Samsung DVD-HD931 - HDTV Converter Progressive-Scan DVD... User manual

DVD PLAYER
Chassis : Exino
DVD-HD931
SERVICE
1. Precautions
2. Alignment and Adjustment
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagram
6. Schematic Diagrams
Manual
DVD PLAYER CONTENTS
SERVICE MANUAL DVD-HD931
ELECTRONICS
© Samsung Electronics Co., Ltd. MAR. 2003
Printed in Korea
AK82-00332A
If you want to know additional information which is not included on this Service Manual, please refer to the
DVD-HD931 Training Manual of (AK82-00333A).
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Samsung Electronics 1-1
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
always make a safety check of the entire instrument,
including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are
defective or have been defeated during servicing.
(1)Protective shields are provided to protect both
the technician and the customer. Correctly replace
all missing protective shields, including any
removed for servicing convenience.
(2)When reinstalling the chassis and/or other as-
sembly in the cabinet, be sure to put back in place
all protective devices, including, but not limited to,
nonmetallic control knobs, insulating fish papers,
adjustment and compartment covers/shields, and
isolation resistor/capacitor networks. Do not oper-
ate this instrument or permit it to be operated with-
out all protective devices correctly installed and
functioning.
(2) Be sure that there are no cabinet openings through
which adults or children might be able to insert
their fingers and contact a hazardous voltage. Such
openings include, but are not limited to, excessive-
ly wide cabinet ventilation slots, and an improper-
ly fitted and/or incorrectly secured cabinet back
cover.
(3) Leakage Current Hot Check-With the instrument
completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an iso-
lation transformer during this test.) Use a leakage
current tester or a metering system that complies
with American National Standards institute (ANSI)
C101.1 Leakage Current for Appliances and
Underwriters Laboratories (UL) 1270 (40.7). With
the instrument’s AC switch first in the ON position
and then in the OFF position, measure from a
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the instrument
(antennas, handle brackets, metal cabinets, screw-
heads, metallic overlays, control shafts, etc.), espe-
cially any exposed metal parts that offer an electri-
cal return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the out-
let and repeat the test. See Fig. 1-1.
Any measurements not within the limits specified
herein indicate a potential shock hazard that must
be eliminated before returning the instrument to
the customer.
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1) Unplug
the power supply cord and connect a jumper wire
between the two prongs of the plug. (2) Turn on the
power switch of the instrument. (3) Measure the
resistance with an ohmmeter between the
jumpered AC plug and all exposed metallic cabinet
parts on the instrument, such as screwheads,
antenna, control shafts, handle brackets, etc. When
an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2
megohm. When there is no return path to the chas-
sis, the reading must be infinite. If the reading is
not within the limits specified, there is the possibil-
ity of a shock hazard, and the instrument must be
repaired and rechecked before it is returned to the
customer. See Fig. 1-2.
Fig. 1-2 Insulation Resistance Test
DEVICE
UNDER
TEST
(READING SHOULD
NOT BE ABOVE
0.5mA)
LEAKAGE
CURRENT
TESTER
EARTH
GROUND
TEST ALL
EXPOSED METER
SURFACES
ALSO TEST WITH
PLUG REVERSED
(USING AC ADAPTER
PLUG AS REQUIRED)
2-WIRE CORD
Antenna
Terminal
Exposed
Metal Part
ohm ohmmeter
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Precautions
1-2 Samsung Electronics
2) Read and comply with all caution and safety re-
lated notes on or inside the cabinet, or on the chas-
sis.
3) Design Alteration Warning-Do not alter or add to
the mechanical or electrical design of this instru-
ment. Design alterations and additions, including
but not limited to, circuit modifications and the
addition of items such as auxiliary audio output
connections, might alter the safety characteristics of
this instrument and create a hazard to the user. Any
design alterations or additions will make you, the
servicer, responsible for personal injury or property
damage resulting therefrom.
