Siemens SIMATIC ET 200iSP User manual

SIMATIC
Distributed I/O
ET 200iSP
Operating Instructions
11/2017
A5E00247483-07
Preface
Product overview 1
Commissioning guideline 2
Configuration options 3
Installing 4
Wiring 5
Commissioning and
Diagnostics 6
Maintenance 7
General technical
specifications 8
Terminal modules 9
Power Supply 10
Interface module 11
Digital electronic modules 12
Analog electronic modules 13
Other modules 14
Appendix A

Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will be
used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to property
damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions. Qualified
personnel are those who, based on their training and experience, are capable of identifying risks and avoiding
potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended or
approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.
Trademarks
All names identified by ® are registered trademarks of Siemens AG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software described.
Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the information in
this publication is reviewed regularly and any necessary corrections are included in subsequent editions.
Siemens AG
Division Process Industries and Drives
Postfach 48 48
90026 NÜRNBERG
GERMANY
A5E00247483-07
Ⓟ 12/2017 Subject to change
Copyright © Siemens AG 2017.
All rights reserved

Preface
Purpose of the manual
The information in this manual enables you to operate the ET 200iSP distributed I/O device
as a DP slave via an RS 485 IS coupler on the PROFIBUS DP RS 485 IS.
Basic knowledge required
This manual presumes a general knowledge in the field of automation engineering.
The following qualifications are also required:
Table 1 Qualified personnel
Activities Qualifications
Setting up the ET 200iSP ● Basic technical training
● Knowledge of safety regulations regarding the workplace
Wiring the ET 200iSP ● Basic practical training in electro-engineering
● Knowledge of the relevant electrotechnical safety
regulations
● Knowledge of methods of installing explosion-proof
electrical equipment
● Knowledge of safety regulations regarding the workplace
Commissioning the ET 200iSP ● Knowledge of all electrical and functional parameters and
properties of the ET 200iSP
● Knowledge of the functions and commissioning of
PROFIBUS-DP
● Knowledge of the connected encoders, actuators, and
HART field devices
● Knowledge of the safety regulations regarding the
workplace, particularly regarding procedures in hazardous
areas
Range of validity of this manual
This manual is valid for the distributed I/O station ET 200iSP.
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 3

Changes since with the previous edition
This manual contains the following changes/additions compared to the previous version:
● The terminal module TM-PS-UC can also be used for the PS DC 24V (as of ES07)
● The terminal modules TM-PS-A/B (DA10/DB10) can also be supplied as replacement parts
● The approvals have been updated.
Approvals
See section Standards and certifications (Page 195)
CE mark
See section Standards and certifications (Page 195)
Labeling for Australia (C-tick mark)
See section Standards and certifications (Page 195)
Standards
See section Standards and certifications (Page 195)
Position in the information landscape
In the section AUTOHOTSPOT you can find a list of additional information sources for SIMATIC
S7 and the ET 200 distributed I/O system.
Guide
This manual describes the hardware of the ET 200iSP distributed I/O station. It consists of
introductory sections and reference sections (technical specifications).
● Installing and wiring the ET 200iSP distributed I/O station
● Commissioning and diagnostics of the ET 200iSP distributed I/O station
● Components of the ET 200iSP distributed I/O station
● Order numbers
Special notes
The EC-type-examination certificate and EC certificate of conformity for the ET 200iSP
distributed I/O device are available from Service & Support on the Internet (http://
www.siemens.com/automation/service&support)
Preface
ET 200iSP
4Operating Instructions, 11/2017, A5E00247483-07

Recycling and disposal
Due to the fact that it is low in contaminants, the ET 200iSP distributed I/O station is recyclable.
For ecologically compatible recycling and disposal of your old device, contact a certificated
disposal service for electronic scrap.
Additional support
Please contact your local Siemens representative and offices if you have any questions about
the products described in this manual and do not find the right answers.
You will find information on who to contact on the Internet (http://www.siemens.com/
automation/partner)
A guide to the technical documentation for the various SIMATIC products and systems is
available on the Internet (http://www.siemens.de/simatic-tech-doku-portal)
The online catalog and the online ordering systems are available on the Internet.
Training Center
We offer a range of courses to help you get started with the ET 200iSP distributed I/O station
and the SIMATIC S7 automation system. For details, please contact your local Training Center
or the Central Training Center in Nuremberg, D -90327 Germany.
You can find additional information on the Internet (http://www.sitrain.com)
Technical support
You can contact the Technical Support for all the A&D products by means of the Web form
Internet (http://www.siemens.de/automation/support-request) for the support request.
You can find additional information about our Technical Support on the Web (http://
www.siemens.com/automation/service).
Service & Support on the Internet
In addition to our documentation pool, we offer our complete online knowledge base on the
Internet (http://www.siemens.com/automation/service&support).
There you will find:
● The newsletter, which constantly provides you with up-to-date information on your products.
● The documentation you need, by using our Service & Support search engine.
● A forum where users and experts from all over the world exchange experiences.
● Your local Automation & Drives representative.
● Information about on-site services, repairs, spare parts, and lots more.
Preface
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 5

