Sony SPP-ID300 User manual

SERVICE MANUAL
Serial Number
SPP-ID300/ID400
US Model
Canadian Model
SUPPLEMENT-1
File this supplement with the service manual.
Subject: BASE (MAIN) and HAND (MAIN) boards Modification
(ENG-99003)
1. DISCRIMINATION
On this set, the boards have been changed in the midway of production.
Refer to this service manual supplement-1, if the serial number given on the bottom of the base unit is as listed below.
If the given serial number does not correspond to the following table, refer to original service manual (9-925-742-11) .
Model Serial Number
SPP-ID300: US model 220,007 and later
SPP-ID300: Canadian model 113,004 and later
SPP-ID400: US model 254,010 and later
SPP-ID400: Canadian model 279,016 and later

– 2 –
TABLE OF CONTENTS
1. DISCRIMINATION .................................................... 1
2. TEST MODE
2-1. Base Unit ......................................................................... 3
2-2. Handset ............................................................................ 5
3. ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 7
Handset ............................................................................ 10
4. DIAGRAMS
4-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 13
4-2. Printed Wiring Board
– BASE UNIT Section (SPP-ID300) –........................... 15
4-3. Schematic Diagram
– BASE UNIT Section (SPP-ID300) –........................... 17
4-4. Printed Wiring Boards
– BASE UNIT Section (SPP-ID400) –........................... 19
4-5. Schematic Diagram
– BASE UNIT Section (SPP-ID400) –........................... 21
4-6. Printed Wiring Board
– HANDSET Section – ................................................... 23
4-7. Schematic Diagram
– HANDSET Section – ................................................... 25
5. EXPLODED VIEWS................................................ 27
6. ELECTRICAL PARTS LIST ............................... 28

– 3 –
1 CH
7 CH
17 CH
10 CH
8 CH
19 CH
11 CH
9 CH
20 CH
25 CH
12 CH
21 CH
2 CH
13 CH
22 CH
3 CH
14 CH
23 CH
4 CH
15 CH
24 CH
18 CH
5 CH
16 CH
6 CH
2. TEST MODE (SPP-ID300)
Note: See the original service manual for SPP-ID400.
2-1. BASE UNIT
[Setting theTest Mode]
1. Power on with press the [PAGE] key for two seconds.
2. CHARGE LED turns on for one second, and the Test Mode is set.
* Press the [PAGE] key for two seconds in test mode, EEPROM (IC102) is been initialize and CHARGE LED turns on.
After this operation, it isn’t able to change Test Mode No. and to change channel.
[Releasing theTest Mode]
To release the Test Mode, perform as follows:
• Turn off the power (disconnect and reconnect theAC adapter plug).
• Set the handset to charge on the base unit (except Test Mode 9).
• Bell in (except Test Mode 8).
[Changing theTest Mode Step]
1. Set the [DIALMODE] switch to the [P] (PULSE) position.
2. Press the [PAGE] key.
3. A step is changed each time the key is pressed, and CHARGE LED turns on for 300 msec.
[Changing the Channel]
1. Set the [DIALMODE] switch to the [T] (TONE) position.
2. Press the [PAGE] key.
3. A channel is changed each time the key is pressed, and CHARGE LED turns on for 300 msec.
* Channel will be back to initial channel (6 CH), when Test Mode No. is changed.
When it is Test Mode 12 or 13, DTMF will be changed.
• Channel Rotation

– 4 –
[Test Mode Execution]
Press the [PAGE] key to execute any of the following tests:
1 VCO/TX FREQ. ADJ H H H L L
2 TX MODE CHECK L H H L H
3 TX DATA 1 H H H L L *1
4 RX ADJ H L L H H
5 DUPLEX L L H L H
6 DATA IN CHECK L L H L L *2
7 RSSI CHECK L L H L H *3
8 BELL CHECK H H L H L *4
9 CHARGE CHECK H H L H L *5
10 DTMF SINGLE TONE H H L H H *6
11 DTMF DUAL TONE H H L H H *7
12 TX DATA 2 H H H L L *8
Step Test Mode Name
TX MUTE (PDT pin 1)
RX MUTE (EO pin @º)
TXBPWR (pin $¡)
TXBENB (pin $º)
RLCONT (pin #¡)
Remarks
PLL IC
control
(IC1)
Hard control
(IC2)
* Initial Channel of each step: 6 CH
*1. Test Mode 3: Continue output TX data as “ 0000……” (200 Hz).
*2. Test Mode 6: When locked receiving data is “ 0000……” or “ 1111……”, CHARGE LED turns on. (200, 400 Hz)
*3. Test Mode 7: When RSSI (IC2 pin #¢) is “ L” during 100 msec, CHARGE LED turns on.
*4. Test Mode 8: When it detects bell, CHARGE LED turns on.
*5. Test Mode 9: When CHRGIN (IC2 pin @£) is “ L” (charge on), CHARGE LED turns on.
*6. Test Mode 10: Set the [DIALMODE] switch to the [T] (TONE) position, and press the [PAGE] key.
DTMF will be changed.
ROW 1 →2 →3 →4 →COL1 →COL2 →COL3 →COL4 →ROW1 →…… .
*DTMF frequency
ROW 1: 697 Hz COL1: 1209
ROW 2: 770 Hz COL2: 1336
ROW 3: 852 Hz COL3: 1477
ROW 4: 941 Hz COL4: 1633
*7. Test Mode 11: Set the [DIALMODE] switch to the [T] (TONE) position, and press the [PAGE] key.
DTMF will be changed.
1 →2 →3 →4 →5 →6 →7 →8 →9 →0 →→# →A →B →C →D →
1 →…… .
*8. Test Mode 12: Continue output TX data as “ 1111……” (400 Hz).
*

