Sony ICD-P620 User manual

SERVICE MANUAL
Sony Corporation
Audio Business Group
Published by Sony Techno Create Corporation
ICD-P620
SPECIFICATIONS
IC RECORDER
9-887-971-02
2008C04-1
© 2008.03
US Model
Canadian Model
AEP Model
E Model
Ver. 1.1 2008.03
IC recorder section
Recording media
recording
A part of the memory capacity is used as a
management area.
Recording time
HQ: 59 hours 45 minutes
SP: 159 hours 20 minutes
LP: 261 hours 45 minutes
Freqency range
HQ: 260 Hz - 6,800 Hz
SP/LP: 220 Hz - 3,400 Hz
General
Speaker
Approx. 2.8 cm (1 1/8 in.) dia.
Power output
250 mW
Input/Output
Headphone jack (minijack) for 8 - 300 ohms
ear receiver/headphones
Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
USB connector
[
[
[
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl.
projecting parts and controls)
34.6 × 109.2 × 18.4 mm (1 3/8 × 4 3/8 × 3/4 in.)
Mass (incl. batteries)
67 g (2.4 oz)
Supplied accessories
Operating instructions (1)
LR03 (size AAA) alkaline batteries (2)
Headphone (1) (excluding the U.S.A., Canada
and Europe)
Carrying pouch (1) (excluding the U.S.A.,
Canada and Europe)
USB connecting cable (1)
Application software (CD-ROM) (1)
Built-in ash memory 512 MB, Monaural
change without notice.
Design and specications are subject to

ICD-P620
2
1. GENERAL .................................................................. 3
2. DISASSEMBLY
2-1. Case (Front) Assy ........................................................... 4
2-2. Main Board..................................................................... 5
2-3. USB Board...................................................................... 5
3. TEST MODE ............................................................ 6
4. DIAGRAMS
4-1. Block Diagram................................................................ 9
4-2. Printed Wiring Board –MAIN Section– ......................... 11
4-3. Schematic Diagram –MAIN Section (1/2)– ................... 12
4-4. Schematic Diagram –MAIN Section (2/2)– ................... 13
4-5. Printed Wiring Board –USB Section– ............................ 14
4-6. Schematic Diagram –USB Section–............................... 15
5. EXPLODED VIEWS
5-1. Case (Front) Section ....................................................... 18
5-2. Case (Rear) Section ........................................................ 19
6. ELECTRICAL PARTS LIST .............................. 20
TABLE OF CONTENTS
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

ICD-P620
3
SECTION 1
GENERAL This section is extracted
from instruction manual.
6GB
Index to Parts and Controls
Main unit
Built-in microphone
(microphone) jack
Display window
DISPLAY/MENU
DIVIDE
Y(stop)
[9REC (record)
–
(review/fast backward) /
+
(cue/fast forward)
Speaker
J(headphone) jack
Operation indicator
ERASE
VOL (volume) control*
HOLD
/YPLAY/ENTER**
* There is a tactile dot beside the control to show
the direction to turn up the volume.
** The button has a tactile dot.
7GB
Preventing Accidental Operation
— HOLD function
Slide the HOLD switch to ON. “HOLD”will ash
three times, indicating that all the functions of
the buttons are locked.
When the HOLD function is activated during
stop, all the display will be turned o after
“HOLD” ashes.
HOLD
To cancel the HOLD function
Slide the HOLD switch to OFF.
Note
When the HOLD function is activated during
recording, cancel the HOLD function rst to
stop recording.
Tip
Even if the HOLD function is activated, you can
stop the alarm playback. To stop the alarm or
playback, press Y(stop).
1
[
Rear
USB connector
Battery compartment
Hook for handstrap
(not supplied)
8GB
Display window
Folder indication
Microphone sensitivity
Alarm indicator
Selected message number
REC DATE (recorded date)
indication
REMAIN indicator
Remaining memory
indicator
Remaining battery
indicator
Recording mode
indication
REC (recording) indicator
Repeat play indicator
EASY-S (Easy Search)
indicator
Number of messages in a
folder/Menu indication/
Counter/Remaining time
indication /Recording date
indication/
Current time indication/
Messages

