Sony HCD-SHAKE33 User manual

SERVICE MANUAL
Sony Corporation
Published by Sony EMCS (Malaysia) PG Tec
HCD-SHAKE33/SHAKE77
HOME AUDIO SYSTEM
9-890-648-01
2014A80-1
© 2014.01
US Model
AEP Model
UK Model
HCD-SHAKE33
E Model
HCD-SHAKE33/SHAKE77
Australian Model
HCD-SHAKE77
Ver. 1.0 2014.01
• HCD-SHAKE33 is the tuner, USB, CD
player, Bluetooth, NFC and amplifier
section in SHAKE-33.
• HCD-SHAKE77 is the tuner, USB, CD
player, Bluetooth, NFC and amplifier
section in SHAKE-77.
SPECIFICATIONS
CD Section
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM90-DVBU202//M
Optical Pick-up Name CMS-S76RFS7G
Photo: HCD-SHAKE77
– Continued on next page –
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AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
(US model only)
SHAKE-33
With 4 ohm loads, both channels driven, from
40 – 600 Hz; rated 180 watts per channel
minimum RMS power, with no more than
0.7% total harmonic distortion from 250
milliwatts to rated output.
Amplifier section
The following are measured at
US model:
AC 120 V, 60 Hz
MX model:
AC 120 V– 240 V, 60 Hz
AEP, UK model:
AC 220 V– 240 V, 50/60 Hz
E51 model:
AC 220 V– 240 V, 50 Hz
Other models:
AC 120 V– 240 V, 50/60 Hz
SHAKE-77
WF (Woofers)/MID (Mid speakers)/
TW (Tweeters)
Power Output (rated):
350 W+ 350 W(at 4 ohms, 1 kHz,
1% THD)
RMS output power (reference):
600 W+ 600 W(per channel at
4 ohms, 1 kHz)
SW (Subwoofers)
RMS output power (reference):
1,200 W+ 1,200 W(per channel at
8 ohms, 100 Hz)
SHAKE-33
WOOFERS
Power Output (rated):
350 W+ 350 W(at 4 ohms, 100 Hz,
1% THD)
RMS output power (reference):
600 W+ 600 W(per channel at
4 ohms, 100 Hz)
MID (Mid speakers)/TWEETERS
RMS output power (reference):
500 W+ 500 W(per channel at
5 ohms, 1 kHz)
Inputs
AUDIO IN 1/PARTY CHAIN IN L/R
Voltage 2 V, impedance 47 kilohms
AUDIO IN 2 L/R
Voltage 2 V, impedance 47 kilohms
MIC (SHAKE-77 only)
Sensitivity 1 mV, impedance 10 kilohms
(USB) A, (USB) B port
Type A
Outputs
AUDIO OUT/PARTY CHAIN OUT L/R
Voltage 2 V, impedance 1 kilohm
USB section
Supported bit rate
WMA:
48 kbps – 192 kbps, VBR, CBR
AAC:
48 kbps – 320 kbps, VBR, CBR
Sampling frequencies
WMA: 44.1 kHz
AAC: 44.1 kHz
Supported USB device
Mass Storage Class
Maximum current
500 mA
Disc/USB section
Supported bit rate
MPEG1 Layer-3:
32 kbps – 320 kbps, VBR
MPEG2 Layer-3:
8 kbps – 160 kbps, VBR
MPEG1 Layer-2:
32 kbps – 384 kbps, VBR
Sampling frequencies
MPEG1 Layer-3:
32 kHz/44.1 kHz/48 kHz
MPEG2 Layer-3:
16 kHz/22.05 kHz/24 kHz
MPEG1 Layer-2:
32 kHz/44.1 kHz/48 kHz
Disc player section
System
Compact disc and digital audio system
Laser Diode Properties
Emission Duration: Continuous
Laser Output*: Less than 44.6 µW
* This output is the value
measurement at a distance of
200 mm from the objective lens
surface on the Optical Pick-up
Block with 7 mm aperture.
Frequency response
20 Hz – 20 kHz
Signal-to-noise ratio
More than 90 dB
Dynamic range
More than 88 dB
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section
Tuning range
US
model:
87.5 MHz – 108.0 MHz (100 kHz step)
Other models:
87.5 MHz – 108.0 MHz (50 kHz step)
AM tuner section
Tuning range
AEP, UK model:
531 kHz – 1,602 kHz (9 kHz step)
AUS, E2, E51, US, MX models:
531 kHz – 1,710 kHz (9 kHz step)
530 kHz – 1,710 kHz (10 kHz step)
Other models:
531 kHz – 1,602 kHz (9 kHz step)
530 kHz – 1,610 kHz (10 kHz step)
Bluetooth section
Communication system
Bluetooth Standard version 3.1
Output
Bluetooth Standard Power Class 2
Maximum communication range
Line of sight approx. 10m1)
Frequency band
2.4 GHz band (2.4000 GHz –
2.4835 GHz)
Modulation method
FHSS (Freq Hopping Spread
Spectrum)
Compatible Bluetooth profiles2)
A2DP (Advanced Audio Distribution
Profile)
AVRCP 1.3 (Audio Video Remote
Control Profile)
SPP (Serial Port Profile)
Supported codecs
SBC (Sub Band Codec)
AAC (Advanced Audio Coding)
1) The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity,
antenna’s performance, operating system,
software application, etc.
2) Bluetooth standard profiles indicate the
purpose of Bluetooth communication
between devices.

