Sony CDP-XE270 - Compact Disc Player User manual

SERVICE MANUAL
COMPACT DISC PLAYER
US Model
AEP Model
UK Model
E Model
Australian Model
CDP-XE270/XE370
Canadian Model
CDP-XE270
SPECIFICATIONS
CDP-XE270/XE370
Photo: CDP-XE370
Ver. 1.4 2006.07
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM66-5BD27
Base Unit Name BU-5BD27
Optical Pick-up Name PXR-104X or KSS-213C
Compact disc player
Laser Semiconductor laser (λ=
780 nm)
Emission duration:
continuous
Frequency response 2 Hz to 20 kHz ±0.5 dB
Dynamic range More than 93 dB
Harmonic distortion 0.0045%
Outputs
ANALOG
OUT
DIGITAL
OUT
(OPTICAL)
General
Power consumption 11 W
Dimensions (approx.) 430 x 95 x 290 mm
(w/h/d) incl. projecting parts
Mass (approx.) CDP-XE370: 3.2 kg
CDP-XE270: 3.2 kg
Supplied accessories
Audio cord (2 phono plugs – 2 phono plugs) (1)
Remote commander (remote) (1) (CDP-XE370 only)
R6 (size AA) batteries (2) (CDP-XE370 only)
Design and specifications are subject to change
without notice.
Load
impedance
Over 10
kilohms
Wave length:
660 nm
Jack
type
Phono
jacks
Optical
output
connector
Maximum
output level
2 V
(at 50
kilohms)
–18 dBm
Power requirements
Where purchased
US, Canadian models
AEP, UK models
Australian model
Singapore model
Power requirements
120 V AC, 60 Hz
230 V AC, 50/60 Hz
240 V AC, 50/60 Hz
220 V– 230 V AC, 50/60 Hz
9-929-591-15 Sony Corporation
2006G05-1 Home Audio Division
© 2006.07 Published by Sony Techno Create Corporation

2
CDP-XE270/XE370
TABLE OF CONTENTS
1. SERVICING NOTES ............................................... 4
2. GENERAL ................................................................... 5
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Case ................................................................................. 6
3-3. CD Mechanism Deck (CDM66-5BD27)........................ 7
3-4. MAIN Board ................................................................... 7
3-5. Base Unit (BU-5BD27)................................................... 8
4. TEST MODE.............................................................. 9
5. ELECTRICAL CHECKS ....................................... 11
6. DIAGRAMS
6-1. Note for Printed Wiring Boards
and Schematic Diagrams ................................................ 13
6-2. Printed Wiring Board –BD Board –............................. 14
6-3. Schematic Diagram –BD Board –................................ 15
6-4. Printed Wiring Boards
–LOADING/MAIN/POWER SW Boards –.................. 16
6-5. Schematic Diagram
–LOADING/MAIN/POWER SW Boards –.................. 17
6-6. Printed Wiring Boards –DISPLAY/KEY Boards –...... 18
6-7. Schematic Diagram –DISPLAY/KEY Boards –.......... 19
6-8. IC Pin Function Description ........................................... 22
7. EXPLODED VIEWS
7-1. Case Section .................................................................... 26
7-2. Front Panel Section ......................................................... 27
7-3. CD Mechanism Deck Section (CDM66-5BD27)........... 28
7-4. Base Unit Section (BU-5BD27) ..................................... 29
8. ELECTRICAL PARTS LIST ............................... 30
Ver 1.1 2001.07

3
CDP-XE270/XE370
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized”knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
TheAC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operatedAC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit”indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2VAC range are suit-
able. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 k Ω 0.15 µF
AC
voltmete
r
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED
LINE WITH MARK 0ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
The following caution label is located inside the unit.
This appliance is classified as a CLASS 1 LASER
product.
The CLASS 1 LASER PRODUCT MARKING is
located on the rear exterior.

