Sony Cyber-shot DSC-T200 User manual

SERVICE MANUAL
LEVEL 2
Link
DISASSEMBLY
SERVICE NOTE
SPECIFICATIONS
SCHEMATIC DIAGRAMS
FRAME SCHEMATIC DIAGRAM
BLOCK DIAGRAMS
REPAIR PARTS LIST
PRINTED WIRING BOARDS
Link
Revision History
Revision History
Sony EMCS Co.
DSC-T200_L2
Internal memory
ON BOARD
Internal memory
ON BOARD
Ver. 1.4 2008.09
DIGITAL STILL CAMERA
2008I0800-1
© 2008.09
Published by Kohda TEC9-852-215-33
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Japanese Model
Tourist Model
The components identified by
mark 0or dotted line with
mark 0are critical for safety.
Replace only with part num-
ber specified.
Les composants identifiés par une
marque 0sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
• Precaution on Replacing the SY-182 Board
DSC-T200
Photo: Silver
Precaution on Replacing the Exterior Screw
Revised-2
Replace the previously issued
SERVICE MANUAL 9-852-215-32
with this Manual.

— 2 —
DSC-T200_L2
SPECIFICATIONS
Audio output (Monaural)
USB communication
: Video output
Camera
[System]
Image device: 7.18 mm (1/2.5 type) color CCD,
Primary color filter
Total pixel number of camera:
Approx. 8 286 000 pixels
Effective pixel number of camera:
Approx. 8 083 000 pixels
5.8 – 29.0 mm (35 – 175 mm when
converted to a 35 mm still camera) F3.5 – 4.4
Exposure control: Automatic exposure, Scene
Selection (10 modes)
White balance: Automatic, Daylight, Cloudy,
Fluorescent 1, 2, 3, Incandescent, Flash
File format (DCF compliant):
Still images: Exif Ver. 2.21 JPEG compliant,
DPOF compatible
Movies: MPEG1 compliant (Monaural)
Recording media: Internal Memory (approx.
31 MB), “Memory Stick Duo”
Flash: Flash range (ISO sensitivity
(Recommended Exposure
approx. 0.8 to 2.9 m (2 feet 7 1/2 inches to
9 feet 6 1/4 inches) (T)
[Input and Output connectors]
Multi connector
USB communication : Hi-Speed USB (USB 2.0
compliant)
[LCD screen]
LCD panel: Wide (16:9), 8.8 cm (3.5 type) TFT drive
[Power, general]
Power: Rechargeable battery pack NP-BD1, 3.6 V
NP-FD1 (not supplied), 3.6 V
AC-LS5K AC Adaptor (not supplied), 4.2 V
Power consumption (during shooting): 1.0 W
Operating temperature: 0 to 40 ºC (32 to 104 ºF)
Storage temperature: –20 to +60 ºC (–4 to +140 ºF)
protrusions)
Mass (including NP-BD1 battery pack, paint pen
and strap etc.): Approx. 186 g (6.6 oz)
Microphone: Monaural
Speaker: Monaural
Exif Print: Compatible
PRINT Image Matching III: Compatible
PictBridge: Compatible
BC-CSD battery charger
Power requirements: AC 100 V to 240 V, 50/60 Hz,
2.2 W
Output voltage: DC 4.2 V, 0.33 A
Operating temperature: 0 to 40 ºC (32 to 104 ºF)
Storage temperature: –20 to +60 ºC (–4 to +140 ºF )
Mass: Approx. 75 g (2.7 oz)
Rechargeable battery pack NP-BD1
Used battery: Lithium-ion battery
Maximum voltage: DC 4.2 V
Nominal voltage: DC 3.6 V
Capacity: 2.4 Wh (680 mAh)
Design and specifications are subject to change
without notice.
Lens: Carl Zeiss Vario-Tessar 5×zoom lens f = Total number of dots: 230 400 (960×240) dots
Dimensions: 93.5×59.3×20.4 mm (3 3/4×
2 3/8×13/16 inches) (W/H/D, excluding
Dimensions: Approx. 62×24×91 mm (2 1/2×
31/32×3 5/8 inches) (W/H/D)
Index) set to Auto): approx. 0.1 to 3.7 m
(4 inches to 12 feet 1 3/4 inches) (W)/

DSC-T200_L2
— 3 —
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. FLEXIBLE Circuit Board Repairing
•Keep the temperature of the soldering iron around 270°C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.

