Siemens simatic ET 200MP User guide

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ET 200MP Distributed I/O System
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SIMATIC
ET 200MP
ET 200MP Distributed I/O System
System Manual
01/2013
A5E03723484-01
Preface
Documentation guide
1
Product overview
2
Module overview
3
Application planning
4
Installation
5
Wiring
6
Configuring
7
Commissioning
8
Maintenance
9
Technical specifications
10
Dimension drawings
A
Accessories/spare parts
B
Service&Support
C

Siemens AG
Industry Sector
Postfach 48 48
90026 NÜRNBERG
GERMANY
A5E03723484-01
Ⓟ 02/2013 Technical data subject to change
Copyright © Siemens AG 2013.
All rights reserved
Legal information
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damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will
be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to
property damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions.
Qualified personnel are those who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended
or approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
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Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software
described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the
information in this publication is reviewed regularly and any necessary corrections are included in subsequent
editions.

ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 3
Preface
Purpose of the documentation
This documentation provides important information on configuring, installing, wiring and
commissioning the ET 200MP distributed I/O system.
Basic knowledge required
A basic knowledge of automation technology is required to understand the documentation.
Scope of validity of the documentation
This documentation applies to the ET 200MP distributed I/O system.
Conventions
Please also observe notes marked as follows:
Note
A note contains important information on the product, on the handling of the product and on
the section of the documentation to which particular attention should be paid.
Recycling and disposal
The products can be recycled due to their low pollutant content. For environmentally
compliant recycling and disposal of your electronic waste, please contact a company
certified for the disposal of electronic waste.
Additional support
● Information about the technical support available can be found in the appendix to this
documentation (Page 115).
● The range of technical documentation for the individual SIMATIC products and
automation systems can be found on the Internet (http://www.siemens.com/simatic-tech-
doku-portal).
● The online catalog and the online ordering system are available on the Internet
(http://mall.automation.siemens.com).

Preface
ET 200MP Distributed I/O System
4 System Manual, 01/2013, A5E03723484-01

ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 5
Table of contents
Preface ...................................................................................................................................................... 3
1 Documentation guide................................................................................................................................. 9
2 Product overview ..................................................................................................................................... 13
2.1 Distributed I/O – overview ............................................................................................................13
2.2 What is the ET 200MP distributed I/O system?...........................................................................15
2.3 Components.................................................................................................................................17
2.4 Properties.....................................................................................................................................20
3 Module overview...................................................................................................................................... 23
3.1 Interface modules ........................................................................................................................23
3.2 Digital input modules....................................................................................................................24
3.3 Digital output modules .................................................................................................................24
3.4 Analog input modules ..................................................................................................................26
3.5 Analog output modules ................................................................................................................27
3.6 Power supply modules.................................................................................................................27
3.7 Technology modules....................................................................................................................28
3.8 Communication modules .............................................................................................................29
4 Application planning................................................................................................................................. 31
4.1 Hardware configuration................................................................................................................31
4.2 Power budget calculation.............................................................................................................32
4.3 Setting up power segments .........................................................................................................36
5 Installation ............................................................................................................................................... 39
5.1 Basics...........................................................................................................................................39
5.2 Installing the mounting rail ...........................................................................................................41
5.3 Installing the power supply module..............................................................................................45
5.4 Installing the interface module .....................................................................................................46
5.5 Installing I/O modules ..................................................................................................................48
6 Wiring ...................................................................................................................................................... 51
6.1 Rules and regulations for operation.............................................................................................51
6.2 Operating the ET 200MP on grounded incoming supply.............................................................53
6.3 Electrical configuration of the ET 200MP.....................................................................................56
6.4 Wiring rules ..................................................................................................................................57

