1 OVERVIEW .................................................................................... 4-1
4.2 FC HOST CONNECTION PRE-REQUISITES...................................... 4-1
4.2.1 Cabling........................................................................................ 4-1
4.2.2 FC Lasers.................................................................................... 4-2
4.2.3 SFP Transceivers........................................................................ 4-2
4.2.4 Fibre Channel Topologies .......................................................... 4-3
4.3 CONNECTING TO HOST PORTS ...................................................... 4-4
4.3.1 Points of Failure ......................................................................... 4-4
4.4 SINGLE CONTROLLER HOST CONNECTION.................................... 4-4
4.4.1 Single Host.................................................................................. 4-4
4.4.2 Dual Hosts .................................................................................. 4-5
4.4.3 Fibre Channel Dual Hosts and Fibre Switch.............................. 4-6
4.5 DUAL-REDUNDANT HOST CONNECTION....................................... 4-7
4.5.1 Dual Hosts .................................................................................. 4-7
4.5.2 Dual Fibre Switches and Dual Hosts.......................................... 4-8
4.6 EXPANSION PORT CONNECTION.................................................... 4-8
4.7 SAMPLE CONFIGURATION: MULTI-PATHING ................................ 4-9
4.7.1 Logical Drive Presentation after Controller Failure................ 4-12
4.7.2 Notes on This Configuration ..................................................... 4-13
4.8 POWER ON.................................................................................. 4-13
4.8.1 Check List.................................................................................. 4-13
4.8.2 Power On Procedure ................................................................ 4-14

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4.8.3 Galaxy 16i Power On-Procedure ............................................. 4-15
4.8.4 Power On Status Check ............................................................ 4-16
4.8.5 LCD Screen............................................................................... 4-17
4.9 POWER OFF PROCEDURE ............................................................ 4-18
CHAPTER 5: SYSTEM MAINTENANCE............................................. 5-1
5.1 OVERVIEW.................................................................................... 5-1
5.2 REPLACING CONTROLLER MODULE COMPONENTS ...................... 5-2
5.2.1 Re-Moving the controller Module............................................... 5-2
5.2.2 Re-placing the BBU .................................................................... 5-3
5.2.3 Replacing a Failed DIMM Module............................................. 5-3
5.2.4 Replacing the controller Module ................................................ 5-4
5.3 REPLACING A FAILED PSU MODULE............................................ 5-5
5.4 REPLACING A FAILED COOLING FAN MODULE............................ 5-7
5.5 REPLACING A FAILED HARD DRIVE.............................................. 5-9
5.6 REPLACING A DONGLE/MUX KIT ................................................ 5-9
APPENDIX A: SYSTEM FEATURES................................................... A-1
A.1 OVERVIEW........................................................................................ A-1
A.2 FLEXIBLE CONFIGURATION OPTIONS................................................ A-1
A.2.1 Single and Redundant Models....................................................A-1
A.2.2 Rear Panel Variations................................................................A-1
A.2.3 Fibre Channel Configuration.....................................................A-2
A.3 RAID SUPPORT AND RAID LEVELS................................................. A-2
A.3.1 JBOD..........................................................................................A-2
A.3.2 RAID 0........................................................................................A-3
A.3.3 RAID 1........................................................................................A-4
A.3.4 RAID 1(0+1) ..............................................................................A-5
A.3.5 RAID 3........................................................................................A-6
A.3.6 RAID 5........................................................................................A-7
A.3.7 RAID 30 and RAID 50................................................................A-8
A.3.8 Non-RAID Storage .....................................................................A-8
A.3.9 Spares.........................................................................................A-9
A.4 REDUNDANT FEATURES.................................................................. A-10
A.4.1 Dual-Active Redundant Controllers .........................................A-10
A.4.2 Redundant Data Paths .............................................................A-10
A.5 FAULT TOLERANCE ........................................................................ A-10
A.5.1 Intelligent Drive Handling .......................................................A-10
A.5.2 Hot-swappable active components...........................................A-11
A.5.3 Global and Local Spares..........................................................A-11
A.5.4 Hot-Swapping of Drives ...........................................................A-11
A.5.5 S.M.A.R.T. Support...................................................................A-12
A.5.6 Other Fault Tolerant Features .................................................A-12
A.6 SAN FEATURES.............................................................................. A-12
A.6.1 Logical Unit Numbers ..............................................................A-12