1-1
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1. SERVICE NOTE
1-2. SELF-DIAGNOSIS FUNCTION
1-2-1. Self-diagnosis Function
When problems occur while the unit is operating, the self-diagnosis
function starts working, and displays on the LCD screen what to
do.
Details of the self-diagnosis functions are provided in the Instruction
manual.
1-2-2. Self-diagnosis Display
When problems occur while the unit is operating, the LCD screen
shows a 4-digit display consisting of an alphabet and numbers, which
blinks at 3.2 Hz. This 5-character display indicates the “repaired
by:”, “block” in which the problem occurred, and “detailed code”
of the problem.
0 0
3 2C
Repaired by:
Refer to “1-2-3. Self-diagnosis Code Table”.
Indicates the appropriate
step to be taken.
E.g.
13 ....Format the “Memory Stick Duo”.
32 ....Turn on power again.
Block Detailed Code
Blinks at 3.2 Hz
C : Corrected by customer
E : Corrected by service
engineer
LCD screen
1-1. PRECAUTION ON REPLACING THE SY-182 BOARD
DESTINATION DATA
When you replace to the repairing board, the written destination data of repairing board also might be changed to original setting.
Refer to Service Manual ADJ, and perform “DESTINATION DATA WRITE”.
USB SERIAL No.
The set is shipped with a unique ID (USB Serial No.) written in it.
This ID has not been written in a new board for service, and therefore it must be entered after the board replacement.
Refer to Service Manual ADJ, and perform “USB SERIAL No. INPUT”.

1-2
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1-3. PROCESS AFTER FIXING FLASH ERROR
When “FLASH error” (Self-diagnosis Code E : 91 : 01) occurs, to prevent any abnormal situation caused by high voltage, setting of the flash
is changed automatically to disabling charge and flash setting.
After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the HOME screen.
Method for Initializing the Flash Error Code
1-2-3. Self-diagnosis Code Table
C
C
E
E
E
E
E
E
E
E
E
Block
Function
13
32
61
61
62
62
62
62
62
91
92
Detailed
Code
01
01
00
10
02
10
11
12
20
01
00
Symptom/State
The internal memory has experienced a
format error.
“Memory Stick Duo” is unformatted.
“Memory Stick Duo” is broken.
“Memory Stick Duo” type error
The camera cannot read or write data
on the “Memory Stick Duo”.
Trouble with hardware
Difficult to adjust focus
(Cannot initialize focus)
Zoom operations fault
(Cannot initialize zoom lens.)
Abnormality of IC for steadyshot.
Lens initializing failure.
Lens overheating (PITCH).
Lens overheating (YAW).
Abnormality of thermistor.
Abnormality when flash is being charged.
Non-standard battery is used.
Self-diagnosis Code
Repaired by:
Correction
Format the internal memory.
Format the “Memory Stick Duo”.
Insert a new “Memory Stick Duo”.
Insert a supported “Memory Stick Duo”.
Turn the power off and on again, or taking out and inserting the
“Memory Stick Duo” several times.
Turn the power off and on again.
Retry turn the power on by the power switch. If it does not
recover, check the focus reset sensor of lens block (pin 6of
CN402 on the SY-182 board). If it is OK, check the focus motor
drive IC (IC401 on the SY-182 board).
Retry turn the power on by the power switch. Check the zoom
reset sensor of lens block (pin 9of CN402 on the SY-182
board), if zooming is performed when the zoom button is
operated. If it is OK, check the zoom motor drive IC (IC401 on
the SY-182 board).
Check or replacement of the IC for steadyshot (IC503 on the SY-
182 board).
Check or replacement of the IC for steadyshot (IC503 on the SY-
182 board).
Check the HALL element (PITCH) of optical image stabilizer
(pin ea, es of CN402 on the SY-182 board). If it is OK, check
PITCH angular velocity sensor (SE502 on the SY-182 board)
peripheral circuits.
Check the HALL element (YAW) of optical image stabilizer (pin
ed, ef of CN402 on the SY-182 board). If it is OK, check YAW
angular velocity sensor (SE501 on the SY-182 board) peripheral
circuits.
Check the OIS temp sensor of optical image stabilizer (pin wa of
CN402 on the SY-182 board).
Checking of flash unit or replacement of flash unit. (Note)
Use the compatible battery only.
Note: After repair, be sure to perform “1-3. PROCESS AFTER FIXING FLASH ERROR”.
Initializes the setting to the default setting. Even if you execute this function, the images
stored in the internal memory are retained.
1Touch [Initialize].
The message “Initialize all settings” appears.
2Touch [OK].
The settings are reset to the default setting.
To cancel the resetting
Touch [Cancel] or [BACK] in step 2.
•Make sure that the power is not disconnected during resetting.
Initialize

1-3
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
The data can be copied/erased by the operations on the HOME screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-182 board, erase the data in internal memory of the board before replacement.
Method for Copying the Data in Internal Memory
Method for Formatting the Internal Memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Formats the internal memory.
•Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1Touch [Format].
The message “All data internal memory will be erased” appears.
2Touch [OK].
The format is completed.
To cancel the formatting
Touch [Cancel] or [BACK] in step 2.
Format
Copies all images in the internal memory to a “Memory Stick Duo”.
1Insert a “Memory Stick Duo” with sufficient capacity.
2Touch [Copy].
The message “All data internal memory will be copied” appears.
3Touch [OK].
Copy starts.
To cancel the copying
Touch [Cancel] or [BACK] in step 3 .
•Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
•You cannot copy individual images.
•The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in
[Internal Memory Tool].
•When you copy the data in the internal memory to the “Memory Stick Duo”, all the data will be copied.
Yo u cannot choose a specific folder on the “Memory Stick Duo” as the destination for the data to be
copied.
•Even if you copy data, a DPOF (Print order) mark is not copied.
Copy