Table of contents
ET 200MP Distributed I/O System
6 System Manual, 01/2013, A5E03723484-01
6.5 Connecting supply voltage to the interface module .................................................................... 58
6.6 Connecting supply voltage to the power supply module............................................................. 59
6.7 Connecting PROFINET IO via the RJ45 bus connector to the interface module ....................... 61
6.8 Front connector for the I/O modules ........................................................................................... 63
6.8.1 Characteristics of the front connector ......................................................................................... 63
6.8.2 Wiring front connectors for I/O modules without shield contact element.................................... 64
6.8.3 Wiring front connectors for I/O modules with shield contact element......................................... 66
6.8.4 Bringing the front connector into final position............................................................................ 72
6.9 Marking the I/O modules............................................................................................................. 74
6.9.1 Labeling strips ............................................................................................................................. 74
6.9.2 Optional marking ......................................................................................................................... 75
7 Configuring .............................................................................................................................................. 77
7.1 Selection of the power supply (PS) module................................................................................ 77
7.2 Selection of the load power supply (PM) ....................................................................................78
8 Commissioning ........................................................................................................................................ 79
8.1 Commissioning the ET 200 MP .................................................................................................. 79
8.2 Startup of the ET 200MP............................................................................................................. 80
8.3 Identification data ........................................................................................................................ 81
8.3.1 Reading out and entering I&M data ............................................................................................ 81
8.3.2 Record structure for I&M data..................................................................................................... 82
8.4 Protection by locking the interface module .................................................................................84
9 Maintenance ............................................................................................................................................ 85
9.1 Removing and inserting I/O modules.......................................................................................... 85
9.2 Replacement of I/O modules and front connectors .................................................................... 86
9.2.1 Coding element on the I/O module and on the front connector.................................................. 86
9.2.2 Replacing an I/O module............................................................................................................. 88
9.2.3 Replacing a front connector ........................................................................................................ 89
9.3 Coding element on the power connector of the power supply module....................................... 90
9.4 Firmware update ......................................................................................................................... 92
9.5 Resetting interface module to factory settings............................................................................ 93
10 Technical specifications........................................................................................................................... 95
10.1 Standards and approvals ............................................................................................................ 95
10.2 Electromagnetic compatibility ................................................................................................... 100
10.3 Shipping and storage conditions............................................................................................... 102
10.4 Mechanical and climatic ambient conditions............................................................................. 103
10.5 Information on insulation, protection class, degree of protection and rated voltage ................ 105
10.6 Use of the ET 200MP in zone 2 potentially explosive atmospheres......................................... 106

Table of contents
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 7
A Dimension drawings .............................................................................................................................. 107
A.1 Dimension drawings of the mounting rails .................................................................................107
A.2 Dimension drawing of the shielding bracket ..............................................................................110
A.3 Dimension drawing of the shield clamp .....................................................................................111
A.4 Dimension drawing of the power supply element ......................................................................111
A.5 Dimension drawing of the labeling strip .....................................................................................112
B Accessories/spare parts ........................................................................................................................ 113
C Service&Support.................................................................................................................................... 115
Glossary ................................................................................................................................................ 119
Index...................................................................................................................................................... 123

Table of contents
ET 200MP Distributed I/O System
8 System Manual, 01/2013, A5E03723484-01

ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 9
Documentation guide 1
Introduction
This modular documentation of the SIMATIC products covers diverse topics concerning your
automation system.
The complete documentation for the ET 200MP distributed I/O system consists of a system
manual, function manuals, and product manuals.
The STEP 7 information system (Online Help) also helps you configure and program your
automation system.
Overview of the documentation provided for the ET 200MP distributed I/O system
The following tables list the documentation for the ET 200MP distributed I/O system.
Table 1- 1 System Manual for the ET 200MP distributed I/O system
Topic Documentation Most important contents
System
description
ET 200MP Distributed I/O System
(http://support.automation.siemens.com/WW
/view/en/59193214)
•Application planning
•Installation
•Wiring
•Commissioning
•Maintenance
Table 1- 2 Function Manuals for the ET 200MP distributed I/O system
Topic Documentation Most important contents
Analog value
processing
Analog value processing
(http://support.automation.siemens.com/WW
/view/en/59193559)
•Basics of analog technology
(wiring, processing, installation
technology), etc.
•Description/explanation of
meanings, e.g. conversion and
cycle time, basic and
operational limits, etc.
System
diagnostics
System diagnostics
(http://support.automation.siemens.com/WW
/view/en/59192926)
•Overview
•Diagnostic evaluation of
hardware/software