HCD-SHAKE33/SHAKE77
2
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage. Check
leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. Acommercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. Abattery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2V AC range are suitable. (See
Fig. A)
1.5 kŸ0.15 —F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
License and Trademark Notice
• “WALKMAN” and “WALKMAN” logo are registered trademarks of
Sony Corporation.
• MPEG Layer-3 audio coding technology and patents licensed from
Fraunhofer IIS and Thomson.
• Windows Media is either a registered trademark or trademark of
Microsoft Corporation in the United States and/or other countries.
• This product is protected by certain intellectual property rights of
Microsoft Corporation. Use or distribution of such technology outside
of this product is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
• The Bluetooth®word mark and logos are registered trademarks
owned by Bluetooth SIG, Inc. and any use of such marks by Sony
Corporation is under license. Other trademarks and trade names are
those of their respective owners.
• The N Mark is a trademark or registered trademark of NFC Forum,
Inc. in the United States and in other countries.
• Android™ is a trademark of Google Inc.
• Google Play™ is a trademark of Google Inc.
• iPhone and iPod touch are trademarks of Apple Inc., registered in the
U.S. and other countries. App Store is a service mark of Apple Inc.
• “Made for iPod” and “Made for iPhone” mean that an electronic
accessory has been designed to connect specifically to iPod or iPhone,
respectively, and has been certified by the developer to meet Apple
performance standards. Apple is not responsible for the operation of
this device or its compliance with safety and regulatory standards.
Please note that the use of this accessory with iPod or iPhone may
affect wireless performance.
• All other trademarks and registered trademarks are of their respective
holders. In this manual, ™ and ® marks are not specified.
•Abbreviation
AUS : Australian model
E2 : 120 V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.

