Sony ICD-P620 User manual

SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
ICD-P620
SPECIFICATIONS
IC RECORDER
9-887-971-02
2008C04-1
© 2008.03
US Model
Canadian Model
AEP Model
E Model
Ver. 1.1 2008.03
IC recorder section
Recording media
recording
A part of the memory capacity is used as a
management area.
Recording time
HQ: 59 hours 45 minutes
SP: 159 hours 20 minutes
LP: 261 hours 45 minutes
Freqency range
HQ: 260 Hz - 6,800 Hz
SP/LP: 220 Hz - 3,400 Hz
General
Speaker
Approx. 2.8 cm (1 1/8 in.) dia.
Power output
250 mW
Input/Output
Headphone jack (minijack) for 8 - 300 ohms
ear receiver/headphones
Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
USB connector
[
[
[
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl.
projecting parts and controls)
34.6 × 109.2 × 18.4 mm (1 3/8 × 4 3/8 × 3/4 in.)
Mass (incl. batteries)
67 g (2.4 oz)
Supplied accessories
Operating instructions (1)
LR03 (size AAA) alkaline batteries (2)
Headphone (1) (excluding the U.S.A., Canada
and Europe)
Carrying pouch (1) (excluding the U.S.A.,
Canada and Europe)
USB connecting cable (1)
Application software (CD-ROM) (1)
Built-in ash memory 512 MB, Monaural
change without notice.
Design and specications are subject to

ICD-P620
2
1. GENERAL .................................................................. 3
2. DISASSEMBLY
2-1. Case (Front) Assy ........................................................... 4
2-2. Main Board..................................................................... 5
2-3. USB Board...................................................................... 5
3. TEST MODE ............................................................ 6
4. DIAGRAMS
4-1. Block Diagram................................................................ 9
4-2. Printed Wiring Board –MAIN Section– ......................... 11
4-3. Schematic Diagram –MAIN Section (1/2)– ................... 12
4-4. Schematic Diagram –MAIN Section (2/2)– ................... 13
4-5. Printed Wiring Board –USB Section– ............................ 14
4-6. Schematic Diagram –USB Section–............................... 15
5. EXPLODED VIEWS
5-1. Case (Front) Section ....................................................... 18
5-2. Case (Rear) Section ........................................................ 19
6. ELECTRICAL PARTS LIST .............................. 20
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

ICD-P620
3
SECTION 1
GENERAL This section is extracted
from instruction manual.
6GB
Index to Parts and Controls
Main unit
Built-in microphone
(microphone) jack
Display window
DISPLAY/MENU
DIVIDE
Y(stop)
[9REC (record)
–
(review/fast backward) /
+
(cue/fast forward)
Speaker
J(headphone) jack
Operation indicator
ERASE
VOL (volume) control*
HOLD
/YPLAY/ENTER**
* There is a tactile dot beside the control to show
the direction to turn up the volume.
** The button has a tactile dot.
7GB
Preventing Accidental Operation
— HOLD function
Slide the HOLD switch to ON. “HOLD”will ash
three times, indicating that all the functions of
the buttons are locked.
When the HOLD function is activated during
stop, all the display will be turned o after
“HOLD” ashes.
HOLD
To cancel the HOLD function
Slide the HOLD switch to OFF.
Note
When the HOLD function is activated during
recording, cancel the HOLD function rst to
stop recording.
Tip
Even if the HOLD function is activated, you can
stop the alarm playback. To stop the alarm or
playback, press Y(stop).
1
[
Rear
USB connector
Battery compartment
Hook for handstrap
(not supplied)
8GB
Display window
Folder indication
Microphone sensitivity
Alarm indicator
Selected message number
REC DATE (recorded date)
indication
REMAIN indicator
Remaining memory
indicator
Remaining battery
indicator
Recording mode
indication
REC (recording) indicator
Repeat play indicator
EASY-S (Easy Search)
indicator
Number of messages in a
folder/Menu indication/
Counter/Remaining time
indication /Recording date
indication/
Current time indication/
Messages