– 5 –
1 CH
7 CH
17 CH
10 CH
8 CH
19 CH
11 CH
9 CH
20 CH
25 CH
12 CH
21 CH
2 CH
13 CH
22 CH
3 CH
14 CH
23 CH
4 CH
15 CH
24 CH
18 CH
5 CH
16 CH
6 CH
2-2. HANDSET
[Setting theTest Mode]
Power on with press the [*] key and the [#] key simultaneously for one second, and the Test Mode is set.
* Press the [SPEEDDIAL] key in Test Mode, EEPROM (IC501) is been initialize, and it beeps confirm tone.
* LIQUID CRYSTAL DISPLAY turns on/off, when press the [#] key.
[Releasing theTest Mode]
To release the Test Mode, perform as follows:
• Press the [TALK] key or [REDIAL/PAUSE] key.
• Turn off the power (disconnect and reconnect Battery connector).
• Set the handset to charge on the base unit (except Test Mode 10).
[Changing theTest Mode Step]
Press the each key of the Test Mode No.
[Changing the Channel]
Press the [CHANNEL] key.
* The channel is back to initial channel (6 CH), when Test Mode step is changed.
• Channel Rotation

– 6 –
[Test Mode Execution]
Press the each key for the desired Test Mode step to execute any of the following tests:
* Initial Channel of each step: 6 CH
*1. Test Mode 3: Continue output TX data as “ 0000……” or “ 1111……”. (200, 400 Hz)
To change TX data by press the [FLASH] key. (Initial data: “ 0000……” )
*2. Test Mode 9: When BATLOW (IC503 pin $∞) is “ L” (battery low), it beeps confirm tone.
*3. Test Mode 10: When CHARGE (IC503 pin !¢) is “ H” (Charge on), it beeps confirm tone.
*4. Test Mode 11: When locked receiving data is “ 0000……” or“ 1111……”, it beeps confirm tone. (200, 400 Hz)
*5. Test Mode 12: CPU clock keeps stopping.
*6. Test Mode 13: When RSSI (IC503 pin $™) is “ L ” during 100 msec, it beeps confirm tone.
1 VCO/TX FREQ. ADJ 1 1 1 1 1 0 1 L IN L
2 TX MODE CHECK 2 1 0 1 1 0 1 L IN L
3TXDATA 3111101LINL*1
4 RX ADJ 4 0 1 0 1 0 1 L IN L
5 RX CHECK 5 0 1 0 1 0 1 H L L
6 BELL HIGH 6 1 1 1 1 0 1 L IN L
7 BELL LOW 7 1 1 1 1 0 1 L IN L
8 DUPLEX 8 0 0 0 1 0 1 L IN L
9 BAT. LOW CHECK 9 1 1 1 1 0 1 H L L *2
10 CHARGE CHECK 0 1 1 1 1 0 1 H L L *3
11 DATA IN CHECK 0 1 0 1 0 1 L IN L *4
12 STOP
REDIAL/
1 1 1 1 0 1 IN IN IN *5
PAUSE
13 RSSI CHECK PGM 0 1 0 1 0 1 L IN L *6
Step Test Mode Name
KEY SP MUTE (SAO2 pin !¶) TX MUTE (PDT pin 1) RX MUTE (EO pin @º)
ALC DIS LIM DIS CLK DIS TXVCO (pin $¡)
TXBPWR (pin #ª)
PXBPWR (pin %º)
Remarks
PLL IC
control
(IC504)
Hard control
(IC503)