4
CDP-XE270/XE370 SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc reflective surface by the objective lens in the optical
pick-up block. Therefore, when checking the laser diode emis-
sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
Carry out the “S curve check” in “CD section adjustment” and
check that the S curve waveforms is output three times.
• MODEL IDENTIFICATION
– Rear Panel –
MODEL PART No.
CDP-XE270: AEP model 4-232-151-0[]
CDP-XE270: UK model 4-232-151-1[]
CDP-XE270: US and Canadian models 4-232-151-2[]
CDP-XE270: Australian model 4-232-151-3[]
CDP-XE270: Singapore model 4-232-151-6[]
CDP-XE370: AEP model 4-232-692-0[]
CDP-XE370: UK model 4-232-692-1[]
CDP-XE370: US model 4-232-692-2[]
CDP-XE370: Australian model 4-232-692-3[]
CDP-XE370: Singapore model 4-232-692-6[]
PART No.

5
CDP-XE270/XE370
SECTION 2
GENERAL This section is extracted from
instruction manual.
CLEAR qg (12)
Disc compartment 6(8)
Display qj (10)
PLAY MODE 2(9, 12, 14)
POWER 1(8)
Remote sensor qh (7)
(CDP-XE370 only)
REPEAT 3(9, 11)
TIME w; (10)
BUTTON DESCRIPTIONS
AOPEN/CLOSE 7(8, 10, 12)
H8(9, 11, 12, 14)
X9(9, 14)
x0(9, 14)
lAMSLdial qa (9, 12, 14)
m/Mqk (9, 13)
LOCATION OF CONTROLS
– FRONT PANEL – – REMOTE CONTROL –
(CDP-XE370 only)
ANALOG OUT LEVEL +/– qk (7, 9)
CHECK qg (12)
CLEAR qf (12)
CONTINUE 2(9, 14)
DISPLAY ON/OFF qs (11)
FADER qd (13)
Number buttons 4(9, 12)
PROGRAM qa (9)
REPEAT 6(9)
SHUFFLE 1(9)
TIME 3(10)
BUTTON DESCRIPTIONS
>10 5(9, 12)
Nqh (9, 11, 12, 14)
X8(9, 14)
xqj (9, 14)
.AMS >9(9, 12, 14)
m/M0(9, 13)
–REAR PANEL –
ANALOG OUT L/R jacks 2(7)
Mains lead 4(7)
DIGITAL OUT OPTICAL jack 1(8)

6
CDP-XE270/XE370
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SECTION 3
DISASSEMBLY
Note: Follow the disassembly procedure in the numerical order given.
3-2. CASE
3-2. CASE
(Page 6)
3-3. CD MECHANISM DECK
(CDM66-5BD27)
(Page 7)
3-5. BASE UNIT
(BU-5BD27)
(Page 8)
3-4. MAIN BOARD
(Page 7)
SET
1 two screws
(case 3 TP2)
1 two screws
(case 3 TP2)
1 screw
(case 3 TP2)
2 case

7
CDP-XE270/XE370
3-3. CD MECHANISM DECK (CDM66-5BD27)
3-4. MAIN BOARD
1 tapering driver
2
3
panel, loading
4 wire (flat type) (21core)
7 connector (CN151)
8 CD mechanism deck
(CDM66-5BD27)
– BOTTOM VIEW –
5 three screws
(BVTP3
× 8)
6
Note:When the power supply does not turn on,
rotate the cam with tepering driver (
∅ 3 mm) as the figure shows,
and the loading panel will be moved.
1 connector (CN602)
2 wire (flat type) (17core)
(CN621)
2 wire (flat type) (21core)
(CN651)
5 main board
3 four screws
(BVTP3 × 8
)
4 two screws
(BVTP3 × 8)

8
CDP-XE270/XE370
3-5. BASE UNIT (BU-5BD27)
1 screw (DIA.12), froating
3 three screws
(DIA. 12), froating
4 holder (66)
2
–BOTTOM VIEW –
5 two springs
(932), compression
5 two springs
(932), compression
6 base unit
(BU-5BD27)