HCD-SHAKE33/SHAKE77
3
1. SERVICING NOTES ............................................. 4
2. DISASSEMBLY
2-1. Overall Case.................................................................... 10
2-2. Back Panel Section ......................................................... 11
2-3. Loading Panel Assy ........................................................ 11
2-4. CDM90-DVBU202//M................................................... 12
2-5. Front Panel Section......................................................... 13
2-6. MOTHERBOARD Board............................................... 13
2-7. 4CH DAMP Board (SHAKE33),
6CH DAMP Board (SHAKE77)..................................... 14
2-8. REGULATOR, SWITCHING (3H401W) (SHAKE33),
SWITCHING REGULATOR (SSN-GBR)
(SHAKE77) .................................................................... 15
2-9. Service Optical Device, Wire (Flat Type)....................... 16
3. TEST MODE ............................................................ 17
4. ELECTRICAL CHECK ......................................... 21
5. TROUBLESHOOTING .......................................... 22
6. DIAGRAMS
6-1. Block Diagram - RS SERVO, USB Section -................. 31
6-2. Block Diagram - MAIN Section -................................... 32
6-3. Block Diagram - AMP Section (SHAKE33) -................ 33
6-4. Block Diagram - AMP Section (SHAKE77) -................ 34
6-5. Block Diagram
- PANEL, POWER SUPPLYSection -........................... 35
6-6. Printed Wiring Board
- MOTHERBOARD Board (Component Side) -............ 37
6-7. Printed Wiring Board
- MOTHERBOARD Board (Conductor Side) - ............. 38
6-8. Schematic Diagram
- MOTHERBOARD Board (1/8) - ................................. 39
6-9. Schematic Diagram
- MOTHERBOARD Board (2/8) - ................................. 40
6-10. Schematic Diagram
- MOTHERBOARD Board (3/8) - ................................. 41
6-11. Schematic Diagram
- MOTHERBOARD Board (4/8) - ................................. 42
6-12. Schematic Diagram
- MOTHERBOARD Board (5/8) - ................................. 43
6-13. Schematic Diagram
- MOTHERBOARD Board (6/8) - ................................. 44
6-14. Schematic Diagram
- MOTHERBOARD Board (7/8) - ................................. 45
6-15. Schematic Diagram
- MOTHERBOARD Board (8/8) - ................................. 46
6-16. Printed Wiring Board
- 4CH DAMP Board (SHAKE33) - ................................ 47
6-17. Schematic Diagram
- 4CH DAMP Board (SHAKE33) (1/2) - ....................... 48
6-18. Schematic Diagram
- 4CH DAMP Board (SHAKE33) (2/2) - ....................... 49
6-19. Printed Wiring Board - 6CH DAMP Board (SHAKE77)
(Component Side) -......................................................... 50
6-20. Printed Wiring Board - 6CH DAMP Board (SHAKE77)
(Conductor Side) - .......................................................... 51
6-21. Schematic Diagram
- 6CH DAMP Board (SHAKE77) (1/3) - ....................... 52
6-22. Schematic Diagram
- 6CH DAMP Board (SHAKE77) (2/3) - ....................... 53
6-23. Schematic Diagram
- 6CH DAMP Board (SHAKE77) (3/3) - ....................... 54
TABLE OF CONTENTS
6-24. Printed Wiring Board - STR Board (SHAKE33) - ......... 55
6-25. Schematic Diagram - STR Board (SHAKE33) -............ 56
6-26. Printed Wiring Board - STR Board (SHAKE77)
(Component Side) -......................................................... 57
6-27. Printed Wiring Board - STR Board (SHAKE77)
(Conductor Side) - .......................................................... 58
6-28. Schematic Diagram - STR Board (SHAKE77) -............ 59
6-29. Printed Wiring Board - FL Board (SHAKE33) -............ 60
6-30. Schematic Diagram - FL Board (SHAKE33) -............... 61
6-31. Printed Wiring Board - FL Board (SHAKE77)
(Component Side) -......................................................... 62
6-32. Printed Wiring Board - FL Board (SHAKE77)
(Conductor Side) - .......................................................... 63
6-33. Schematic Diagram - FL Board (SHAKE77) -............... 64
6-34. Printed Wiring Board - MIC Board (SHAKE33) -......... 65
6-35. Schematic Diagram - MIC Board (SHAKE33) -............ 66
6-36. Printed Wiring Board - MIC Board (SHAKE77) -......... 67
6-37. Schematic Diagram - MIC Board (SHAKE77) -............ 68
6-38. Printed Wiring Board - TUNER Board - ........................ 69
6-39. Schematic Diagram - TUNER Board -........................... 70
7. EXPLODED VIEWS
7-1. Overall Case Section....................................................... 84
7-2. Back Panel Section ......................................................... 85
7-3. FL Board, STR Board ..................................................... 86
7-4. Front Panel Section......................................................... 87
7-5. MOTHERBOARD Board Section.................................. 88
7-6. Chassis Section ............................................................... 89
7-7. CD Mechanism Section (CDM90-DVBU202//M) ......... 90
8. ELECTRICAL PARTS LIST .............................. 91

HCD-SHAKE33/SHAKE77
4
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Use of controls or adjustments or performance of procedures
other than those speci
fi ed herein may result in hazardous radiation
exposure.
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The
fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re
fl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
This appliance is classi
fi ed as a CLASS 1 LASER product. This
marking is located on the rear exterior.
MODEL IDENTIFICATION
- BACK PANEL -
Model Part No.
HCD-SHAKE77 : E2, E51, AUS 4-479-323-0[]
HCD-SHAKE77 : MX 4-479-323-2[]
HCD-SHAKE33 : E2, E51 4-479-422-0[]
HCD-SHAKE33 : US 4-479-422-1[]
HCD-SHAKE33 : MX 4-479-422-2[]
HCD-SHAKE33 : AEP, UK 4-479-422-3[]
• Abbreviation
AUS : Australian model
E2 : 120 V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
PLAYABLE DISCS
• AUDIO CD
• CD-R/CD-RW
– audio data
– MP3
fi les that conforms to ISO9660 Level 1/Level 2, or
Joliet (expansion format).
Notes
• MP3 (MPEG 1 Audio Layer-3) is a standard format de fi ned
by ISO (International Organization for Standardization) which
compresses audio data. MP3
fi les must be in MPEG 1 Audio
Layer-3 format.
• The system can only play back MP3
fi les that have a fi le
extension of “.mp3”.
PART No.