– 7 –
3. ELECTRICAL ADJUSTMENTS
0 dBm = 0.775 V
BASE UNIT
• Make the set in test mode. (See page 3)
–TX Adjustment and Check –
1.TX VCO Adjustment
Setting:
Procedure:
1. Connect a digital voltmeter to TP (TXVCO) and TP (GND).
2. Adjust L10 so that the value of digital voltmeter becomes 2.7
±0.05 V (SPP-ID300) or 2.8 ±0.05 V (SPP-ID400) .
2. Power Check
Setting:
Procedure:
1. Connect a power meter to TP (ANT) and TP (GND).
2. Check that the value of power meter is 7.5 ±3 dBm.
3. Frequency Check
Setting:
Procedure:
1. Connect a frequency counter to TP (ANT) and TP (GND).
2. Check that the value of frequency counter is 46.77 MHz ±1.2
kHz.
4. RXVCO Adjustment
Setting:
Procedure:
1. Connect a digital voltmeter to TP (RXVCO) and TP (GND).
2. Adjust L7 so that the value of digital voltmeter becomes 1.3
±0.05 V.
5. Modulation Sensitivity Check
Setting:
Procedure:
1. Connect an AF OSC to the LINE jack (J1).
2. Connect a deviation meter to TP (ANT) and TP (GND).
3. Set the [DIALMODE] switch (S1) to the [P] (PULSE) position
(SPP-ID300) .
4. Press the [PAGE] key (S4) to change the test mode step to TX
MODE CHECK. (SPP-ID300)
Press the [SPEAKERPHONE] key (S2) to change the test mode
step to TX MODE CT PASS. (SPP-ID400)
5. Check that the value of deviation meter is ±2.25 kHz to ±3.95
kHz.
6. Data Deviation Check
Setting:
Procedure:
1. Press the [PAGE] key (S4) to change the test mode step to TX
DATA1. (SPP-ID300)
Press the [SPEAKERPHONE] key (S2) twice to change the test
mode step to TX DATA. (SPP-ID400)
2. Check that the value of deviation meter is ±3.75 kHz to ±6.75
kHz.
7. Channel Change Check
Setting:
Procedure:
1. Connect a frequency counter to TP (ANT) and TP (GND).
2. Set the [DIALMODE] switch (S1) to the [T] (TONE) position.
(SPP-ID300)
3. When press the [PAGE] key (S4) (SPP-ID300) or the
[INTERCOM] key (S3) (SPP-ID400) , check that the frequency
of frequency counter (channel) is changed each time the key is
pressed, and CHARGE LED lights up for 300 msec.
+
–
digital voltmeter
TP (TX VCO)
TP (GND)
+
–
power meter
TP (ANT)
TP (GND)
+
–
frequency counter
TP (ANT)
TP (GND)
+
–
digital voltmeter
TP (RX VCO)
TP (GND)
AF OSC
ATT LINE jac
k
(J1)
600
Ω
1 kHz, –20 dBm
+
–+
–+
–
+
–
deviation meter
TP (ANT)
TP (GND)
+
–
deviation meter
TP (ANT)
TP (GND)
+
–
frequency counter
TP (ANT)
TP (GND)