4) Observe original lead dress. Take extra care to
assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be
sure that leads and components do not touch ther-
mally hot parts), (3) the AC supply, (4) high voltage,
and (5) antenna wiring. Always inspect in all areas
for pinched, out-of-place, or frayed wiring, Do not
change spacing between a component and the
printed-circuit board. Check the AC power cord for
damage.
5) Components, parts, and/or wiring that appear to
have overheated or that are otherwise damaged
should be replaced with components, parts and/ or
wiring that meet original specifications.
Additionally, determine the cause of overheating
and/or damage and, if necessary, take corrective
action to remove any potential safety hazard.
6) Product Safety Notice-Some electrical and mechani-
cal parts have special safety-related characteristics
which are often not evident from visual inspection,
nor can the protection they give necessarily be
obtained by replacing them with components rated
for higher voltage, wattage, etc. Parts that have spe-
cial safety characteristics are identified by shading,
an ( )or a ( )on schematics and parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire and/or
other hazards. Product safety is under review con-
tinuously and new instructions are issued whenev-
er appropriate.
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Precautions
Samsung Electronics 1-3
1-2 Servicing Precautions
CAUTION : Before servicing units covered by this
service manual and its supplements, read and follow
the Safety Precautions section of this manual.
Note : If unforseen circumstances create conflict
between the following servicing precautions and any
of the safety precautions, always follow the safety pre-
cautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord
from the AC power source before (1) re-moving
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic capaci-
tor in the instrument.
b. Do not defeat any plug/socket B+ voltage inter-
locks with which instruments covered by this
service manual might be equipped.
c. Do not apply AC power to this instrument and
/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly in-
stalled.
d. Always connect a test instrument’s ground lead
to the instrument chassis ground before connect-
ing the test instrument positive lead. Always
remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground
lead last.
(2) The service precautions are indicated or printed on
the cabinet, chassis or components. When servic-
ing, follow the printed or indicated service precau-
tions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength.
When replacing components, use components
which have the same ratings. Components ientified
by shading, by( ) or by ( ) in the circuit diagram
are important for safety or for the characteristics of
the unit. Always replace them with the exact
replacement components.
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiring board for safety. The internal wiring is
sometimes clamped to prevent contact with heat-
ing components. Install such elements as they
were.
(5) After servicing, always check that the removed
screws, components, and wiring have been in-
stalled correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades of
the attachment plug and accessible conductive
parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation resi-
stance meter (500V) to the blades of the attachment
plug. The insulation resistance between each blade of
the attachment plug and accessible conductive
parts(see note) should be more than 1 Megohm.
Note : Accessible conductive parts include metal pan-
els, input terminals, earphone jacks, etc.
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Precautions
1-4 Samsung Electronics
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be dam-
aged easily by static electricity.
Such components commonly are called Electrostati-
cally Sensitive Devices(ESD). Examples of typical ESD
devices are integrated circuits and some field-effect
transistors and semiconductor chip components. The
following techniques should be used to help reduce
the incidence of component damage caused by static
electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped assembly,
drain off any electrostatic charge on your body by
touching a known earth ground. Alternatively,
obtain and wear a commercially available dis-
charging wrist strap device, which should be
removed for potential shock reasons prior to apply-
ing power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conduc-
tive surface such as aluminum foil, to prevent elec-
trostatic charge buildup or exposure of the assem-
bly.
(3) Use only a grounded-tip soldering iron to solder or
unsolder ESD devices.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as
“anti-static” can generate electrical charges suffi-
cient to damage ESD devices.
(5) Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage
ESD devices.
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it.(Most replacement ESD
devices are packaged with leads electrically short-
ed together by conductive foam, aluminum foil or
comparable conductive materials).
(7) Immediately before removing the protective ma-
terials from the leads of a replacement ESD device,
touch the protective material to the chassis or cir-
cuit assembly into which the device will be
installed.