Security information
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, solutions, machines, equipment and/or networks. They are
important components in a holistic industrial security concept. With this in mind, Siemens’
products and solutions undergo continuous development. Siemens recommends strongly that
you regularly check for product updates.
For the secure operation of Siemens products and solutions, it is necessary to take suitable
preventive action (e.g. cell protection concept) and integrate each component into a holistic,
state-of-the-art industrial security concept. Third-party products that may be in use should also
be considered. You can find more information about industrial security on the Internet (http://
www.siemens.com/industrialsecurity).
To stay informed about product updates as they occur, sign up for a product-specific
newsletter. You can find more information on the Internet (http://
support.automation.siemens.com).
Preface
ET 200iSP
6Operating Instructions, 11/2017, A5E00247483-07

Table of contents
Preface.........................................................................................................................................................3
1Product overview........................................................................................................................................13
1.1 Distributed I/O stations...........................................................................................................13
1.2 ET 200iSP Distributed I/O Station..........................................................................................14
1.3 ET 200iSP in the Hazardous Area.........................................................................................21
1.4 Figure Integration in the Control System...............................................................................24
2 Commissioning guideline............................................................................................................................27
2.1 Introduction............................................................................................................................27
2.2 Prerequisites..........................................................................................................................28
2.3 Materials and Tools Required to Set Up the Example...........................................................29
2.4 Overview of the Configuration................................................................................................30
2.5 Installing the the Sample Configuration.................................................................................31
2.5.1 Installing the ET 200iSP.........................................................................................................31
2.5.2 Installing the S7-400..............................................................................................................31
2.5.3 Installing the RS 485-IS Coupler............................................................................................31
2.6 Wiring the Sample Configuration...........................................................................................32
2.7 Inserting the interface module and the electronics modules..................................................34
2.8 Setting the PROFIBUS address.............................................................................................35
2.9 Configuring the Example........................................................................................................35
2.9.1 Configuring S7-400................................................................................................................35
2.9.2 Configuring and assigning parameters for the ET 200iSP.....................................................38
2.10 Programming the Sample Configuration................................................................................41
2.11 Putting the Example into Operation.......................................................................................41
2.12 Evaluating the diagnostics.....................................................................................................42
2.13 Removing and inserting of modules.......................................................................................42
2.14 Wire break of NAMUR encoder on digital input module.........................................................43
3 Configuration options..................................................................................................................................45
3.1 Modular system......................................................................................................................45
3.2 Electronics modules suitable for your application..................................................................46
3.3 Electronics modules suitable for the terminal modules..........................................................47
3.4 Configuration Options in Zones..............................................................................................48
3.5 Use of the ET 200iSP in category M2 of equipment-group I (mining) ...................................52
3.6 Restricted Number of Connectable Electronics Modules.......................................................52
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3.7 Maximum configuration of the ET 200iSP..............................................................................56
3.8 Power Supply of the ET 200iSP.............................................................................................57
3.9 Direct data exchange.............................................................................................................57
3.10 Identification data I&M............................................................................................................58
3.11 Redundancy of the Power Supply..........................................................................................60
3.12 System configuration in RUN (CiR)........................................................................................62
3.12.1 System modification in a non-redundant system...................................................................62
3.12.2 System modification in a redundant system...........................................................................63
3.13 Operating the ET200iSP with older CPUs.............................................................................65
3.14 Year of Production of the Module...........................................................................................66
3.15 Time stamping........................................................................................................................66
3.15.1 Fundamentals of Time Stamping...........................................................................................66
3.15.2 Time stamps accurate to 20 ms.............................................................................................67
3.15.3 Time synchronization with a flexible time interval..................................................................69
3.16 Counting.................................................................................................................................70
3.16.1 Properties...............................................................................................................................70
3.16.2 Principle of operation.............................................................................................................70
3.16.3 Configuring counters..............................................................................................................72
3.16.4 Assigning parameters to counters..........................................................................................75
3.17 Metering frequencies..............................................................................................................76
3.17.1 Properties...............................................................................................................................76
3.17.2 Principle of operation.............................................................................................................76
3.17.3 Configuring frequency meters................................................................................................77
3.17.4 Assigning parameters for the frequency meters....................................................................78
3.18 Redundancy with IM 152........................................................................................................79
3.18.1 Introduction............................................................................................................................79
3.18.2 Redundancy with S7 DP Masters..........................................................................................80
4 Installing.....................................................................................................................................................83
4.1 Installation rules.....................................................................................................................83
4.2 Installing the mounting rail.....................................................................................................91
4.3 Installing the terminal module for power supply PS...............................................................93
4.4 Installing Terminal Modules for the Interface Module and Electronics Modules....................96
4.5 Installing the Terminating Module and the Slot Cover...........................................................98
4.6 Installing the Slot Number Labels........................................................................................101
5 Wiring.......................................................................................................................................................103
5.1 General Rules and Regulations for Wiring...........................................................................103
5.2 Operating the ET 200iSP with equipotential bonding...........................................................105
5.3 Electrical Design of the ET 200iSP......................................................................................108
5.4 Wiring the ET 200iSP...........................................................................................................109
5.4.1 Wiring Rules for the ET 200iSP...........................................................................................109
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5.4.2 Wiring Terminal Modules with Screw Terminals..................................................................110
5.4.3 Wiring terminal modules with spring terminals.....................................................................110
5.4.4 Grounding the mounting rail.................................................................................................111
5.4.5 Wiring terminal module TM-PS-A/ TM‑PS-A UC or TM-PS-B/ TM-PS-B UC.......................112
5.4.6 Wiring Terminal Modules TM-IM/EM and TM-IM/IM............................................................114
5.4.7 Wiring Terminal Modules TM-EM/EM..................................................................................117
5.4.8 Wiring terminal module TM-RM/RM.....................................................................................119
5.4.9 Connecting cable shields.....................................................................................................120
5.4.10 How to Connect a TC Sensor Module..................................................................................122
5.5 Inserting and labeling the power supply, interface module, and electronic modules...........123
5.5.1 Requirements.......................................................................................................................123
5.5.2 Inserting power supply PS...................................................................................................124
5.5.3 Inserting and labeling the interface module and electronic modules...................................125
5.5.4 Inserting and labeling electronic modules 2 DO Relay UC60V/2A......................................128
5.6 Setting the PROFIBUS address...........................................................................................131
6 Commissioning and Diagnostics..............................................................................................................133
6.1 Basics of commissioning and diagnostics............................................................................133
6.2 Project engineering with STEP 7.........................................................................................136
6.3 Project Engineering with GSD File and SIMATIC PDM.......................................................137
6.4 Assigning Parameters for the ET 200iSP during Operation using SIMATIC PDM...............140
6.5 Diagnostics Using the Process Image Input Table..............................................................141
6.6 Status and error LEDs on the ET 200iSP............................................................................142
6.7 Commissioning and starting up the ET 200iSP....................................................................147
6.7.1 Safety Information................................................................................................................147
6.7.2 Requirements for commissioning.........................................................................................148
6.7.3 Commissioning the ET 200iSP............................................................................................148
6.7.4 Figure Starting up the ET 200iSP.......................................................................................150
6.7.5 Startup of the ET 200iSP with IM 152 redundancy..............................................................151
6.7.6 Startup for time synchronization / time stamping of signal changes....................................153
6.8 Diagnostics with STEP 7......................................................................................................154
6.8.1 Introduction..........................................................................................................................154
6.8.2 Reading out the diagnostics.................................................................................................154
6.8.3 Diagnostic messages of the electronic modules..................................................................155
6.8.4 Evaluating interrupts from the ET 200iSP (S7-DP slave/ DPV1 slave)................................157
6.8.5 Structure of the slave diagnostics........................................................................................159
6.8.6 Station statuses 1 to 3..........................................................................................................160
6.8.7 Master PROFIBUS address.................................................................................................162
6.8.8 Manufacturer's ID.................................................................................................................162
6.8.9 ID-related diagnostics..........................................................................................................163
6.8.10 Module Status......................................................................................................................164
6.8.11 Channel-related diagnostics.................................................................................................165
6.8.12 H-Status (only with the S7-400H and standard redundancy)...............................................170
6.8.13 Interrupts..............................................................................................................................171
6.8.14 Diagnostics for incorrect ET 200iSP configuration statuses................................................182