– 8 –
4. Sensitivity Adjustment
Setting:
Procedure:
1. Connect a SINAD meter and level meter to the LINE jack (J1).
2. Change the output level of SSG to 20 dBµ EMF.
3. Change the carrier frequency of SSG to 48.76 MHz.
4. Set the [DIALMODE] switch (S1) to the [T] (TONE) position
(SPP-ID300) .
5. Press the [PAGE] key (S4) (SPP-ID300) or the [INTERCOM] key
(S3) (SPP-ID400) four times to change the channel to 11CH.
6. Adjust L6 to get maximum reading on the SINAD meter.
7. Check that the value of level meter is more than 12 dB.
8. Change the output level of SSG to 5 dBµ EMF.
9. Adjust L6 to get maximum reading on the SINAD meter.
10. Check that the value of level meter is more than 12 dB.
11. Change the frequency of SSG to 49.5 MHz.
12. Press the [PAGE] key (S4) (SPP-ID300) or the [INTERCOM] key
(S3) (SPP-ID400) to change the channel to 25CH.
13. Check that the value of level meter is more than 12 dB.
5. RSSI ON/OFF Level Check
Setting:
Procedure:
1. Change the carrier frequency of SSG to 49.83 MHz.
2. Change the modulation of SSG to OFF (±0 kHz deviation).
3. Change the output level of SSG to 15 dBµ EMF.
4. Set the [DIALMODE] switch (S1) to the [P] (PULSE) position
(SPP-ID300) .
5. Press the [PAGE] key (S4) three times (SPP-ID300) or the
[SPEAKERPHONE] key (S2) twice (SPP-ID400) to change the
test mode step to RSSI CHECK.
6. Check that the CHARGE LED (D11) lights up.
7. Change the output level of SSG to 3 dBµ EMF.
8. Check that the CHARGE LED (D11) goes off.
– RX Adjustment and Check –
1. RX VCO Voltage Check
Setting:
Procedure:
1. Connect a digital voltmeter to TP (RX VCO) and TP (GND).
2. Check that the value of digital voltmeter is 1.3 ±0.1 V
2. DISCRI Coil Adjustment
Setting:
Procedure:
1. Connect a SSG to TP (ANT) and TP (GND) .
2. Connect a noise meter to TP (DISC) and TP (GND) .
3. Set the [DIALMODE] switch (S1) to the [P] (PULSE) position.
(SPP-ID300)
4. Press the [PAGE] key (S4) three times to change the test mode
step to RX ADJ. (SPP-ID300)
Press the [SPEAKERPHONE] key (S2) four times to change the
test mode step to RX ADJ TXB ON. (SPP-ID400)
5. Adjust L3 so that the value of noise meter becomes maximum.
3.TEL Out Level Adjustment
Setting:
Procedure:
1. Connect a noise meter to the LINE jack (J1) .
2. Adjust RT2 so that the value of noise meter becomes –3.5 ±0.5
dBm.
+
–
digital voltmeter
TP (RX VCO)
TP (GND)
SSG
Carrier frequency: 49.83 MHz
Modulation: 1 kHz,
± 3 kHz deviation
Output level: 66 dB µ EMF
TP (ANT)
TP (GND)
+
–
noise meter
TP (DISC
)
TP (GND)
noise meter
600
Ω
+
–LINE jac
k
(J1)
SSG
Carrier frequency: 48.76 MHz
Modulation: 1 kHz,
± 3 kHz deviation
Output level: 20 dB µ EMF
TP (ANT)
TP (GND)
level meter
600
Ω
+
–
+
–
SINAD meter
LINE jac
k
(J1)
SSG
Carrier frequency: 49.83 MHz
Modulation: off,
± 0 kHz deviation
Output level: 15 dB µ EMF
TP (ANT)
TP (GND)

– 9 –
6. Data In Check
Setting:
Procedure:
1. Change the modulation of SSG to 200 Hz (±4 kHz deviation).
2. Set the [DIALMODE] switch (S1) to the [P] (PULSE) position
(SPP-ID300) .
3. Press the [PAGE] key (S4) eleven times (SPP-ID300) or the
[SPEAKERPHONE] key (S2) twice (SPP-ID400) to change the
test mode step to DATA IN CHECK.
4. Check that the CHARGE LED (D11) lights up or blinks.
Adjustment Location:
SSG
Carrier frequency: 49.83 MHz
Modulation: 200 Hz,
± 4 kHz deviation
Output level: 3 dB
µ EFM
TP (ANT)
TP (GND)
TP (TX VCO)
TP (RX VCO)
TP (ANT)
TP (GND)
TP (DISC)
J1
S1
T (TONE) P (PULSE)
L10 TX VCO Adjustment
L7 RX VCO Adjustment
L3 DISCRI Coil Adjustment
L6 Sensitivity Adjustment
RT2TEL Out Level Adjustment
– BASE (MAIN) BOARD (Component Side) – – BASE (MAIN) BOARD (Conductor Side) –
˜

– 10 –
HANDSET
• Make the set in test mode. (See page 3)
–TX Adjustment and Check –
1.TX VCO Adjustment
Setting:
Procedure:
1. Connect a digital voltmeter to IC504 pin 1and TP (GND).
2. Press [1] key to change the test mode step to VCO/TX FREQ.
ADJ.
3. Adjust L509 so that the value of digital voltmeter becomes 2
±0.05 V.
2. Power Check
Setting:
Procedure:
1. Connect a power meter to TP (ANT) and TP (GND).
2. Check that the value of power meter is 2.5 ±3 dBm.
3. Frequency Check
Setting:
Procedure:
1. Connect a frequency counter to TP (ANT) and TP (GND).
2. Check that the value of frequency counter is 49.83 MHz ±1.2
kHz.
4. RX VCO Adjustment
Setting:
Procedure:
1. Connect a digital voltmeter to TP (RX VCO) and TP (GND).
2. Adjust L505 so that the value of digital voltmeter becomes 1.3
±0.05 V.
5. Modulation Sensitivity Check
Setting:
Procedure:
1. Remove the microphone (MC501) , and connect anAF OSC to
TP (MIC +) and TP (MIC –) .
2. Connect a deviation meter to TP (ANT) and TP (GND).
3. Press the [2] key to change the test mode step to TX MODE
CHECK.
4. Check that the value of deviation meter is ±2.25 kHz to ±3.95
kHz.
6. Data Deviation Check
Setting:
Procedure:
1. Press the [3] key to change the test mode step to TX DATA.
2. Check that the value of deviation meter is ±4.5 kHz to ±6.5
kHz.
+
–
digital voltmeter
IC504 pin 1
TP (GND)
+
–
power meter
TP (ANT)
TP (GND)
+
–
frequency counter
TP (ANT)
TP (GND)
+
–
digital voltmeter
TP (RX VCO)
TP (GND)
AF OSC
ATT TP (MIC +)
TP (MIC –)
600
Ω
1 kHz, 20 mV
+
–+
–+
–
+
–
deviation meter
TP (ANT)
TP (GND)
+
–
deviation meter
TP (ANT)
TP (GND)

