Sony XDCAM PMW-160 User manual

SOLID-STATE MEMORY CAMCORDER
PMW-160
PMW-150
PMW-EX260
SERVICE MANUAL
1st Edition

警告
このマニュアルは， サービス専用です。
お客様が， このマニュアルに記載された設置や保守， 点検， 修理などを行うと感電や火災，
人身事故につながることがあります。
危険をさけるため， サービストレーニングを受けた技術者のみご使用ください。
WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
WARNING
When installing the unit, incorporate a readily accessible
disconnect device in thefixed wiring, or connect the
power cord to a socket-outlet which must be provided
near the unit and easily accessible, so that the user can
turn off the power in case a fault should occur.
WARNUNG
Beim Einbau des Geräts ist daher im Festkabel ein leicht
zugänglicher Unterbrecher einzufügen, oder das Netzka-
bel muß mit einer in der Nähe des Geräts befindlichen,
leicht zugänglichen Wandsteckdose verbunden werden,
damit sich bei einer Funktionsstörung die Stromversor-
gung zum Gerät jederzeit unterbrechen läßt.
警告
万一，異常が起きた際に，お客様が電源をきることがで
きるように，設置の際には，機器近くの固定配線内に専
用遮断装置を設けるか，機器使用中に，容易に抜き差し
できるコンセントに電源プラグを接続してください。
PMW-160/PMW-150/PMW-EX260

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type rec-
ommended by the manufacturer.
When you dispose of the battery, you must obey the
law in the relative area or country.
ATTENTION
Il y a danger d’explosion s’il y a remplacement incor-
rect de la batterie. Remplacer uniquement avec
une batterie du même type ou d’un type équivalent
recommandé par le constructeur.
Lorsque vous mettez la batterie au rebut, vous devez
respecter la législation en vigueur dans le pays ou la
région où vous vous trouvez.
VORSICHT
Explosionsgefahr bei Verwendung falscher Batterien.
Batterien nur durch den vom Hersteller empfohlenen
oder einen gleichwertigen Typ ersetzen.
Wenn Sie die Batterie entsorgen, müssen Sie die
Gesetze der jeweiligen Region und des jeweiligen
Landes befolgen.
注意
指定以外の電池に交換すると，破裂する危険があります。
必ず指定の電池に交換してください。
使用済みの電池は，国または地域の法令に従って
処理してください。
FÖRSIKTIGHET!
Fara för explosion vid felaktigt placerat batteri.
Byt endast mot samma eller likvärdig typ av batteri,
enligt tillverkarens rekommendationer.
När du kasserar batteriet ska du följa rådande lagar
för regionen eller landet.
PAS PÅ
Fare for eksplosion, hvis batteriet ikke udskiftes
korrekt.
Udskift kun med et batteri af samme eller tilsvarende
type, som er anbefalet af fabrikanten.
Når du bortskaffer batteriet, skal du følge
lovgivningen i det pågældende område eller land.
HUOMIO
Räjähdysvaara, jos akku vaihdetaan virheellisesti.
Vaihda vain samanlaiseen tai vastaavantyyppiseen,
valmistajan suosittelemaan akkuun.
Noudata akun hävittämisessä oman maasi tai
alueesi lakeja.
FORSIKTIG
Eksplosjonsfare hvis feil type batteri settes i.
Bytt ut kun med samme type eller tilsvarende
anbefalt av produsenten.
Kasser batteriet i henhold til gjeldende avfallsregler.
⊼ᛣ
⊼ᛣ
བᵰ᳈ᤶⱘ⬉∴ϡℷ⹂ˈህӮ᳝⟚⚌ⱘ䰽DŽ
া᳈ᤶৠϔ㉏ൟ៪ࠊ䗴ଚ᥼㤤ⱘ⬉∴ൟোDŽ
໘⧚⬉∴ᯊˈᖙ乏䙉ᅜⳌ݇ഄ៪೑ᆊⱘ⊩ᕟDŽ
PMW-160/PMW-150/PMW-EX260