CAUTION : Be sure no power is applied to the ch-
assis or circuit, and observe all other safety precau-
tions.
(8) Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise harm-
less motion such as the brushing together of your
clothes fabric or the lifting of your foot from a car-
peted floor can generate static electricity sufficient
to damage an ESD device).
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Precautions
Samsung Electronics 1-5
1-4 Handling the optical pick-up
The laser diode in the optical pick up may suffer elec-
trostatic breakdown because of potential static elec-
tricity from clothing and your body.
The following method is recommended.
(1) Place a conductive sheet on the work bench (The
black sheet used for wrapping repair parts.)
(2) Place the set on the conductive sheet so that the
chassis is grounded to the sheet.
(3) Place your hands on the conductive sheet(This
gives them the same ground as the sheet.)
(4) Remove the optical pick up block
(5) Perform work on top of the conductive sheet. Be
careful not to let your clothes or any other static
sources to touch the unit.
◆Be sure to put on a wrist strap grounded to the
sheet.
◆Be sure to lay a conductive sheet made of copper
etc. Which is grounded to the table.
Fig.1-3
(6) Short the short terminal on the PCB, which is in-
side the Pick-Up ASS’Y, before replacing the Pick-
Up. (The short terminal is shorted when the Pick-
Up Ass’y is being lifted or moved.)
(7) After replacing the Pick-up, open the short termi-
nal on the PCB.
THE UNIT
WRIST-STRAP
FOR GROUNDING
1M
1M CONDUCTIVE SHEET
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Precautions
1-6 Samsung Electronics
1-5 Pick-up disassembly and reassembly
1-5-1 Disassembly
1) Remove the power cord.
2) Disassemble the Deck-Assy.
3) Make solder land 2 points short on Pick-up.
(See Fig. 1-4)
4) Disassembly the Pick-up.
1-5-2 Assembly
1) Replace the Pick-up.
2) Remove the soldering 2 points on Pick-up.
3) Reassemble the Deck-Assy.
PICK-UP ASS'Y
SOLDER LAND 2 POINTS SHORT
Note : If the assembly and disassembly are not done in correct sequence, the Pick-up may be damaged.
Fig. 1-4
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Samsung Electronics 2-1
2. Alignment and Adjustment
2-1 Location of Test Point
Fig. 2-1 Location of Test Point
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Alignment and Adjustment
2-2 Samsung Electronics
2-2-1 Adjustment Spec. and Test Point
2-2 Skew Adjustment
Test Disc Adjustment Spec. Test Point Adjustment Location
TDV-533 “ENV” Screw A / B
Chapter 14 Flat Waveform (Main PCB - Component Side) Ass’y Deck - Top Side
(See Fig. 2-1) (See Fig. 2-2)
Fig. 2-2 Ass’y Deck (Top Side)
◆Test Disc ; Service not Available
<Table 2-1>
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Alignment and Adjustment
Samsung Electronics 2-3
2-2-2 SKEW Adjustment Method
Needed to minimize the variations in Skew of the Pickup unit and to provide optimum match with the recorded
signal on the Disc.
1) Connect an Oscilloscope to the “ENV” Test Point (See Fig. 2-1).
2) Connect Power, Open the Tray and Play the TDV-533 Disc, Chapter 14.
◆Set the Oscilloscope Range as follows :
(Voltage ; 50mV/Div., Frequency ; 10m Sec.)
3) Adjust the Screws “A” and “B” (See Fig. 2-2) using a Hex screwdriver until you obtain a Flat Waveform and
the picture is stable.
Then, go to Chapter 1 and make sure the Waveform is Flat here as well.
If not, you have to go back to Chapter 14 and adjust again.
If you cannot obtain a Flat waveform, then the unit is defective.
Note : The Deck must be in a horizontal position. Use both “A” and “B” screws to adjust.