7 Maintenance.............................................................................................................................................185
7.1 Activities during operation....................................................................................................185
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7.2 Removing and inserting electronics modules during operation (hot swapping)...................186
7.3 Replacing the interface module............................................................................................188
7.4 Maintenance during operation..............................................................................................189
7.5 Cleaning...............................................................................................................................190
7.6 IM 152 firmware update.......................................................................................................191
7.7 Reading service data...........................................................................................................192
8 General technical specifications...............................................................................................................195
8.1 General technical specifications...........................................................................................195
8.2 Standards and certifications.................................................................................................195
8.3 Electromagnetic compatibility, transport and storage conditions.........................................198
8.4 Mechanical and climatic environmental conditions..............................................................200
8.5 Information on dielectric strength tests, class of protection, degree of protection and
rated voltage of the ET 200iSP............................................................................................201
9 Terminal modules.....................................................................................................................................203
9.1 Overview of the contents......................................................................................................203
9.2 Terminal module TM-PS-A/ TM‑PS-A UC and TM-PS-B/ TM-PS-B UC..............................204
9.3 Terminal modules TM-IM/EM 60S and TM-IM/EM 60C.......................................................207
9.4 Terminal module TM-IM/IM..................................................................................................210
9.5 Terminal modules TM-EM/EM 60S and TM-EM/EM 60C....................................................213
9.6 Terminal module TM-RM/RM...............................................................................................216
10 Power Supply...........................................................................................................................................221
10.1 Power supply PS 24 VDC....................................................................................................221
10.2 Power supply PS 120/230 VAC...........................................................................................224
11 Interface module.......................................................................................................................................227
11.1 Interface module IM 152......................................................................................................227
11.2 Parameters for the IM 152...................................................................................................230
11.3 Identification and Message Functions (I&M)........................................................................231
11.4 Description of the parameters for the IM 152.......................................................................231
11.4.1 Operation at Preset <> Actual Configuration.......................................................................231
11.4.2 Self-diagnostics....................................................................................................................232
11.4.3 Redundant power supply diagnostics..................................................................................232
11.4.4 Diagnostic interrupts............................................................................................................232
11.4.5 Hardware interrupts..............................................................................................................232
11.4.6 Time stamping / edge evaluation.........................................................................................233
11.4.7 Data format..........................................................................................................................233
11.4.8 Noise suppression................................................................................................................233
11.4.9 Temperature unit..................................................................................................................233
11.4.10 Slot reference junction/reference junction input...................................................................234
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12 Digital electronic modules.........................................................................................................................235
12.1 Digital electronics module 8 DI NAMUR..............................................................................235
12.2 Digital electronics module 4 DO...........................................................................................243
12.3 Digital electronic module 2 RO Relay UC60V/2A................................................................254
12.4 Identification and Message Functions (I&M)........................................................................259
12.5 Parameters of the digital electronic modules.......................................................................259
12.5.1 Digital electronic module 8 DI NAMUR................................................................................259
12.5.2 Digital electronic module 4 DO.............................................................................................262
12.5.3 Digital electronic module 2 DO Relay UC60V/2A................................................................263
12.6 Description of the parameters of the digital electronic modules...........................................263
12.6.1 Time stamping......................................................................................................................263
12.6.2 Pulse stretching....................................................................................................................263
12.6.3 Flutter monitoring.................................................................................................................265
12.6.4 Shutdown signal...................................................................................................................266
12.6.5 Parameters for counting.......................................................................................................266
12.6.6 Parameters for metering frequencies...................................................................................267
13 Analog electronic modules.......................................................................................................................269
13.1 Behavior of the analog modules during operation and in the event of problems.................269
13.2 Analog electronics module 4 AI I 2WIRE HART..................................................................270
13.3 Analog electronics module 4 AI I 4WIRE HART..................................................................274
13.4 Analog electronics module 4 AI RTD...................................................................................278
13.5 Analog electronics module 4 AI TC......................................................................................282
13.6 Analog electronics module 4AO I HART..............................................................................286
13.7 Identification and Message Functions (I&M)........................................................................290
13.8 Representation of analog values..........................................................................................291
13.8.1 Overview..............................................................................................................................291
13.8.2 Analog value representation for measuring ranges with SIMATIC S7.................................292
13.8.3 Measuring ranges of the analog input modules in S7 format...............................................293
13.8.4 Output ranges of the analog output modules in S7 format...................................................300
13.9 Fundamentals of analog value processing...........................................................................301
13.9.1 Wiring thermocouples..........................................................................................................301
13.10 Basics of HART....................................................................................................................306
13.10.1 Introduction..........................................................................................................................306
13.10.2 Properties of HART..............................................................................................................306
13.10.3 Principles of HART operation...............................................................................................306
13.10.4 Integration of HART field devices with ET 200iSP...............................................................308
13.10.5 Using HART.........................................................................................................................309
13.10.6 HART Fast Mode.................................................................................................................311
13.10.7 IEEE tags.............................................................................................................................312
13.10.8 HART data records..............................................................................................................315
13.11 Parameters of the analog electronic modules......................................................................317
13.11.1 Parameters for analog electronics modules 4 AI I 2WIRE HART, 4 AI I 4WIRE HART.......317
13.11.2 Parameters relevant for 4 AI RTD, 4 AI TC analog electronics modules.............................320
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13.11.3 Parameters for analog electronics module 4AO I HART......................................................321
13.12 Parameter description of the analog electronic modules.....................................................323
13.12.1 Reference junction / reference junction number..................................................................323
13.12.2 Smoothing............................................................................................................................323
13.12.3 Assigning the channel and IEEE tag....................................................................................324
13.12.4 HART repetitions..................................................................................................................326
13.12.5 HART Fast Mode.................................................................................................................326
13.12.6 HART warning......................................................................................................................327
13.12.7 HART diagnostics................................................................................................................327
14 Other modules..........................................................................................................................................329
14.1 Reserve module...................................................................................................................329
14.2 Watchdog module................................................................................................................330
A Appendix...................................................................................................................................................335
A.1 Order numbers.....................................................................................................................335
A.2 Dimensional drawings..........................................................................................................341
A.2.1 Dimensional drawings..........................................................................................................341
A.3 Reaction times.....................................................................................................................344
A.3.1 Reaction times.....................................................................................................................344
A.3.2 Response times at the DP master.......................................................................................344
A.3.3 Reaction times on the ET 200iSP........................................................................................345
A.3.4 Reaction times of digital input modules................................................................................345
A.3.5 Reaction times for the digital output modules......................................................................345
A.3.6 Reaction times for analog input modules.............................................................................345
A.3.7 Reaction times for analog output modules...........................................................................346
A.4 Address space of the inputs and outputs.............................................................................348
A.4.1 Digital input module..............................................................................................................348
A.4.2 Digital output module...........................................................................................................350
A.4.3 Digital output module 2 DO Relay UC60V/2A......................................................................351
A.4.4 Analog input modules...........................................................................................................351
A.4.5 Analog output modules........................................................................................................352
A.4.6 Analog input modules with HART (4 AI I 2WIRE HART, 4 AI I 4WIRE HART)....................353
A.4.7 Analog output module with HART (4 AO I HART)................................................................354
A.4.8 Watchdog module................................................................................................................355
A.5 Lightning and overvoltage protection...................................................................................355
A.5.1 Overview..............................................................................................................................355
A.5.2 Lightning protection zone concept.......................................................................................356
A.5.3 Rules for the interfaces between Lightning Protection Zones 0 and 1.................................359
A.5.4 Rules for the interfaces between lightning protection zones 1 and 2 and higher.................361
A.5.5 Application example for protection of ET 200iSP from overvoltages...................................362
Glossary...................................................................................................................................................365
Index.........................................................................................................................................................373
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ET 200iSP
12 Operating Instructions, 11/2017, A5E00247483-07