Table of Contents
Manual Structure
Purpose of this manual....................................................................................................................5
Related manual............................................................................................................................5
1. Service Overview
1-1. External Connectors...........................................................................................................1-1
1-1-1. Connector Input/Output Signals........................................................................................1-1
1-2. Location of Printed Wiring Boards............................................................................................1-4
1-3. Circuit Description............................................................................................................1-5
1-3-1. CMOS Block and Lens Block..........................................................................................1-5
1-3-2. Camera Block System..................................................................................................1-6
1-3-3. Video Signal System...................................................................................................1-6
1-3-4. Media Recording/Playback System....................................................................................1-7
1-3-5. Audio System...........................................................................................................1-8
1-3-6. System Control.........................................................................................................1-9
1-3-7. Power Supply System.................................................................................................1-10
1-4. Service Tools/Measuring Equipment List...................................................................................1-12
1-4-1. Service Tools..........................................................................................................1-12
1-4-2. Measuring Equipment.................................................................................................1-12
1-5. Firmware Upgrade...........................................................................................................1-13
1-6. Circuit Protection Parts......................................................................................................1-14
1-6-1. Circuit Protection Element............................................................................................1-14
1-6-2. Replacing Fuses and IC Links.........................................................................................1-14
1-7. Notes on Service.............................................................................................................1-15
1-7-1. Actions to Be Taken when Replacing Parts and Boards..............................................................1-15
1-7-2. Actions to Be Taken when the Lens Has Been Replaced.............................................................1-15
1-7-3. Notes on Replacing Onboard Parts....................................................................................1-15
1-7-4. Backup Battery........................................................................................................1-15
1-8. Flexible Card Wire and Fine-Wire Coaxial Cable...........................................................................1-16
1-8-1. Disconnecting/Connecting Flexible Card Wire.......................................................................1-16
1-8-2. Disconnecting/Connecting Fine-Wire Coaxial Cable.................................................................1-16
1-9. Lead-free Solder.............................................................................................................1-19
2. Replacement of Main Parts
2-1. Outline of Replacement Procedure............................................................................................2-1
2-2. Lithium Battery................................................................................................................2-2
2-3. Bottom Cover and Tripod Washer............................................................................................2-3
2-4. Inside Panel....................................................................................................................2-4
2-4-1. Inside Panel Assembly..................................................................................................2-4
2-4-2. SW-1577/SW-1578/SW-1579 Board...................................................................................2-4
2-4-3. SxS Lid Assembly......................................................................................................2-6
2-4-4. AU Cover Sub Assembly...............................................................................................2-7
2-5. Outside Panel..................................................................................................................2-9
2-5-1. Outside Panel Assembly................................................................................................2-9
2-5-2. Zoom Seesaw Assembly................................................................................................2-9
2-5-3. IO-254 Board..........................................................................................................2-11
PMW-160/PMW-150/PMW-EX260 1

2-6. Top Panel Assembly.........................................................................................................2-12
2-7. SxS Slot......................................................................................................................2-13
2-7-1. SxS Slot Assembly....................................................................................................2-13
2-7-2. AU Volume Block.....................................................................................................2-14
2-7-3. SWC-54 Board/EC-75 Board.........................................................................................2-14
2-8. Front Panel...................................................................................................................2-16
2-8-1. Front Panel Assembly.................................................................................................2-16
2-8-2. SW-1558/SW-1559/SW-1580 Board .................................................................................2-17
2-9. Rear Panel Assembly........................................................................................................2-18
2-10. IFC-13 Board................................................................................................................2-19
2-11. IO-255 Board................................................................................................................2-20
2-12. DCP-61 Board...............................................................................................................2-22
2-13. Handle........................................................................................................................2-24
2-13-1. Handle Assembly......................................................................................................2-24
2-13-2. Control Switch Block (GZ92000).....................................................................................2-25
2-13-3. MIC Unit..............................................................................................................2-25
2-13-4. EVF Case Assembly..................................................................................................2-27
2-13-5. LCD Assembly........................................................................................................2-28
2-13-6. DET-55 Board.........................................................................................................2-29
2-13-7. LCD Panel.............................................................................................................2-30
2-13-8. DR-670 Board/RM-237 Board/RM-238 Board.......................................................................2-32
2-13-9. AXM-48 Board........................................................................................................2-33
2-13-10. KSW-62 Board/KSW-61 Board/Speaker.............................................................................2-35
2-14. Front Lens....................................................................................................................2-38
2-14-1. Front Lens Assembly..................................................................................................2-38
2-14-2. Prism Block/Lens Unit................................................................................................2-38
2-15. Battery Case..................................................................................................................2-42
2-15-1. Battery Case Assembly................................................................................................2-42
2-15-2. DC-167 Board/PSW-97 Board........................................................................................2-42
2-16. Main Chassis.................................................................................................................2-44
2-16-1. IF-1182 Board.........................................................................................................2-44
2-16-2. DPR-343 Board.......................................................................................................2-44
2-16-3. AU-342 Board, RE-298 Board, RE-299 Board, and RE-300 Board..................................................2-45
3. SERVICE Menu
3-1. Outline of SERVICE Menu...................................................................................................3-1
3-1-1. Basic Menu Operations.................................................................................................3-1
3-1-2. SERVICE Menu Structure..............................................................................................3-1
3-1-3. Display/Hide the SERVICE Menu.....................................................................................3-2
3-2. SERVICE Menu List..........................................................................................................3-3
3-2-1. MAINTENANCE Menu................................................................................................3-3
3-2-2. RPN CORRECT Menu.................................................................................................3-3
3-2-3. INFORMATION Menu................................................................................................3-4
3-3. Self-Diagnosis.................................................................................................................3-5
3-3-1. Self-Diagnostic Items...................................................................................................3-5
3-3-2. Executing Self-Diagnosis...............................................................................................3-5
3-3-3. Details of Self-Diagnosis...............................................................................................3-6
3-4. Error Code List...............................................................................................................3-13
PMW-160/PMW-150/PMW-EX260 2