1-4
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1-5. HOW TO WRITE DATA TO INTERNAL MEMORY
Usually, the camera has been set so as to disable the data writing from the PC to the internal memory of the camera.
This setting must be changed temporarily when the data is to be written to the internal memory such as a case after the board replacement.
To change the setting, use the write enable tool “WriteEnableTool.exe”.
Data writing method
1) Connect the PC to the camera (USB mode: Mass Storage), and switch the driver to the “Sony Seus USB Driver”.
2) Start the Write Enable Tool and the SeusEX.
3) Click the [Activate Write Enable Mode] button of the Write Enable Tool.
4) Upon completion of the setting change, the following message will be displayed.
5) Return the driver to the original one, and connect the PC to the camera (USB mode: Mass Storage).
6) Write the data read out into the PC to the internal memory of the camera.
7) Disconnect the PC from the camera, and turn off the camera.
Note: By turning off the camera, the write enable setting is reset.

1-5
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1. SERVICE NOTE
1-1. SY-182基板交換時の注意
仕向けデータ
補修用基板と交換する時，補修用基板に書かれている仕向けデータは元の設定と違っている場合があります。
ADJ編を参照して，「DESTINATIONDATAWRITE」を行ってください。
USBシリアルNo.
セットは，1台毎に異なる固有のID（USBSerialNo.）を書き込んだ後，出荷されています。
新品の補修用基板には，このIDが書き込まれていないので，基板交換後にIDを入力する必要があります。
ADJ編を参照して，「USBSERIALNo.INPUT」を行ってください。
1-2. 自己診断機能
1-2-1. 自己診断機能について
本機の動作に不具合が生じたとき，自己診断機能が働き，
LCD画面に，どう処置したらよいか判断できる表示を行い
ます。自己診断機能については取扱説明書にも掲載されて
います。
1-2-2. 自己診断表示
本機の動作に不具合が生じたとき，LCD画面にアルファベッ
トと4桁の数字が表示され，3.2Hzで点滅します。この5文字
の表示によって対応者分類および不具合の生じたブロックの
分類，不具合の詳細コードを示します。
0 0
3 2C
対応者分類
「1-2 -3 . 自己診断コード表」
を参照
対応方法の違いにより分類
例 13 ･･･“メモリースティック
32 ･･･電源を入れ直す
ブロック分類 詳細コード
3.2Hz点滅
C ：お客さま自身で対応
E ：サービスエンジニア 
で対応 デュオ”をフォーマッ
トする
LCD画面
C : 3 2 : 00

1-6
DSC-T200_L2
ENGLISH JAPANESE
ENGLISH JAPANESE
1-2-3. 自己診断コード表
C
C
E
E
E
E
E
E
E
E
E
ブロック
機能
13
32
61
61
62
62
62
62
62
91
92
詳細
コード
01
01
00
10
02
10
11
12
20
01
00
症状／状態
内蔵メモリにフォーマットエラーが
あった。
フォーマットしていないメモリー
スティックデュオを入れた。
メモリースティックデュオが
壊れている。
メモリースティックデュオの
タイプエラーを検出した。
メモリースティックデュオが
読み／書きできない。
ハードウェアトラブルを検出した。
フォーカスが合いにくい。
（フォーカスの初期化ができない）
ズーム動作の異常。
（ズームレンズの初期化ができな
い）
手振れ補正用ICの異常。
手振れ補正用ICの異常。
（レンズ初期化異常）
レンズオーバーヒート（PITCH）
レンズオーバーヒート（YAW）
サーミスタの異常。
フラッシュの充電異常。
規定外の充電池が使用された。
自己診断コード
対応／方法
内蔵メモリをフォーマットする。
メモリースティックデュオをフォーマットする。
新しいメモリースティックデュオに交換する。
規格内のメモリースティックデュオを挿入する。
電源の入れ直し，またはメモリースティックデュオ
の挿し／外しを数回試す。
電源を入れ直す。
操作スイッチの電源を入れ直す。
復帰しない場合はレンズブロックのフォーカスリセットセ
ンサ（SY-182基板CN4026ピン）を点検する。異常なけ
ればフォーカスモータ駆動IC（SY-182基板IC401）を点検
する。
操作スイッチの電源を入れ直す。
ズームボタンを操作したときにズーム動作をすればレンズ
ブロックのズームリセットセンサ（SY-182基板CN4029
ピン）を点検する。異常なければズームモータ駆動IC
（SY-182基板IC401）を点検する。
手振れ補正用IC（SY-182基板IC503）を点検または交換す
る。
手振れ補正用IC（SY-182基板IC503）を点検または交換す
る。
光学手振れ補正ブロックのホール素子（PITCH）（SY-182
基板CN402ea，esピン）を点検する。異常なければ
PITCH角速度センサ（SY-182基板SE502）周辺の回路を点
検する。
光学手振れ補正ブロックのホール素子（YAW）（SY-182
基板CN402ed，efピン）を点検する。異常なければYAW
角速度センサ（SY-182基板SE501）周辺の回路を点検す
る。
光学手振れ補正ブロックのサーミスタ（SY-182基板CN402
waピン）を点検する。
フラッシュユニットを点検または交換する。（Note）
規定の充電池を使用する。
対
応
者
Note：交換後は，必ず「1-3.フラッシュ異常修理後の処置」を行って下さい。

