Siemens SIMATIC EB 200P-3 Technical Document

Introduction 1
Security information 2
Repair 3
Product overview 4
Hardware structure 5
Connectors of the EB 200P‑3 6
Technical specifications 7
References A
Abbreviations B
SIMATIC
EB 200P-3
Evaluation Board for ERTEC
200P-3
Equipment Manual
06/2023
A5E52825940-AA

Siemens AG
Digital Industries
Postfach 48 48
90026 NÜRNBERG
GERMANY
A5E52825940-AA
Ⓟ 08/2023 Subject to change
Copyright © SiemensAG 2023.
All rights reserved
Legal information
Warning notice system
This manual contains notices you have to observe in order to ensure your personal safety, as well as to prevent
damage to property. The notices referring to your personal safety are highlighted in the manual by a safety alert
symbol, notices referring only to property damage have no safety alert symbol. These notices shown below are
graded according to the degree of danger.
DANGER
indicates that death or severe personal injury will result if proper precautions are not taken.
WARNING
indicates that death or severe personal injury may result if proper precautions are not taken.
CAUTION
indicates that minor personal injury can result if proper precautions are not taken.
NOTICE
indicates that property damage can result if proper precautions are not taken.
If more than one degree of danger is present, the warning notice representing the highest degree of danger will
be used. A notice warning of injury to persons with a safety alert symbol may also include a warning relating to
property damage.
Qualified Personnel
The product/system described in this documentation may be operated only by personnel qualified for the specific
task in accordance with the relevant documentation, in particular its warning notices and safety instructions.
Qualified personnel are those who, based on their training and experience, are capable of identifying risks and
avoiding potential hazards when working with these products/systems.
Proper use of Siemens products
Note the following:
WARNING
Siemens products may only be used for the applications described in the catalog and in the relevant technical
documentation. If products and components from other manufacturers are used, these must be recommended or
approved by Siemens. Proper transport, storage, installation, assembly, commissioning, operation and
maintenance are required to ensure that the products operate safely and without any problems. The permissible
ambient conditions must be complied with. The information in the relevant documentation must be observed.
Trademarks
All names identified by ® are registered trademarks of SiemensAG. The remaining trademarks in this publication
may be trademarks whose use by third parties for their own purposes could violate the rights of the owner.
Disclaimer of Liability
We have reviewed the contents of this publication to ensure consistency with the hardware and software
described. Since variance cannot be precluded entirely, we cannot guarantee full consistency. However, the
information in this publication is reviewed regularly and any necessary corrections are included in subsequent
editions.

1 Introduction........................................................................................................................................ 5
2 Security information........................................................................................................................... 7
2.1 Security information......................................................................................................... 7
2.2 General safety instructions................................................................................................ 7
3 Repair.................................................................................................................................................. 9
3.1 Repair Support.................................................................................................................. 9
4 Product overview................................................................................................................................ 10
4.1 Procedure when using the ASIC ERTEC 200P-3 to develop your own PROFINET device........ 12
4.2 Structure of the EB 200P-3................................................................................................ 12
4.3 Features of the EB 200P-3................................................................................................. 13
4.4 Block diagram of the EB 200P-3......................................................................................... 14
4.5 Function overview............................................................................................................ 15
5 Hardware structure............................................................................................................................. 16
5.1 ERTEC 200P-3................................................................................................................... 16
5.1.1 Boot modes of the EB 200P-3............................................................................................ 16
5.2 Memory on EB 200P-3...................................................................................................... 20
5.2.1 Memory hardware............................................................................................................ 20
5.2.2 Chip Select assignment..................................................................................................... 23
5.2.3 SDRAM............................................................................................................................. 24
5.2.4 Page-mode NOR flash....................................................................................................... 24
5.3 Test and debug peripherals............................................................................................... 25
5.3.1 ERTEC 200P-3 JTAG interface............................................................................................ 25
5.3.2 Status LEDs....................................................................................................................... 27
5.3.3 User GPIOs with LEDs and switches................................................................................... 29
5.4 Configuration................................................................................................................... 30
5.4.1 Installing/connecting........................................................................................................ 30
5.4.2 DIP switches..................................................................................................................... 32
5.4.3 Strapping pins.................................................................................................................. 35
5.5 Reset system of the EB 200P-3.......................................................................................... 36
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Table of contents

