Tandy PC-6 User manual
Page 1 of 27
Toshiba America Information Systems, Inc. and Apple Inc. Exhibit 1012
Page 2 of 27
CONTENTS
SPECIFICATIONS
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3
How
To
Open
Upper
Case
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3
THEORY
OF
OPERATION
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4
Block
Diagram
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Interrupt
Circuit
Keyboard
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6
Power
Supply
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LSI
(Pin
Functions)
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8
DISPLAY
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9
TROUBLESHOOTING
GUIDE
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10
Test
Programs
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11
Operation
Check
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14
PCB
ASSEMBLY
VIEWS
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19
PARTS
LIST
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20
Electrical
Parts
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20
Mechanical
Parts
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21
EXPLODED
VIEW/DISASSEMBLY
INSTRUCTIONS
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SCHEMATIC
DIAGRAM
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Main
I3lock
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Page 3 of 27
Display
Method
Display
Calculation
Range
Program
System
Program
Language
Number
of
Variables
RAM
Capacity
Program
Areas
Number
of
Stacks
Subroutine
FOR
w
NEXT
LOOP
Operators
Power
Supply
Power
Consumption
Battery
Life
Memory
protection
battery
Auto
Power-off
Ambient
Temperature
Dimensions
Weight
SPECIFICATIONS
5 x 7
dot-matrix
crystal
24digit,
dot-matrix
liquid-crystal
display
i10'99
w
:t9.999999999
x
10”
Stored
System
BASIC
26
fixed
variables,
exclusive
character
variable
and
array
variables
7520
bytes
(system
area:
672
bytes)
Maximum
of
10
(P0
through
P9)
8
levels
4
levels
12
levels
2
lithium
batteries
(CR-2032)
for
main
frame
1
lithium
battery
(CR-1220)
for
memory
backup
Maximum
0.07W
1)
Continuous
program
execution:
approximately
85
hours
2)
Continuous
display
of
5555555555
at
68°F
(20°C):
approximately
200
hours
or
5.5
months
when
unit
is
used
1
hour
per
day
NOTE:
1
hour
includes
10
minutes
of
condition
1)
and
50
minutes
of
con-
dition
2)
Approximately
2
years
(with
main
batteries
installed)
Approximately
6
minutes
32°
F
to
104°
F
(0°C
to
40°
C)
3/4"H
x
5-5/8"W
x
2-3/4"D
(18
mm
x
142
mm
x
71
mm)
5.8
oz
(165
g),
including
batteries
How
To
Open
Upper
Case
Tweezers
1.
Insert
the
tweezers
into
the
back
of
the
upper
case.
2.
Move
tweezers
gently
in
the
direction
indicated
by
the
arrow
in
the
figure
below.
Page 4 of 27
THEORY
OF
OPERATION
Block
Diagram
DOT—MATR|X
DISPLAY
5 x
7
dots,
24
digits
a7’\za12,
d7’\zd12
a1r\,a5,
d1r\,d5
b7'\zb12,
e7’\ze12
b1r\,b6,
314,55
c7~c12,
RONR14
c1’\zc6,
R0'\zR14
RAM
IC3
Ks2’\uKs10
'<mW'<m12
KEYBOARD KEYBOARD
HM6264ALFP
ADO-AD12
CS3-CS6
I00-I07
26-3671
26-3651
26-3652 26-3652
NOTE:
Only
one
of
2
options
can
be
connected
at
a
time.
Page 5 of 27
LSI
Main
CPU
HD61747B20
BASIC
control,
Key
signal
input/output
(lower
keyboard),
1st
to
6th
digits
and
13th
to
18th
digits
display
control.
Sub
CPU
HD61747B25
Calculation,
I/O
control,
key
signal
input/output
(upper
keyboard),
7th
to
12th
digits
and
19th
to
24th
digits
display
control.
Gate
Array
MB64H193
Interface
between
CPU
and
RAM,
buzzer
control.
RAM
HM6264ALFP-50‘
Stores
data
and
program.
RAM
has
8K
bytes
(64K
bits)
capacity
and
contains
a
self-control
circuit.