ICD-P620
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
2-1. CASE (FRONT) ASSY
(Page 4)
2-2. MAIN BOARD
(Page 5)
SET
2-3. USB BOARD
(Page 5)
R
screw
RB two screws
RT two brackets (speaker)
RE speaker
RG case (front) assy
claw
claw
claw
claw
two claws
battery case lid
claw
claw

ICD-P620
5
2-2. MAIN BOARD
2-3. USB BOARD
USB board
two screws


MAIN board
S701
CN2001
insulating sheet
battery case lid
cushion (battery terminal)
screw

ICD-P620
6
SECTION 3
TEST MODE
1. Outline of the TEST MODE
The TEST MODE is designed to help verify the set when servic-
ing it.
The TEST MODE is only menu driven to select modes for servic-
ing.
2. Entering and Canceling the TEST MODE
With the power on, turn on the [HOLD] switch while pressing the
[x] button and the [DISPLAY/MENU] button at the same time.
3. Canceling the TEST MODE
The TEST MODE can be cancelled by turning off the power (un-
plugging the dry battery).
4. Menu Key Designation
The menu has the five modes described below. The following keys
are assigned on the initial screen (version display).
5. Key Assignment
From within TEST MODE, the intended menu can be entered by
using the appropriate one key of the following key.
LCD Test (All OnyAll Off) DISPLAY/MENU
BEEP Test (1.3 kHz) ERASE
HQ-DSP LOOP zXREC
SP-DSP LOOP – .
LP-DSP LOOP >+
USB Test NxPLAY/ENTER
REST MENU Test DIVIDE
Initial Display from each mode x
5-1. Initial Display in TEST MODE
LCD indications (destination information, memory capacity, CPU
FW information and MIC sens) when TEST MODE is entered:
Memory capacity
(512-512 MB)
MIC sens
Destination
information
CPU FW information
5-2. LCD Test
To enter the LCD Test, press the [DISPLAY/MENU] button. The
LCD Test has two modes: All On and All Off First all the indica-
tors are on. All the indicators are off when the button is pressed
again.
ALLON
DISPLAY/MENU
Switch between
the modes.
ALLOFF
Press the [x] button to return to the initial display (destination
information, memory capacity, CPU FW information and MIC
sens).
5-3. BEEP Test
To enter the BEEP Test, press the [ERASE] button.
Beep: Frequency 1.3 kHz only
Press the [x] button to return to the initial screen (memory and
CPU version).
5-4. DSP LOOP
The DSP LOOP modes can be entered selectively by pressing the
appropriate one of the following three keys.
Within the LOOP test menu, “LOOP” is displayed. The sensitivity
character H or L is displayed depending on the position into which
the [HOLD] switch is placed.
The sensitivity H is displayed when [HOLD] switch is in the ON
position. The sensitivity L is displayed when [HOLD] switch is in
the OFF position.
[9 REC


To change the DSP LOOP test mode, press the [x] button, then
select the [zXREC] button, [– .] button, or [>+] button.
In a DSPTest mode, to select another DSP Test mode and to select
the other sensitivity, the [x] button also has to be pressed.

ICD-P620
7
Sensitivity H
HOLD
ON
OFF
Sensitivity L
HOLD
To change the sensitivity again, press the [x] button and change
the [HOLD] switch.
In a DSPTest mode, changing the mode and changing the sensitiv-
ity require the [x] button be pressed.
5-5. USB Test
In this test, the ON/OFF status of VBUS is displayed and the SUS-
PEND test is performed.
The [NxPLAY/ENTER] button is pressed to display the status of
VBUS by “On” or “OFF” indication.
With the VBUS ON, the [HOLD] switch is operated (ON) to per-
form the SUSPEND test.
• VBUS Test
• SUSPEND Test
With the VBUS ON, turn the [HOLD] switch ON to enter the SUS-
PEND mode.
When this mode is cancelled, the VBUS is turned OFF.
/YPLAY/ENTER L
,Y
Y
with VBUS
VBUS OFF
,
KHOLD
ON
+
SUSPEND mode
5-6. RESET MENU
To enter the RESET MENU test, press the [DIVIDE] button.
When all of the buttons or controls located on the set are operated,
the system shows “Ok” if all of them are normally operated.
An operation of a switch is indicated by the number for verification
in order to make a simple indication.
Note 1:When 10 different operations of the switches are normally made
in any order (regardless of the order that pushbuttons are pressed
and the slide switch is set to ON and OFF), the system shows
“Ok”.
Note 2:Clear memory when “ACCESS” is blinking on the display. (Do
this before “Ok” is shown.) To exit from this menu, the power has
to be turned off (battery to be removed).
/YPLAY/ENTER L
,Y
with VBUS
without VBUS