– 11 –
– RX Adjustment and Check –
1. RX VCO Voltage Check
Setting:
Procedure:
1. Connect a digital voltmeter to TP (RXVCO) and TP (GND).
2. Press [1] key to change the test mode step to VCO/TX FREQ.
ADJ.
3. Check that the value of digital voltmeter is 1.3 ±0.1 V.
2. DISCRI Coil Adjustment
Setting:
Procedure:
1. Connect a SSG to TP (ANT) and TP (GND) .
2. Connect a noise meter to TP (DISC) and TP (GND) .
3. Press the [4] key to change the test mode step to RXADJ.
4. Adjust L502 so that the value of noise meter becomes
maximum.
3. Speaker Output Level Adjustment
Setting:
Procedure:
1. Disconnect the speaker (SP801) , and connect a noise meter to
J502.
2. Adjust RT501 so that the value of noise meter becomes 80 ±5
mV.
4. Sensitivity Adjustment
Setting:
Procedure:
1. Change the carrier frequency of SSG to 46.97 MHz.
2. Change the output level of SSG to 20 dBµ EMF.
3. Connect a SINAD meter and level meter to J502.
4. Press the [CHANNEL] key three times to change the channel to
10CH.
5. Adjust L510 to get maximum reading on the SINAD meter.
6. Check that the value of level meter is more than 12 dB.
7. Change the output level of SSG to 4 dBµ EMF.
8. Adjust L510 to get maximum reading on the SINAD meter.
9. Check that the value of level meter is more than 12 dB.
10. Adjust L501 to get maximum reading on the SINAD meter.
11. Check that the value of level meter is more than 12 dB.
12. Change the frequency of SSG to 43.72 MHz.
13. Press the [CHANNEL] key three times to change the channel to
11CH.
14. Adjust L501 to get maximum reading on the SINAD meter.
15. Check that the value of level meter is more than 12 dB.
16. Change the frequency of SSG to 44.48 MHz.
17. Press the [CHANNEL] key three times to change the channel to
25CH.
18. Check that the value of level meter is more than 12 dB.
19. Change the frequency of SSG to 46.77 MHz.
20. Press the [4] key to change the channel to 6CH.
21. Check that the value of level meter is more than 12 dB.
22. Change the frequency of SSG to 44.16 MHz.
23. Press the [CHANNEL] key to change the channel to 18CH.
24. Check that the value of level meter is more than 12 dB.
+
–
digital voltmeter
TP (RX VCO)
TP (GND)
SSG
Carrier frequency: 46.77 MHz
Modulation: 1 kHz,
± 3 kHz deviation
Output level: 66 dB µ EMF
TP (ANT)
TP (GND)
+
–
noise meter
TP (DISC
)
TP (GND)
SSG
Carrier frequency: 46.77 MHz
Modulation: 1 kHz,
± 3 kHz deviation
Output level: 66 dB µ EMF
TP (ANT)
TP (GND)
noise meter
150
Ω
+
–J502 pin
1
J502 pin 2


SSG
Carrier frequency: 46.97 MHz
Modulation: 1 kHz,
± 3 kHz deviation
Output level: 20 dB µ EMF
TP (ANT)
TP (GND)
level meter
150
Ω
+
–
+
–
SINAD meter
J502 pin 1
J502 pin 2