ICD-P620
4
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
2-1. CASE (FRONT) ASSY
(Page 4)
2-2. MAIN BOARD
(Page 5)
SET
2-3. USB BOARD
(Page 5)
R
screw
RB two screws
RT two brackets (speaker)
RE speaker
RG case (front) assy
claw
claw
claw
claw
two claws
battery case lid
claw
claw

ICD-P620
5
2-2. MAIN BOARD
2-3. USB BOARD
USB board
two screws


MAIN board
S701
CN2001
insulating sheet
battery case lid
cushion (battery terminal)
screw

ICD-P620
6
SECTION 3
TEST MODE
1. Outline of the TEST MODE
The TEST MODE is designed to help verify the set when servic-
ing it.
The TEST MODE is only menu driven to select modes for servic-
ing.
2. Entering and Canceling the TEST MODE
With the power on, turn on the [HOLD] switch while pressing the
[x] button and the [DISPLAY/MENU] button at the same time.
3. Canceling the TEST MODE
The TEST MODE can be cancelled by turning off the power (un-
plugging the dry battery).
4. Menu Key Designation
The menu has the five modes described below. The following keys
are assigned on the initial screen (version display).
5. Key Assignment
From within TEST MODE, the intended menu can be entered by
using the appropriate one key of the following key.
LCD Test (All OnyAll Off) DISPLAY/MENU
BEEP Test (1.3 kHz) ERASE
HQ-DSP LOOP zXREC
SP-DSP LOOP – .
LP-DSP LOOP >+
USB Test NxPLAY/ENTER
REST MENU Test DIVIDE
Initial Display from each mode x
5-1. Initial Display in TEST MODE
LCD indications (destination information, memory capacity, CPU
FW information and MIC sens) when TEST MODE is entered:
Memory capacity
(512-512 MB)
MIC sens
Destination
information
CPU FW information
5-2. LCD Test
To enter the LCD Test, press the [DISPLAY/MENU] button. The
LCD Test has two modes: All On and All Off First all the indica-
tors are on. All the indicators are off when the button is pressed
again.
ALLON
DISPLAY/MENU
Switch between
the modes.
ALLOFF
Press the [x] button to return to the initial display (destination
information, memory capacity, CPU FW information and MIC
sens).
5-3. BEEP Test
To enter the BEEP Test, press the [ERASE] button.
Beep: Frequency 1.3 kHz only
Press the [x] button to return to the initial screen (memory and
CPU version).
5-4. DSP LOOP
The DSP LOOP modes can be entered selectively by pressing the
appropriate one of the following three keys.
Within the LOOP test menu, “LOOP” is displayed. The sensitivity
character H or L is displayed depending on the position into which
the [HOLD] switch is placed.
The sensitivity H is displayed when [HOLD] switch is in the ON
position. The sensitivity L is displayed when [HOLD] switch is in
the OFF position.
[9 REC


To change the DSP LOOP test mode, press the [x] button, then
select the [zXREC] button, [– .] button, or [>+] button.
In a DSPTest mode, to select another DSP Test mode and to select
the other sensitivity, the [x] button also has to be pressed.