ICD-P620
8
• Switches and corresponding LCD indications
Switch Indication
DIVIDE 1
DISPLAY/MENU 2
zXREC 3
NxPLAY/ENTER 4
– .5
x6
>+ 7
ERASE 8
HOLD-OFF 9
HOLD-ON 10
S
SPress DIVIDE button.
Indication after DIVIDE
button is pressed.
Indication after DISPLAY/MENU
button is pressed.
Indication after [9 REC
button is pressed.
Indication after HOLD is
set to OFF.
Indication after HOLD is
set to ON.
UIf any key is not pressed,
the system waits for the key
to be pressed.
Clear memory when “ACCESS” is
blinking on the display.
The system shows “Ok”.
••••••
S
S
S
1 2
8
10
34
567
9
DIVIDE
REC
Y+
–
[9 /Y

ERASE
VOL
HOLD ON
OFF
DISPLAY/MENU
PLAY/ENTER

ICD-P620
ICD-P620
99
SECTION 4
DIAGRAMS
4-1. BLOCK DIAGRAM
47 MIP HSSPOOT
XOUT
XIN
RV101
VOL
33
51
52
MIC101
MICROPHONE
J101
(PLUG IN POWER)
A/D,D/ACONVERTER,DSP
IC101
SYSTEM CONTROL,
USB/LED/LCD DRIVER
IC703
FLASH MEMORY
IC701
48
3
2
–IN
1SHUTDOWN
+IN
BIAS
VO2 5
VO1 SP101
SPEAKER
DSP+3V-1 34
DSP+3V REG
IC501
VOUT VIN 1
CE
5
EXT
1
FB
MUTE
Q101
MICAMP
Q106
SPEAKERAMP
IC102
HEADPHONEAMP
IC2002
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS, 3V
23 EGPIO11
SI1
XDSPIFRW
SCK1
SO1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCK1
XDSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCKI
DSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
DSPIFREQ
EGPIO12
EGPIO13
EGPIO14
EGPIO15
RSTN
BGPIO2
24
25
26
27
54
58
• Signal path
: PB
: REC
100
I
69
61
I
68
15
54
55
56
57
58
59
60
29
I
32
•
41
I
44
7
19
9
16
17
18
8
FLMRB
13
HPMUTE 12
SPAMPPWR 14
HPAMPPWR
47
BEEP
45
LMUTE
XFLMRE
XFLMCSO
FLMCLE
FLMALE
XFLMWE
XFLMWP
UCOM+3V
UCOM+3V
OPR
(PB) (REC)
R/B
WP
CE
CLE
ALE
WE
RE
XREDLED
XGRNLED
DC+3V
OSC1
OSC2 DSPPWR
29
HOLDHPDET
9
FLMPWR
51
XVBUSDET 46
TRON/CLKOUT 33
D+ 34
D–
26
BATT
31
XBATTEN
SEG0
I
SEG31
I/O1
I
I/O4
I/O5
I
I/O8
LIQUID
CRYSTAL
DISPLAY
PANEL
LCD701
BATTERY
DETECT
Q702
D702 OPR D701
X701
8MHz
1
I
4
COM0
I
COM3
40
41
42
RESET
IC702
39
43
44
52
HOLD
OFF
ON
S701
23
17
18
XI
XO
X702
32.768kHz
20
21
X2001
4.096MHz
XRESET
10
11
DSP+3V-2 34
VOUT VIN 1
CE
DECT
D505 L501
DC/DC
CONVERTER
IC506
UCOM+3V 34
VOUT VIN 1
CE
DC+3V
3
CE
BATTERY
VOLTAGE
DETECT
IC504
SWITCHING
Q506
VOLTAGE
DETECT
Q507,508
SWITCH
Q509
BUFFER
Q704
VBUS
DETECT
Q2002
N
J102
J
4
5
3
2
–IN
1SHUTDOWN
+IN
BIAS VO1
HP MUTE
Q2001
UCOM+3V REG
IC503
FLM+3V 43
VOUT VIN 1
CE
FLM+3V REG
IC2001
DSP+3V REG
IC502
SCKI(DSP)
SO1(DSP)
SI1(DSP)
XDSPRST
DSPIFREQ
DSPIFRW
XDSPIFACK
FLMIO0
I
FLMIO7
DC+3.3V
DC+3.3V
CN1001
VBUS
DATA+
DATA– (USB)
+
–
KEYIN0
KEYIN1
WAKEUP
WAKE UP
SWITCH
Q703
KEY
MATRIX
S702-709
27
28
48