   
    
Typical Waveform before Adjustment Waveform after Correct Adjustment
Fig. 2-3 Envelope Waveform
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Alignment and Adjustment
2-4 Samsung Electronics
MEMO
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Samsung Electronics 3-1
3. Exploded View and Parts List
3-1 Cabinet Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
3-2 Deck Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Page
3-2
3-4
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Exploded Views and Parts List
3-2 Samsung Electronics
3-1 Cabinet Assembly
S.N.A. : Service Not Available
101
151 152
151
152
150
601 (ASSY-PCB-MAIN)
603 (ASSY-PCB-SUB)
S.N.A. (ASS'Y CABINET-BOTTOM)
DECK-DVD MECHA (S.N.A.)
152
153
UT01
1
2
5
702
701 152
152
610
152
602 (ASS'Y-PCB-JACK)
PCN10B
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Exploded Views and Parts List
3-3
Samsung Electronics
Loc. No Parts No. Description ; Specification Remark
1AK97-00367A ASSY FRONT CABINET;ASSY,DVD-H931,XAA
2AK97-00369A ASSY-DOOR;ASSY,DVD-H931,XAA
5AK64-00221A KNOB-SHUTTLE;DVD-HD931,ABS 94HB,-,-,-,-,
150 6003-000275 SCREW-TAPTITE;BH,+,B,M3,L10,BLK ,SWCH101
151 6003-000262 SCREW-TAPTITE;BH,+,B,M3,L6,CBLACK,SWRCH1
152 6003-000283 SCREW-TAPTITE;BH,+,B,M3,L8,ZPC(YEL),SM20
153 6046-001010 STAND OFF;M3,L6,NI PLT,SUM24L,#4-40
601 AK92-00174A ASSY PCB-MAIN;DVD-HD931/XAA,MAIN
602 AK92-00180A ASSY PCB-JACK;DVD-HD931/XAA,JACK
603 AK92-00238A ASSY PCB-SUB;DVD-HD931,SUC-PCB ASS
610 AC39-10200N CBF POWER CORD;EP2,SPT-2,AWG#18,1.8MT,WA
701 AK92-00198A ASSY PCB-PWR KEY;DVD-HD931,PWR-KEY PCB A
702 AK92-00197A ASSY PCB-JOG KEY;DVD-HD931,JOG-KEY PCB A
PCN10B 3809-001317 CABLE-FLAT;30V,80C,80MM,27P,1.25MM,UL289
UT01 AK59-00012A REMOCON-ASSY;DVD-HD931/XAA,XAA,-,-,-,-,-
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Exploded Views and Parts List
3-4 Samsung Electronics
3-2 Deck Assembly
H106
H105
H107
H102
H205
903
H204
900
904
903
900
H104
H108
H241
H211
H203
H210
H103
S.N.A.
H206
H207
H206
H202
H209
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Exploded Views and Parts List
3-5
Samsung Electronics
Loc. No Parts No. Description ; Specification Remark
900 6003-001157 SCREW-TAPTITE;PWH,+,B,M2,L6,ZPC(YEL),SWR
903 6001-001370 SCREW-MACHINE;CH,+,M1.7,L3.0,ZPC(YEL),SW
904 6002-001086 SCREW-TAPPING;PH,+,B,M1.7,L5.0,ZPC(YEL),
H102 AH66-00111B CLAMPER-ASSY;DP-5,POM+MAGNET,-,-,-,-,-,-
H103 AK66-00007A PULLEY-GEAR;DP-9,POM ,-,-,-,-,-,-
H104 AK31-00003A MOTOR-LOAD ASSY;SM-2412L2,DP-9,-,-,-,-,-
H105 6602-001076 BELT-RECTANGULAR;CR,T1.2,4.3%,1.2X25.1,B
H106 AK66-00008A GEAR-TRAY;DP-9,POM,-,-,-,-,-,-,-
H107 AK66-00009A SLIDER-HOUSING;DP-9,POM,-,-,-,-,-
H108 AK63-00008A TRAY-DISC;DP-9,ABS,-,-,-,-,BLK,DP-9
H202 AK73-00005A RUBBER-INSULATOR;DP-9,BUTYL RUBBER,-,-,-
H203 AH61-50327A SHAFT-P/U;DP-3,SUS420J2,L84.7,OD3,-,-,-
H204 AK66-00010A GEAR-FEED A;DP-9,POM ,-,-,-,-,-,-,-
H205 AK66-00011A GEAR-FEED B;DP-9,POM ,-,-,-,-,-,-,-
H206 AK61-00032A HOLDER-CAM SKEW;DP-9,POM,-,-,-,BLACK,-
H207 AK31-00004A MOTOR SPINDLE;RSM-2606A1,DP-9,350MA,-,-,
H209 AK64-00052A CHASSIS-SUB;DP-9,ABS(SR-0320),0,0,0,-,-
H210 AK31-00005A MOTOR-FEED ASSY;-,DP-9,-,-,-,-,-,-,-,-,-
H211 AK97-00168B ASSY-PICK UP;-,SOH-DSSA T544C
H241 3809-001409 CABLE-FLAT;30V,80C,230MM,24P,1MM,UL2896
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Exploded Views and Parts List
3-6 Samsung Electronics
MEMO
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Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
Samsung Electronics 4-1
601 AK92-00174A ASSY PCB-MAIN;DVD-HD931/XAA,MAIN
CN1 3708-000249 CONNECTOR-FPC/FFC/PIC;27P,1.25mm,STRAIGH
CN2 3711-005413 CONNECTOR-HEADER;NOWALL,8P,2R,2.0mm,STRA
CON10 3711-000596 CONNECTOR-HEADER;BOX,10P,1R,2MM,STRAIGHT
CON12 3711-005414 CONNECTOR-HEADER;NOWALL,12P,2R,2mm,STRAI
CON8 3711-005416 CONNECTOR-HEADER;NOWALL,16P,2R,2mm,STRAG
DC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DC2 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
DCN1 3708-001696 CONNECTOR-FPC/FFC/PIC;24P,1MM,STRAIGHT,S
DCN2 3708-001695 CONNECTOR-FPC/FFC/PIC;13P,1MM,STRAIGHT,S
DCN3 3711-001018 CONNECTOR-HEADER;BOX,5P,1R,2mm,STRAIGHT,
DD1 0407-000116 DIODE-ARRAY;DAP202K,80V,100mA,CK2-3,SOT-
DQ1 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
DQ2 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
DQ3 0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW,SOT-
DR1 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
DR2 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
DR3 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608
DR4 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
DR5 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
DR6 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608
DR7 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608
DR8 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608
FC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC10 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC11 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC12 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC13 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC15 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC2 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC3 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC4 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC5 2203-001222 C-CERAMIC,CHIP;820pF,10%,50V,X7R,TP,1608