Product overview 1
1.1 Distributed I/O stations
Distributed I/O stations - Area of application
When a system is set up, it is common for the inputs to and outputs from the process to be
incorporated centrally in the automation system.
If the inputs/outputs are located at greater distances from the automation system, the wiring
can become very extensive and complex, and electromagnetic interferences can impair
reliability.
In such systems, it is often advisable to use distributed I/O stations:
● The controller CPU is located centrally.
● the I/O devices are distributed on site
● The powerful PROFIBUS DP with its high data transmission rates ensures smooth
communication between the controller CPU and the I/O devices.
● Less installation effort since less cables are required.
PROFIBUS DP
PROFIBUS DP is an open bus system based on
IEC 61784-1:2002 Ed1 CP 3/1 with the "DP"
transmission protocol (DP stands for distributed peripheral I/O).
Physically, PROFIBUS DP is either an electrical network based on a shielded two-wire cable
or an optical network based on a fiber-optic cable.
The "DP" protocol allows fast, cyclic data exchange between the control CPU and the
distributed I/O devices.
PROFIBUS RS 485-IS
In contrast to PROFIBUS DP, PROFIBUS DP RS 485-IS is intrinsically safe (protection type
- intrinsically safe i). The RS 485 IS coupler ensures intrinsic safety and acts as a safety barrier.
You can find addtional information on PROFIBUS RS 485-IS in the "PROFIBUS RS485‑IS
User and Installation Guideline (http://www.profibus.com)"
DP master and DP slaves
The link between the control CPU and the distributed I/O devices is the DP master. The DP
master exchanges data with the distributed I/O devices via PROFIBUS DP and monitors the
PROFIBUS DP.
The distributed I/O devices (= DP slaves) prepare the sensor and actuator data on-site so that
they can be transmitted to the controller CPU via PROFIBUS DP.
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 13