Documentation guide
ET 200MP Distributed I/O System
10 System Manual, 01/2013, A5E03723484-01
Topic Documentation Most important contents
Communication
(http://support.automation.siemens.com/WW
/view/en/59192925)
•Overview
PROFINET with STEP 7 V12
•PROFINET with STEP 7 V12
(http://support.automation.siemens.com/
WW/view/en/49948856)
Communication
PROFINET with STEP 7 V5.5
•PROFINET system description
(http://support.automation.siemens.com/
WW/view/en/19292127)
•From PROFIBUS DP to PROFINET IO
(http://support.automation.siemens.com/
WW/view/en/19289930)
•PROFINET basics
•PROFINET functions
•PROFINET diagnostics
Counting and
measuring
Counting and measuring
(http://support.automation.siemens.com/WW
/view/en/59709820)
•Counting and measuring
basics
Interference-free
installation of
control systems
Interference-free installation of control
systems
(http://support.automation.siemens.com/WW
/view/en/59193566)
•Basics
•Electromagnetic compatibility
•Lightning protection
•Housing selection
Cycle and
response times
Cycle and response times
(http://support.automation.siemens.com/WW
/view/en/59193558)
•Basics
•Calculations

Documentation guide
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 11
Table 1- 3 Product Manuals for the ET 200MP distributed I/O system
Topic Documentation Most important contents
Interface module Interface module
(http://support.automation.siemens.com/WW/vi
ew/en/59193106)
Digital modules DQ 32x24VDC/0.5A ST digital output module
(http://support.automation.siemens.com/WW/vi
ew/en/59193400)
DQ 16x24VDC/0.5A ST digital output module
(http://support.automation.siemens.com/WW/vi
ew/en/59193401)
DQ 8x230VAC/2A ST digital output module
(http://support.automation.siemens.com/WW/vi
ew/en/59193088)
DQ 8x230VAC/5A ST digital output module
(http://support.automation.siemens.com/WW/vi
ew/en/59192915)
DQ 8x24VDC/2A HF digital output module
(http://support.automation.siemens.com/WW/vi
ew/en/59193089)
DI 16x230VAC BA digital input module
(http://support.automation.siemens.com/WW/vi
ew/en/59193398)
DI 16x24VDC HF digital input module
(http://support.automation.siemens.com/WW/vi
ew/en/59193001)
DI 16x24VDC SRC BA digital input module
(http://support.automation.siemens.com/WW/vi
ew/en/59191844)
DI 32x24VDC HF digital input module
(http://support.automation.siemens.com/WW/vi
ew/en/59192896)
Analog modules AQ 8xU/I HS analog output module
(http://support.automation.siemens.com/WW/vi
ew/en/59193551)
AQ 4xU/I ST analog output module
(http://support.automation.siemens.com/WW/vi
ew/en/59191850)
AI 8xU/I HS analog input module
(http://support.automation.siemens.com/WW/vi
ew/en/59193206)
AI 8xU/I/RTD/TC ST analog input module
(http://support.automation.siemens.com/WW/vi
ew/en/59193205)
•Block diagram
•Wiring
•Parameters/address space
•Interrupts, diagnostic
messages, error and
system messages
•Technical specifications
•Dimension drawings

Documentation guide
ET 200MP Distributed I/O System
12 System Manual, 01/2013, A5E03723484-01
Topic Documentation Most important contents
System power
supply modules
Power supply module PS 25W 24V DC
(http://support.automation.siemens.com/WW/vi
ew/en/59193552)
Power supply module PS 60W 24/48/60V DC
(http://support.automation.siemens.com/WW/vi
ew/en/59192919)
Power supply module PS 60W 120/230V
AC/DC
(http://support.automation.siemens.com/WW/vi
ew/en/59193004)
Technology
modules
TM Count 2x24V technology module
(http://support.automation.siemens.com/WW/vi
ew/en/59193105)
TM PosInput 2 technology module
(http://support.automation.siemens.com/WW/vi
ew/en/61777657)
Communication
modules
CM PtP RS232 BA communication module
(http://support.automation.siemens.com/WW/vi
ew/en/59057152)
CM PtP RS232 HF communication module
(http://support.automation.siemens.com/WW/vi
ew/en/59057160)
CM PtP RS422/485 BA communication module
(http://support.automation.siemens.com/WW/vi
ew/en/59057390)
CM PtP RS422/485 HF communication module
(http://support.automation.siemens.com/WW/vi
ew/en/59061372)
SIMATIC manuals
The current manuals for SIMATIC products are available for download free of charge on the
Internet (http://www.siemens.com/automation/service&support).

ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 13
Product overview 2
2.1 Distributed I/O – overview
Distributed I/O systems – field of application
A plant configuration quite often features a process I/O configuration in a central automation
system.
When the inputs/outputs are far away from the automation system, wiring can become very
extensive and complex.
Distributed I/O systems are the perfect solution for such configurations.
● The master CPU is located centrally
● The I/O systems (inputs and outputs) work locally on a distributed basis.
What is PROFINET IO?
PROFINET IO is an open transmission system with real-time functionality defined in
accordance with the PROFINET standard. This standard defines a cross-manufacturer
communication, automation and engineering model.
Industrial-strength connections are available for wiring the PROFINET components.
● PROFINET discards the hierarchical PROFIBUS master/slave concept and deploys a
provider/consumer principle instead. The IO devices (e.g. the ET 200MP station) that will
be subscribed to by an IO controller (e.g by a SIMATIC S7-1500 CPU) are defined during
the configuration phase.
● The quantity structures are extended in accordance with the available quantities for
PROFINET IO. Parameter limits are not exceeded during configuration.
● The transmission rate is 100 Mbps.

Product overview
2.1 Distributed I/O – overview
ET 200MP Distributed I/O System
14 System Manual, 01/2013, A5E03723484-01
Configuration of a PROFINET IO network
The figure below illustrates a typical PROFINET IO network configuration. Existing
PROFIBUS slaves can be integrated using an IE/PB Link.
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Figure 2-1 Typical configuration of PROFINET IO
Note
ET 200MP modules can only be connected to the S7-1200 via GSD/GSDML.

Product overview
2.2 What is the ET 200MP distributed I/O system?
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 15
2.2 What is the ET 200MP distributed I/O system?
Introduction
The ET 200MP distributed I/O system is a scalable and highly flexible distributed I/O system
for connecting the process signals to a central controller via a fieldbus.
Field of application
The scalable design allows you to adapt your configuration exactly to the specific local
requirements.
The ET 200MP distributed I/O system is approved for IP 20 degree of protection and suitable
for installation in a control cabinet.
Installation
The ET 200MP distributed I/O system is mounted on a mounting rail (see chapter
Accessories/spare parts (Page 113)) and consists of:
● An optional power supply (PS) module before the interface module,
● An interface module that communicates with all IO controllers that behave in accordance
with the PROFINET standard IEC 61158
● Up to 30 modules after the interface module (including at most two power supply (PS)
modules).

Product overview
2.2 What is the ET 200MP distributed I/O system?
ET 200MP Distributed I/O System
16 System Manual, 01/2013, A5E03723484-01
Configuration example
The following figure shows a configuration example of the ET 200MP distributed I/O system.
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
① Interface module
② I/O module
③ I/O module
④ Power supply module
⑤ I/O module
⑥ I/O module
⑦ Mounting rail with integrated top-hat rail profile
Figure 2-2 Configuration example of the ET 200MP distributed I/O system

Product overview
2.3 Components
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 17
2.3 Components
Components of the ET 200MP distributed I/O system
The following table provides an overview of the most important components of the
ET 200MP:
Table 2- 1 Components of the ET 200MP
Components Function Diagram
Mounting rail The mounting rail is the rack of the ET 200MP. The ET 200MP is
installed on the mounting rail. Components after the EN 60715
(terminals, circuit breakers, small contactors or similar
components) can be mounted directly on the
integrated standard DIN rail in the lower part of the mounting rail.
The mounting rail allows a marginless installation.
The mounting rails may be ordered as accessories (Page 113).
Set of screws for grounding Set of screws for grounding the mounting rail
The set of screws is contained in the scope of delivery of the
mounting rails in the standard lengths, and may be ordered as an
accessory (Page 113).
U connector The modules of the ET 200MP are connected with the U
connector. The U connector provides the mechanical and
electrical connection between the modules.
The U connector is included in the scope of delivery of all
modules (exception: interface module) and may be ordered as a
spare part (Page 113).
Interface module for
PROFINET IO
The interface module connects the ET 200MP to the IO controller
and prepares the data for the assembled I/O modules.
The interface module contains an integrated power supply
module as a component of the system power supply, which
supplies the I/O modules via the backplane bus.