HCD-SHAKE33/SHAKE77
5
NOTE OF REPLACING THE IC001, IC002, IC106,
IC302 AND IC306 ON THE MOTHERBOARD BOARD
IC001, IC002, IC106, IC302 and IC306 on the MOTHERBOARD
board cannot exchange with single. When these parts on the
MOTHERBOARD board are damaged, exchange the entire
mounted board.
NOTE OF REPLACEMENT OF THE MS-476 BOARD
When the MS-476 board is defective, exchange the entire
LOADING COMPLETE ASSY (T).
RELEASING THE DISC TRAYLOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [ \/1 ] button to turn the power on.
2. Press the [CD] button to select CD function.
3. Press the [
x
] button and [ n /  +] button simultaneously and
hold down for around 5 seconds.
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When “LOCKED”is displayed, the slot lock is not released by
turning power on/off with the [
\/1 ]button.
NOTE OF DISASSEMBLE THE CASE, OVERALL
To disassemble the CASE, OVERALL, hexagon key is required to
unscrew the SCREW, TAPPING (HEX).
NOTE OF REPLACING MOTHERBOARD BOARD OR
BLUETOOTH MODULE OR RC-S801/A (WW) BOARD
When the MOTHERBOARD board or BLUETOOTH module or
RC-S801/A (WW) board are replaced, please execute the below
service mode.
Pairing this system with a Bluetooth device
1. Press the [ \/1 ] button to turn the power on.
2. Place the
Bluetooth device within 1 meter (3 feet) from the
system.
3. Press BLUETOOTH on the unit to select
Bluetooth function.
“BLUETOOTH” appears in the display panel.
4. Hold down BLUETOOTH on the unit for 2 seconds or more.
“PAIRING”
fl ashes in the display panel.
5. Perform the pairing procedure on the
Bluetooth device.
6. Select the model number of the unit on the display of the
Bluetooth device.
For example, select “SONY : SHAKE-77/SHAKE-33”. If
passkey is required on the
Bluetooth device, enter “0000”.
7. Perform the
Bluetooth connection on the Bluetooth device.
8. When pairing is completed and the
Bluetooth connection is
established, the
Bluetooth device name appears in the display
panel.
9. To cancel pairing operation, hold down BLUETOOTH on the
unit for 2 seconds or more until “BLUETOOTH” appears in
the display panel.
Connecting with a smartphone by one touch (NFC)
Note: The operation in this mode must use a NFC-compatible smartphone
(Smartphones with a built-in NFC function [OS: Android 2.3.3 or
later, excluding Android 3.x])
1. Press the [ \/1 ] button to turn the power on.
2. Download and install the app “NFC Easy Connect”.
Download the free Android app from Google Play by searching
for “NFC Easy Connect”.
3. Start the app “NFC Easy Connect” on the smartphone.
Make sure that the application screen is displayed.
4. Touch the smartphone to the N-Mark on the system until the
smartphone vibrates.
Complete the connection by following the instructions
displayed on the smartphone.
5. When pairing is completed and the
Bluetooth connection is
established, the
Bluetooth device name appears in the display
panel.
hexagon key
hexagon key

HCD-SHAKE33/SHAKE77
6
Playing music from a Bluetooth device
For a Bluetooth device
1. Press the [
\/1 ] button to turn the power on.
2. Press BLUETOOTH on the unit to select
Bluetooth function.
“BLUETOOTH” appears in the display panel.
3. Establish connection with the
Bluetooth device.
Press BLUETOOTH on the unit to connect to the last
connected
Bluetooth device.
Perform the
Bluetooth connection from the Bluetooth device if
the device is not connected.
Once the connection is established, the
Bluetooth device name
appears in the display panel.
4. Press
N .
Depending on the
Bluetooth device,
– you may have to press
N twice.
– you may need to start playback of an audio source on the
Bluetooth device.
For an NFC-compatible smartphone
1. Press the [ \/1 ] button to turn the power on.
Touch the smartphone to the N-Mark on the system to establish
the
Bluetooth connection.
Start playback of an audio source on the smartphone. For
details on playback, refer to the operating instructions of your
smartphone.
To disconnect the Bluetooth device
For a
Bluetooth device
Press BLUETOOTH on the unit.
“BLUETOOTH” appears in the display panel.
For an NFC-compatible smartphone
Touch the smartphone to the N-Mark on the system again.
To erase all the pairing registration information perform
COLD RESET test mode (Refer page 18).