ICD-P620
ICD-P620
1010
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• f: internal component.
• C: panel designation.
• A : B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– Main (1/2), (2/2) sections –
no mark : PB
( ) : REC
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E: PB
a: REC
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For Printed Wiring Boards.
Note:
• X: Parts extracted from the component side.
• Y: parts extracted from the conductor side.
• f: internal component.
• : Pattern from the side which enables seeing.
• Waveforms
– MAIN Board –
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• IC Block Diagrams
IC102 MM3111AWLE (MAIN Board (1/2))
IC2002 MM3111AWLE (MAIN Board (1/2))
IC703 RL (OSC2)
0.5 V/DIV, 0.1 μsec/DIV
IC703 XB (XO)
0.5 V/DIV, 20 μsec/DIV
0.5 V/DIV, 0.1 μsec/DIV
IC101 UB (XOUT)
1.2 Vp-p
4.096 MHz
8 MHz
2.8 Vp-p
32.768 kHz
3.5 Vp-p
IC506 XC9105D091MR (MAIN Board (1/2))
1BIAS
3
4
28
6
5
7
SHUTDOWN
BIAS
+IN
-IN
VO2
GND
VDD
VO1
5
BUFFER
DRIVER
PHASE
COMPENSATION
PHASE
COMPARATOR RAMP WAVE
GENERATOR,
OSC
4
CURRENT
RIPPLE DETED
AND FB VREF WITH
SOFT START,
CE
PWM/PFM
CONTROLER
ERROR
AMP
1 2 3
FB VDD CE
EXT GND
Ref. No. Location
• Semiconductor
Location
(MAIN Section)
(D505) H-6
D701 E-12
D702 E-12
D2001 E-12
D2002 C-6
D2004 C-5
(D2007) I-6
D2008 A-12
IC101 C-9
IC102 D-10
(IC501) J-6
(IC502) G-6
(IC503) I-6
(IC504) H-3
(IC506) I-6
(IC701) I-8
(IC702) G-10
(IC703) I-10
IC2001 D-8
IC2002 D-11
(Q101) G-11
Q106 B-10
(Q506) H-5
(Q507) I-4
(Q508) I-4
Q509 C-4
(Q702) G-10
Q703 C-8
Q704 C-5
(Q2001) H-12
Q2002 C-5
( ): SIDE B