Devices that can be connected to PROFIBUS-DP devices
An extremely wide range of devices can be connected on the PROFIBUS DP as a DP master
or as DP slaves, provided their behavior complies with
IEC 61784-1:2002 Ed1 CP 3/1 . These
include the devices of the following product families:
● SIMATIC S7/M7/C7
● SIMATIC programming devices/PCs
● SIMATIC HMI (operator panel (OP), operator station (OS), and text display (TD) operator
control and monitoring devices)
● Distributed I/O stations
● Devices from other manufacturers
Structure of a PROFIBUS DP network
The figure below illustrates a typical PROFIBUS DP network structure. The DP master is
integrated in the relevant device, for example the S7-400 as a PROFIBUS DP interface. The
ET 200iSP distributed I/O stations are connected to the DP masters via PROFIBUS DP and
PROFIBUS RS 485-IS.
(7L63(7L63352),%8656,66(70352),%86'33*3&56,6&RXSOHU+D]DUGRXVDUHD=RQH+D]DUGRXVDUHD=RQH
Figure 1-1 Typical structure of a PROFIBUS DP network
1.2 ET 200iSP Distributed I/O Station
Definition
The ET 200iSP distributed I/O station is a highly modular and intrinsically safe DP slave with
degree of protection IP 30.
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
14 Operating Instructions, 11/2017, A5E00247483-07