Product overview
2.3 Components
ET 200MP Distributed I/O System
18 System Manual, 01/2013, A5E03723484-01
Components Function Diagram
I/O module The I/O modules form the interface between the controller and
the process. The controller detects the current process state via
the connected sensors and actuators, and triggers the
corresponding reactions. I/O modules are classified into the
following types of modules:
•Digital input (DI)
•Digital output (DQ)
•Analog input (AI)
•Analog output (AQ)
•Technology module (TM)
•Communication module (CM)
System power supply
module
The power supply module (PS) is required if the power supplied
by the interface module is insufficient.
As a component of the system power supply, the power supply
module increases the output at the backplane bus, and thus
allows the use of additional modules; it serves exclusively for the
power supply of the I/O modules and the interface module. Power
supply modules are available in three models:
•PS 25W 24V DC
•PS 60W 24/48/60V DC
•PS 60W 120/230V AC/DC
A power cable connector with coding element is included in the
scope of delivery of the power supply module, and may be
ordered as a spare part (Page 113).
Front connector The front connector serves for the wiring of the I/O modules.
The front connector for analog modules must be supplemented
with a shielding bracket, power supply element, and shielding
clamp. These components are included in the scope of delivery of
the analog module, and may be ordered as accessories
(Page 113).
Four potential bridges and one cable tie are included in the scope
of delivery of the front connector.
Potential bridge for front
connector
With potential bridges, the provided supply voltage can be
bridged to the terminals on the opposite side (9 and 29, 10 and
30, 19 and 39, 20 and 40; only for digital modules with a
maximum rated voltage of 24 V DC). Voltage is present at these
terminals.
The potential bridges are included in the scope of delivery of the
front connector, and may be ordered as a spare part (Page 113).

Product overview
2.3 Components
ET 200MP Distributed I/O System
System Manual, 01/2013, A5E03723484-01 19
Components Function Diagram
Shielding bracket The shielding bracket is an insertable bracket for modules with
EMC-critical signals (e.g., analog modules, technology modules),
and (together with the shielding clamp) permits the low
impedance application of shielding with minimal installation times.
The shielding bracket is included in the scope of delivery of the
analog and technology modules, and may be ordered as an
accessory (Page 113).
Shield clamp The shield clamp is inserted on the shielding bracket, and serves
for overlaying cable shields on the shielding bracket.
The shield clamp is included in the scope of delivery of the
analog and technology modules, and may be ordered as an
accessory (Page 113).
Power supply element The power supply element is inserted in the front cable
connector, and serves to supply power to modules with EMC-
critical signals (analog modules, technology modules).
The power supply element (connection technology: screw
terminal) is included in the scope of delivery of the analog and
technology modules, and may be ordered as an accessory
(Page 113).
Labeling strips for the
exterior of the front cover of
the I/O modules
Labeling strips can be inserted for plant-specific labeling of the
modules. The labeling strips can be printed.
One labeling strip is included in the scope of delivery of the I/O
module. Additional labeling strips may be ordered as accessories
(Page 113).

Product overview
2.4 Properties
ET 200MP Distributed I/O System
20 System Manual, 01/2013, A5E03723484-01
2.4 Properties
Introduction
The most important properties of the ET 200MP are described in the following tables.
Properties of the configuration
Table 2- 2 Properties of the configuration
Properties of the configuration Explanation
Scalable configuration using 4, 8, 16, and 32-
channel I/O modules
•Function-oriented, cost-optimized station
design
•Significant reduction of configuration and
documentation effort
•Space-saving because modules can be
installed in any order
•Marginless installation on the mounting rail
Wide range of modules Universal and flexible area of application
Installation with U connectors •Fast and simple connection of the modules
•Simple extension of the system configuration
Implementation of up to three power segments Simple system expansion by plugging in up to
two additional power supply (PS) modules after
the interface module (in case of need)