Sony XR-C5090 User manual

MICROFILM
SERVICE MANUAL
FM/AM CASSETTE CAR STEREO
E Model
Model Name Using Similar Mechanism XR-C340
Tape Transport Mechanism Type MG-25F-136
SPECIFICATIONS
XR-C5090
Refer to RM-X4S SERVICE MANUAL (9-925-698-∏) issued
previously for information of remote commander (RM-X4S)
supplied with this set

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TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Setting the Unit ............................................................... 4
Detaching the Front Panel............................................... 4
Preparing the Rotary Commander .................................. 4
Setting the Clock ............................................................. 4
Installation....................................................................... 5
Connection ...................................................................... 7
2. DISASSEMBLY ......................................................... 9
3. ASSEMBLY OF MECHANISM DECK........... 11
4. MECHANICAL ADJUSTMENTS....................... 14
5. ELECTRICAL ADJUSTMENTS
Tape Deck Section .......................................................... 14
Tuner Section .................................................................. 14
6. DIAGRAMS
6-1. IC Pin Function Description ........................................... 15
6-2. Printed Wiring Boards – MAIN Section – .................... 19
6-3. Schematic Diagram – MAIN Section –.......................... 21
6-4. Printed Wiring Board – PANEL Section – .................... 25
6-5. Schematic Diagram – PANEL Section –....................... 27
7. EXPLODED VIEWS................................................ 31
8. ELECTRICAL PARTS LIST ............................... 34
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

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SECTION 1
GENERAL This section is extracted from
instruction manual.

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FRONT PANEL ASS’Y, COLLAR
COVER ASS’Y
Note: Follow the disassembly procedure in the numerical order given.
SECTION 2
DISASSEMBLY
1 Push the button
(release).
3 claw
3 claw
4 collar
2 Remove the front panel ass’y
to the direction of the arrow
A .
A
1
2
1
2
3
cover ass’y

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SUB PANEL, MECHANISM DECK (MG-25F-136)
MAIN BOARD, HEAT SINK
3 connector
(CN351)
2 sub panel
1 three screws
(PTT2.6
× 8)
1 three screws
(PTT2.6
× 8)
5 screw
(PTT2.6
× 6)
6 mechanism dec
k
(MG-25F-136)
4 flexible flat cable
(CN301)
3 two ground point
screws
5 three screws
(PTT2.6
× 8)
5 two screws
(PTT2.6
× 10)
1 screw
(PTT2.6
× 8)
5 two screws
(PTT2.6
× 8)
6 heat sink
2 rubber cap (25)
1 two screws
(PTT2.6
× 8)
4 main board