Area of application
The ET 200iSP distributed I/O station can be operated in potentially explosive atmospheres
characterized by gas and dust:
Approval ET 200iSP Station* Inputs and outputs
ATEX
IECEx
Zone 1, Zone 21 up to Zone 0, Zone 20 **
Zone 2, Zone 22 up to Zone 0, Zone 20 **
* In combination with an appropriate enclosure
** for electronic module 2 DO Relay UC60V/2A: up to Zone 1, Zone 21
The ET 200iSP distributed I/O station can, of course, also be used in the safety area.
You can insert almost any combination of ET 200iSP I/O modules directly next to the interface
module that transfers the data to the DP master. This means you can adapt the configuration
to suit your on-site requirements.
Every ET 200iSP consists of a power supply module, an interface module, and a maximum of
32 electronic modules (for example, digital electronics modules). Remember not to exceed the
maximum current consumption.
Terminal modules and electronic modules
In principle, the ET 200iSP distributed I/O device consists of various passive terminal modules
onto which you plug the power supply and the electronic modules.
The ET 200iSP is connected to PROFIBUS RS 485-IS by means of a connector on terminal
module TM-IM/EM. Every ET 200iSP is a DP slave on the PROFIBUS RS 485‑IS.
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 15

View
The figure below shows an example of an ET 200iSP configuration.
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①Power supply PS
②Interface module IM 152
③Electronic modules
④Terminating module
⑤Terminal module TM-RM/RM
⑥TM-EM/EM terminal modules
⑦TM-IM/EM terminal module
⑧Terminal module TM-PS-A/ TM-PS-A UC
Figure 1-2 View of the ET 200iSP distributed I/O station
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
16 Operating Instructions, 11/2017, A5E00247483-07