HCD-SHAKE33/SHAKE77
7
HOW TO OPEN THE TRAYWHEN POWER SWITCH TURN OFF
Note 1:
After the case overall is removed, this word is done.
Note 2: Please prepare the thin wire (clip etc. processed to the length of 8 cm or more).
2Insert the clip etc.
3
tra
y
tray
Insert the clip etc.
processed to the
length of 8 cm or
more in the hole
on the side of the
chassis and push.
8 cm or more
hole
– Side view –
– Top view –
Note: Push after it inserts it in this hole well.
CD drive
1Remove the case, overall.
(Illustration of disassembly is omitted.)
CAPACITOR DISCHARGE FOR ELECTRIC SHOCK PREVENTION
Switching Regulator Board (Conductor side view) (HCD-SHAKE33)
In checking the Switching Regulator board, make 3 capacitors discharge of C221, C602 and C618 for eletrical shock prevention.
800 :/5 W
800 :/5 W
800 :/5 W
C602
C618
C221

HCD-SHAKE33/SHAKE77
8
Switching Regulator Board (Conductor side view) (HCD-SHAKE77)
In checking the Switching Regulator board, make 3 capacitors discharge of C20, C28 and C18 for eletrical shock prevention.
800 :/5 W
C20 C28
C18
800 :/5 W
800 :/5 W
PRECAUTION WHEN INSTALLING ANEW OP UNIT/PRECAUTION BEFORE UNSOLDERING THE STATIC
ELECTRICITY PREVENTION SOLDER BRIDGE (CDM90-DVBU202//M)
When installing a new OP unit, be sure to connect the fl exible printed circuit board fi rst of all before removing the static electricity
prevention solder bridge by unsoldering.
Remove the static electricity prevention solder bridge by unsoldering after the
fl exible printed circuit board has already been connected.
(Do not remove nor unsolder the solder bridge as long as the OP unit is kept standalone.)

HCD-SHAKE33/SHAKE77
9
2-2. BACK PANEL SECTION
(Page 11)
2-3. LOADING PANEL ASSY
(Page 11)
2-4. CDM90-DVBU202//M
(Page 12)
2-5. FRONT PANEL SECTION
(Page 13)
2-6. MOTHERBOARD BOARD
(Page 13)
2-7. 4CH DAMP BOARD (SHAKE33), 6CH DAMP BOARD (SHAKE77)
(Page 14)
2-1. OVERALL CASE
(Page 10)
2-8. REGULATOR, SWITCHING (3H401W) (SHAKE33),
SWITCHING REGULATOR (SSN-GBR) (SHAKE77)
(Page 15)
2-9. SERVICE OPTICAL DEVICE,
WIRE (FLAT TYPE)
(Page 16)
SET
Note: Disassemble the unit in the order as shown below.
SECTION 2
DISASSEMBLY

HCD-SHAKE33/SHAKE77
10
Note: Follow the disassembly procedure in the numerical order given.
2-1. OVERALL CASE
Note: To disassemble the CASE, OVERALL, allen key
is required to unscrew the SCREW, TAPPING (HEX).
4 protector, rear R
8
5 seven screws
(+BVTP 3 u8) (BLACK)
3 protector, rear L
1 four screws
(+BVTP 3 u8) (BLACK)
2 two screws
(+BVTP 3 u8) (BLACK)
6 three screws
(tapping (HEX))
9 case, overall
7 three screws
(tapping (HEX))

HCD-SHAKE33/SHAKE77
11
2-2. BACK PANEL SECTION
2-3. LOADING PANEL ASSY
1Insert the clip etc.
3three claws
4panel, loading
assy
2
tray
Insert the clip etc.
processed to the
length of 8 cm or
more in the hole
on the side of the
chassis and push.
8 cm or more
hole
– Side view –
– Top view –
Note: Push after it inserts it in this hole well.
CD drive
1 CN1002 (3P) (SHAKE77)
CN1003 (3P) (SHAKE33)
3 two screws
(+BVTP 3 u8) (BLACK)
4 two screws
(+BVTP 3 u8) (BLACK)
5 three screws
(+BVTP 3 u8) (BLACK)
7
9 back panel section
2wire (flat type)
(9 core) (CN851)
6 four screws
(+BVTP 3 u8) (BLACK)
‡:LUHVHWWLQJ
rear side
6CH DAMP board
MOTHERBOARD board