1-7
DSC-T200_L2
ENGLISH JAPANESE
ENGLISH JAPANESE
1-3. フラッシュエラー発生時の対処法
本機はフラッシュエラー（自己診断コードE：91：01）が発生した場合，高電圧による異常を防止するために自動的にフラッシュ
充電および発光禁止の設定になります。
フラッシュエラー発生後はエラーの解除を行う必要があります。エラーの解除はホーム画面から初期化操作を実行することによ
り行います。
1-4. 内蔵メモリのデータコピーおよび消去方法
内蔵メモリのデータコピーまたは消去はホーム画面の操作から実行可能です。（消去する場合は内蔵メモリの初期化を行いま
す。）
Note1：SY-182基板交換の際は，基板交換前に内蔵メモリのデータを消去して下さい。
内蔵メモリのコピー方法
内蔵メモリのフォーマット方法
設定リセット
お買い上げ時の設定に戻します。
［設定リセット］を実行しても、内蔵メモリーに記録されている画像は削除されません。
［設定リセット］をタッチする。
［全ての設定内容をリセットしま す ］というメッセージが表示される。
［実行］をタッチする。
設定リセットが実行される。
設定リセットを中止するには
手順2で、［キャンセル］または［BACK］をタッチする。
設定リセット中は電源が切れないようにご注意ください。
1
2
“メモリースティックデュオ”が本機に入っている場合は表示されません。
フォーマット
内蔵メモリーの管理領域をフォーマット（初期化）します。
フォーマットすると、プロテクトしてある画像も含めて、すべてのデータが消去され、元に戻せ
ません。
［フォーマット］をタッチする。
「内蔵メモリーのデータがすべて消去されます」というメッセージが表示される。
［実行］をタッチする。
フォーマットを中止するには
手順2で、［キャンセル］または［BACK］をタッチする。
1
2
内蔵メモリーに記録した画像を、メモリースティック デュオに一括コピーします。
充分な空き容量のあるメモリースティックデュオ を本体に入れる。
［コピー］をタッチする。
「内蔵メモリーのデータがすべてコピーされます」というメッセージが表示される。
［実行］をタッチする。
コピーが実行される。
コピーを中止するには
手順3で、［キャンセル］または［BACK］をタッチする。
•充分に充電したバッテリーをご使用ください。残量の少ないバッテリーを使用して画像ファイ
ルをコピーすると、バッテリー切れのため、データを転送できなかったり、データを破損するお
それがあります。
•画像ごとのコピーはできません。
•データをコピーしても、内蔵メモリー内のデータは削除されません。内蔵メモリーの内容を消
去するには、 コピー後にメモリースティック デュオを本体から取りはずし、［内蔵メモ
リーツール］の［フォーマット］を行ってください 。
•データのコピーをすると、メモリースティックデュオ内に新しいフォルダが作成されます。
コピー先のフォルダを指定することはできません。
•データのコピーを行っても、
DPOF
（プリント予約）マークの設定はコピーされません。
1
2
3
コピー

1-8E
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-T200_L2
1-5. 内蔵メモリへデータを書き戻す方法
通常は，PCからカメラの内蔵メモリへデータを書き込むことはできない設定になっています。
基板交換後などに，内蔵メモリへデータを書き戻す場合には，この設定を一時的に変更する必要があります。
設定の変更には，書き込み許可ツール（WriteEnableTool.exe）を使用します。
書き戻し方法
1) カメラとPCをマスストレージ接続し，ドライバを"SonySeusUSBDriver"に切り替える。
2) 書き込み許可ツールとSeusEXを起動する。
3) 書き込み許可ツールの[Activate Write Enable Mode]ボタンをクリックする。
4) 設定の変更が終了すると，次のメッセージが表示されます。
5) ドライバを元に戻して、カメラとPCをマスストレージ接続する。
6) PCに読み出しておいたデータをカメラの内蔵メモリに書き込む。
7) カメラとPCの接続を解除し，カメラの電源をOFFにする。
注意：カメラの電源をOFFにすることにより，書き込み許可の設定が解除されます。