4. Electrical Alignment
4-1. Preparation....................................................................................................................4-1
4-1-1. Notes on Adjustments..................................................................................................4-1
4-1-2. Service Tools and Equipment..........................................................................................4-1
4-1-3. Connection..............................................................................................................4-1
4-2. MAINTENANCE Menu......................................................................................................4-2
4-2-1. Test Saw Setting........................................................................................................4-2
4-2-2. Executing Auto Black Balance.........................................................................................4-2
4-2-3. Black Shading Adjustment.............................................................................................4-2
4-2-4. White Shading Adjustment.............................................................................................4-3
4-2-5. Flare Adjustment.......................................................................................................4-4
4-2-6. Executing Auto FB Adjust.............................................................................................4-5
4-3. RPN CORRECT Menu........................................................................................................4-8
4-3-1. Executing Auto Detection..............................................................................................4-8
4-3-2. Channel Setting.........................................................................................................4-8
4-3-3. Cursor Setting...........................................................................................................4-8
4-3-4. Cursor H Position Setting...............................................................................................4-8
4-3-5. Cursor V Position Setting...............................................................................................4-8
4-3-6. Operating Cursor Next..................................................................................................4-9
4-3-7. Operating Cursor Prev..................................................................................................4-9
4-3-8. Executing Record.......................................................................................................4-9
4-3-9. Executing Delete........................................................................................................4-9
4-3-10. Setting Readout Mode..................................................................................................4-9
4-3-11. Executing Reset.........................................................................................................4-9
5. Spare Parts
5-1. Note on Repair Parts..........................................................................................................5-1
5-2. Exploded Views...............................................................................................................5-2
5-3. Electrical Parts List..........................................................................................................5-20
5-4. Supplied Accessories........................................................................................................5-24
6. Block Diagrams
Overall..................................................................................................................................6-1
7. Schematic Diagrams
Frame Wiring...........................................................................................................................7-1
PMW-160/PMW-150/PMW-EX260 3

Manual Structure
Purpose of this manual
This document is the service manual of Solid-State Memory Camcorder PMW-160/150/EX260.
When servicing this unit, parts are replaced on a board basis in principle. Therefore, this manual includes no circuit
diagram or board layout.
Related manual
The following manual is provided for this unit in addition to this “Service Manual”.
If you need the manual, contact your local Sony Sales Office/Service Center.
• Operating Instructions (Supplied with this unit)
This manual contains information required to operate and maintain the unit.
PMW-160/PMW-150/PMW-EX260 5