6 Connectors of the EB 200P‑3............................................................................................................... 40
6.1 Overview.......................................................................................................................... 40
6.2 PCI Express x1 Interface.................................................................................................... 43
6.3 Sync connector................................................................................................................. 45
6.4 USB Device Port - UART Interface....................................................................................... 46
6.5 Trace connector for ETM of ARM926EJ-S........................................................................... 47
6.6 JTAG connector for ICE or debugger.................................................................................. 48
6.7 Optical connection............................................................................................................ 49
7 Technical specifications...................................................................................................................... 50
7.1 General certifications........................................................................................................ 51
A References.......................................................................................................................................... 54
B Abbreviations..................................................................................................................................... 55
4
Table of contents
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Introduction 1
Target audience of this manual
This manual is intended for hardware (HW) developers who want to use the ERTEC 200P for
new products. You must have experience working with processors and designing embedded
systems, as well as knowledge of Ethernet.
The manual serves as a reference for software developers. Information on the structure (Page
12) and technical specifications (Page 51) of the EB 200P-3 is available as required for
software tests.
Intended operation
The EB 200P-3 evaluation board is a standard PCIe card for test and development to evaluate
the PROFINET functionality of the ERTEC 200P-3 ASIC for a variety of applications.
For operation, the EB 200P-3 card must be installed in a PC. Use is restricted to professionals
at research and development facilities.
NOTE
If the EB 200P-3 evaluation board is used in any other way than the above, it will lose UL
approval.
Technical support
The Support Team Technical provides information and support on development packages:
Siemens Sanayi ve Ticaret A.S.
Office Address:
Yakacik Caddesi No. 111
34870, Istanbul, Turkey
Email: (mailto:[email protected])
If you have questions regarding the use of the described blocks that are not addressed in the
documentation, you should send your written questions, comments, and suggestions
regarding the manual to the hotline through the appropriate e-mail address indicated below.
PROFINET certification
Comprehensive consulting prior to starting the development project is particularly important
for an efficient and successful development process. The final step in field device
development is certification. For PROFINET, Siemens also offers you independent, accredited
test laboratories like "ComDeC" in Germany, "PIC" in the USA, and "ITEI" in China, and "an
testlabs" in the Czech Republic.
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Germany and Europe
Siemens AG
Communication, Development & Certification (ComDeC)
Breslauer Strasse 5
90766 Fürth, Germany
Tel.: [phone]
E-mail: (mailto:[email protected])
Web: (https://www.siemens.com/comdec)
Europe
An testlabs
Siemensnova 1
155 00, Praha 13, Czech Republic
Tel: [phone]
Email: (mailto:[email protected])
Web: (https://new.siemens.com/cz/cs/products/sluzby-a-servis/an-testlabs.html)
USA
PROFI Interface Center (PIC)
One Internet Plaza
P.O. Box 4991
Johnson City, TN 37602-4991, USA
Tel.: [phone]
E-mail: (mailto:[email protected])
Web: (https://www.profiinterfacecenter.com)
China
Siemens Ltd., China
Factory Automation Department
7, Wang Jing Zhong Huan Nan Lu, Chaoyang District, Beijing 100102, PR. China
E-mail: (mailto:[email protected])
See also
JTAG connector for ICE or debugger (Page 48)
Reset system of the EB 200P-3 (Page 36)
Introduction (Page 5)
Security information (Page 7)
Product overview (Page 10)
Hardware structure (Page 16)
Connectors of the EB 200P‑3 (Page 40)
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Introduction