ICD-P620
ICD-P620
1111
4-2. PRINTED WIRING BOARD – MAIN Section – • : Uses unleaded solder.
• See page 10 for Semiconductor Location.
1
A
B
C
D
E
F
G
H
I
J
234567891011121314
A
DIVIDE
DISPLAY/MENU
USB
BOARD
CN1002
ERASE
W502
R748
S702
DRY BATTERY
SIZE "AAA"
IEC DESIGNATION
LR03
2PCS, 3V
S705
–
[9
REC
/Y
PLAY/ENTER
Y
+
D2004
R745
TP104
SP101
SPEAKER
RED
BLK
R747
TP508
W501
TP105
D505
TP2001
C515
W7001
CN2001
R702 R703
RV101
R714
R707
Q702
R523
R2010
R2011
R721
R2014
R2025
R2012
R754
R706
R126
C124
W7004
W7006
X701
W7005
W7002
W7003
R713
R712
Q101
C2005
R727
R728
S708
R753
C126
S701
S701
HOLD
VOL
S708
OFF ON
Q506
R515
R503
Q508
R519
R520
Q507
R521
C505
L501
R518
R516
R517
C513
C514
C510
C512
C516
C509 C2003
C701
C702
R726
R2004 C2004
R138
C131
R2015 R2013
R711
R131
R124
C511
S704
TP703
C518
Q509
Q2002
G D S
Q2001 S D G
G D S
S D G
G D S
G D S
G D S
S D G
BC E
TP504
Q704
EC B
R513
S707 TP505 C715
C128 R723
X2001
CN701
R116
RB101
C732
LCD701
LIQUID CRYSTAL DISPLAY PANEL
C127
C106
R121
C113 R2019
C2014 C2013
C707
R110
R105
C708
R2001
TP107
D2001
C2001
OPR D701
D702
(REC)
(PB)
W2001
TP106
C119
C2011
R118
R119
C108
R128
C103
R108
Q106
E C B
R109 C105
R101
R102
FB103
X702
W101
D2008
D2007
TP103
W102
TP102
J101
MIC101
MICROPHONE
N
(PLUG IN POWER)
J102
J
TP101
R722
R120
C731
R709
C716
Q703
C712
R749
C711
R2020
R524 TP507
S703
C742
TP704
R528
TP702
D2002
R512
R511
R526 R525
R752 R751
R733
R710
R734
R510
C504
R701
C109
C132 C120
C104
R2024 R2023
FB105
FB106
R130
C2012
C111
R122 R104
C107
C130
C102
FB101
R106
R107
R135
R137
R724
FB701
FB702
R746
76
100
50
26
1
1
3
5
4
25
75
36 1
51
85
14 41
58
10076 1
25
2650
51
75
4825
1
2
12
43
4
3
1
2220
119
4
3
1
2
4
3
54
13
124
MAIN BOARD (SIDEA)
MAIN BOARD (SIDE B)
1-869-159-
1-869-159-
12
43
BLK
RED
R736
S709
TP502
C110
R2002
C2008 C122
C743
S709
R750
TP701
R757
S706
FB2001
R
L
A
COM
R129
R2021
12
(12)
12
(12)
IC504
IC506
IC502
IC701
IC703
IC702
IC101
IC102
IC2001
IC2002
IC501
IC503
(Page 14)

ICD-P620
ICD-P620
1212
4-3. SCHEMATIC DIAGRAM – MAIN Section (1/2) – • See page 10 for waveform. • See page 10 for IC Block Diagrams.
IC B/D
IC B/D
IC B/D
10
6.3V
DAN217UT106
J101
FB101
RB101
C124
L501
W101
W102
TP101
TP102
R102
FB103
TP103
C107
C130
R110R105R107
R106
C105
R101
R108 R109
C106
MIC101
IC101
C103
R104 C131
C110
RV101
R126
R124 R128
C108
R119
R118
R122 C111
C113
C109
IC102
R121
R129
SP101
IC2002
C2014
R2002 C2012
C2011
C2013
C2005 R138
FB105
FB2001
FB106
TP106
TP107
C2004
R2004
W2001
C104
R137
C127
C128
C516
C514
C510
IC504
C505
R521 R503
Q507
Q508
R520
R518
D505
Q506
IC506
TP504
R516
R515
R525 R511
C504
R510
R513
R512
R519 D2004 C518
R526
C511
IC503
C509
R517 C513 C515 C512
R524
TP502
C2001
R131
C126
R2024
R2023
CN2001
J102
TP507
TP505
C120
C119
X2001
R116
TP105
TP104
IC501 IC502
W501
W502
TP508
Q106
R130
Q101
Q2001
R135
Q704
Q509
D2008
C102
C122
R2019
D2002
D2007
C132
C2008
R2001
R120
R2021
D2001
(Page 15)
(Page 13)