Section 1
Service Overview
1-1. External Connectors
1-1-1. Connector Input/Output Signals
6
107891142
1
3
13
512
Input/Output Signals
1. GENLOCK IN/VIDEO OUT
Both IN and OUT, BNC type
GENLOCK IN: SD binary sync/HD tri-level sync, 1.0 Vp-p,
75 Ω, termination
VIDEO OUT: 1.0 Vp-p, 75 Ω, Unbalanced
2. TC IN/OUT
Both IN and OUT, BNC type
TC IN: 0.5 V to 18 Vp-p
TC OUT: 1.0 Vp-p, 75 Ω, Unbalanced
3. HEADPHONE
Stereo mini jack
–20.5 dBu (reference level output 16 Ω loaded)
Sound monitor, monaural/stereo selectable
4. SDI OUT
SDI signal SMPTE 292M/259M compliant
BNC type, 0.8 Vp-p, 75 Ω, 270 Mbps/1.5 Gbps
5. DC IN
- External View -
DC jack, Type 4
GNDEXT DC
PMW-160/PMW-150/PMW-EX260 1-1

6. AUDIO IN CH-1, 2
1
2
3
- External View -
(0 dBu = 0.775 Vrms)
XLR 3-pin, Female
No. Signal I/O Specifications
1 MIC/LINE
(G)
— –65 dBu to –8 dBu
+4 dBu, selectable
High impedance, Bal-
anced
2 MIC/LINE
(H)
IN
3 MIC/LINE
(C)
IN
7. HDV/DV
i.LINK connector
14
- External View -
4-pin, IEEE1394, S400
No. Signal I/O Specifications
1 TPB– IN/OUT Strobe on receive, data on
transmit B (–)
2 TPB+ IN/OUT Strobe on receive, data on
transmit B (+)
3 TPA– IN/OUT Data on receive, strobe on
transmit A (–)
4 TPA+ IN/OUT Data on receive, strobe on
transmit A (+)
8. USB
15
- External View -
5-pin, mini-B, USB2.0 Hi-Speed
No. Signal I/O Specifications
1 VCC — USB Vcc
2 D– IN/OUT I/O USB–
3 D+ IN/OUT I/O USB+
4 ID — NC
5 GND — Ground
9. BATTERY
- External View -
5-pin, Male
12 3 45
No. Signal I/O Specifications
1 BATT (+) — +11 to +17 V dc
2 BAT SCL OUT —
3 BAT SDA IN/OUT —
4 BATT ID
DATA
IN —
5 BATT (–) — —
10. A/V OUT
Multi-connector
- External View -
10-pin
1
2
9
10
No. Signal I/O Specifications
1 LINE
MONI1 L (A/
V)
OUT LINE OUT (L)
2 LANC SIG — NC
3 S GND — GND
4 LANC DC — NC
5 S-C OUT NC
6 LINE
MONI2 R
(A/V)
OUT LINE OUT (R)
7 AV SW IN —
8 VIDEO/
AUDIO
GND
— GND
9 VIDEO OUT Composite OUT
10 S-Y OUT NC
11. HDMI
- External View -
19-pin, Type A
19 1
18 2
PMW-160/PMW-150/PMW-EX260 1-2

No. Signal I/O Specifications
1 TMDS DATA2+ OUT —
2 TMDS DATA2
SHIELD
— —
3 TMDS DATA2– OUT —
4 TMDS DATA1+ OUT —
5 TMDS DATA1
SHIELD
— —
6 TMDS DATA1– OUT —
7 TMDS DATA0+ OUT —
8 TMDS DATA0
SHIELD
— —
9 TMDS DATA0– OUT —
10 TMDS CLOCK+ OUT —
11 TMDS CLOCK
SHIELD
— —
12 TMDS CLOCK– OUT —
13 CEC (N.C.) — —
14 RESERVED (N.C.) — —
15 SCL OUT —
16 SDA IN/OUT —
17 DDC/CEC GND — —
18 +5V POWER OUT —
19 HPD IN —
12. External device connector
USB (Series A), 4-pin
- External View -
14
No. Signal I/O Specifications
1 USB_VBUS — USB Vcc
2 DATA (–) IN/OUT I/O USB–
3 DATA (+) IN/OUT I/O USB+
4 GND — Ground
13. LENS REMOTE
- External View -
8-pin, Female
8 1
7 2
6
5 4
3
No. Signal I/O Specifications
1 COMMON
–V
OUT GND
Continued
No. Signal I/O Specifications
2 ZOOM IN GND: WIDE, 1.4 V:
STOP, 2.8 V: TELE
3 COMMON
+V
OUT 2.8 V
4 COMMON IN 1.4 V
5 REC IN GND: ON, OPEN: OFF
6 RET IN GND: ON, OPEN: OFF
7 SW COM-
MON
OUT GND
8 FRAME
GND
—
PMW-160/PMW-150/PMW-EX260 1-3