Security information 2
2.1 Security information
Siemens provides products and solutions with industrial security functions that support the
secure operation of plants, systems, machines and networks.
In order to protect plants, systems, machines and networks against cyber threats, it is
necessary to implement – and continuously maintain – a holistic, state-of-the-art industrial
security concept. Siemens’ products and solutions constitute one element of such a concept.
Customers are responsible for preventing unauthorized access to their plants, systems,
machines and networks. Such systems, machines and components should only be connected
to an enterprise network or the internet if and to the extent such a connection is necessary
and only when appropriate security measures (e.g. firewalls and/or network segmentation)
are in place.
For additional information on industrial security measures that may be implemented, please
visit (https://www.siemens.com/industrialsecurity).
Siemens' products and solutions undergo continuous development to make them more
secure. Siemens strongly recommends that product updates are applied as soon as they are
available and that the latest product versions are used. Use of product versions that are no
longer supported, and failure to apply the latest updates may increase customers' exposure to
cyber threats.
To stay informed about product updates, subscribe to the Siemens Industrial Security RSS
Feed visit (https://www.siemens.com/cert).
2.2 General safety instructions
ESD guidelines
Modules containing electrostatic sensitive devices (ESDs) can be identified by the following
label:
Figure 2-1ESD
Strictly follow the guidelines mentioned below when handling modules which are sensitive to
ESD:
•Before working with modules with ESD, you need to ensure that you are free of
electrostatic charge (e.g. by touching a grounded object).
•All devices and tools must be free of static charge.
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•Always pull the mains connector and disconnect the battery before installing or removing
modules which are sensitive to ESD.
•Handle modules fitted with ESDs only by their edges.
•Do not touch any connector pins or conductors on modules containing ESDs.
Hot surface guidelines
Safety Symbol 13, IEC 60417-5041 (2002-10)
Warning of hot surface
The Warning Hot Surface sign warns the user that hot surfaces are present and that contact
with these hot surfaces should be avoided in order to prevent personal injury.
Warning
Safety Symbol 14, ISO 7000-0434B (2004-01)
Warning
The equipment is designed for operation with Safety Extra-Low Voltage (SELV) or Protective
Extra-Low Voltage (PELV). This indicates an electrical circuit in which the voltage cannot
exceed 30 VAC (RMS), 42.4 VAC peak or 60 VDC under NORMAL CONDITIONS and
CONDITIONS OF A SINGLE FAULT, including ground faults in other circuits.
Recycling and disposal guidelines
Figure 2-2WEEE
For environmentally friendly recycling and disposal of your old equipment, contact a certified
electronic waste disposal company and dispose of the equipment according to the applicable
regulations in your country.
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Security information
2.2 General safety instructions

Repair 3
3.1 Repair Support
The Siemens Support Team provides technical information and support on development
packages:
Siemens Sanayi ve Ticaret A.S.
Office Address:
Yakacik Caddesi No. 111
34870, Istanbul, Turkey
Email: (mailto:[email protected])
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Product overview 4
This manual describes the procedure for using the ERTEC200P‑3 for HW development of a
PROFINETdevice and the properties of the EB200P‑3 evaluation board.
The intended use of the EB200P‑3 is as follows:
•It serves as a template for development of your own PROFINET device hardware.
•It supports development and testing of your own PROFINET device application software.
•It enables testing of your hardware on a supplementary board together with the
EB200P‑3, where applicable.
Figure 4-1EB 200P-3 Board Connections

Figure 4-2EB 200P-3 Front View
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Product overview
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4.1 Procedure when using the ASIC ERTEC 200P-3 to develop your
own PROFINET device
Developing your own PROFINET device
You will find general information, current product information, and downloads regarding
PROFINET Device Development Kit for ERTEC 200P on the Internet
(https://support.industry.siemens.com/cs/ww/en/view/109812804).
There are also examples for the EB 200P-3 board available.
Procedure
You can use the ASIC ERTEC200P‑3 to develop your own hardware in one of two ways:
•By using an own developed test board on the EB200P‑3 to adapt and test your application
circuit
•By using the ASIC ERTEC200P‑3 directly to develop and test your complete target
hardware
Debug interfaces for commissioning and testing
You should make provision on your hardware for connectors to the JTAG interface and, if
possible, to the Universal Asynchronous Receiver-Transmitter (UART) of the ERTEC200P‑3 to
facilitate commissioning.
4.2 Structure of the EB 200P-3
Overview
The EB200P‑3 is implemented in the form of a half-size PCIe card. The PCIe interface is used
only to provide power (+12V, +3.3V) to the board. In standard configuration, the EB200P‑3 is
plugged into the PCIe slot of an industrial PC at connector X2700.
See also
JTAG connector for ICE or debugger (Page 48)
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Product overview
4.2 Structure of the EB 200P-3