HCD-SHAKE33/SHAKE77
12
2-4. CDM90-DVBU202//M
0 two screws
(+BVTP 3 u8)
qs bracket, CDM (M7)
6 four screws
(+BVTP 3 u8)
1 CN401 (6P)
4 CN451 (10P)
2 wire (flat type) (5 core)
(CN303)
3 wire (flat type) (24 core)
(CN302)
qa two screws
(+BVTP 3 u8)
Note: When you install the CD
drive (CDM90-DVBU202//M),
please match the position of
the boss two places.
7 boss
8
9 CDM90-DVBU202//M
‡:LUHVHWWLQJ
rear side
MOTHERBOARD board
CDM90-DVBU202//M
‡:LUHVHWWLQJ front side
bracket, tunnel
CDM90-DVBU202//M
5CN601 (4P)
(SHAKE77)

HCD-SHAKE33/SHAKE77
13
2-5. FRONT PANEL SECTION
2-6. MOTHERBOARD BOARD
3five screws
(+BVTP 3 u8)
4MOTHERBOARD board
1CN001 (6P)
2wire (flat type)
(21 core) (CN111)
4five screws
(+BVTP 3 u8)
5one screw
(+PWH 3 u8 (SUMITITE))
1wire (flat type)
(10 core) (CN102)
7front panel section
6
2wire (flat type)
(23 core) (CN109)
3wire (flat type)
(8 core) (CN105)

HCD-SHAKE33/SHAKE77
14
2-7. 4CH DAMP BOARD (SHAKE33), 6CH DAMP BOARD (SHAKE77)
B
B
D
D
D
E
E
B
qs
qs
‡:LUHVHWWLQJ
front side
SWITCHING REGULATOR (SSN-GBR)
bracket, tunnel
(M7)
‡:LUHVHWWLQJ
front side REGULATOR, SWITCHING (3H401W)
bracket,
tunnel
(M3)
1CN1001 (2P)
6CN1000 (10P)
1CN1001
(2P)
2 two screws
(+BVTP 3 u8)
3 two screws
(+BVTP 3 u8)
3 two screws
(+BVTP 3 u8)
2 four screws
(+BVTP 3 u8)
0 six screws
(+BVTP 3 u8)
qa 6CH DAMP board
qa 4CH DAMP
board
2 two screws
(+BVTP 3 u8)
4 bracket,
tunnel (M7)
4 bracket,
tunnel (M3)
5 DC fan
5 fan, DC
8 thermal sheet
8 sheet,
thermal
7three screws
(+PTPWH 2.6 uL
(DIA8.0))
7three screws
(+PTPWH 2.6 uL
(DIA8.0))
9heat sink
0four screws
(+BVTP 3 u8)
9heat sink (M3)
qd bracket, heat sink (M7)
qd bracket,
heat sink
C
C
C
(SHAKE77)(SHAKE33)

HCD-SHAKE33/SHAKE77
15
2-8. REGULATOR, SWITCHING (3H401W) (SHAKE33), SWITCHING REGULATOR (SSN-GBR) (SHAKE77)
1three screws
(+BV3 (3-CR))
1three screws
(+BV3 (3-CR))
8SWITCHING REGULATOR
(SSN-GBR)
7 REGULATOR, SWITCHING
(3H401W)
3CN1 (2P)
4
2chassis, sub (M7)
1three screws
(+BV3 (3-CR))
1three screws
(+BV3 (3-CR))
2chassis, sub (M7)
5seven screws
(+PWH 3 u8
(SUMITITE))
5two screws
(+PWH 3 u8 (SUMITITE))
6two washer,
dia 20.0mm
7clamp
9chassis assy (M7)
5 nine screws
(+PWH 3 u8
(SUMITITE))
6 clamp
(SHAKE77)
(SHAKE33)
8chassis assy (M3)
3CN1 (2P)
4