1-2. Location of Printed Wiring Boards
AU-342
KSW-62
KSW-61
HN-403
FP-179
AXM-48
DET-55
RE-300
RE-298
DC-167
PSW-97
DR-670
RM-237
HN-404
HN-387
RM-238
HN-386
RE-299
IF-1182
DPR-343
HN-398
IO-254
DCP-61
IO-255
SW-1575
SW-1580
SW-1559
IFC-13
HN-402
SE-1110
EC-75
SWC-54
VR-350
BI-202A
BI-204A
BI-203A
IF-1188
SW-1558
SW-1578
SW-1577
SW-1579
HN-384
PMW-160/PMW-150/PMW-EX260 1-4

1-3. Circuit Description
1-3-1. CMOS Block and Lens Block
BI-286/293 Boards
The BI-286 board is a CMOS imager board for the G channel, and the BI-293 board is a CMOS imager board for the
B channel and R channel.
The BI-286/293 boards are used to supply the power bias and synchronous signal to the CMOS image sensor (ICl) and
to transmit output signals to the DCP-61 board. These boards are provided with a 32-pin fine-wire coaxial connector
(CN1) for transmission of video signals and power.
The CMOS image sensor converts optical signal to electrical signal, and its internal A/D converter converts the electrical
signal to 12-bit digital signal and outputs the digital signal. Video signals are output as four differential serial signals
from the each board.
These boards are also provided with functions as an electronic shutter and an analog gain amplifier. The sync signal and
the serial communication signal from the DCP-61 board are input to the CMOS image sensor.
Various types of decoupling capacitors and damping resistors are also mounted on this board.
The temperature sensor (IC4) on the BI-286 board sends the temperature data to the camera microcomputer SUN (IC702)
on the DCP-61 board through the I2C bus.
The drop regulator (IC2) in the power supply circuit supplies smoothed power voltages to the CMOS image sensor.
IFC-13 Board
The IFC-13 board equipped with a 32-bit microcomputer (IC300) is connected to the camera microcomputer (IC702)
on the DCP-61 board via the AU-342 board. The IFC-13 board has a function to operate lens. This board is also connected
through the connector CN400 to the camera microcomputer with serial communication, and is connected to the lens
through connectors CN201 to CN203.
The image stabilizer gyro board (SE-1110 board) and the iris AUTO/MANUAL switching board (SW-1558 board) are
mounted around the IFC-13 board. The SE-1110 board is connected to the connector CN204 on the IFC-13 board, and
the SW-1558 board is connected to the connector CN401 on the IFC-13 board.
Furthermore, the IFC-13 board has a function to relay signals from the VR-350 board and the LENS REMOTE (8P)
connector. The zoom signal is processed by the lens microcomputer (IC300) on the IFC-13 board. The REC, REC
REVIEW, and EXPANDFOCUS signals are sent through CN502 and the IF-1182 board to the KSW-62 board.
SE-1110 Board
The SE-1110 board contains a gyro sensor and is connected to the lens drive (IC200) on the IFC-13 board. The gyro
sensor functions as an image stabilizing sensor.
SW-1558 Board
The SW-1558 board contains an AUTO/MANUAL of an iris changing switch , and is connected to the IFC-13 board.
PMW-160/PMW-150/PMW-EX260 1-5