Components of the ET 200iSP
The following table provides an overview of the most important components of the ET 200iSP.
Table 1-1 Components of the ET 200iSP
Component Function Image
Enclosure ...is an additional measure to further in‐
crease safety avoiding the production of
high temperatures, sparks and electric arcs.
Mounting rail ...is the rack for the ET 200iSP. You install
the ET 200iSP on the mounting rail.
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 17

Component Function Image
Terminal module ...carries the wiring and accommodates the
power supply module, interface module,
and the electronic modules. Terminal mod‐
ules are available in the following variants:
● TM-PS-A for the power supply PS 24
VDC
● TM-PS-B for the redundant power
supply PS 24 VDC
● TM-PS-A UC for the power supply
PS 120/230 VAC and PS 24 VDC
(Product version 7 and higher)
● TM-PS-B UC for the redundant
PS 120/230 VAC and PS 24 VDC
redundant power supply (Product
version 7 and higher)
● TM-IM/EM for the interface module
● TM-IM/IM for the redundant interface
module
● TM-EM/EM for the electronic modules
● TM-RM/RM for the electronic module
2DO Relay UC60V/2A
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Power supply PS ...is plugged into terminal module TM-PS-A /
TM‑PS-A UC or
TM-PS-B / TM-PS-B UC. The power supply
module supplies the electronic circuits and
sensors with voltage.
● PS 24 VDC power supply to TM-PS-A/
TM-PS-B
● Power supply PS 120/230 VAC and PS
24 VDC (as of product version 7) to
TM‑PS‑A UC/ TM-PS-B UC
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
18 Operating Instructions, 11/2017, A5E00247483-07

Component Function Image
Interface module ...is plugged onto the terminal module. The
interface module connects the ET 200iSP
with the DP master and conditions the data
for the inserted electronic modules.
Electronic module ...is inserted onto the terminal module and
determines the function:
● Digital electronic modules for NAMUR
sensors, digital output, relay module
● Analog electronic modules with current
and resistance measurement circuit,
thermoresistor and thermocouples,
analog output
● Reserve module
● Watchdog module
Terminating module ...completes the ET 200iSP.
RS 485-IS Coupler ...couples PROFIBUS DP to PROFIBUS RS
485-IS.
Labeling sheet (DIN A4,
perforated, foil)
...for machine labeling or printing
80 strips per labeling sheet
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
Operating Instructions, 11/2017, A5E00247483-07 19

Component Function Image
Slot number plates ...are used for identifying the slots on the
terminal module.
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PROFIBUS cable with bus
connector
...interconnects the PROFIBUS RS 485-IS
nodes or connects the RS 485-IS coupler to
ET 200iSP.
PROFIBUS connector RS 485-IS, including
switched terminating resistor
Features and benefits of the ET 200iSP
Table 1-2 Features and benefits
Properties Benefits
Structure
Modular structure based on 4- or 8-channel elec‐
tronic modules
● Station design optimized to contain costs
● Reduced configuration and documentation
effort
● Space savings due to the ability to string
modules together in any order
Extensive range of electronic modules Broad area of application
Permanent wiring due to the separation of me‐
chanical and electronic components
● Prewiring possible
● Hot swapping of modules while the ET 200iSP
is operating when at least two electronic
modules are present.
Integrated power bus Reduced effort required for wiring
Connection system
Screw or spring terminals Use of most suitable terminating technique
Intrinsically safe inputs and outputs complying with
Ex ia IIC
Intrinsically safe sensors, actuators and HART
field devices up to Zone 0/ 20 can be connected
Automatic coding of the I/O modules Quick and reliable module replacement
Large label Adequate space for clear identification
Disabling all digital outputs of a module by an in‐
trinsically safe switching signal
Control of the outputs independent of the process
image
Functionality
Changing parameter settings and expansion dur‐
ing operation
No restart of the ET 200iSP necessary
Time stamping, flutter monitoring, pulse stretch‐
ing
Efficient monitoring of the inputs
Counting and frequency measurement Options for use in technological applications
Identification data I&M Unique identification/assignment of the modules
used (for example, for validation, quality assur‐
ance)
Analog value display in S7 format
Product overview
1.2 ET 200iSP Distributed I/O Station
ET 200iSP
20 Operating Instructions, 11/2017, A5E00247483-07