ICD-P620
ICD-P620
1313
4-4. SCHEMATIC DIAGRAM – MAIN Section (2/2) – • See page 10 for waveforms. • See page 16 for IC Pin Function Description of IC703.
470k
NAND04GW3B2DN6F
ERASEDISPLAY/MENU
UNR31A4G0LS0
CN701
R528
R733
R2012
S701
R710
R2020R709
C732
R748R747
R746R745
R736
C712
C731
C711
R749 R750 R752
R734
R714
R707
R706
C702
TP704
TP703
TP702
R711
C708
C707
C743
C716
R703 R702
C715
IC2001
R523
C701
IC702
R727 R726
R728
C2003
D702
LNJ326
W830S0
D701
LNJ826
W830S0
TP701
TP2001
R701
X702
X701
Q702 Q2002
Q703
R2010
R2011
FB701
FB702
R2013
C742
IC703
R754
R757
W7001
W7002
W7003
W7004
W7005
W7006
R2025
R2015
R2014
R721
R722
R723
R724
R712
R713
S706 S707 S709
S702 S703 S704 S705
R753
IC701
S708
R751
(Page 12)

ICD-P620
ICD-P620
1414
4-5. PRINTED WIRING BOARD – USB Section – • : Uses unleaded solder.
1
A
B
C
D
E
F
G
2345678910111213
A
MAIN
BOARD
CN2001
USB BOARD (SIDEA) USB BOARD (SIDE B)
CN1002
220
1
1
8
9
6
7
5
19
W1001
R1011
TP1001
C1008
R1030
R1003
R1004
R1010
CN1001
(USB)
1-869-170- (11)
R1031
R1019
11 1-869-170- (11) 11
(Page 11)

ICD-P620
15
5P
R1010
R1011
R1019
R1003
R1030
R1031
R1004
C1008
TP1001
CN1002
CN1001
4-6. SCHEMATIC DIAGRAM – USB Section –
(Page 12)

ICD-P620
16
Pin No. Pin Name I/O Description
1 to 4 COM0 to 3 O LCD common 0 to 3 signal output
5 to 7 VLC3 to 1 I LCD VLC 3 to 1 signal input
8 C2/N.C I Not used (Open)
9 FLMPWR O Flash memory power ON signal output (H: ON, L: OFF)
10 XREDLED O Red LED ON/OFF signal output (Open drain)
11 XGRNLED O Green LED ON/OFF signal output (Open drain)
12 HPMUTE O Headphone muting signal output (H: Muting)
13 SPAMPPWR O Speaker power amplifier power ON signal output (H: ON, L: OFF)
14 HPAMPPWR O Headphone power amplifier power ON signal output (H: ON, L: OFF)
15 DSPPWR O DSP power control signal output (H: ON, L: OFF)
16 VSS — Ground
17 OSC1 I Main clock input (8 MHz)
18 OSC2 O Main clock output (8 MHz)
19 VDD — Power supply (+3.1 V)
20 XI I Sub clock input (32.768 kHz)
21 XO O Sub clock output (32.768 kHz)
22 NMOD I Not used (Connected to GND)
23 XRESET I CPU reset signal input
24 DMOD I Not used (Pull up)
25 VREF I Reference voltage input for A/D converter. (+3.1 V)
26 BATT I Battery level A/D input
27 KEYIN0 I Key 0 A/D input
28 KEYIN1 I Key 1 A/D input
29 HOLDHPDET I HOLD switch/headphone detection signal input
30 SHIMUKE I Destination setting pin
31 XBATTEN O Battery level sense enable signal output (L: Enable)
32 VDD — Power supply (+3.1 V)
33 D+ I/O USB D+ signal input/output
34 D– I/O USB D– signal input/output
35 VSS — Ground
36 FM_SCK O FM tuner serial clock output (Not used in this set.)
37 FM_SDAO(TX) O FM tuner serial data output (Not used in this set.)
38 FM_SDAI(RX) I FM tuner serial data input (Not used in this set.)
39 SCK1(DSP) O DSP I/F serial clock output
40 SO1(DSP) O DSP I/F serial data output
41 SI1(DSP) I DSP I/F serial data input
42 XDSPRST O DSP reset signal output (L: Reset)
43 DSPIFREQ O DSP I/F request signal output
44 DSPIFRW O DSP I/F read/write signal output
45 LMUTE O Audio line muting signal output
46 TRON/CLKOUT O USB TRON signal output
47 BEEP O Beep signal output
48 WAKEUP I Wakeup interruption signal input
49 FM_LCLDX O FM Local/DX ON signal output (Not used in this set.)
50 FM_SCE O FM serial chip select signal output (Not used in this set.)
51 XVBUSDET I VBUS detection signal input (L: VBUS ON)
52 XDSPIFACK I DSP acknowledge interruption signal input
53 FM_PWR O FM tuner power ON signal output (Not used in this set.)
• IC Pin Function Description
IC703 MN101C93KSK (SYSTEM CONTROL, USB/LED/LCD DRIVER) (MAIN BOARD (2/2))