1-3-2. Camera Block System
DCP-61 Board
The camera block consists of a camera signal processor IC that processes the digital camera signal and a camera
microcomputer that controls the camera signal processor IC, CMOS image sensor, and lens. This block outputs the
digital video signal (Y/C) to the following video signal system (baseband).
Digital video signals that are output in the LVDS format from the BI-286 board and the BI-293 board that contain a
CMOS image sensor are sent to the correction IC HELIOS (IC500) on the DCP-61 board. FD white-point detection
correction, clamp processing, monitor frame adjustment, and PI conversion are added to the digital video signals, and
the processed digital video signals are then input to the camera signal processor IC RISE (IC200). The camera signal
processor IC detects values (including video signal average values and peak values) required for camera operations such
as white balance, black balance, focus, iris, and knee processing. Detected values are sent to the camera microcomputer
SUN (IC702).
The digital video signal enters first the selector circuit that selects digital video signal or the test signal, and is then
transferred to the CMOS image sensor correction circuit and the lens correction circuit.
After that, the digital video signal receives white balance processing, flare correction, and then the matrix signal and
the detail signal are added to the video signal. The video signal then receives pedestal control, knee correction, gamma
correction, and white/black clip processing. The video signal is finally output to the baseband processing IC T-ONE
(IC900) .
The processing for converting the number of pixels from 1920/1080 to 1440/1080 or from 1920/1080 to 1280/720 is
also performed in the camera signal processor IC RISE (IC200).
The camera microcomputer SUN (IC702) performs the overall camera control, and is controlled by the system
microcomputer MELON (IC2101) on the DPR-343 board. SUN's peripheral ICs FLASH ROM (IC701) and SDRAM
(IC700) are mounted on the DCP-61 board.
1-3-3. Video Signal System
DCP-61 Board
The digital video signal (Y/C) sent from the camera signal processor IC RISE (IC200) on the DCP-61 board is input to
the baseband processing IC T-ONE (IC900).
The baseband processing IC T-ONE that incorporates scaler functions (supporting multi-format output), OSD, PLL (54
to 74 MHz), and CPU performs baseband processing for video and audio signals.
The baseband signal processed by T-ONE is sent to the router IC ANDV (IC1700), and is then distributed to inputs and
outputs.The following table lists inputs and outputs of the baseband processing IC T-ONE.
Signal name and input/output
• HD/SD digital component signal
Output to the router IC (Used for outputting SDI/HDMI/VIDEO OUT (without characters))
• HD/SD analog component signal
Output through the A/D converter (IC805) to the router IC (Used for outputting SDI/HDMI/VIDEO OUT (with
characters))
• Analog composite signal
Output to the IO-255 board
• Video signal for LCD
Output through the KSW-62 board to the LCD
• Video signal for viewfinder
Output through the IF-1182 board to the DR-670 board
• Video signal for CODEC
Output through the router IC to the CODEC (IC500, 700: TORINO) on the DPR-343 board
PMW-160/PMW-150/PMW-EX260 1-6

• Return video signal
Input from the router IC
• Audio interface signal
Output to the AU-342 board
The peripheral circuit of the baseband processing IC T-ONE contains the following circuit and devices.
• Master clock 54 MHz VCXO (X1400) control circuit (including IC1401)
• Mobile DDR SDRAM (IC1100, IC1101)
• FLASH ROM (IC1201) and SDRAM (IC1200) as peripheral ICs of the internal CPU
1-3-4. Media Recording/Playback System
DPR-343 Board
Output signals from the baseband processor IC (IC900) on the DCP-61 board are transferred to the router IC ANDV
(IC1700) and the selector IC CAVS (IC100) on the DPR-343 board, and are then input to the MPEG encoder/decoder
TRINO (IC500, IC700) or the media block controller (IC1000).
The MPEG encoder/decoder (IC500, IC700) is a single-chip MPEG CODEC IC that encodes and decodes high-quality
HD image and audio signals in real time. It has various interfaces with MPEG video bitstream and baseband video input/
output, MPEG audio bitstream and baseband audio input/output.
The media block controller (IC1000) processes these signals and then files them, and writes the file data to the SxS
memory card through the SWC-54 board or the EC-75 board with the PCI Express interface.
This controller performs operation opposite to this procedure in the playback mode.
Furthermore, the media block controller (IC1000) has an internal CPU and a USB device controller for router IC CAVS
(IC100) control, serial communication with the system controller (IC2101), and data communication with each controller
through the PCI bus.
A flash ROM (IC1101) is also connected to IC1000, and the CPU program in IC1000 is read at the first startup.
Controlled by the system controller (IC2101) in the same way as other main devices, the board performs video/audio
stream control, SxS memory card access, mass storage operation through the USB connection, and HDV device control
through the i-LINK connection.
Peripheral Devices
SxS memory card slot
The 2-channel PCI-Express signal from the media block controller (IC1000) is input to the two memory card slot boards
(SWC-54, EC-75) through the 0.4 mm-pitch 30-pin fine-wire coaxial cables connected to CN1400 and CN1401.
The 2-channel USB host signal that is output from the media block controller (IC1000) by controlling USB host controller
(IC1301) is sent to the SWC-54 and EC-75 boards through fine-wire coaxial cables in the same way as the PCI-Express
signal. IC1301 is controlled by IC1000 through the PCI bus.
USB device controller
USB device signals input/output from the USB device controller in the media block controller (IC1000) are input to the
USB Mini-B connector (CN2200).
USB host controller
The USB host controller (IC1301) takes charge of one channel for connection to Wi-Fi adapter or USB memory in
addition to two channel of slots for SxS memory card.
The USB host signal input/output from the USB host controller (IC1301) is transferred from CN2501 through the
shielded harness to the IO-254 board, and is then transferred to the USB TYPE-A connector (CN101).
IC1301 is controlled by IC1000 through the PCI bus.
PMW-160/PMW-150/PMW-EX260 1-7