– 12 –
6. Data in Check
Setting:
Procedure:
1. Change the modulation of SSG to 200Hz (±4 kHz deviation).
2. Change the output level of SSG to 4 dBµ EMF.
3. Press the [*] key to change the test mode step to DATA IN
CHECK.
4. Check that the buzzer (SP501) rings continuously.
5. RSSI ON/OFF Level Check
Setting:
Procedure:
1. Change the carrier frequency of SSG to 46.77 MHz.
2. Change the modulation of SSG to OFF (±0 kHz deviation).
3. Change the output level of SSG to 10 dBµ EMF.
4. Press the [PGM] key to change the test mode step to RSSI
CHECK.
5. Check that the buzzer (SP501) does not ring.
6. Change the output level of SSG to 33 dBµ EMF.
7. Check that the buzzer (SP501) rings continuously.
Adjustment Location:
SSG
Carrier frequency: 46.77 MHz
Modulation: off,
± 0 kHz deviation
Output level: 10 dB µ EMF
TP (ANT)
TP (GND)
SSG
Carrier frequency: 46.77 MHz
Modulation: 200 Hz,
± 4 kHz deviation
Output level: 4 dB µ EMF
TP (ANT)
TP (GND)
1
IC504
J5021
2
TP (RX VCO)
TP (ANT)
TP (GND)
TP (DISC)
TP (MIC+)TP (MIC–)
L509 TX VCO Adjustment
L505 RX VCO Adjustment
L502 DISCRI Coil Adjustment
Sensitivity Adjustment L510
L501
RT501
Speaker Output Level Adjustment
– HAND (MAIN) BOARD –
(Side A) – HAND (MAIN) BOARD – (Side B)

– 14 –
4. DIAGRAMS
4-1. NOTE FOR PRINTED WIRING BOARDS
AND SCHEMATIC DIAGRAMS
Note on Printed Wiring Board:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Carbon pattern.
•W: indicates side identified with part number.
•b: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•C: panel designation.
•U: B+ Line.
•H: adjustment for repair.
• Powervoltagesare dc9V andfedwith regulateddc power
supply from DC IN 9 V jack (J2) on the BASE (MAIN)
board, dc 12 V and fed with regulated dc power supply
from LINE jack (J1) on the BASE (MAIN) board with 100
Ωin series, and dc 3.6 V and fed with regulated dc power
supply from battery jack (J501) on the HAND (MAIN)
board.
• Voltages and waveforms are dc with respect to ground in
test mode.
• Voltagesare takenwith aVOM(Inputimpedance 10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
N: RX
O: TX
P: bell
Caution:
Pattern face side: Partsonthepattern facesideseen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
– 13 –
• Waveforms
– BASE (MAIN) Board –
1IC1 #∞ (2LOI)
2IC2 !¢ (X2) (SPP-ID300)
IC2 %∞ (X2) (SPP-ID400)
– HAND (MAIN) Board –
1IC504 #∞ (2LOI)
2IC504 @™ (XIN)
1.2 Vp-p
98 ns
2.8 Vp-p
280 ns
1.2 Vp-p
98 ns
3 Vp-p
238 ns
• IC Block Diagram
IC1 KB8527BQ-2 (BASE (MAIN) Board)
IC504 KB8527BQ-2 (HAND (MAIN) Board)
37
38
39
40
41
42
43
44
45
46
47
48
36 35 34 33 32 30 29 28 27 26 25
OSCILLATOR
IF AMP
(455kHz)
RX
VCO
QUAD
DETECTOR
LIMITING
IF AMP
31
AMP
METER
DRIVER
CARRIER
DETECTOR
IF AMP
(10.7MHz)
23
16
15
14
13
SUM AMP
+
–
LIMITER
GAIN CELL
RECTIFER
ALC
PRI
AMP
SUM AMP
CONTROL COMPANDOR
MUTE
11109876543
21 12
LOW BATTERY
DETECTOR
BUFFER
PROGRAMMABLE COUNTER
(RX)
PROGRAMMABLE COUNTER
(TX)
PROGRAMMABLE COUNTER
(REF) 4_25CNT
fMCU
TX PHASE
DETECTOR
RX PHASE
DETECTOR
SPLATTER
FILTER AMP
REGULATOR
(2.15V)
19
18
17
SPK
AMP
REGULATOR
(1V) 24
22
21
20
+
–
RECTIFIER
GAIN CELL
VREF
PRI
AMP
2nd MIX
1st MIX
SPK
AMP
CPI–
CPI+
GND
VCC
SAO2
SAO1
SAI
EO
ERC
EPI
ALC
VREF
MDO DSCO DSCI RAO QCI GND LD LI VCC 2MO 2LOI 2LOI
2MI
1MO
1LOI
1LOI
VCO
1MI
1MI
GND
VREF
TIF
PDR
VCC
PDT
CO
SFI
SFO
CDO/LDT
GND
DATA
LBD
CLK
EN
AGIC
CRC
FSK
COMPARATOR