FC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
FC7 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
FE1 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
FE2 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
FE3 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
FE4 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
FE5 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
FE6 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
FR1 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
FR10 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR11 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR12 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
FR13 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
FR14 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR15 2007-000129 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608
FR16 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR17 2007-000088 R-CHIP;7.5Kohm,5%,1/16W,DA,TP,1608
FR18 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
FR2 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
FR3 2007-000034 R-CHIP;1OHM,5%,1/4W,DA,TP,3216
FR4 2007-000034 R-CHIP;1OHM,5%,1/4W,DA,TP,3216
FR5 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608
FR6 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR7 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608
FR8 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
FR9 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
IC1 AH14-10004R IC;M74HCU04,SOP,TAPE 14P
MC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC10 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MC11 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC12 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC13 2203-000626 C-CERAMIC,CHIP;0.022NF,5%,50V,C0G,TP,160
MC15 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC16 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
MC17 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
MC18 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
MC2 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC3 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC315 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC4 2203-000626 C-CERAMIC,CHIP;0.022NF,5%,50V,C0G,TP,160
MC5 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC6 2203-000426 C-CERAMIC,CHIP;0.018NF,5%,50V,C0G,TP,160
MC7 2203-000426 C-CERAMIC,CHIP;0.018NF,5%,50V,C0G,TP,160
MC8 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
MC9 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
MIC1 0903-001322 IC-MICROCONTROLLER;TMP91C630F,-,P-LQPF,1
MIC3 0801-002143 IC-CMOS LOGIC;7S32,OR GATE,SOT-23,5P,63M
MIC4 1103-001204 IC-EEPROM;24C021,256x8Bit,SOP,8P,150MIL,
MIC5 3704-000472 SOCKET-IC;32P,DIP,SN,2.54mm
MIC5B 1102-001133 IC-EPROM;M27W201-80B6,256KX8BIT,DIP,32P
MR1 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR13 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
MR14 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR16 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR17 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR18 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR19 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR2 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR21 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR22 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR23 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR24 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
MR25 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR26 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR27 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
MR28 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR29 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR3 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR30 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
MR31 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608
MR32 2007-000075 R-CHIP;220ohm,5%,1/16W,DA,TP,1608
MR4 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR5 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR6 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR7 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR77 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
MR8 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MR9 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
MY1 2802-001152 RESONATOR-CERAMIC;20MHZ,0.5%,TP,5.5X3.5X
PC1 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC100 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC12 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC15 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC2 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC3 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC35 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
PC36 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