HCD-SHAKE33/SHAKE77
16
2-9. SERVICE OPTICAL DEVICE, WIRE (FLAT TYPE)
Note 1 : Before disconnecting the wire (flat type) (24 core) of optical pick-up block, solder the short-land.
8four insulator screws
7connector
qa insulator
6belt
3Insert the thin
wire (clip etc.).
5tray
qs service,
optical device
qa insulator
qa insulator
qh
qk wire (flat type)
(24 core)
qg tape
1 six claws
4
9
0
2chuck holder assy (T)
2Solder the short-land.
qf wire (flat type)
(5 core)
– Bottom view –
loading assy (T)
qd base, lo assy
qj holder, FFC
Note 2: When assembling the service optical device,
remove the solder of short-land after
connecting the wire (flat type) (24 core).
Under the guide
Under the guide
(Fold area)
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Note:
This illustration sees the loading assy (T) from bottom side.
1wire (flat type) (24 core)
2Through the hole
3Through the hole
4
terminal face
loading assy (T)
7wire (flat type)
(24 core)
6holder, FFC
5three claws
5two claws
8wire (flat type)
(5 core)
9tape

HCD-SHAKE33/SHAKE77
17
SECTION 3
TEST MODE
[PANEL TEST MODE]
This mode is used to check the fl uorescent indicator tube, LEDs,
keys, [VOLUME/DJ CONTROL] jog, model, destination and
software version.
Procedure:
1. Press [OPTIONS] button and [FOOTBALL] button simultane-
ously and hold 3 seconds.
2. All LEDs and segments in
fl uorescent indicator tube are lighted
up. All RGB LEDs are lighted up in white color.
3. When you want to enter to the software version display mode,
press [
n /  +] button.
The model information appears on the
fl uorescent indicator
tube.
Press [
n /  +] button again to view the destination information.
4. During the destination information display, press [
n /  +]
button. Each time [
n /  +] button is pressed, the fl uorescent
indicator tube shows the version of each category software
in the following sequence: SC, MTK, OPU, UI, PF, SYS,
CD, CDMA, CDMB, ST, TA, TM and return back to model
information display.
5. When [  ] button is pressed while the version numbers are
being displayed except model and destination, the date of the
software creation appears. When [
 ] button is pressed again,
the display returns to the software version display.
6. Press [
Å / p ] button, the key check mode is activated.
7. In the key check mode, the fluorescent indicator tube displays
“K 0 V0”.
Each time a button is pressed, “K” value increases. However,
once a button has been pressed, it is no longer taken into
account.
“V” value increases in the manner of 0, 1, 2, 3 ... if [VOLUME/
DJ CONTROL] knob is turned clockwise, or it decreases in the
manner of 0, 9, 8, 7 ... if [VOLUME/DJ CONTROL] knob is
turned counterclockwise.
8. When [ENTER] button is pressed after all LEDs and segments
in
fl uorescent indicator tube light up, alternate segments in
fl uorescent indicator tube and LEDs would light up, all RGB
LEDs would light up in red color. If you press [ENTER]
button again, another half of alternate segments in
fl uorescent
indicator tube and LEDs would light up, all RGB LEDs
would light up in green color. Pressing [ENTER] button again
would cause all segments in
fl uorescent indicator tube and
LEDs light up, all RGB LEDs would light up in blue color.
Pressing [ENTER] button again would turn off all segments in
fl uorescent indicator tube and all LEDs including RGB LEDs.
9. To release from this mode, press the buttons in the same
manner as step 1, or disconnect the power cord.

HCD-SHAKE33/SHAKE77
18
[USER RESET]
The user reset clears all data including preset data stored in the data
fl ash to initial conditions exclude history mode data.
Procedure:
1. Press [ \/1 ] button to turn on the system.
2. Press [
 ] button and [LED COLOR] button simultaneously
for 3 seconds.
3. “RESET” appears on the
fl uorescent indicator tube. After that,
the
fl uorescent indicator tube becomes blank for a while, and
the system is reset.
[COLD RESET]
The cold reset clears all data including preset data stored in the
data
fl ash to initial conditions included history mode data. Execute
this mode when returning the set to the customer.
Procedure:
1.Press [ \/1 ] button to turn on the system.
2. Press [
 ] button and [OPTIONS] button simultaneously for 3
seconds.
3. “COLD RESET” appears on the
fl uorescent indicator tube.
After that, the
fl uorescent indicator tube becomes blank for a
while, and the system is reset.
[CD TRAYLOCK MODE]
This mode let you lock the disc tray. When this mode is activated,
the disc tray will not open when [
Z OPEN/CLOSE] button is
pressed. The message “LOCKED” will be displayed on the
fl uorescent indicator tube. This mode only applied when there is
disc(s) on the tray.
Procedure:
1. Press [ \/1 ] button to turn on the system.
2. Select CD function.
3. Press [
 ] button and [ n /  +] button simultaneously and hold
down until “LOCKED” or “UNLOCKED” displayed on the
fl uorescent indicator tube (around 5 seconds).