SPP-ID300/ID400
– 15 – – 16 –
4-2. PRINTED WIRING BOARD – BASE UNIT Section (SPP-ID300) –
• Semiconductor
Location
D1 A-3
D2 B-3
D3 F-5
D4 E-2
D5 E-3
D6 B-5
D7 F-10
D8 B-10
D9 F-10
D10 F-8
D11 F-9
D101 B-8
D102 B-8
D103 B-8
D104 B-8
D105 C-8
D106 C-4
D107 C-4
D108 C-4
D109 C-4
D110 B-4
D111 C-4
IC1 F-6
IC2 E-8
IC3 A-3
IC4 D-10
IC5 F-9
IC101 B-7
IC103 B-4
Q1 G-5
Q2 D-3
Q3 F-4
Q4 F-5
Q5 E-5
Q6 D-10
Q7 E-3
Q8 B-5
Q9 B-9
Q10 B-9
Q11 B-4
Q12 B-4
Q18 D-6
Q19 A-6
Q20 A-6
Q21 C-7
Ref. No. Location

SPP-ID300/ID400
– 17 – – 18 –
4-3. SCHEMATIC DIAGRAM – BASE UNIT Section (SPP-ID300) – • See page 13 forWaveforms. •See page 14 for IC Block Diagram.

SPP-ID300/ID400
– 19 – – 20 –
4-4. PRINTED WIRING BOARDS – BASE UNIT Section (SPP-ID400) –
• Semiconductor
Location
D1 B-3
D2 B-3
D3 F-5
D4 E-2
D5 E-4
D6 B-3
D7 F-10
D8 B-9
D9 F-10
D10 F-8
D11 F-9
D12 G-9
D13 E-9
D101 B-8
D102 B-9
D103 C-9
D104 B-8
D105 C-8
D106 C-4
D107 C-4
D108 C-4
D109 C-4
D110 C-4
D111 C-4
D112 E-3
IC1 F-6
IC2 E-8
IC3 B-3
IC4 D-10
IC5 F-8
IC6 C-6
IC7 B-7
IC8 D-4
IC101 B-8
IC103 B-4
Q1 G-4
Q2 D-3
Q3 F-4
Q4 F-4
Q5 F-5
Q6 D-10
Q7 E-3
Q8 B-4
Q9 B-9
Q10 B-9
Q11 B-4
Q12 B-4
Q13 D-5
Q14 C-6
Q15 C-6
Q16 C-5
Q17 E-3
Q18 C-7
Q19 A-8
Q20 A-8
Q21 C-8
Ref. No. Location

SPP-ID300/ID400
– 21 – – 22 –
4-5. SCHEMATIC DIAGRAM – BASE UNIT Section (SPP-ID400) – • See page 13 forWaveforms. •See page 14 for IC Block Diagram.

SPP-ID300/ID400
– 23 – – 24 –
4-6. PRINTED WIRING BOARD – HANDSET Section –
• Semiconductor
Location
D501 F-5
D502 F-10
D503 F-11
D504 E-7
D505 F-10
D506 F-10
D510 E-11
D511 F-11
D514 F-10
IC502 E-10
IC503 E-9
IC504 F-3
IC505 F-10
Q501 E-1
Q502 E-10
Q503 E-6
Q504 F-4
Q505 F-4
Q506 F-8
Q509 F-8
Q510 F-9
Q511 F-10
Q512 F-10
Q516 F-10
Q517 F-7
Q518 F-7
Ref. No. Location

SPP-ID300/ID400
– 25 – – 26 –
4-7. SCHEMATIC DIAGRAM – HANDSET Section – • See page 13 for Waveforms. •See page 14 for IC Block Diagram.