LSI
ROM
CPU
(Main)
H
D61747
B20
CPU
(Sub)
H
D61
747
B25
RAM
HM6264ALFP-50
113024
bits
1896
bits
113024
bits
1896
hits
65536
bits
226056
bits
69328
bits
Input
Buffer
Code
Buffer
Z
—
Users
Area
--
M
FT
P3T
P7T
Communication
Buffer
2
GOSUB
STACK
DISP
Buffer
FF
—
¥.:'i:;
FOR
NEXT
Page 6 of 27
Buzzer
Control
Circuit
There
are
3
ways
to
operate
the
buzzer:
Key
input,
BEEP
O,
and
BEEP
1
Mode
BEEP
0
BEEP1
Key
Input
B2
Frequency
0.9
kHz
4.55
kHz
4.55
kHz
31
Time
110
msec.
110
msec.
11
msec.
MBMH193
Interrupt
Circuit
0
interrupt
circuit
for
the
clock
pulse
when
VDD2
drops.
1.
When
the
power
is
on,
VDD2
is
"L"
level.
2.
PG2
through
the
IC
and
26th
pin
of
the
CPU
receive
PG2.
3.
When
VDD2
drops,
the
output
of
the
IC
becomes
“GND”
level
and
the
CPU
does
not
receive
PG2.
PG1
HD61747B25
0
Interrupt
circuit
for
the
voltage
of
the
Gate
Array
and
options
when
VDD2
and
SW
drop.
1.
When
the
power
is
on,
VDD2
and
SW
is
"L”
level.
2.
VDD2
for
Gate
Array
and
VDD4
is
also
"L"
level.
3.
When
VDD2
drops,
VDD2
for
Gate
Array
and
VDD4
becomes
”GND"
level
and
stops
the
op-
ration
of
the
RAM
and
options.
sw
VDD2(from
IC
4)
—
VDD4
VDD2(from
IC
2)
HD61747B25
controls
the
upper
keyboard.
K52
‘
HD61747B2
-
K53“’K‘°’8
K59,
K510
HD61747B20
controls
the
lower
keyboard.
Keyboard
HD61747B2
K"‘5“’K””°
Km11,
Km12
Page 7 of 27
Power
Supply
VSS1
Power
supply
voltage
for
TC4071
BF.
VRAM
Memory
used
to
keep
the
voltage
for
the
RAM.
V1~V5
LCD
drive
voltages.
Voltage
is
generated
by
connecting
the
external
resistor
to
VDD2.
VDD1
Power
supply
for
the
CPU,
RAM
and
options.
VDD2
Stays
VDD1
at
power—on.
Goes
to
GND
at
power-off
or
APO
(auto
power—off).
Page 8 of 27
LSI
(Pin
Functions)
IC1,
HD61747B2O
lC2,
HD61747B25
o°ol3r°3'R$§§"§§KE$°m‘3‘cB%$
A
A
A
A
E
E’
E
1
64
2
63
3
62
4
61
5
60
5
59
7
58
8
57
9
58
-[Q
55
11
54
12
_ 53
13
_
52
14
>
51
15
_
50
16
_
49
17
_
48
18
_
47
19
46
20 _
45
21
>
44
22
b5
>
43
l\)|\)
4300
0.0
0101
VV
-54>
an
IC4,
MB64H193
1N4
5
19
Signal
Name
D1,
2,
4,
8
INT
KM’\zK1
SW
V5’\;V1
PG2,
PG1
R15’\IFl7
GND
CE2
CE1
VDD1
VDD2
Signal
Name
Function
Data
in/out
(D1,
D2, D3,
D4)
Interrupt
signal
from
RAM
Key
signal
for
keyboard
Switch
signal.
GND
at
switch
"OFF”
and
VDD1
at
switch
MON!!-
Display
voltage.
Divided
vol-
tage
from
VDD1.
CPU
internal
clock
Display
signal
GND
Chip
designating
signal.
Select
RAM
or
other
devices
Select
RAM
or
other
devices
Power
source
VDD1
output
from
the
LSI.
VDD1
at
switch
"ON”
and
GND
switch
”OFF".