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A.6.2 LUN Masking............................................................................A-12
A.7 MECHANICAL FEATURES ................................................................ A-13
A.7.1 Modular Design........................................................................A-13
A.7.2 Cableless Design ......................................................................A-13
APPENDIX B: ACCESSING THE RAIDWATCH SOFTWARE....... B-1
B.1 SOFTWARE INSTALLATION REQUIREMENTS................................. B-1
B.1.1 What Is the “Disk Reserved Space?” .........................................B-1
B.1.2 Web-Based Management ............................................................B-2
B.1.3 Requirements ..............................................................................B-2
B.2 CONNECTING ETHERNET PORT: ................................................... B-3
B.3 CONFIGURING THE CONTROLLER................................................. B-3
B.4 NPC ONBOARD ........................................................................... B-7
APPENDIX C: SPECIFICATIONS........................................................ C-1
C.1 TECHNICAL SPECIFICATIONS ....................................................... C-1
C.2 CONTROLLER SPECIFICATIONS .................................................... C-3
C.2.1 Configuration ............................................................................ C-3
C.2.2 Architecture............................................................................... C-4
C.2.3 Environmental Specifications.................................................... C-4
C.3 DRIVE TRAY SPECIFICATIONS...................................................... C-5
C.4 POWER SUPPLY SPECIFICATIONS ................................................. C-5
C.5 RAID MANAGEMENT .................................................................. C-6
C.6 FAULT TOLERANCE MANAGEMENT ............................................. C-6

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Safety Precautions
Precautions and instructions
 Prior to powering on the subsystem, ensure that the
correct power range is being used.
 The Galaxy 16i subsystem comes with 16 drive bays
(slots). Leaving any of these slots empty will greatly
affect the efficiency of the airflow within the enclosure,
and will consequently lead to the system overheating,
which can cause irreparable damage.
 If a module fails, leave it in place until you have a
replacement unit and you are ready to replace it.
 Airflow Consideration: The subsystem requires an
airflow clearance especially at the front and at the rear.
 To handle subsystem modules, use the retention screws,
eject levers, and the metal frames/face plates. Avoid
touching PCB boards or connector pins.
 To comply with safety, emission, or thermal
requirements, none of the covers or replaceable modules
should be removed. Make sure that during operation, all
enclosure modules and covers are securely in place.
 Be sure that the rack cabinet into which the subsystem
chassis is to be installed provides sufficient ventilation
channels and airflow circulation around the subsystem.
 Provide a soft, clean surface to place your subsystem on
before working on it. Servicing on a rough surface may
damage the exterior of the chassis.
 If it is necessary to transport the subsystem, repackage all
drives and replaceable modules separately.

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 Dual redundant controller models come with two
controller modules that must be installed into the
subsystem. Single controller modules come with a single
controller module and a metal sheet is placed over the
lower controller bay at the rear of the subsystem. Since
single controller modules cannot be upgraded this metal
sheet should NEVER be removed.
ESD Precautions:
Observe all conventional anti-ESD methods while handling
system modules. The use of grounded wrist-strap and an anti-
static work pad are recommended. Avoid dust or debris in
your work area.
About This Manual:
This manual
 introduces the the Galaxy 16i RAID Subsystem series.
 describes all the active components in the system.
 provides recommendations and details about the hardware
installation process of the subsystem.
 briefly describes how to monitor the subsystem.
 describes how to maintain the subsystem.
This manual does not
 describe components that are not user-serviceable.
 describe the configuration options of firmware, using
terminal emulation programs or the RAIDWatch GUI that
came with your subsystem.
 give a detailed description of the RAID processing units,
the RAID controllers embedded within the subsystem.