ICD-P620
7
Sensitivity H
HOLD
ON
OFF
Sensitivity L
HOLD
To change the sensitivity again, press the [x] button and change
the [HOLD] switch.
In a DSPTest mode, changing the mode and changing the sensitiv-
ity require the [x] button be pressed.
5-5. USB Test
In this test, the ON/OFF status of VBUS is displayed and the SUS-
PEND test is performed.
The [NxPLAY/ENTER] button is pressed to display the status of
VBUS by “On” or “OFF” indication.
With the VBUS ON, the [HOLD] switch is operated (ON) to per-
form the SUSPEND test.
• VBUS Test
• SUSPEND Test
With the VBUS ON, turn the [HOLD] switch ON to enter the SUS-
PEND mode.
When this mode is cancelled, the VBUS is turned OFF.
/YPLAY/ENTER L
,Y
Y
with VBUS
VBUS OFF
,
KHOLD
ON
+
SUSPEND mode
5-6. RESET MENU
To enter the RESET MENU test, press the [DIVIDE] button.
When all of the buttons or controls located on the set are operated,
the system shows “Ok” if all of them are normally operated.
An operation of a switch is indicated by the number for verification
in order to make a simple indication.
Note 1:When 10 different operations of the switches are normally made
in any order (regardless of the order that pushbuttons are pressed
and the slide switch is set to ON and OFF), the system shows
“Ok”.
Note 2:Clear memory when “ACCESS” is blinking on the display. (Do
this before “Ok” is shown.) To exit from this menu, the power has
to be turned off (battery to be removed).
/YPLAY/ENTER L
,Y
with VBUS
without VBUS

ICD-P620
8
• Switches and corresponding LCD indications
Switch Indication
DIVIDE 1
DISPLAY/MENU 2
zXREC 3
NxPLAY/ENTER 4
– .5
x6
>+ 7
ERASE 8
HOLD-OFF 9
HOLD-ON 10
S
SPress DIVIDE button.
Indication after DIVIDE
button is pressed.
Indication after DISPLAY/MENU
button is pressed.
Indication after [9 REC
button is pressed.
Indication after HOLD is
set to OFF.
Indication after HOLD is
set to ON.
UIf any key is not pressed,
the system waits for the key
to be pressed.
Clear memory when “ACCESS” is
blinking on the display.
The system shows “Ok”.
••••••
S
S
S
1 2
8
10
34
567
9
DIVIDE
REC
Y+
–
[9 /Y

ERASE
VOL
HOLD ON
OFF
DISPLAY/MENU
PLAY/ENTER

ICD-P620
ICD-P620
99
SECTION 4
DIAGRAMS
4-1. BLOCK DIAGRAM
47 MIP HSSPOOT
XOUT
XIN
RV101
VOL
33
51
52
MIC101
MICROPHONE
J101
(PLUG IN POWER)
A/D,D/ACONVERTER,DSP
IC101
SYSTEM CONTROL,
USB/LED/LCD DRIVER
IC703
FLASH MEMORY
IC701
48
3
2
–IN
1SHUTDOWN
+IN
BIAS
VO2 5
VO1 SP101
SPEAKER
DSP+3V-1 34
DSP+3V REG
IC501
VOUT VIN 1
CE
5
EXT
1
FB
MUTE
Q101
MICAMP
Q106
SPEAKERAMP
IC102
HEADPHONEAMP
IC2002
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS, 3V
23 EGPIO11
SI1
XDSPIFRW
SCK1
SO1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCK1
XDSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
XDSPIFREQ
SCKI
DSPIFRW
SO1
SI1
XDSPIFACK
XDSPRST
DSPIFREQ
EGPIO12
EGPIO13
EGPIO14
EGPIO15
RSTN
BGPIO2
24
25
26
27
54
58
• Signal path
: PB
: REC
100
I
69
61
I
68
15
54
55
56
57
58
59
60
29
I
32
•
41
I
44
7
19
9
16
17
18
8
FLMRB
13
HPMUTE 12
SPAMPPWR 14
HPAMPPWR
47
BEEP
45
LMUTE
XFLMRE
XFLMCSO
FLMCLE
FLMALE
XFLMWE
XFLMWP
UCOM+3V
UCOM+3V
OPR
(PB) (REC)
R/B
WP
CE
CLE
ALE
WE
RE
XREDLED
XGRNLED
DC+3V
OSC1
OSC2 DSPPWR
29
HOLDHPDET
9
FLMPWR
51
XVBUSDET 46
TRON/CLKOUT 33
D+ 34
D–
26
BATT
31
XBATTEN
SEG0
I
SEG31
I/O1
I
I/O4
I/O5
I
I/O8
LIQUID
CRYSTAL
DISPLAY
PANEL
LCD701
BATTERY
DETECT
Q702
D702 OPR D701
X701
8MHz
1
I
4
COM0
I
COM3
40
41
42
RESET
IC702
39
43
44
52
HOLD
OFF
ON
S701
23
17
18
XI
XO
X702
32.768kHz
20
21
X2001
4.096MHz
XRESET
10
11
DSP+3V-2 34
VOUT VIN 1
CE
DECT
D505 L501
DC/DC
CONVERTER
IC506
UCOM+3V 34
VOUT VIN 1
CE
DC+3V
3
CE
BATTERY
VOLTAGE
DETECT
IC504
SWITCHING
Q506
VOLTAGE
DETECT
Q507,508
SWITCH
Q509
BUFFER
Q704
VBUS
DETECT
Q2002
N
J102
J
4
5
3
2
–IN
1SHUTDOWN
+IN
BIAS VO1
HP MUTE
Q2001
UCOM+3V REG
IC503
FLM+3V 43
VOUT VIN 1
CE
FLM+3V REG
IC2001
DSP+3V REG
IC502
SCKI(DSP)
SO1(DSP)
SI1(DSP)
XDSPRST
DSPIFREQ
DSPIFRW
XDSPIFACK
FLMIO0
I
FLMIO7
DC+3.3V
DC+3.3V
CN1001
VBUS
DATA+
DATA– (USB)
+
–
KEYIN0
KEYIN1
WAKEUP
WAKE UP
SWITCH
Q703
KEY
MATRIX
S702-709
27
28
48