2. DISASSEMBLY
DSC-T200_L2
2-1
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the
short jig about 10 seconds.
To avoid the spark with the metal plate,
wrap the short jig with the insulation tape.
R:1 kΩ/1 W
(Part code: 1-215-869-11)
C902
C901
NOTE FOR REPAIR
• Make sure that the flat cable and flexible board are not cracked of bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
• When remove a connector, don’t pull at wire of connector. It is possible that a wire is snapped.
•When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
•Do not apply excessive load to the gilded flexible board.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
DISCHARGING OF THE ST-171 BOARD’S CHARGING CAPACITORS (C901, C902)
The charging capacitors (C901, C902) of the ST-171 board is
charged up to the maximum 315 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by
the charged voltage which is kept without discharging when the
main power of the unit is simply turned off. Therefore, the
remaining voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of
a resistor of 1 kΩ/1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to
prevent electrical shock.
1 kΩ/1 W
Wrap insulating tape.

2-2
DSC-T200_L2
2-1. IDENTIFYING PARTS
CD-709 Flexible board
ST-171 Flexible board
2-2-1. OVERALL SECTION
- Cabinet (Front) Assy
- Cabinet (Rear) Assy
- Control Switch Block (RL60730)
- MC-184 Flexible Board
- Lens Block
2-2-2. LCD SECTION
- LCD Block
- SY-182 Board
- Flash Unit
- BT-038 Flexible Board
- DISASSEMBLY FLOW -
SY-182 Board
MC-184 Flexible Board
Flash Unit
Cabinet (Front) Assy
BT-038 Flexible Board
Control Switch Block
(RL60730)
LCD Block
Cabinet (Rear) Assy
Lens Block

2-3
DSC-T200_L2
HELP
HELP
EXPLODED VIEW
HARDWARE LIST
2-2. DISASSEMBLY
2-2-1. OVERALL SECTION
Follow the disassembly in the numerical order given.
1Cabinet (Front) Assy (1-1 to 1-4)
2Cabinet (Rear) Assy (2-1)
3Control Switch Block (RL60730) (3-1)
4MC-184 Flexible Board (4-1 to 4-6)
5Lens Block (5-1 to 5-2)
Note 1 : This screw cannot be re-used.
Discard the screw removed once in servicing.
Instead, use a new screw.
Pull the lower part and open
the Cabinet (Front) Assy,
be cautious not to damage
the claws marked with 1-4.
1-4
(Claws)
1-3
(#79/#80)
(Note 1)
1 Cabinet (Front)
Assy
5
Lens Block
2-1
(#79/#80)
(Note 1)
5-1
5-2
1-1
(#79/#80)
(Note 1)
1-2
(#79/#80)
(Note 1)
3 Control Switch Block
(RL60730)
3-1
4 MC-184 Flexible Board
4-3
(#78)
4-2
(#78)
4-1
4-4
4-6
4-5
2 Cabinet (Rear)
Assy
Note 2:
HELP
Ver. 1.3 2008.07

2-4E
DSC-T200_L2
2-2-2. LCD SECTION
Follow the disassembly in the numerical order given.
1LCD Block (1-1 to 1-3)
2SY-182 Board (2-1 to 2-4)
3Flash Unit (3-1)
4BT-038 Flexible Board (4-1)
Note : High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the
short jig about 10 seconds.
To avoid the spark with the metal plate,
wrap the short jig with the insulation tape.
C902
C901
R:1 kΩ/1 W
(Part code: 1-215-869-11)
2 SY-182 Board
4 BT-038 Flexible
Board
4-1
Main Frame Block
B
A
1 LCD Block
1-1
1-2
1-3
SY-182
B
A
B
A
2-1
2-2
2-3
2-4
(Claws)
3-1
(Claws)
3 Flash Unit
Ver. 1.3 2008.07
EXPLODED VIEW
HARDWARE LIST

HELP
DSC-T200_L2
HELP
Sheet attachment positions and procedures of processing the flexible boards/harnesses are shown.
CN701
SY-182 board

DSC-T200_L2
Link
Link
3. BLOCK DIAGRAMS
OVERALL BLOCK DIAGRAM (2/2)
OVERALL BLOCK DIAGRAM (1/2) POWER BLOCK DIAGRAM (1/2)
POWER BLOCK DIAGRAM (2/2)