PC4 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
PC5 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
4. Electrical Parts List
All manuals and user guides at all-guides.com

Loc.No Part No Description ; Specification RemarkLoc.No Part No Description ; Specification Remark
4-2 Samsung Electronics
Electrical Parts List
PC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
PC8 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
PE1 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE10 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE100 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE15 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE2 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE3 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE35 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE4 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE5 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PE6 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
PIC1 1203-002178 IC-VOLTAGE REGULATOR;1563,SOP,7P,173MIL,
PIC2 1203-002220 IC-POSI.ADJUST REG.;LD1117,DPAK,3P,240MI
PIC3 1203-002577 IC-VOLTAGE REGULATOR;MM1561J,SOP,7P,173M
PL100 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
PL2 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
PL99 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
PR1 2007-001044 R-CHIP;56ohm,5%,1/16W,DA,TP,1608
PR2 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608
PR85 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
PR86 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
PR87 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
RC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC11 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC12 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC13 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608,
RC14 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC15 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608,
RC16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
RC17 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
RC18 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
RC19 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
RC2 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RC21 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC22 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC23 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC24 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC25 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC27 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC28 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC29 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
RC3 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RC31 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC32 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
RC33 2203-000715 C-CERAMIC,CHIP;3.3nF,10%,50V,X7R,TP,1608
RC34 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RC35 2203-000236 C-CERAMIC,CHIP;0.1NF,5%,50V,C0G,TP,1608
RC4 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RC5 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
RC54 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC7 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC8 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RC9 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
RE1 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5
RE10 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
RE2 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RE3 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RE4 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5
RE5 2401-000922 C-AL;22uF,20%,16V,GP,TP,5x5,5
RE6 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RE7 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RE8 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RE9 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
RIC1 AH13-00009C IC ASIC;S5L1463A01-Q1,DVD-L200,80,+5,-
RL11 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
RL3 2703-000398 INDUCTOR-SMD;10uH,10%,3.2x2.5x2.2mm
RQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT-
RQ2 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW,SOT-
RR100 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
RR101 2007-001179 R-CHIP;8.2Kohm,5%,1/16W,DA,TP,1608
RR11 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
RR12 2007-000312 R-CHIP;10OHM,5%,1/8W,DA,TP,3216
RR15 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RR16 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RR17 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
RR18 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
RR19 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RR2 2007-000458 R-CHIP;18Kohm,5%,1/16W,DA,TP,1608
RR21 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RR22 2007-000129 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608
RR23 2007-001235 R-CHIP;910Kohm,5%,1/16W,DA,TP,1608
RR24 2007-000134 R-CHIP;33Kohm,5%,1/16W,DA,TP,1608
RR25 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