HCD-SHAKE33/SHAKE77
19
[HISTORYMODE]
This mode is used to check important data stored in the system
when PROTECTOR happen.
Procedure:
1. During demo mode, press [OPTIONS] button and [FLANGER]
button for 5 seconds to mode into history mode.
2.
Press the [TUNING +/ M >
x
] button or [TUNING Å /
w
. m ] button to check history data stored.
To release from History Mode.
To release from this mode, press [
\/1 ] button.
Protect Type Description:
Error Code Description
E01 The over current condition to MOSFET occurs
by defect of MOSFET or defect of PS output
line.
E03 Defect of power supply circuit to AMP.
There is possibility of unusual power supply of
any of the AMP IC or Pre-ampli
fi er.
E04 DC appears in SP terminal by defect of AMP
IC and MOSFET
or
Defect of DC FAN and DC FAN driver circuit
E05 Unusual heat up of MOSFET by improper
assembly of heat sink, destruction of MOSFET
etc.
If speaker does not have output even if the set status is not in
PROTECT mode, the following defect might be possible:
Defects Possible cause
RESET defect Reset signal status from micom is not ‘H’.
Display on fl uorescent indicator tube Description
PROCOUNT
dd
No of time protector happen (0 ~ 99)
PROTYPE
dddd
Refer to protect type description
T1
ddddd
H
dd
MSingle Power On Time until protector happened
(0~99999 hours, 0~99Min)
T2
ddddd
H
dd
MTotal Power On Time [ no consider protector happen ]
(0~99999 hours, 0~99Min)
FUNC
ddddddd
Input Function during protector happened
VOL
ddd
Volume setting (MIN / 1 - 50 / MAX)
ATT
ddd
Actual attenuation (-87 … 0)
EQ LOW
ddd
Low EQ level (-6 … 0 … +6)
EQ MID
ddd
Mid EQ level (-6 … 0 … +6)
EQ HIGH
ddd
High EQ level (-6 … 0 … +6)
SURR
ddd
Surround setting (OFF / ON)
DJ
dddddd dd
DJ Effect setting
DJ Mode: OFF/ISOLAT/FLANGE/PAN/WAH
DJ Setting Value: 1~ 40
BAZUCA
ddd
Bass Bazuca setting (OFF / ON)

HCD-SHAKE33/SHAKE77
20
[MODEL & DEST WRITE MODE]
This mode is used to set software model & destination.
This mode only available when no permanent model & destination
is stored.
Procedure:
1. Press [MOVIE/GAME] button & [LED PATTERN] button
simultaneously and hold for 5 seconds.
2. Fluorescent indicator tube display will show “M XXXXX”.
3. Press [
n /  +] / [  -/ p ] button to select the model based on the
set’s model.
Product Code F. Tube display
SHAKE-33 “M MAGMA3”
SHAKE-77 “M MAGMA7”
4. Press [ENTER] button.
5. Fluorescent indicator tube display will show “D XXXXX”.
6. Press [
n /  +] / [  -/ p ] button to select the destination based
on the set’s country.
Area Code Country F. Tube display
J1 Japan “D J”
JE1 Tourist “D JE”
U2/CA2 America, Canada “D NA”
CEL/CE1/
CE2
Europe(general) “D CE2”
CEK U.K. “D CEK”
RU1/RU3 Russia “D RU”
AU1 Australia “D AU”
CN1 China “D CN”
E12 India, Pakistan, Morocco “D E12”
E3/E15 Middle East, Iran “D E3”
E4/EA3/
E93/SA2
Saudi Arabia, Africa “D EA3”
HK1/
HK2/PL1/
SP1/SP2/
SP6/TH1
Hong Kong, Philippines,
Singapore, Malaysia,
Thailand
“D ASIA”
KR2 Korea “D KR”
TW2 Taiwan “D TW”
E2, E32,
E51, AR2
Latin America(general),
Chile, Peru, Argentina
“D LATIN”
BR1 Brazil “D BR”
MX2,
MX4
Mexico “D MX”
7. Press [ENTER] button to con
fi rm the selection.
8. “RESET” appears on the
fl uorescent indicator tube. After that,
the
fl uorescent indicator tube becomes blank for a while, and
the system is reset.
9. Mode in [PANEL TEST MODE] again to con
fi rm on the
model & destination.