9
CDP-XE270/XE370
SECTION 4
TEST MODE
AGING MODE
Procedure:
1. While pressing the both xand [CLEAR] buttons, turn the
power on.
2. Tray open-close aging is performed.
3. Press the [TIME] button to display time for open-close on the
fluorescent indicator tube.
4. To release the mode, press the [POWER] button to turn OFF
the power.
CHECK MODE
Procedure:
1. Press the [POWER] button to turn ON the power
2. Press the [ OPEN/CLOSE] button and insert the disc.
3. Press the [POWER] button to turn OFF the power.
4. While pressing the both [PLAY MODE] and [ ] buttons, turn
the power on .
5. CD starts playing, and every time the [TIME] button is pressed,
RFDC and OFFSET are changed over.
6. To release the mode, press the [POWER] button to turn OFF
the power.
ADJ MODE
Procedure:
1. Press the [POWER] button to turn ON the power
2. Press the [ OPEN/CLOSE] button and insert the disc.
3. Press the [POWER] button to turn OFF the power.
4. Short-circuit the test TP (ADJ) of the DISPLAY board and
ground with a lead wire.
5. Press the [POWER] button to turn ON the power and CD plays
the second track.
6. To release the mode, press the [POWER] button to turn OFF
the power.
7. Open-circuit the test TP (ADJ) of the DISPLAY board and
ground with a lead wire.
AFADJ MODE (KEY AND FLUORESCENT INDICA-
TOR TUBE DISPLAY CHECK MODE)
Procedure:
1. Short-circuit the test TP (AFADJ) of the DISPLAY board and
ground with a lead wire.
2. Press the [POWER] button to turn ON the power.
The whole fluorescent indicator tube lights up.
3. All buttons have individual button numbers.
When a button is pressed, the button number is counted up
and displayed.
When remote controller signals are received, “RM **” will be
displayed.
(** are the numbers corresponding to the remote controller
buttons.) (CDP-CE370 only)
4. To release the mode, press the [POWER] button to turn OFF
the power.
5. Open-circuit the test TP (AFADJ) of the DISPLAY board and
ground with a lead wire.
Buttons and Corresponding Button Numbers
Button Button Number or Display
H(PLAY) Partical lighting 1
X(PAUSE) 02
x(STOP) Partical lighting 2
lAMSL (button) 04
m05
M06
TIME 07
PLAY MODE 08
CLEAR 09
REPEAT 10
AOPEN/CLOSE All lit
lAMSL (knob)
When rotated clockwise: The music calendar
numerals light up in ascending order.
When rotated counterclockwise: The music
calendar numerals light up in descending
order.
Count up display Displays button number
10
SECMIN
Partial lighting 1
24
6810
12 14
16 18 20
Partial lighting 2
[ ]
A
H
A

10
CDP-XE270/XE370
Checking Location:
– DISPLAY BOARD (Conductor Side) –
TP
(ADJ)
TP
(AFADJ)
(GND)

11
CDP-XE270/XE370
Ver 1.1 2001.07
Note:
1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.
2. Use PATD-012 disc (4-225-203-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩimpedance.
4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S Curve Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP (FE1) and TP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track and press the
xbutton to stop playing back.
5. Press the [REPEAT] button. (The object lens moves up and
down)
6. Confirm the oscilloscope waveform (S-curve) is symmetrical
between A and B. And check peak to peak level within 2 ± 1
Vp-p.
S-curve waveform
Note: • Try to measure several times to make sure than the ratio of A : B
or B : A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
Checking Location: BD board (See page 12)
RFDC Level Check
Connection:
+
–
BD board
TP (FE1)
TP (VC)
oscilloscope
A
B
symmetry
within 2
± 1 Vp-p
+
–
BD board
TP (RFDC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
level: 1.15
± 0.35 Vp-p
VC
Procedure:
1. Connect an oscilloscope to test point TP (RFDC) andTP (VC)
on the BD board.
2. Turn the power on and insert the disc (PATD-012).
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RFDC
signal level is correct or not.
Note: A clear RFDC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
RFDC signal waveform
Checking Location: BD board (See page 12)
RFAC Level Check
Connection:
Procedure:
1. Connect an oscilloscope to test point TP (RFAC) and TP (VC)
on the BD board.
2. Turn the power on.
3. Turn the power off and enter the ADJ mode. (Refer to 4. Test
Mode)
4. Turn the power on to playback the second track.
5. Confirm that oscilloscope waveform is clear and check RFAC
signal level is correct or not.
Note: A clear RFAC signal waveform means that the shape “◊” can be
clearly distinguished at the center of the waveform.
RFAC signal waveform
Checking Location: BD board (See page 12)
+
–
BD board
TP (RFAC)
TP (VC)
oscilloscope
VOLT/DIV: 200 mV
TIME/DIV: 500 ns
level: 1.35
± 0.4 Vp-p
SECTION 5
ELECTRICAL CHECKS