DSC-T200_L2
3-1
3. BLOCK DIAGRAMS
HD_Y
HD_Pb
HD_Pr
A: VIDEO SIGNAL
A: AUDIO SIGNAL
A: VIDEO/AUDIO SIGNAL
SY-182 BOARD (1/2)
VSUB_CONT_PRE,
VSUB_CONT_POST
1
3
5
Y13
Y12
2
AF18
GEN_TG_CLK
GEAR_ON
GEN_SYS_CLK
CPU
(3/10, 4/10, 5/10)
AF22
CA_FD
CA_FD
AE23
CA_HD
CA_AD00 - CA_AD13
LENS
CCD
IMAGER
IC001
IC002
CD-709 FLEXIBLE BOARD
18 14
10 D14
C7
P8
LENS BLOCK
CN301
ZOOM
MOTOR
M
FOCUS
MOTOR
M
FOCUS
RESET
SENSOR
ZOOM
RESET
SENSOR
YAW
MOTOR
M
HALL
ELEMENT
21 - 3234, 33 4 - 2
P10, P9, P11
D7 - D9
V19, D19, C25
1, 16
16, 15
J2, H4
38
LENS TEMP
SENSOR
HIGH SPEED
BUFFER
AMP
28 - 30
20 8
18
3 - 14
CCD_OUT
V1, V2, V3A, V3B, V4,
V5A, V5B, V6 - V10
H1 - H3
POWER_SAVE
VST1, VST2
13, 14 32, 33
H3, H1
VHLD1, VHLD2
19
17
RG
G4
31 12 LV
P727 6 LH1
25
Q301
CCD SIGNAL
PROCESS,
TIMING
GENERATOR
(6/10)
IC304
CLOCK
GENERATOR
(2/10)
IC202
1 J4
C6
SUB
SUB_CONT
Q302
K14
XLENS_DRIVER_PS
H11
D4
K13
J13
R7, AF25
AE3
Y10
AD26
IRIS
(METER)
IRIS
MOTOR
M
IC401
IC506
17 - 14
1 - 4
36 - 39
FOCUS
MOTOR
DRIVER
IRIS_DIR_A, IRIS_BRK_A,
IRIS_DIR_B, IRIS_BRK_B
FC_DIR_A, FC_DIR_B, FC_BRK_A
ZM_DIR_A, ZM_DIR_B, ZM_BRK_A
ZOOM
MOTOR
DRIVER
IRIS MOTOR
DRIVER
FOCUS_A, A, B, B
FC_SENS
ZM_SENS
LENS_TEMP
FC_SENS
ZM_SENS_1ST
LENS_TEMP
IRIS_A, A, B, B
CN402
F2, E2, D2, B1
D6, E6, B7, C6
B4, B5, B3, A3
G6, J8, J9, J7J3, J2, H2, J4
LENS DRIVE
(7/10)
12
6
9
M8
J8
FC_SENS_GND
ZM_SENS_GND
XFC_RST_LED
XZM_RST_LED
8
11
OIS TEMP
SENSOR
AF3
TZ_HALL_TEMP
IC_401_TEMP 21
XDD_SYS_RST
XDD_SYS_RST
XDD_SYS_RST
1
OVERALL (2/2)
(PAGE 3-2)
AE8
AF8
IC211
(1/2)
V8
IC_211_AUOUT
IC_211_AUIN
XCS_AUDIO
LCD_CK, LCD_HD, LCD_VD
LCD_D0 - LCD_D7
U19
XCS_ PANEL
XCS_FE, XIC_211_3_SCK, IC_211_3_SO
IC_211_2_SO,
XIC_211_2_SCK
IC_211_2_SO, XIC_211_2_SCK
AB13
AF12
AC12
V7
IC_211_CVOUT
VOUT_1
VOUT_2
XHD_EN
V_LINE_OUT V_OUT
IC_211_YOUT
IC_211_PBOUT
IC_211_PROUT
USB_DP, USB_DM USB_DP, USB_DM
MSX_BS, MSX_D0 - MSX_D3, MSX_CLK
F1, G2, E2, E1,
G1, D4, D3, F4,
E4, F3, D1, C2
N5, P4, M4, N2, L3, L1, P5,
L5, N4, N3, M2, L2, K4, K3
AB21, AC21, AB20, AC20, AB19,
AC19, AC18, AE21, AF21, AE20,
AF20, AE19, AF19, AE18
F5, E5, D3, F1D5, A6, B6, C5
A2, C3, C4, A1
Y1, AA1 E18, B23
B18, D18, B17
W16, AD25, Y18, Y17
A13 - A15,
B13 - B15
D17, B19, E17, A19,
E16, A18, D16, A17
W18, AB26, W17AB23, AC26, AA23
18, 19, 26, 2722, 23, 33, 34
PITCH
MOTOR
M
HALL
ELEMENT
OPTICAL IMAGE
STABILIZER
YAW
YAW_HALL_BIAS ,
YAW_HALL
20, 24, 2529 - 32
PITCH
PITCH_HALL_BIAS ,
PITCH_HALL
ZOOM_A, A, B, B
FOCUS_A, A, B, B
IRIS_A, A, B, B
ZOOM_A, A, B, B
SE501
SE502
SWBOUT
SWAOUT
PITCH/YAW
SENSOR
AMP
(8/10)
IC503
OPTICAL
IMAGE
STABILIZATION
DRIVE
(8/10)
21J5
G5
13
10
CLK, DATA
CLK_IC_503
XCS_IC_503
A3
A7
C9
A5
XIC_211_IC_503_RST
A6
W13
U8
H10
YAW
SENSOR
PITCH
SENSOR
B10, D10
B1, D1
D5, D6
24, 25
A4, B4, B5
X201
36MHz
LCD
BACKLIGHT
3.5 inch
COLOR
LCD
MONITOR
3 - 10
CN706
LCD901 (1/2)
OVERALL (2/2)
(PAGE 3-2)
2
OVERALL (2/2)
(PAGE 3-2)
3
16
17
BL_L
MIC_SIG
38
24
29
31
16
14
18
11 - 1314, 1520, 22 3, 4
16
20
24
4
2
6
10, 12
BL_H 39
USB_VBUS USB_VBUS
XMS_IN
D10
1
MIC901
MICROPHONE
BLOCK
( )
SP
AU_LINE_OUT AOUT_L
SP901
(SPEAKER)
AUDIO/VIDEO
AMP
(9/10)
BUFFER
Q242 - Q244
CLAMP
Q241
IC602
A3
A1, C1
E6, D5
D6
A6
B6
E2
F1
E1
F3
CN001
(1/2)
MULTI
CONNECTOR
MEMORY
STICK
DUO
2 - 5, 7, 8
6
CN702
IC_211_0_SO, IC_211_0_SI, XIC_211_0_SCK
XDD_SYS_RST
CN710
(1/2)
MC-184 FLEXIBLE
BOARD (1/2)
SP
3-1. OVERALL BLOCK DIAGRAM (1/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.

