
Contents
2.2.5.4.Connectionboard..........................................................................................2−26
2.2.5.5.CTD(ColorToneDensity)board.....................................................................2−27
2.2.5.6.CRUMJointboard........................................................................................2−27
2.2.5.7.USBHost....................................................................................................2−28
2.2.5.8.WirelessLANboard......................................................................................2−28
2.2.5.9.SMPS(SwitchingModePowerSupply)Board....................................................2−29
2.2.5.10.HVPSboard.................................................................................................2−31
2.2.5.11.NFCTagSticker...........................................................................................2−32
2.2.5.12.ElectricalPartsLocation.................................................................................2−33
2.2.6.EngineF/WControlAlgorithm......................................................................................2−34
2.2.6.1.Feeding.......................................................................................................2−34
2.2.6.2.Transfer.......................................................................................................2−34
2.2.6.3.Fusing.........................................................................................................2−35
2.2.6.4.LSU............................................................................................................2−35
2.2.7.SoftwareDescriptions..................................................................................................2−36
2.2.7.1.Softwaresystemoverview..............................................................................2−36
2.2.7.2.Architecture.................................................................................................2−36
2.2.7.3.DataandControlFlow...................................................................................2−37
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.Precautionswhenreplacingparts................................................................................................3−1
3.1.1.Precautionswhenassemblinganddisassembling...............................................................3−1
3.1.2.PrecautionswhenhandlingPBA.....................................................................................3−1
3.1.3.ReleasingPlasticLatches..............................................................................................3−2
3.2.Screwsusedintheprinter..........................................................................................................3−3
3.3.Replacingthemaintenanceparts.................................................................................................3−5
3.3.1.ITBUnit....................................................................................................................3−5
3.3.2.FuserUnit..................................................................................................................3−7
3.3.3.Transfer(T2)roller.......................................................................................................3−8
3.3.4.Pickuproller..............................................................................................................3−8
3.4.ReplacingthemainSVCparts....................................................................................................3−9
3.4.1.Cover........................................................................................................................3−9
3.4.2.ADFUnit...................................................................................................................3−10
3.4.3.OPEUnit...................................................................................................................3−10
3.4.4.PlatenUnit.................................................................................................................3−11
3.4.5.CISunitandScanDriveunit.........................................................................................3−12
3.4.6.MiddleCover.............................................................................................................3−13
3.4.7.Faxboard...................................................................................................................3−13
3.4.8.HVPSboard...............................................................................................................3−14
3.4.9.LSU..........................................................................................................................3−14
3.4.10.FRAMEBASE-PAPERPATH.......................................................................................3−15
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