12
CDP-XE270/XE370
Ver 1.1 2001.07
E-F Balance Check
Connection:
Procedure:
1. Connect an oscilloscpe to test point TP (TE1) and TP (VC) on
the BD board.
2. Turn the power on.
3. Put the disc (PATD-012) in to playback the number two track.
4. Press the [TIME] button. (The tracking servo and the sledding
servo are turned OFF)
5. Check the level B of the oscilliscope's waveform and the A
(DC voltage) of the center of the Traverse waveform.
Confirm the following :
A/B x 100 = less than ± 22%
Traverse Waveform
6. Press the[TIME] button. (The tracking servoand sledding servo
are turned ON)
Confirm the C (DC voltage) is almost equal to the A (DC
voltage) is step 5.
Traverse Waveform
Checking Location: BD board
+
–
BD board
TP (TE1)
TP (VC)
oscilloscope
0V
B
level: 1.15 ± 0.5 Vp-p
Center of
the waveform
A (DC
voltage)
0V
Tracking servo
Sled servo
ON
C (DC
voltage)
Tracking servo
Sled servo
OFF
Checking Location:
– BD BOARD (Conductor Side) –
TP
(RFDC)
TP
(FE1)
TP
(VC)
IC131
IC150
IC101
TP
(TE1)
TP
(RFAC)

1313
CDP-XE270/XE370
SECTION 6
DIAGRAMS
6-1. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Partsonthepatternfaceside seenfrom
(Conductor Side) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• Indication of transistor
C
BThese are omitted. E
Q
B
These are omitted.
CE
Q
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•C: panel designation.
•A: B+ Line.
•B: B–Line.
•Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark :CD PLAY
•Voltages are takenwithaVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
J: CD PLAY (ANALOG OUT)
c: CD PLAY (DIGITAL OUT)
Note:
The components identi-
fied by mark 0or dotted
linewithmark0arecriti-
cal for safety.
Replace only with part
number specified.
Note:
Lescomposantsidentifiéspar
une marque 0sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
• Circuit Boards Location
POWER SW board
KEY board
LOADING board
DISPLAY board
MAIN board
BD board

1414
CDP-XE270/XE370
6-2. PRINTED WIRING BOARD –BD Board –•See page 13 for Circuit Boards Location.
TP (DGND)
C111
R138
C140
C158
C112
C182
R151
R152
R140
C154
R174
C138
C132
C151
C191
C153
C192
C134
C102
C101 R101
C171
R142
R192
C133
C199
C103
C110
C172
R110
R136
C131
R184
C150
R112
Q132
R111
C194
R146
C152
R149
FB191
C181
Q131
R134
R137
X191
R103
R143
C193
R102
C130
C137
E
E
M101
(SPINDLE)
M102
(SLED)
S101
(LIMIT)
IC150
CN101
C136
C184
RB101
C124
RB102
IC131
CN102
R135
C145
R141
R172
R183
R182
C139
C174
C173
R171
R144
IC101
R191
R155
R145
R173
C183
R181
R127
R123
C123
C125
C120
R120
R122
C126
C122
R125
R129
R126
R121
C121
R153
R139
1-681-001-
11
(11)
BD BOARD
(COMPONENT SIDE)
TP (VC)
TP (TE1)
TP (FE1)
TP (RFAC) 1-681-001-
11
(11)
M
BD BOARD
(CONDUCTOR SIDE)
A
MAIN BOARD
CN651
M
OPTICAL PICK-UP
BLOCK
(PXR-104X)
B
C
D
E
F
G
1 2 3 4 5 6 7 8 9 10 11 12 13
A
TP (RFDC)
•Semiconductor
Location
Ref. No. Location
IC101 E-10
IC131 E-8
IC150 C-8
Q131 F-6
Q132 E-6
(Page 16)
Ver 1.1 2001.07