4.3 Features of the EB 200P-3
In addition to the ERTEC200P‑3 with its integrated function groups, the following elements
are available on the EB200P‑3:
•PC front panel element
–2 RJ45 PROFINET sockets with integrated magnetics, with a POF assembly option
–2 RJ45 TAP sockets for debugging purposes during development for the MDI port
–2 LEDs Link and Activity per RJ45 socket
–4 LEDs for additional PROFINET status indicators
–BNC connector for PLL Sync signal
•I2C EEPROM
•SPI Flash memory
•Debug and trace interface for ARM926EJ-S Microcontroller
•USB Virtual serial interface for monitoring
•Configuration and boot modes can be set by DIP-Switches
•Various operating modes of the EB200P‑3 can be set by DIP-Switches
•Various connectors for external wiring
LPSDRAM: 512Mbits / 64Mbytes, PC133 (125MHz), 32-bit data bus, 1.8 V signaling
QSPI Flash
memory:
128MBits / 16Mbytes, maximum supported clock frequency in DTR QUAD
mode is 62.5MHz
For information concerning the function of the onboard ASIC, refer to the "ERTEC 200P-3 data
sheet" or the "ERTEC 200P-3 manual".
13
Product overview
4.3 Features of the EB 200P-3
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4.4 Block diagram of the EB 200P-3
Block diagram
(1*01*/)FBEFST"3.5SBDF.JDUPS"3.53"$&$POOFDUPST4JMJDPO$-,4PVSDF1PXFS4VQQMJFT1$MFDPOOFDUPS3FTFU(FOFSBUJPO+5"(QJOIFBEFS/PUNPVOUFEPO1$#64#$/03'MBTICJUYCJU4%3".CJUCJU(1*0<>7777.)[773+5"1593+5"1393+3+$&&130.41*&&130.2VBE41*'MBTI6"3564#9)*'$$41*41*2VBE41*6"356"3564#.%*.%*&.$(1*0T0DUBM41*1):1):04$&35&$1
Figure 4-3Block Diagram of the EB200P‑3
NOTE
NOR-Flash memory chips are not populated on the EB 200P-3 board.
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Product overview
4.4 Block diagram of the EB 200P-3

4.5 Function overview
Refer to documents /1/ and /2/ (Page 54) for a detailed function description of the
ERTEC200P‑3.
You can find descriptions of the hardware structure, operating modes, and connectors of the
EB 200P-3, as well as a block diagram.
15
Product overview
4.5 Function overview
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Hardware structure 5
5.1 ERTEC 200P-3
5.1.1 Boot modes of the EB 200P-3
You can set various boot modes on the EB200P‑3 by means of the DIP switch S2602. See
"Strapping Pins" (Page 35).
GPIO configurations
The GPIO interface of the ERTEC200P‑3 consists of 96 I/O that can be configured for different
functionalities. They are available on three 2x20-pin 2.54mm pitch pin headers type Samtec
TSM-120-01-T-DV-P-TR. GPIO[0-31] supports 3V3 only, GPIO[32-96] supports 1V8 and 3V3
voltage level and are shared with the XHIF interface.
The pin-header has the following pin assignment:
Signal Pin Pin Signal
P3V3 1 2 P3V3
GND 3 4 GND
GPIO[0] 5 6 GPIO[1]
GPIO[2] 7 8 GPIO[3]
GPIO[4] 9 10 GPIO[5]
GPIO[6] 11 12 GPIO[7]
GPIO[8] 13 14 GPIO[9]
GPIO[10] 15 16 GPIO[11]
GPIO[12] 17 18 GPIO[13]
GPIO[14] 19 20 GPIO[15]
GND 21 22 GND
GPIO[16] 23 24 GPIO[17]
GPIO[18] 25 26 GPIO[19]
GPIO[20] 27 28 GPIO[21]
GPIO[22] 29 30 GPIO[23]
GPIO[24] 31 32 GPIO[25]
GPIO[26] 33 34 GPIO[27]
GPIO[28] 35 36 GPIO[29]
GPIO[30] 37 38 GPIO[31]
GND 39 40 GND
X2400 Pin header for GPIOs [0-31]