RR26 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RR28 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RR29 2007-000381 R-CHIP;13Kohm,5%,1/16W,DA,TP,1608
RR3 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RR31 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
RR4 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RR5 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
RR7 2007-000086 R-CHIP;5.6Kohm,5%,1/16W,DA,TP,1608
RR8 2007-000077 R-CHIP;470ohm,5%,1/16W,DA,TP,1608
RR9 2007-000312 R-CHIP;10OHM,5%,1/8W,DA,TP,3216
SBC1 2203-000681 C-CERAMIC,CHIP;0.027NF,5%,50V,C0G,TP,160
SBC2 2203-000681 C-CERAMIC,CHIP;0.027NF,5%,50V,C0G,TP,160
SBC3 2203-000440 C-CERAMIC,CHIP;1nF,10%,50V,X7R,TP,1608,-
SBC4 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SBL1 3301-000314 CORE-FERRITE BEAD;AB,120ohm,1.6x0.8x0.8m
SBL2 3301-000314 CORE-FERRITE BEAD;AB,120ohm,1.6x0.8x0.8m
SBR1 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
SBR2 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SBY1 2801-003554 CRYSTAL-UNIT;27MHz,10ppm,28-AAM,12pF,40o
SC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC11 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
SC13 2203-001634 C-CERAMIC,CHIP;33nF,10%,50V,X7R,TP,1608,
SC14 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
SC15 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC16 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC17 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC18 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC2 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
SC23 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC24 2203-000681 C-CERAMIC,CHIP;0.027NF,5%,50V,C0G,TP,160
SC25 2203-000681 C-CERAMIC,CHIP;0.027NF,5%,50V,C0G,TP,160
SC251 2203-000384 C-CERAMIC,CHIP;0.015NF,5%,50V,C0G,TP,160
SC26 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC28 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
SC29 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
SC3 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
SC31 2203-000626 C-CERAMIC,CHIP;0.022NF,5%,50V,C0G,TP,160
SC32 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
SC33 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC34 2203-000626 C-CERAMIC,CHIP;0.022NF,5%,50V,C0G,TP,160
SC35 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC36 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC38 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC4 2203-001652 C-CERAMIC,CHIP;470nF,+80-20%,16V,Y5V,TP,
SC41 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
SC42 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
SC43 2203-001634 C-CERAMIC,CHIP;33nF,10%,50V,X7R,TP,1608,
All manuals and user guides at all-guides.com

Loc.No Part No Description ; Specification Remark Loc.No Part No Description ; Specification Remark
Electrical Parts List
Samsung Electronics 4-3
SC44 2203-000715 C-CERAMIC,CHIP;3.3nF,10%,50V,X7R,TP,1608
SC45 2203-001126 C-CERAMIC,CHIP;0.68nF,10%,50V,X7R,TP,160
SC46 2203-000975 C-CERAMIC,CHIP;47nF,10%,25V,X7R,TP,1608,
SC47 2203-000140 C-CERAMIC,CHIP;1.5nF,10%,50V,X7R,TP,1608
SC5 2203-002398 C-CERAMIC,CHIP;22nF,10%,50V,X7R,TP,1608
SC50 2203-006035 C-CERAMIC,CHIP;220NF,+-10%,10V,X7R,TP,16
SC53 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
SC54 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
SC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
SC7 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
SC8 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
SC9 2203-000491 C-CERAMIC,CHIP;2.2nF,10%,50V,X7R,TP,1608
SE1 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5
SE30 2401-002165 C-AL;100uF,20%,16V,GP,TP,6.3x7,5
SIC1 AH13-00006B IC ASIC;S5L1455X01,DVD-P293,160,+3.3V,
SIC2 1105-001355 IC-DRAM;416256,256KX16BIT,TSOP(II),40P
SIC3 1003-001489 IC-MOTOR DRIVER;FAN8728,HQFP,48P,14X14MM
SL1 3301-000314 CORE-FERRITE BEAD;AB,120ohm,1.6x0.8x0.8m
SL2 3301-000314 CORE-FERRITE BEAD;AB,120ohm,1.6x0.8x0.8m
SR1 2007-001235 R-CHIP;910Kohm,5%,1/16W,DA,TP,1608
SR106 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR107 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR11 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
SR13 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
SR14 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
SR15 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
SR16 2007-000129 R-CHIP;27Kohm,5%,1/16W,DA,TP,1608
SR17 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
SR18 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR19 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
SR2 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
SR21 2007-000093 R-CHIP;20Kohm,5%,1/16W,DA,TP,1608
SR22 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR23 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR24 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR26 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
SR27 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR28 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR29 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR3 2007-000092 R-CHIP;15Kohm,5%,1/16W,DA,TP,1608