i-LINK controller
The i-LINK signal that is output from the i-LINK controller (IC1300) by controlling IC1300 from the media block
controller (IC1000) is sent to the 4-pin i-LINK connector (CN1300). IC1300 is controlled by IC1000 through the PCI
bus.
1-3-5. Audio System
FP-179 Board
The FP-179 board relays audio signals between the internal microphone and the KSW-62 board.
AXM-48 Board
This connector board contains EXT LINE/MIC input XLR (3P) connectors and LINE/MIC/MIC+48 V input select
switches for two channels.
KSW-62 Board
• The KSW-62 board amplifies the internal microphone by the bias power supply and the head amplifiers (Q102 and
Q104, Q103 and Q105) and outputs balanced audio signals.
• When the line input level (+4 dBu) is selected for the EXT input signal, an input attenuator is inserted by switches
(Q150 to Q153, Q158 to Q162).
• A speaker is connected to the speaker connector (CN102).
IF-1182 Board
The MIC input level (-30 dBu to -60 dBu/10 dB step) of the EXT input signal is common to the LINE input level (+4
dBu: input reference -30 dBu selected), and the gain of this signal is adjusted by the switches (Q302 to Q305, Q308 to
Q309).
AU-342 Board
The AU-342 board mainly has motherboard, audio, and RTC functions.
Motherboard function
The AU-342 board relays signals to main boards (DPR-343, DCP-61) and power supply boards (RE-299, RE-300) as
a motherboard function.
Audio signal flow
• Input
Analog audio input signals are transferred from the IF-1182 board through the HN-386 board and the A/D converter
to the FPGA (IC501). The digital playback signal (bidirectional bus) is transferred from the DPR-343 board to the
FPGA.
• Input processing by FPGA
The EE input signal is selected by the FPGA and is transferred to the DSP (IC601). The playback signal is transferred
to the DSP.
PMW-160/PMW-150/PMW-EX260 1-8