1515
CDP-XE270/XE370
6-3. SCHEMATIC DIAGRAM – BD Board – • See page 20 forWaveforms. • See page 20 for IC Block Diagrams.
(Page 17)
TP
(RFDC)
Ver 1.1 2001.07

1616
CDP-XE270/XE370
6-4. PRINTED WIRING BOARDS –LOADING/MAIN/POWER SW Boards –•See page 13 for Circuit Boards Location.
•Semiconductor
Location
Ref. No. Location
D601 D-7
D602 D-7
D603 C-7
D604 D-7
D605 D-7
D612 D-7
D613 C-7
D614 D-6
D615 D-6
D616 D-6
D631 E-3
D641 E-4
D643 E-3
D681 D-6
D682 D-5
D691 D-6
D692 D-5
IC601 E-6
IC602 F-6
IC603 D-6
IC631 E-2
IC651 B-9
IC801 B-8
Q642 E-4
Q681 C-6
Q682 B-9
Q691 C-6
Q692 C-9
1
5
CN151
S151
LOAD
OUT
M151
(LOADING)
M
S152
LOAD
IN
1-645-721-
11
(21)
LOADING BOARD
JW620
JW656
C620
D681
JW664
JW650
D691
JW645
JW608
JW624
JW602
C610
JW628
R648
R809
IC601
C802
C902
JW649
JW651
JW671
C631
R651
IC603
JW617
JW668
JW653
JW610
R606
JW615
JW601
JW635
R805
IC602
JW625
JW670
JW662
JW669
IC631
C642
C619
JW640
JW606
D616
D615
R607
JW629
JW605
C606
JW654
R647
CN621
C612
JW612
JW607
Q642
R631
Q692
JW673
R611
D605
JW614
C618
R806
C675
R904
R804
IC801
JW627
JW661
JW663
C641
JW638
C908
R641
R691
Q682
R692
R909
CN651
R812
C654
D613
JW604
JW618
R910
C609
JW603
R906
D604
D601
R646
T601
POWER
TRANSFORMER
D603
R681
NO603
JW613
R912
JW666
JW658
C677
R632
C608
JW611
D641
D602
IC651
JW616
NO631
C657
Q691
JW657
C605
R612
C604
C653
Q681
JW646
C601
R642
R810
D643
C808
C658
R682
JW655
C616
D612
JW619
C603
C607
JW652
C602
C659
JW609
R652
C651
D614
D682
D692
C811
C911
C663
JW679
R905
L651
JW674
JW675
JW676
JW677
JW678
JW680
JW681
JW682
JW683
JW684
JW685
JW686
C682
R653
D631
CN601
S601
C621
CN602
MAIN BOARD
B
DISPLAY
BOARD
CN501
91
15
A
BD BOARD
CN101
EE
31
31
31
58
41
3
1
E
E
*
NOT REPLACEABLE:
BUILT IN TRANSFORMER
*
12
1-681-128-
11
(11)
R
ANALOG
OUT
L
J681
IC651
DIGITAL
OUT
OPTICAL
POWER SW BOARD
POWER
2
1
2
1
11
(11)
1-681-131-
2
1
AC IN
A
B
C
D
E
F
G
H
1 2 3 4 5 6 7 8 9
(Page 18)
(Page 14)

1717
CDP-XE270/XE370
6-5. SCHEMATIC DIAGRAM – LOADING/MAIN/POWER SW Boards – • See page 20 for IC Block Diagram.
(Page 15)
(Page 19)