Signal Pin Pin Signal
P3V3 1 2 P3V3
GND 3 4 GND
GPIO[32] 5 6 GPIO[33]
GPIO[34] 7 8 GPIO[35]
GPIO[36] 9 10 GPIO[37]
GPIO[38] 11 12 GPIO[39]
GPIO[40] 13 14 GPIO[41]
GPIO[42] 15 16 GPIO[43]
GPIO[44] 17 18 GPIO[45]
GPIO[46] 19 20 GPIO[47]
P1V8 21 22 P1V8
GPIO[48] 23 24 GPIO[49]
GPIO[50] 25 26 GPIO[51]
GPIO[52] 27 28 GPIO[53]
GPIO[54] 29 30 GPIO[55]
GPIO[56] 31 32 GPIO[57]
GPIO[58] 33 34 GPIO[59]
GPIO[60] 35 36 GPIO[61]
GPIO[62] 37 38 GPIO[63]
GND 39 40 GND
X2401 Pin header for GPIOs [32-63]
Signal Pin Pin Signal
P3V3 1 2 P3V3
GND 3 4 GND
GPIO[64] 5 6 GPIO[65]
GPIO[66] 7 8 GPIO[67]
GPIO[68] 9 10 GPIO[69]
GPIO[70] 11 12 GPIO[71]
GPIO[72] 13 14 GPIO[73]
GPIO[74] 15 16 GPIO[75]
GPIO[76] 17 18 GPIO[77]
GPIO[78] 19 20 GPIO[79]
P1V8 21 22 GND
GPIO[80] 23 24 GPIO[81]
GPIO[82] 25 26 GPIO[83]
GPIO[84] 27 28 GPIO[85]
GPIO[86] 29 30 GPIO[87]
X2402 Pin header for GPIOs [64-95]
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Hardware structure
5.1 ERTEC 200P-3
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Equipment Manual, 06/2023, A5E52825940-AA

Signal Pin Pin Signal
GPIO[88] 31 32 GPIO[89]
GPIO[90] 33 34 GPIO[91]
GPIO[92] 35 36 GPIO[93]
GPIO[94] 37 38 GPIO[95]
GND 39 40 GND
X2402 Pin header for GPIOs [64-95]
Overview of GPIO functions
The following table lists all connections to the GPIO pins made to onboard devices. If more
are connected on the board, you must ensure that at most one function is enabled.
GPIO Connections, functions on the board in GPIO mode Section
GPIO[0] Sync (BNC) / UserGPIO[0] - Green LED
GPIO[1] UserGPIO[1] - Green LED
GPIO[2] TRACE_DBGRQ / PN1 Signal Detect / UserGPIO[2] - Green LED
GPIO[3] TRACE_DBACK / PN2 Signal Detect / UserGPIO[3] - Green LED
GPIO[4] PN1 I2C_SDA / UserGPIO[4] - Green LED
GPIO[5] PN1 I2C_SCL / UserGPIO[5] - Green LED
GPIO[6] PN2 I2C_SDA / UserGPIO[6] - Green LED
GPIO[7] PN2 I2C_SCL / UserGPIO[7] - Green LED
GPIO[8] FPGA ERTEC_INT / UserGPIO[8] - Red LED
GPIO[9] Sync (BNC) / UserGPIO[9] - Red LED
GPIO[10] ONFI NAND - R/Bn signal, FPGA
GPIO[11] UserGPIO[10] - Red LED, FPGA
GPIO[12] UART2 CTS, FPGA
GPIO[13] UART2 RTS
GPIO[14] UART2 RXD / EEPROM I2C_SCL
GPIO[15] UART2 TXD / EEPROM I2C_SDA
GPIO[16] UserGPIO[11] - Red LED
GPIO[17] UserGPIO[12] - Red LED
GPIO[18] UserGPIO[13] - Red LED
GPIO[19] UserGPIO[14] - Red LED, FPGA
GPIO[20] MAINT LED, FPGA
GPIO[21] PCB Diagnostic LED, FPGA
GPIO[22] PCB F0-1 LED, FPGA
GPIO[23] UserGPIO[15] - Red LED
GPIO[24] SPI SCLK - SPI Flash
GPIO[25] ERROR (Bus Fail) LED
GPIO[26] SPI DQ0 (MOSI) - SPI Flash
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Hardware structure
5.1 ERTEC 200P-3