ICD-P620
17
Pin No. Pin Name I/O Description
54 FLMRB I Flash memory ready/busy signal input
55 XFLMWP O Flash memory write protect signal output
56 XFLMCS0 O Flash memory chip select signal output
57 FLMCLE O Flash memory command latch enable signal output
58 FLMALE O Flash memory address latch enable signal output
59 XFLMWE O Flash memory write enable clock signal output
60 XFLMRE O Flash memory read enable clock signal output
61 to 68 FLMIO0 to 7 I/O Flash memory address/data bit0 to 7 signal input/output
69 to 100 SEG31 to 0 O LCD segment 31 to 0 signal output

18
ICD-P620 SECTION 5
EXPLODED VIEWS
1 3-254-083-01 SCREW
2 3-254-003-01 SCREW
3 2-634-641-01 BRACKET (SPEAKER)
4 X-2188-741-1 CASE (FRONT) SUBASSY (P)
5 3-292-056-01 LENS (LED)
6 3-292-053-11 BUTTON (FRONT)
SP101 1-826-927-11 SPEAKER (2.8cm)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
Note:
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice.
Some delay should be anticipated when
ordering these items.
• The mechanical parts with no reference
number in the exploded views are not sup-
plied.
5-1. CASE (FRONT) SECTION
1
2
3
4
5
6
SP101

19
ICD-P620
51 2-633-874-31 BUTTON (SIDE)
52 2-633-876-01 TERMINAL (+.–), BATTERY
53 2-633-870-31 KNOB (HOLD)
54 X-2188-740-1 CASE (REAR) SUBASSY (P)
55 2-177-065-01 CUSHION (BATTERY TERMINAL)
56 2-634-640-11 LID (CONNECTOR)
57 A-1486-576-A USB BOARD, COMPLETE
58 2-633-877-01 TERMINAL (+), BATTERY
59 2-590-020-01 SHEET, INSULATING
60 2-633-878-02 TERMINAL (–), BATTERY
61 3-251-410-02 SHEET, INSULATING
62 2-661-298-01 SPACER (LCD-P)
63 2-633-872-01 HOLDER (LCD)
64 2-590-076-01 CUSHION (MIC)
65 A-1486-574-A MAIN BOARD, COMPLETE
66 2-653-251-01 SHEET
67 3-254-014-01 SCREW
68 2-633-869-51 LID, BATTERY CASE
CN701 1-780-296-21 CONDUCTIVE BOARD, CONNECTION
LCD701 1-802-628-11 DISPLAY PANEL, LIQUID CRYSTAL
MIC101 1-542-758-11 MICROPHONE, ELECTRETCONDENSER (MIC)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
5-2. CASE (REAR) SECTION
51
MIC101
LCD701
CN701
52
53
54
55
55
59
58
60
65 62
63
66
67
67
56
57
68
not supplied
not supplied
not supplied
64
61