SR31 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR33 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR34 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR35 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR36 2007-000074 R-CHIP;100ohm,5%,1/16W,DA,TP,1608
SR39 2007-000116 R-CHIP;120ohm,5%,1/16W,DA,TP,1608
SR4 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR41 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR42 2007-000078 R-CHIP;1Kohm,5%,1/16W,DA,TP,1608
SR43 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR44 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
SR45 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
SR48 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR49 2007-000305 R-CHIP;10Mohm,5%,1/16W,DA,TP,1608
SR5 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
SR50 2007-000305 R-CHIP;10Mohm,5%,1/16W,DA,TP,1608
SR6 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR7 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR70 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR72 2007-000070 R-CHIP;0ohm,5%,1/16W,DA,TP,1608
SR8 2007-000091 R-CHIP;12Kohm,5%,1/16W,DA,TP,1608
SR9 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
SR90 2007-000084 R-CHIP;4.7Kohm,5%,1/16W,DA,TP,1608
SY1 2801-000261 CRYSTAL-UNIT;33.8688MHz,50ppm,28-AAA,12p
ZC1 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC10 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC100 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC101 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC102 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC103 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC104 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC105 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC106 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC107 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC108 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC109 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC11 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC110 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC111 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC112 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC113 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC114 2203-000998 C-CERAMIC,CHIP;0.047NF,5%,50V,C0G,TP,160
ZC12 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC13 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC14 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
ZC15 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
ZC16 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
ZC17 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
ZC18 2203-000815 C-CERAMIC,CHIP;0.033NF,5%,50V,C0G,TP,160
ZC19 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC2 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC20 2203-000384 C-CERAMIC,CHIP;0.015NF,5%,50V,C0G,TP,160
ZC24 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC25 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC26 2203-000626 C-CERAMIC,CHIP;0.022NF,5%,50V,C0G,TP,160
ZC27 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC28 2203-000384 C-CERAMIC,CHIP;0.015NF,5%,50V,C0G,TP,160
ZC29 2203-000384 C-CERAMIC,CHIP;0.015NF,5%,50V,C0G,TP,160
ZC3 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC32 2203-001567 C-CERAMIC,CHIP;0.01nF,0.5pF,50V,NP0,TP,1
ZC33 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC34 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC35 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
ZC36 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC37 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC38 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC39 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC4 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC40 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC41 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC5 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC6 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC64 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
ZC65 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC66 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC67 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC68 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC69 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC7 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC8 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC81 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC86 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZC87 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
ZC88 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
ZC9 2203-005148 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
ZE1 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
ZE2 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
ZE3 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
ZE4 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
ZE5 2401-001507 C-AL;47uF,20%,16V,GP,TP,6.3x5,5
ZIC1 1204-002063 IC-ENCODER/DECODER;ZIVA-5B0,PQFP,208P,11
ZIC11 1103-001204 IC-EEPROM;24C021,256x8Bit,SOP,8P,150MIL,
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