• Signal processing
The DSP enables many functions including AGC, Wind Filter, monitor volume, monitor switching control, and
SG Tone.
• Output processing by FPGA
The FPGA receives recording signals and SDI output signals from the DSP and outputs them.
• Output
Monitor output signals (headphone or speaker) are transferred from the DSP through the D/A converter to the SP
amplifier and the HP amplifier.
Headphone output signals are output from the RM-237 board and RM-238 board through the HN-386 board,
IF-1182 board, and HN-404 board.
Speaker output signals are output from the KSW-62 board through the HN-386 board, IF-1182 board, and HN-403
board.
The analog line output (AV out) signal from the DSP is sent to the DPR-343 board through the D/A converter. The
media recording signal (bidirectional bus) from the FPGA is sent to the DPR-343 board.
Meter output signals from the DSP and SDI output signals from the FPGA are sent to the DCP-61 board.
Control
• The FPGA is totally controlled by the ARM CPU (IC900) on the DCP-61 board through the SIO interface.
• The DSP is booted (SPI boot) by the FPGA and is controlled via the FPGA.
• Analog audio circuit control signals are output by the FPGA.
Clock
• The audio system clock is supplied from IC900 on the DCP-61 board to the FPGA and is distributed from the FPGA
to the A/D converter and the D/A converter.
1-3-6. System Control
DPR-343 Board
The 32-bit RISC CPU (ARM) with ARM core is built-in as the system controller (IC2101).
It has the peripheral interface functions of SDRAM, USB, SCI, and I2C. It operates on a 27 MHz clock (X2000).
FLASH ROM (IC2007), SDRAM (IC2006), and EEPROM (IC2201) are mounted as the peripheral ICs.
It performs the system control through serial communication with IC702 (DCP-61 board) of the camera block system,
IC900 (DCP-61 board) of the video signal system, and IC1000 of the media recording/playback system.
Main functions of the system controller and peripherals
Reading operation switch information
Reading the switch information and the LED control are performed by I2C bus communication with each sub-
microprocessor.
• Handle switch: IC202 on the KSW-62 board
• Inside panel switch: IC200 on the SWC-54 board
• Power supply switch: IC202 on the RE-298 board
Clock IC (RTC) control
The AU-342 board contains a clock IC (IC700).
The clock IC (IC700) backed up by a lithium coin battery monitors the battery voltage via IC200 on the SWC-54 board.
The clock IC (IC700) and the system controller set and read the current clock time through serial communication.
PMW-160/PMW-150/PMW-EX260 1-9

Infrared remote control demodulation
The RM-237 board has an IC (IC100) for REAR infrared remote control signal demodulation, and it receives the
command codes via IC200 on the SWC-54 board. The KSW-61 board has an IC (IC100) for FRONT infrared remote
control signal demodulation, and it receives the command codes via IC202 on the KSW-62 board.
Info-Battery communication
The Info-Battery of SM bus specifications is supported.
The serial terminal of the battery connector is connected to IC202 on the RE-298 board. This IC202 read the battery
authentication, battery type, remaining power, and other information and send them to the system controller via I2C bus
communication.
Power supply voltage detection
The power supply voltage at the DC IN connector is measured by the A/D port on IC202 on the RE-298 board, and it
is posted to the system controller as the input voltage value.
Power system control
IC202 on the RE-298 board checks that the power switch on the unit is turned ON, and turns on the system controller
of IC2101 (DPR-343 board). After that, it controls the power for each circuit block according to the system controller.
The system controller controls the respective power supply systems in the RE-299 and RE-300 boards according to the
operation mode of the device, via the power supply microcomputer (IC202) on the RE-298 board.
1-3-7. Power Supply System
RE-298/299/300 Boards
The RE-298, RE-299, and RE-300 boards consist of a power circuit (RE-299/RE-300 boards) and a power control unit
(RE-298 board).
However, a part of low-voltage power supply circuit is mounted on the DCP-61 and DPR-343 boards.
Input power supply (UNREG) system operations
An UNREG power voltage is input and is changed to the EVER power voltage state. The power switch ON/OFF state
can be recognized in this mode.
When the power microcomputer (RE-298 board: IC202) recognizes the power switch ON state, the power
microcomputer controls power of each block according to instructions of the system controller (DPR-343 board:
IC2101).
The ordinary input power (UNREG) value is approx. +11 V to +17 V.
• Battery/EXT-DC inputs
These two inputs cannot be physically connected at the same time. Either one power input is selected and supplied.
• Protection of input overvoltage
When a high UNREG power voltage is supplied, the overvoltage protection circuit is activated at the set value of
+19.5 V and the camera body is shut down. This circuit automatically resumes power when the input power voltage
lowers to +19.5 V or less.
• Protection of input low voltage
When a low UNREG power voltage is supplied, the low-voltage protection circuit is activated at the set value of
+10.5 V by the power microcomputer control and the camera body is shut down.
Once the low-voltage protection circuit is activated, the state is maintained. In that case, therefore, turn off the
power switch and replace the battery pack with a charged battery pack or take other appropriate actions.
• UNREG overcurrent detection
An overcurrent detection circuit consisting of IC100 is provided on the RE-299 board. The set value is approx. 4.3
A. Once overcurrent is detected, the circuit is not automatically reset even after the overcurrent is cleared, and
power must be turned on again.
PMW-160/PMW-150/PMW-EX260 1-10