20
ICD-P620 SECTION 6
ELECTRICAL PARTS LIST
A-1486-574-A MAIN BOARD, COMPLETE
*********************
2-633-872-01 HOLDER (LCD)
2-661-298-01 SPACER (LCD-P)
3-251-410-02 SHEET, INSULATING
< CAPACITOR >
C102 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C103 1-117-919-11 TANTAL. CHIP 10uF 20% 6.3V
C104 1-164-939-11 CERAMIC CHIP 0.0022uF 10% 50V
C105 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C106 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C107 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C108 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C109 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C110 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C111 1-164-931-11 CERAMIC CHIP 100PF 10% 50V
C113 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C119 1-117-919-11 TANTAL. CHIP 10uF 20% 6.3V
C120 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C122 1-164-941-11 CERAMIC CHIP 0.0047uF 10% 16V
C124 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C126 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C127 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C128 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C130 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C131 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C132 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C504 1-164-858-11 CERAMIC CHIP 22PF 5% 50V
C505 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C509 1-137-934-11 TANTAL. CHIP 47uF 20% 10V
C510 1-126-208-21 ELECT CHIP 47uF 20% 4V
C511 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C512 1-124-779-00 ELECT CHIP 10uF 20% 16V
C513 1-124-779-00 ELECT CHIP 10uF 20% 16V
C514 1-126-208-21 ELECT CHIP 47uF 20% 4V
C515 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C516 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3V
C518 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C701 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C702 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C707 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
C708 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
C711 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C712 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C715 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C716 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C731 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C732 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C742 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C743 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C2001 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C2003 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V
C2004 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C2005 1-119-750-11 TANTAL. CHIP 22uF 20% 6.3V
C2008 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C2011 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C2012 1-164-931-11 CERAMIC CHIP 100PF 10% 50V
C2013 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V
C2014 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
< CONNECTOR >
CN701 1-780-296-21 CONDUCTIVE BOARD, CONNECTION
CN2001 1-819-211-21 CONNECTOR, BOARDTO BOARD 20P
< DIODE >
D505 8-719-085-43 DIODE MA2YD2300LS0
*D701 6-502-310-01 LED LNJ826W830S0
D702 6-502-309-01 LED LNJ326W830S0
*D2001 6-501-855-01 DIODE DAN217UT106
D2002 8-719-069-28 DIODE 1SS400TE-61
D2004 8-719-069-28 DIODE 1SS400TE-61
D2007 8-719-074-67 DIODE EDZ-TE61-5.6B
D2008 8-719-074-67 DIODE EDZ-TE61-5.6B
< FERRITE BEAD >
FB101 1-400-693-21 INDUCTOR, FERRITE BEAD (1005)
FB103 1-400-693-21 INDUCTOR, FERRITE BEAD (1005)
FB105 1-400-693-21 INDUCTOR, FERRITE BEAD (1005)
FB106 1-400-693-21 INDUCTOR, FERRITE BEAD (1005)
FB701 1-469-581-21 INDUCTOR, FERRITE BEAD (1005)
FB702 1-469-581-21 INDUCTOR, FERRITE BEAD (1005)
FB2001 1-400-693-21 INDUCTOR, FERRITE BEAD (1005)
< IC >
IC101 6-707-481-01 IC D36521A11BLC
IC102 6-707-089-01 IC MM3111AWLE
IC501 6-708-467-01 IC XC6213B312NR
IC502 6-708-467-01 IC XC6213B312NR
IC503 6-708-472-01 IC XC6215B312NR
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice.
Some delay should be anticipated when
ordering these items.
• CAPACITORS
uF: μF
• COILS
uH: μH
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• SEMICONDUCTORS
In each case, u: μ, for example:
uA. . : μA. . , uPA. . , μPA. . ,
uPB. . : μPB. . , uPC. . , μPC. . ,
uPD. . : μPD. .
• Abbreviation
CND : Canadian model
KR : Korea model
When indicating parts by reference num-
ber, please include the board name.
MAIN