GPIO Connections, functions on the board in GPIO mode Section
GPIO[27] SPI DQ1 (MISO) - SPI Flash
GPIO[28] PCB PROFIenergy LED
GPIO[29] Sync (Run) LED, FPGA
GPIO[30] PCB FO-0 LED
GPIO[31] SPI CS# - SPI Flash
Overview of GPIO[32-96] functions
GPIO Connections, func
tions on the board
except XHIF - GPIO
mode
Section Connections, functions
on the board except
XHIF - GPIOX modue
Section
XHIF_A1 (GPIO[32]) OCTAL_SPI_SS_N 11 OCTAL_SPI_SS_N 15
XHIF_A2 (GPIO[33]) OCTAL_SPI_SCK 11 OCTAL_SPI_SCK 15
XHIF_A3 (GPIO[34]) OCTAL_SPI_DQS 11 OCTAL_SPI_DQS 15
XHIF_A4 (GPIO[35]) PIPESTAT0 11 OCTAL_SPI_DQ[0] 15
XHIF_A5 (GPIO[36]) PIPESTAT1 11 OCTAL_SPI_DQ[1] 15
XHIF_A6 (GPIO[37]) PIPESTAT2 11 OCTAL_SPI_DQ[2] 15
XHIF_A7 (GPIO[38]) TRACEPKT0 11 OCTAL_SPI_DQ[3] 15
XHIF_A8 (GPIO[39]) TRACEPKT1 11
XHIF_A9 (GPIO[40]) TRACEPKT2 11
XHIF_A10
(GPIO[41])
TRACEPKT3 11
XHIF_A11
(GPIO[42])
TRACEPKT4 11
XHIF_A12
(GPIO[43])
TRACEPKT5 11
XHIF_A13
(GPIO[44])
TRACEPKT6 11
XHIF_A14
(GPIO[45])
TRACEPKT7 11
XHIF_A15
(GPIO[46])
TRACEPKT8 11
XHIF_A16
(GPIO[47])
TRACEPKT9 11
XHIF_A17
(GPIO[48])
TRACEPKT10 11
XHIF_A18
(GPIO[49])
TRACEPKT11 11
XHIF_A19
(GPIO[50])
TRACEPKT12 11
XHIF_SEG_2
(GPIO[51])
TRACEPKT13 11
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Hardware structure
5.1 ERTEC 200P-3
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GPIO Connections, func
tions on the board
except XHIF - GPIO
mode
Section Connections, functions
on the board except
XHIF - GPIOX modue
Section
XHIF_SEG_0
(GPIO[52])
TRACEPKT14 11
XHIF_SEG_1
(GPIO[53])
TRACEPKT15 11
XHIF_RDY
(GPIO[54])
TRACECLK 11
XHIF_D2 (GPIO[66])
Other (no special function
on the board)
5.2 Memory on EB 200P-3
5.2.1 Memory hardware
LPSDRAM
The LPSDRAM interface connects to one memory device, the Micron MT48H16M32LFB5-6
IT:C.
• 64-Mbyte memory capacity
• 32-bit data width
• PC133 SDRAM-compatible (125 MHz is used with ERTEC 200P-3), 1.8 V signaling interface
You can find the LPSDRAM memory device under reference D1900 in the schematics diagram.
QSPI Flash memory (bootable)
You can assemble the EB 200P-3 with QuadSPI memory using one of the following two types
of devices:
•Micron: MT25QL128ABB1ESE-0AUT
•Winbond: W25Q128JVSJM
Due to signal integrity and long distances between QSPI and FPGA, the bus driver separates
the shared XHIF and QSPI signals and disables shared XHIF signals when QSPI is active. The
QSPI Flash memory is the recommended boot device on the EB 200P-3.
You can find the QSPI Flash memory device under the reference D2104 in the schematics
diagram.
QSPI
Device
pin#
Pin
Name
Direction (Memory view) ERTEC Signal
1CS# Input GPIO[32] OctalSPI_SS_N, Pull-up 10K to P3V3
2DO / DQ1 Input / Output GPIO[36] OctalSPI_DQ(1), Pull-up 10K to P3V3
3WP / DQ2 Input / Output GPIO[37] OctalSPI_DQ(2), Pull-up 10K to P3V3
QuadSPI signal connection
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Hardware structure
5.2 Memory on EB 200P-3