Clock
pulse
Operation
signal
Function
I00,
I06
ADO
I07
AD1
VSS
AD2,
10,
3
OE
AD4’vAD12
VDD
RW
CS6’\ICS3
CS2’\uCSO
B1,
B2
S2
VSS
S1
E
OF
Data
in/out
Address
signal
Data
in/out
Address
signal
Power
source
Address
signal
Output
enable
Address
signal
G ND
Read/write
signal
Chip
enable
signal
N
C
Buzzer
signal
G
ND
VSS
G
N D
NC
Data
in/out
Operation
signal
Clock
pulse
Power
source
Chip
enable
G
N D
Data
in/out
Page 9 of 27
lC3,
HM6264ALFB-50
Signal
Name
Function
NC NC
A12'\:AO
Address
signal
I/O1’\z|/O3
Data
signal
GND
VSS
terminal
I/O4’\zl/08
Data
signal
CE1
Chip
enable
A10
Address
signal
OE
Output
enable
A11,
9,
8
Address
signal
CE2
GND
R/W
‘
Read/write
signal
vpp
1
GND
DISPLAY
Numbers
and
characters
are
displayed
in
5
x
7
dots.
Following
is
an
explanation
of
a
dot—matrix
LCD.
3
I9
“_’.
IQ
000-3
E—0000000
3
1
N
2
“_’.
DDD-3
Lower
electrode
Lower
electrode
‘°1J
la:
d
0
0000000-
;—0000000
0
U
0000000——
-—0000000
N
0000000
N
0000000-
I
I
I
0000
0000000—2
-
0000000-
Q
0000000-
;—0000000
U
0000000—2
_—0000000
N
0000000
N
0000
0000000——
g—0000000
0000000-
0000000
g—0000000
DT?
0000000-
1)
:0
tone
Upper
electrode
5
Upper
electrode
13.1.’
1131113
glsl
UCIUUDDD
CIDUDUUD
DCICIDUDU
DUCIUCIDCI
DDCICIDUU
DDDEICIUU
DDDDDUD
U‘-'UCl0ClClDD
UDUUCIDCI
CIDUCIDUU
CIUDUDUU DDCIDDUU
CIDUUUDD
CIUDCJCIUD
DDDDCIDCI
UDUDDUD
iii”
U1
3
Left-half
12
digits
Right-half
12
digits
81
d1
b1
31
On
the
upper
electrode
of
the
LCD,
common
signals
RON
R6
and
R8~
R14
are
applied
horizontally
while
other
signals
a1'\»e1
to
a12'\:e12
are
applied
I II
II
Egg?!-1+3?
vertically
on
the
lower
electrodes
as
shown
in
above
figures.
I&I¢I*I
II
In
the
left
figure,
the
upper—right
corner
of
the
dot
is
displayed
when
a
vol-
_
__
tage
difference
exists
between
signals
R0
and
a1.
The
CPU
outputs
the
dis-
play
signals
to
the
LCD
display.
CPU
HD61747B20
controls
the
1st
to
6th
and
13th
to
18th
digits
of
dis-
play,
while
HD61747B25
controls
the
7th
to
12th
and
19th
to
24th
digits.
Page 10 of 27
TROUBLESHOOTING
GUIDE
Symptom
Cause
Solution
C
No
display
at
all.
Weak
batteris
Replace
the
batteries.
Poor
battery
contact
Clean
the
battery
and
contact
spring.
Lift
the
battery
spring.
Peeled
heat
seal
Replace
the
heat
seal.
Broken
heat
seal
Replace
the
heat
seal.
LCD
(CA51-TS)
Replace
the
LCD.
LSI
(HD61747B)
Replace
the
LSI.
A
certain
segment(s)
Peeled
heat
seal
Replace
the
heat
seal.
cannot
be
displayed.
Broken
heat
seal
Replace
the
heat
seal.
LCD
(CA51-TS)
Replace
the
LCD.
LSI
(HD61747B)
Replace
the
LSI.
Calculation
impossible.
LSI
(HD61747B)
Replace
the
LSI.
A
certain
button
does
not
Poor
key
contact
Celan
the
contact
pad
on
the
PCB
and
the
function.
key
contact
rubber.
Broken
PC
line
Connect
the
PC
line.
Peeled
heat
seal
Replace
the
heat
seal.
LSI
(HD61747B)
Replace
the
LSI.
Page 11 of 27
Test
Program
Noms
1.
After
typing
in
the
programs
below,
save
the
programs
to
a
cassette
tape
for
future
use.
2.
Memory
and
printer
check
programs
cannot
be
executed
at
the
same
time
because
of
a
limited
memory
capacity.
Memory
check
program
Ready
P%
LIST
1%
2%
25
3%
4%
5%
6%
7%
8%
9%
CLEAR
C=904
DEFM
C
FOR
B=1
TO
C
D(B)=B
NEXT
B
$="ABCDEFGHIJKL
MNOPQRSTUVWXYZ"
BEEP
1:
BEEP
1
PRINT
"INPUT
OK
*".