1818
CDP-XE270/XE370
JW511
IC561
R522
R521
C532
R523
R524
JW505
C561
R525
C502
R511
JW514
X501
Q541
R532
R531
R501
C501
JW504
R528
JW510
JW502
JW507
R551
R552
JW506
CN501
JW509
JW501
JW503
R527 C531 JW515
R561
R541
JW513
JW512
JW508
R526
R533
R562
JW516
NO502
NO301
R502 R503
R504
S501 S502
S503 S504
TP
(ADJ)
(GND)
TP
(AFADJ)
DISPLAY BOARD
l AMS L
PUSH ENTER
J681
B
MAIN BOARD
CN621
x
S524
X
S523
M
S527
m
S526
m
S522
A OPEN/CLOSE
S521
IC501
E
12 4 32 34 35
FL501
FLUORESCENT INDICATOR TUBE
21
13
1-681-129-
11
(11)
45
31
12
TIMEPLAY MODE
CLEAR REPEAT
KEY BOARD
11
(11)
1-681-130-
S501 – 504
S521 – 524,
S526, 527
A
B
C
D
E
F
1 2 3 4 5 6 7 8 9 10 11 12
6-6. PRINTED WIRING BOARDS –DISPLAY/KEY Boards –•See page 13 for Circuit Boards Location.
IC501 C-6
IC561 C-12
Q541 C-7
•Semiconductor
Location
Ref. No. Location
(Page 16)

1919
CDP-XE270/XE370
6-7. SCHEMATIC DIAGRAM –DISPLAY/KEY Boards –•See page 20 forWaveform.
(Page 17)

2020
CDP-XE270/XE370
1IC101 ta (RFAC) (CD Play Mode) 6IC101 w; (SCOR) (CD Play Mode) 1IC501 es (XTAL)
2IC101 rd (RFDC) (CD Play Mode) 7 IC101 yj (XTAO) (CD Play Mode)
3IC101 el (FE) (CD Play Mode)
4IC101 ra (TE) (CD Play Mode)
•Waveforms
–BD Board –
5IC101 wh (MDP) (CD Play Mode)
1.3 Vp-p
5.2 Vp-p
13.4 ms
5.5 Vp-p
250 ns
1.4 Vp-p
5.9 Vp-p
59 ns
approx.
200 mVp-p
approx.
400 mVp-p
2.7 V
7.5
µ s
–DISPLAY Board –•IC Block Diagrams –BD Board –
IC101 CXD2587Q
TE
RFDC
CE
IGEN
AVSS0
ADIO
AVDD0
CLTV
FILO
AVSS3
VSS
AVDD3
DOUT
VDD
PCO
FILI ASYO
ASYI
RFAC
BIAS
SSTP
DFCT
MIRR
MDP
LOCK
FOK
SFDR
VSS
TEST
FRDR
FE
VC
COUT
SE
XTSL
TES1
SRDR
TFDR
FFDR
TRDR
2
1
70
71
68
69
66
67
64
65
62
61
63
73
74
72
75
76
77
78
79
80
4
XRST
3
SQCK
SQSO
59
8
7
6
56
60 53
54
55
59 57
58 51
52 48
49
50 47 44
45
46 43 41
42
XLAT
CLOK
SENS
SYSM
DATA
XUGF
XPCK
GFS
C2PO
WFCK
10 11 12 13 14 15 16 17 18 19 20
21
22
23
24
25
26
32
33
30
31
36
37
34
35
39
40
38
28
27
29
SPOA
ATSK
SCLK
VDD
SCOR
SPOB
XLON
XTAI
XVDD
EMPH
AVDD1
AOUT1
AIN1
XTAO
XVSS
AIN2
AOUT2
AVDD2
RMUT
LOUT2
LOUT1
BCK
LRCK
PCMD
LMUT
AVSS1
AVSS2
CPU
INTERFACE
SERVO AUTO
SEQUENCER
SERIAL IN
INTERFACE
OVER SAMPLING
DIGITAL FILTER
3rd ORDER
NOISE SHAPER
PWM PWM
EFM
DEMODULATOR
TIMING
LOGIC
DIGITAL
OUT
D/A
INTERFACE
DIGITAL
PLL
ASYMMETRY
CORRECTOR
CLOCK
GENERATOR
MIRR, DFCT,
FOK
DETECTOR
DIGITAL
CLV
SUBCODE
PROCESSOR
SERVO
INTERFACE
SERVO DSP
FOCUS
SERVO
TRACKING
SERVO
SLED
SERVO
PWM GENERATOR
FOCUS PWM
GENERATOR
TRACKING
PWM GENERATOR
SLED PWM
GENERATOR
16K
RAM
ERROR
CORRECTOR
INTERNAL BUS
A/D
CONVERTER
OPERATIONAL
AMPLIFIER
ANALOG SWITCH