ICD-P620
ICD-P620
1010
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
• f: internal component.
• C: panel designation.
• A : B+ Line.
• Power voltage is dc 3 V and fed with regulated dc power
supply from battery terminal.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
– Main (1/2), (2/2) sections –
no mark : PB
( ) : REC
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E: PB
a: REC
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For Printed Wiring Boards.
Note:
• X: Parts extracted from the component side.
• Y: parts extracted from the conductor side.
• f: internal component.
• : Pattern from the side which enables seeing.
• Waveforms
– MAIN Board –
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen from
the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• IC Block Diagrams
IC102 MM3111AWLE (MAIN Board (1/2))
IC2002 MM3111AWLE (MAIN Board (1/2))
IC703 RL (OSC2)
0.5 V/DIV, 0.1 μsec/DIV
IC703 XB (XO)
0.5 V/DIV, 20 μsec/DIV
0.5 V/DIV, 0.1 μsec/DIV
IC101 UB (XOUT)
1.2 Vp-p
4.096 MHz
8 MHz
2.8 Vp-p
32.768 kHz
3.5 Vp-p
IC506 XC9105D091MR (MAIN Board (1/2))
1BIAS
3
4
28
6
5
7
SHUTDOWN
BIAS
+IN
-IN
VO2
GND
VDD
VO1
5
BUFFER
DRIVER
PHASE
COMPENSATION
PHASE
COMPARATOR RAMP WAVE
GENERATOR,
OSC
4
CURRENT
RIPPLE DETED
AND FB VREF WITH
SOFT START,
CE
PWM/PFM
CONTROLER
ERROR
AMP
1 2 3
FB VDD CE
EXT GND
Ref. No. Location
• Semiconductor
Location
(MAIN Section)
(D505) H-6
D701 E-12
D702 E-12
D2001 E-12
D2002 C-6
D2004 C-5
(D2007) I-6
D2008 A-12
IC101 C-9
IC102 D-10
(IC501) J-6
(IC502) G-6
(IC503) I-6
(IC504) H-3
(IC506) I-6
(IC701) I-8
(IC702) G-10
(IC703) I-10
IC2001 D-8
IC2002 D-11
(Q101) G-11
Q106 B-10
(Q506) H-5
(Q507) I-4
(Q508) I-4
Q509 C-4
(Q702) G-10
Q703 C-8
Q704 C-5
(Q2001) H-12
Q2002 C-5
( ): SIDE B