DSC-T200_L2
3-2
3-2. OVERALL BLOCK DIAGRAM (2/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.
ST-171 FLEXIBLE BOARD
CONTROL SWITCH BLOCK
(RL60730)
SY-182 BOARD (2/2)
ST_UNREG
Q001
FLASH
DRIVE
FLASH
UNIT
FLASH
CONTROL,
CHARGE
CONTROL 4
9
10
7
IC001
XE_H
TRIGGER
TRIGGER_GND
XE_L
+
C901
CHARGING
CAPACITOR
( )
CHARGING
CAPACITOR
( )
+
C902
D001
3
4 1
2
15
T001
6
14
5STRB_CHG
CN701
CN709
4XSTRB_FULL
3STB_CHG_CNT
2STRB_ON1
XAF_LED
XAF_LED
D002
D001
XPWR_LED
XAE_LOCK_SW
XSHUT_SW
KEY_AD_1
D002
AF illuminator/
self-timer lamp
D003
(POWER)
D706
(MS ACCESS)
1, 2
S001
(SHUTTER)
(ZOOM)
XAE_LOCK_SW
XSHUT_SW
KEY_AD_1
XPWR_LED
5
10
8
9
T W
XPWR_ON
POWER
S002
1
XDIRECT_PB
S003
S004 S005
3
CN704
+
–
BH001
BATTERY
TERMINAL
BOARD
BATT_UNREG
BATT_GNDREG_GND
S
BATT_SIG
CHARGE_V
BATT_SIG
BT-038 FLEXIBLE
BOARD
1 - 5 7 - 10
6
33
26, 27
26
15, 9
UART_Rx,
UART_Tx
40 - 45
23, 25
ACV_UNREG
34 - 38
17, 21
CHARGE_VCHARGE_V
BL_H
XAV_JACK_IN
LCD901 (2/2)
12 7
XPOWER_ON
39 19
BATT_XEXTXACV_DET
CN001
(2/2)
MULTI
CONNECTOR
BATTERY
AUTHENTICATION
(2/10)
IC201
E4
B2
C9
D6
D9
B1, B5, C5, D5
W20, H18, B24, G18
XCS_IC_201,
XIC_211_1_SCK,
IC_211_1_SO,
IC_211_1_SI
C6 - C8
XDD_SYS_RST
XDD_SYS_RST
XDIRECT_PB
XIC_211_RST_REQ
D7
XPWR_ON
XPWR_ON
ACV_UNREG
XACV_IN
XAV_JACK_IN
IC_211_1_UI, IC_211_1_UO
F9 BL_L
E10
D10
XMS_IN
E7
C5
USB_VBUS
XCS_DD
XDD_SYS_RST
XDD_SYS_RST
CPU
(3/10, 4/10, 5/10)
IC211
(2/2)
OVERALL (1/2)
(PAGE 3-1)
3
OVERALL (1/2)
(PAGE 3-1)
1
DC/DC
CONVERTER
(1/10)
IC001
Q001,
Q002
A23
Y9
V2
H9
H15
Y16
N19
R19
AC8
H8
C10
XPWR_OFF G8
F6 BATT_SENS
AE7
K8
G9
AB8
AF7
R2
T5
H17, A24, G17
W12
AB18
IC_211_0_SO,
IC_211_0_SI,
XIC_211_0_SCK
IC_211_0_SO,
IC_211_0_SI,
XIC_211_0_SCK
2
OVERALL (1/2)
(PAGE 3-1)
D26, G19
STRB_CHG
XSTRB_FULL
STB_CHG_CNT
STRB_ON1
K7
K6
C4
X001
D701
32.768kHz
CN710
(2/2)
MC-184 FLEXIBLE BOARD
(2/2)
TOUCH
PANEL
TOUCH_PANEL_Y
TOUCH_PANEL_SEL1
TOUCH_PANEL_X
TOUCH_PANEL_SEL2
CN707
1
5
2
4
TP_XL
TP_YL
TP_XR
TP_YU
TOUCH
PANEL
I/F
Q706 - Q708

