Sony XR-C6100 User manual

MICROFILM
SERVICE MANUAL
FM/MW/SW CASSETTE CAR STEREO
Saudi Arabia Model
SPECIFICATIONS
XR-C6100
Dolby noise reduction manufactured under license
from Dolby Laboratories Licensing Corporation.
“DOLBY” and the double-D symbol aare trade-
marks of Dolby Laboratories Licensing Corporation.
Model Name Using Similar Mechanism NEW
Tape Transport Mechanism Type MG-25F-136
– Continued on next page –

– 2 –
TABLE OF CONTENTS
1. GENERAL
Location of Controls ....................................................... 3
Installation....................................................................... 4
Connections ..................................................................... 5
2. DISASSEMBLY ......................................................... 8
3. ASSEMBLY OF MECHANISM DECK........... 10
4. MECHANICAL ADJUSTMENTS ....................... 13
5. ELECTRICAL ADJUSTMENTS
Test Mode ........................................................................ 13
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 14
6. DIAGRAMS
6-1. IC Pin Function Description ........................................... 17
6-2. Note for Printed Wiring Boards and
Schematic Diagram ......................................................... 20
6-3. Printed Wiring Board – MAIN Section – ...................... 21
6-4. Schematic Diagram – MAIN Section (1/2) –................ 23
6-5. Schematic Diagram – MAIN Section (2/2) –................ 25
6-6. Printed Wiring Board – PANEL Section – .................... 27
6-7. Schematic Diagram – PANEL Section – ....................... 29
7. EXPLODED VIEWS................................................ 33
8. ELECTRICAL PARTS LIST ............................... 36
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

– 3 –
SECTION 1
GENERAL This section is extracted from
instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –
COVER ASS’Y
SUB PANEL, MECHANISM DECK (MG-25F-136)
Note: Follow the disassembly procedure in the numerical order given.
SECTION 2
DISASSEMBLY
3 cover ass’y
1
2
1
2
1
2
1 three screws
(PTT2.6
× 6)
2 sub panel
3 connector
(CN302)
5 screw
(PTT2.6
× 6)
6 mechanism dec
k
(MG-25F-136)
4 flexible flat cable
(CN301)
1 three screws
(PTT2.6
× 6)

– 9 –
MAIN BOARD, HEAT SINK
3 two ground point
screws
5 three screws
(PTT2.6
× 10)
5 two screws
(PTT2.6
× 10)
1 screw
(PTT2.6
× 6)
5 three screws
(PTT2.6
× 10
)
6 heat sink
2 rubber cap (25)
1 two screws
(PTT2.6
× 6)
4 main board

– 10 –
SECTION 3
ASSEMBLY OF MECHANISM DECK
HOUSING
ARM (SUCTION)
Note: Follow the assembly procedure in the numerical order given.
A part
C part
B part
D part
8 Hold the hanger by
bending the claw.
6 Fit projection on D part.
4 Fit claw on B part.
3 Put the housing
under
A part.
5 Fit projection on C part.
1 Install the catch to the hanger.
2 Install the hanger onto
two claws of the housing.
7 Holder the hanger by bending the claw.
hanger
housing
2 Move the arm (suction) in the arro
w
direction and fit on projection.
1 Fit the arm (suction) on the shaft.
projection