Supermicro 7048GR-TR Owner's manual

Information for Lot 9 of ErP (Ecodesign)
For 7048GR-TR
This addendum addresses European Union (EU) Ecodesign requirements for servers and storage
products. All data and ratings within this addendum are in reference only to the Supermicro product(s) in
the manual. The below information conforms to requirements laid down in Annex II of the Commission
Regulation 2019/424.
3(1)(a): See Section 1.1 of the system manual for the product type.
3(1)(b): See the title page and preface of the system manual for the trademark and
manufacturer’s address.
3(1)(c): See the title page of the system manual for product model number(s).
3(1)(d): See the serial number on the physical system to determine the year of manufacture.
3(1)(e-j): PSU Efficiency and Power Factor Value (Table) (From 80 Plus report)
PSU Model #: PWS-2K04A-1R
Watts: 2000W
PSU Efficiency
Power Factor
% of Rated Load 10 % 20 % 50 % 100 % 50 %
Single Output (AC-DC)
94.06 %
95.75 %
96.30 %
93.84 %
0.99
System (EUT) Efficiency in Idle State Power (Table)
Representative
Configurations
Measured Idle State
Power (W)
Calculated Idle Power
Allowance (W)
High-End Performance
Configuration
297.84
1309.08
Typical Configuration
N/A
N/A
Low-End Performance
Configuration
71.618
1233.76
System (EUT) Efficiency in Active State Power (Table)
Representative
Configurations
Active State
Efficiency Score
(Effserver)
Minimum Active State
Efficiency for 2-Socket
Server
High-End Performance
Configuration
167.488
Typical Configuration
N/A
9.5
Low-End Performance
Configuration
81.417

3(1)(k): The operating condition class is A2.
Dry bulb temp °C Humidity range, non-condensing
Operating
condition
class
Allowable
range
Recom 
mended
range
Allowable range Recommended range
Max dew
point (°C)
Maximum
rate of
change
(°
C/hr)
A1 15- 32 18-27
– 12 °C Dew Point (DP) and
8 % relative humidity (RH) to
17 °C DP and 80 % RH
– 9 °C DP to
15 °C DP and
60 % RH
17 5/20
A2 10-35 18-27 – 12 °C DP and 8 % RH to
21 °C DP and 80 % RH
Same as A1 21 5/20
A3 5-40 18-27 – 12 °C DP and 8 % RH to
24 °C DP and 85 % RH
Same as A1 24 5/20
A4 5-45 18-27 – 12 °C DP and 8 % RH to
24 °C DP and 90 % RH
Same as A1 24 5/20
3(1)(l): The idle state power at the higher boundary temperature of the operating conditions
class is 297.84 W.
3(1)(m): The active state efficiency and performance is 81.41.
3(1)(n): There are two methods by which a user can securely delete data from this system. The
user performing secure data deletion should be an IT professional.
The first is with a Unified Extensible Firmware Interface (UEFI) shell utility. This utility
works on X10/X11/H11/H12/M11 motherboard series with onboard SATA/NVMe devices.
Any user may access and download this utility through following link:
https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wftp/utility/Lot9_Secure
_Data_Deletion_Utility/
Download the shell utility package and extract it to a USB flash drive, then plug the drive
into the server for which secure data deletion is necessary. Then turn the system on.
Navigate to the BIOS setup menu, then place the server system into the UEFI shell
environment. Follow the instructions in the README file to invoke the utility and
complete the deletion.
The second method is through the secure data deletion tool provided by the original
manufacturer of the hard drive. This should be used in a scenario where the shell utility
is not applicable. Each manufacturer should have the tool available on their website. If
needed, please look on the hard drive label for the name of the manufacturer and model
information.
3(1)(o): List of recommended combinations of blade servers with chassis: N/A.
3(1)(p): List of all current SKUs within this product family: N/A.
3(3)(a): There is no use of cobalt in batteries in this product.

The indicative weight range of neodymium in the HDD is 0.0 if manufactured by Western
Digital, and is between 5-25 grams if manufactured by Seagate.
3(3)(b): Please see the disassembly instructions on the next page.

Illustrated System Disassembly Instructions
Please note: All the illustrations in the below disassembly instructions are for demonstration only.
Components shown here may not match exactly with the components in your system.
CAUTION: Always power off the system and unplug the power cord(s) first before
disassembling the system!
1. Chassis Cover
Type and number of fastenings: One (1) latch and two (2) Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure: Remove the two screws at the rear securing the cover to the chassis. Push down on the
button to unlock and pop the lid off the chassis. Slide the cover towards the rear of the chassis and
lift the cover from the chassis.

2. Power Supply
Type and number of fastenings: One (1) latch.
Tools required: None.
Procedure: Unplug the power cord from the power supply. Push down on the release tab on the back
of the power supply module and pull the module straight out.

3. Processor
Type and number of fastenings: Four (4) Phillips screws per processor.
Tools required: Screwdriver with PH2 bit.
Procedure: Remove the screws in the sequence of 4, then 3, then 2, then 1. Unscrew and remove
the heatsink screws, starting by loosening each a little at a time. Hold the heatsink and gently wiggle
it to loosen it from the processor. (Do not use excessive force!) Once the heatsink is loosened,
remove it from the processor. There are two levers on the LGA 2011 socket. Press the “Open 1st,”
then “Closer 1st” load lever to release the load plate from its locked position. Remove the CPU from
the socket.

4. Memory
Type and number of fastenings: Two (2) latches per memory module.
Tools required: None.
Procedure: Press both release tabs on the ends of the memory module to unlock it. Once the module
is loosened, remove it from the memory slot.

5. Expansion Card/Graphics Card
Type and number of fastenings: One (1) or two (2) Phillips screws per add-on card or graphics card.
Tools required: Screwdriver with PH2 bit.
Procedure: Move the slot bracket to the upright and unlocked position. Remove the Phillips screw(s)
securing the card bracket to the chassis. Grab the card, push on the PCIe slot latch to unlock it, and
carefully lift it up to remove it from the slot.

6. Backplane
Type and number of fastenings: Two (2) Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure: Remove the two Philips screws securing the backplane to the chassis. Grab the backplane
and lift it up as shown to remove.

7. Fans
Type and number of fastenings: One (1) fan header per fan.
Tools required: None.
Procedure: Disconnect the fan wiring from the fan header on the motherboard. Grab the release tab
and apply slight pressure in the indicated direction. Lift the fan in the indicated direction to remove it
from the fan tray.
(mid fan)
(rear fan)