Supermicro AS-2123BT-HNR Owner's manual

Information for Lot 9 of ErP (Ecodesign)
This addendum addresses European Union (EU) Ecodesign requirements for servers and storage
products. All data and ratings within this addendum are in reference only to the Supermicro product(s) in
the manual. The below information conforms to requirements laid down in Annex II of the Commission
Regulation 2019/424.
3(1)(a): See Section 1.1 of the system manual for the product type.
3(1)(b): See the title page and preface of the system manual for the trademark and
manufacturer’s address.
3(1)(c): See the title page of the system manual for product model number(s).
3(1)(d): See the serial number on the physical system to determine the year of manufacture.
3(1)(e-j): PSU Efficiency and Power Factor Value (Table) (From 80 Plus report)
PSU Model #: PWS-
2K60A-1R
Watts: 2600W
PSU Efficiency Power Factor
% of Rated Load 10 % 20 % 50 % 100 % 50 %
Single Output (AC-DC)
90.42
95.83
96.22
94.37
0.99
Multiple Output (AC-DC)
N/A
N/A
N/A
N/A
N/A
System (EUT) Efficiency in Idle State Power (Table)
Representative
Configurations
Total Measured Idle
State Power (W)
Calculated Idle Power
Allowance per Node (W)
High-End Performance
Configuration
961.7
1519.9
Typical Configuration
NA
NA
Low-End Performance
Configuration
599.8
881.5
System (EUT) Efficiency in Active State Power (Table)
Representative
Configurations
Active State
Efficiency Score
(Effserver)
Minimum Active State
Efficiency for 2-Socket
Server
High-End Performance
Configuration
40.1
Typical Configuration
NA
8.0
Low-End Performance
Configuration
38.4

3(1)(k): The operating condition class is A2.
Dry bulb temp °C Humidity range, non-condensing
Operati
ng
conditi
Allowab
le
range
Reco
m
mend
Allowable range Recommended
range
Max
dew
point (°
C)
Maximu
m rate
of
change
A1 15- 32 18-27
– 12 °C Dew Point (DP)
and
8 % relative
humidity (RH) to
17 °C DP and 80 % RH
– 9 °C DP to
15 °C DP
and
60 %
17 5/20
A2 10-35 18-27 – 12 °C DP and 8 % RH
to 21 °C DP and 80 %
Same as A1 21 5/20
A3 5-40 18-27 – 12 °C DP and 8 % RH
to 24 °C DP and 85 %
Same as A1 24 5/20
A4 5-45 18-27 – 12 °C DP and 8 % RH
to 24 °C DP and 90 %
Same as A1 24 5/20
3(1)(l): The idle state power at the higher boundary temperature of the operating conditions
class is 1135W.
3(1)(m): The active state efficiency and performance is 40.1.
3(1)(n): There are two methods by which a user can securely delete data from this system. The
user performing secure data deletion should be an IT professional.
The first is with a Unified Extensible Firmware Interface (UEFI) shell utility. This utility
works on X10/X11/H11/H12/M11 motherboard series with onboard SATA/NVMe devices.
Any user may access and download this utility through following link:
https://www.supermicro.com/about/policies/disclaimer.cfm?url=/wftp/utility/Lot9_Secure
_Data_Deletion_Utility/
Download the shell utility package and extract it to a USB flash drive, then plug the drive
into the server for which secure data deletion is necessary. Then turn the system on.
Navigate to the BIOS setup menu, then place the server system into the UEFI shell
environment. Follow the instructions in the README file to invoke the utility and
complete the deletion.
The second method is through the secure data deletion tool provided by the original
manufacturer of the hard drive. This should be used in a scenario where the shell utility
is not applicable. Each manufacturer should have the tool available on their website. If
needed, please look on the hard drive label for the name of the manufacturer and model
information.
3(1)(o): List of recommended combinations of blade servers with chassis: N/A.
3(1)(p): List of all current SKUs within this product family: AS -2123BT-HNR.

3(3)(a): There is no use of cobalt in batteries in this product.
The indicative weight range of neodymium in the HDD is 0.0 if manufactured by Western
Digital, and is between 5-25 grams if manufactured by Seagate.
3(3)(b): Please see the disassembly instructions on the next page.

Illustrated System Disassembly Instructions
Please note: All the illustrations in the below disassembly instructions are for demonstration only.
Components shown here may not match exactly with the components in your system.
CAUTION: Always power off the system and unplug the power cord(s) first
before disassembling the system!
1. Data Storage Devices
Type and number of fastenings: One (1) latch and four (4) Phillips screws per drive.
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Press the release button on the drive tray. This extends the drive bay handle.
2. Use the handle to pull the drive out of the chassis.
3. Remove the four screws on the drive tray to release the hard drive (dummy tray shown in
illustration).

2. Memory
Type and number of fastenings: Two (2) latches per memory module.
Tools required: None.
Procedure:
1. Press both release tabs on the ends of the memory module to unlock it.
2. Once the module is loosened, remove it from the memory slot.
3. Processor
Type and number of fastenings: Four (4) T20 Torx screws.
Tools required: Screwdriver with T20 Torx bit.
Procedure: Remove the screws in the sequence of 4, then 3, then 2, then 1, as marked in the
illustration below. After removing the screws, lift the processor heatsink module off the processor
socket. Unscrew the processor socket frame in the sequence of 3, 2, and then 1. Flip the socket
frame up. Lift up the rail frame and slide the processor out.

4. Riser Card
Type and number of fastenings: Five (5) Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Remove the node from the chassis by pulling on the pulling ears.
2. Remove the screw at the center of the bracket.
3. Remove the two screws securing each riser card.
4. Lift the riser card out from the motherboard expansion slot.

5. Expansion Card
Type and number of fastenings: One (1) Phillips screw.
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Remove the screw holding the add-on card in place.
2. Carefully pull the add-on card out from the riser card.

6. Power Supply Module
Type and number of fastenings: One (1) latch per module.
Tools required: None.
Procedure:
1. Unplug the power cord from the power supply.
2. Push the release tab on the back of the power supply module to the side and pull the module
straight out.

7. Chassis Cover
Type and number of fastenings: Two (2) Phillips screw
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Remove the two screws that secure the top cover onto the chassis.
2. Lift the top cover up and off the chassis.
8. Batteries
Type and number of fastenings: One (1) latch.
Tools required: None.
Procedure: Push aside the small clamp that covers the edge of the battery. When the battery is
released, lift it out of the holder.

9. Fans
Type and number of fastenings: One (1) fan header per fan.
Tools required: None.
Procedure:
1. Disconnect the fan's power cord from the backplane.
2. Lift the fan housing out of the chassis.

10. SIOM
Type and number of fastenings: Five (5) Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Remove the two riser brackets first, as instructed in Item 4, Riser Card .
2. Remove the five screws securing the pulling bracket to the node.
3. Loosen the two screws holding the SIOM module and carefully disconnect the module from
the motherboard.

11. Motherboard
Type and number of fastenings: 11 Phillips screws.
Tools required: Screwdriver with PH2 bit.
Procedure:
1. Remove the adapter card, both riser cards, and SIOM first, as instructed in previous items.
2. Remove all 11 Phillips screws. Lift the motherboard from its base.