DSC-T200_L2
3-3
Q003
B+ SWITCH
Q004
B+ SWITCH
BATTERY
AUTHENTICATION
(2/10)
IC201
DC/DC CONVERTER
(1/10)
IC001
SY-182 BOARD (1/2)MC-184 FLEXIBLE
BOARD
CONTROL SWITCH
BLOCK (RL60730)
Q001, 002
F002
CN704
CHARGE_V
BATT_XEXT XACV_DET
ACV_UNREG
CHARGE_V
CHARGE_V
BATT_SIG
REG_GND
ACV_UNREG
XACV_IN
D001
D002
CN001
MULTI
CONNECTOR
23, 2517, 21
19
40 - 4534 - 38
39
XPOWER_ON XPWR_ON
7 12
1
1-5
6
S
–
BT-038 FLEXIBLE
BOARD
TXRXE4
DDCBL_LX F10
L004
L001
XRESETB2
XSYS_RESET
C9
XPWR_ON1
D7
XPWR_ON3
D9
XPWR_OFF
C10
XRESET_REQ
XDIRECT_PB
XPWR_OFF
XIC_211_RST_REQ
XDD_SYS_RST
XDD_SYS_RST
XIC_211_RST_REQ
XPWR_OFF
XPWR_ON
D6
P144_SOA0 D5
LD03P1U_IN H4
DDC5_PSW H1
XPWR_ON2 XLV_ON
D8
LD03P1E_OUT F5
P143_SIA0 C5
P142_XSCKA0 B5
P120_INTP0
IC_211_1_SI
IC_211_1_SO
XIC_211_1_SCK
XCS_IC_201
B1
(1/10)
SHUTTER DOOR DETECT
IC002
6.4V REG
(1/10)
IC003
OUT
2
Vin
6
Vcont
1
Vout 4
B+SWITCH
Q006,007
F003
F001
ST_UNREG
D_3.1V
A_3.1V
MS_VCC
VDD 1
DDC2P9_VFB G1
MS_PWR_ON G3
L006
M_5.0V
MS_PWR_ON
PANEL_6.4V
VL_3V
D006
D010,011
D_3.1V
MEMORY
STICK
DUO
CN702
9
POWER (2/2)
(PAGE 3-4)
E
POWER (2/2)
(PAGE 3-4)
C
POWER (2/2)
(PAGE 3-4)
B
POWER (2/2)
(PAGE 3-4)
A
POWER (2/2)
(PAGE 3-4)
D
VL_3V
7-10
BATT_UNREG
BATT_SIG
BATT_GND
CN710
L009
DDC1P8_LX A8
DDC1P8_VFB B6
D_1.85V
L008
DDC1P2_LX A4
DDC1P2_VFB B2
D_1.25V
CAM_3.5V
LD03P4_OUT H3
D_1.5V
LD01P5_OUT A6 DDR_1.85V
LD01P8_OUT A7 BL_H
DDCBL_VO F9 BL_L
DDCBL_VL E10
USB_3.2V
LD03P1U_OUT J5
MS_PWR_OUT F3
D007
DDC12_LX_1
DDC12_LX_2
K9
J9
DDC12_VFB H8
CAM_13V
DDC5_LX_1
DDC5_LX_2
J3
K3
DDC5_VO_1
DDC5_VO_2
J2
K2
DDC2P9_VO_1
DDC2P9_VO_2
F1
F2
DDCM7P5_LX J10
DDCM7P5_VFB F8
CAM_-7.5V
D008
CN709
D003
(POWER)
D_3.1V
6
XPWR_ON
1
POWER
S002
XDIRECT_PB
3
S003
L002
BT001
LITHIUM
RECHARGEABLE
BATTERY
D004
BH001
BATTERY
TERMINAL
BOARD
Q005
3.0V/1.8V
DISCHARGE
3-3. POWER BLOCK DIAGRAM (1/2) ( ) : Number in parenthesis ( ) indicates the division number of schematic diagram where the component is located.