– 28 –
5. EXPLODED VIEWS
DIFFERENCE PARTS LIST
– 27 –
• Items marked “*” are not stocked since they are
seldom required for routine service. Some delay
should be anticipated when ordering these items.
Page FORMER NEW
Ref. No. Part No. Description Remark
*7 A-3672-719-A HAND (MAIN) BOARD, COMPLETE
(ID300)
*7 A-3672-717-A HAND (MAIN) BOARD, COMPLETE
(ID400)
*58 A-3672-718-A BASE (MAIN) BOARD, COMPLETE
(ID300)
*109 A-3672-716-A BASE (MAIN) BOARD, COMPLETE
(ID400)
Ref. No. Part No. Description Remark
*7 A-3672-350-A HAND (MAIN) BOARD, COMPLETE
(ID300)
*7 A-3672-352-A HAND (MAIN) BOARD, COMPLETE
(ID400)
*58 A-3672-349-A BASE MAIN BOARD, COMPLETE
*109 A-3672-351-A BASE MAIN BOARD, COMPLETE
35
33
34
6. ELECTRICAL PARTS LIST
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
*A-3672-716-A BASE (MAIN) BOARD, COMPLETE (ID400)
*A-3672-718-A BASE (MAIN) BOARD, COMPLETE (ID300)
****************************
*3-021-029-01 CONTACT (ANTENNA)
< CAPACITOR >
C1 1-165-319-11 CERAMIC CHIP 0.1uF 50V
C2 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C3 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C4 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C5 1-164-005-11 CERAMIC CHIP 0.47uF 25V
C6 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C7 1-162-809-11 CERAMIC CHIP 0.047uF 10% 25V
C8 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C9 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C10 1-164-344-11 CERAMIC CHIP 0.068uF 10% 25V
C11 1-164-489-11 CERAMIC CHIP 0.22uF 10% 16V
C12 1-163-012-11 CERAMIC CHIP 1800PF 10% 50V
(ID400)
C12 1-163-017-00 CERAMIC CHIP 4700PF 10% 50V
(ID300)
C13 1-163-133-00 CERAMIC CHIP 470PF 5% 50V
C14 1-163-014-11 CERAMIC CHIP 2700PF 10% 50V
(ID400)
C14 1-163-017-00 CERAMIC CHIP 4700PF 10% 50V
(ID300)
C15 1-163-024-00 CERAMIC CHIP 0.018uF 10% 50V
C16 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C17 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C18 1-162-843-11 CERAMIC 0.022uF 10% 16V
C19 1-130-798-00 FILM 1uF 10% 250V
C20 1-162-318-11 CERAMIC 0.001uF 10% 500V
C21 1-102-228-00 CERAMIC 470PF 10% 500V
C22 1-163-139-00 CERAMIC CHIP 820PF 5% 50V
(ID400)
C23 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C24 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C25 1-164-344-11 CERAMIC CHIP 0.068uF 10% 25V
C26 1-163-017-00 CERAMIC CHIP 4700PF 10% 50V
C27 1-135-177-21 TANTALUM CHIP 1uF
C28 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C29 1-104-660-11 ELECT 47uF 20% 16V
C30 1-163-037-11 CERAMIC CHIP 0.022uF 10% 25V
(ID400)
C31 1-115-871-11 ELECT 1uF 20% 50V
C32 1-104-660-11 ELECT 47uF 20% 16V
C33 1-163-023-11 CERAMIC CHIP 15000PF 10% 50V
C34 1-163-249-11 CERAMIC CHIP 82PF 5% 50V
(ID400)
C34 1-163-267-11 CERAMIC CHIP 470PF 5% 50V
(ID300)
C35 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C36 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
C37 1-163-809-11 CERAMIC CHIP 47000PF 10% 25V
(ID400)
C38 1-163-037-11 CERAMIC CHIP 0.022uF 10% 50V
C39 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C40 1-126-382-11 ELECT 100uF 20% 10V
C41 1-163-017-00 CERAMIC CHIP 0.0047uF 10% 50V
C42 1-126-795-11 ELECT 10uF 20% 50V
(ID400)
C43 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C44 1-163-241-11 CERAMIC CHIP 39PF 5% 50V
C45 1-163-223-11 CERAMIC CHIP 6PF 0.5PF 50V
(ID400)
C45 1-163-226-11 CERAMIC CHIP 9PF 0.5PF 50V
(ID300)
C46 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V
C47 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C48 1-163-809-11 CERAMIC CHIP 0.047uF 10% 25V
C49 1-163-018-11 CERAMIC CHIP 5600PF 10% 50V
C50 1-163-237-11 CERAMIC CHIP 27PF 5% 50V
C51 1-163-233-11 CERAMIC CHIP 18PF 5% 50V
C52 1-126-795-11 ELECT 10uF 20% 50V
C53 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C54 1-163-037-00 CERAMIC CHIP 0.022uF 10% 50V
C55 1-164-004-11 CERAMIC CHIP 0.1uF 10% 25V
(ID400)
C56 1-163-017-00 CERAMIC CHIP 4700PF 10% 50V
(ID300)
C56 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
(ID400)
C57 1-163-037-11 CERAMIC CHIP 0.022uF 10% 50V
C58 1-163-017-00 CERAMIC CHIP 0.0047uF 10% 50V
C59 1-163-021-11 CERAMIC CHIP 0.01uF 10% 50V
C60 1-163-229-11 CERAMIC CHIP 12PF 5% 50V
C61 1-163-251-11 CERAMIC CHIP 100PF 5% 50V
C62 1-163-235-11 CERAMIC CHIP 22PF 5% 50V
C63 1-163-241-11 CERAMIC CHIP 39PF 5% 50V
BASE (MAIN)
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. . uPA. . : µPA. .
uPB. . : µPB. . uPC. . : µPC. .
uPD. . : µPD. .
• CAPACITORS
uF: µF
• COILS
uH: µH
When indicating parts by reference
number, please include the board.