GOTO
#1
Ready
Pl
LIST
5
7
1%
2%
3%
4%
5%
6%
1%%
1%1
11%
111
A=%
A=A+1
FOR
B=1
TO
C
IF
D(B)#B
THEN
l%%
NEXT
B
IF
$="ABCDEFGHI
JKLMNOPQRSTUVWX
YZ"
THEN
1%%
IF
A=5
THEN
11%
PRINT
A;:
GOTO
7
PRINT
"CHECK**N
G**";:
BEEP
1:
BEEP
%:
GOTO
111
PRINT
"A=";A;
PRINT
"CHECK**O
K**";:
BEEP
1:
BEEP
1
PRINT
"A=";A;:
END
Printer
check
program
Ready
Pl
LIST
1%
2%
3%
4%
5%
6%
7%
8%
9%
11%
MODE
7
PRINT
"
**PC—
6
CHECK**
";
PRINT
"ABCDEFG
IJKLMNOPQRSTUVW
XYZ";
PRINT
"abcdefgh
ijklmnopqrstuvw
Xyzu;
PRINT
"%.123456
789";
PRINT
"%'@¥[J&+
~L->or.u)(
+
on-teal
'
°
~ZQuY5":
PRINT
"1#$?\<<>
>#+()*/+—eN“;
FOR
A=1
TO
28
PRINT
"8";
NEXT
A
PRINT
"
END-
MODE
8
Page 12 of 27
Program
SAVE,
LOAD
and
MEMORY
System
:
26-3651
or
PC-5
cable
(26-3671)
Operation:
(1)
PW
SW
ON
(2)
CMT
PLAY
MODE
H9
BUZZER
RUN
DEG
END
Ready
P0
(4)
PW
SW
OFF
Take
out
the
26-3651
+
CMT
(5)
PW
SW
ON
BUZZER
RUN
DEG
Ready
P0
(6)
BUZZER
RUN
DEG
DEFM
INPUT
OK*
(Buzzer
sound)
BUZZER
RUN
DEG
DEFM
INPUT
OK*1
BUZZER
RUN
DEG
DEFM
INPUT
OK*
1
2
BUZZER
RUN
DEG
DEFM
INPUT
OK*
1
2
3
BUZZER
RUN
DEG
DEFM
INPUT
OK*
1
2
3
4
BUZZER
RUN
DEG
DEFM
INPUT
OK*
1
2
3
4CHECK**OK**A=5
(Buzzer
sound)OK
BUZZER
RUN
DEG
DEFM
INPUT
OK*
CHECK**NG**A=1
(Buzzer
sound)
NG
Page 13 of 27
Printer
check
System:
263651
+
or
PC-5
+
26-3652
cable
PC-4
Printer
(26-3671)
(1)
PC—6
PW
SW
ON.
(2)
s
2
READY
P0
Print
sample:
**PC-6
CHECK**
ABCDEFGHIJKLMNOPORST
UVWXYzabcdefghijklmn
opqrstuvwxyzib
.
123456
789%'@¥[]&<-Jr-*0DAX%6I
0052!-°
Z§2uy6!#$'.°\<<>
>5eT()*7+-e1r88888888
8888888888888888888
-END-
Page 14 of 27
Operation
Check
1.
When
mis—operation
occurs,
return
to
the
nearest
*
mark
and
operate
from
the
*
mark.
2.
When
connecting
the
printer
and
cassette
interface,
be
sure
to
turn
off
the
power
switch.
Operation
BUZZER
WRT
DEG
7520
P-‘Q-123456789
OWERTYUIOP
BUZZER
RUN
DEG
OWERTYUIOP
)7’;
*[BRK]
ASDFGHJKL
=
Em
BUZZER
EXT
RUN
DEG
ASDFGHJKL
=‘i’
I;\
*
BRK
ZXCVBNM;
:,
BUZZER
EXTRUN
DEG
\
I
zxcvbnm;
:
/
BUZZER
EXTRUN
DEG
\
I
-z-xcvbnm;:
H
I
BUZZER
EXTRUN
DEG
\
|
/
zxcvbnm;
:
,
—H
.
BUZZER
EXT
RUN
DEG
i/
;r\
Page 15 of 27
Operation
Read
Out
*@
0.123+456—789*9/3
BUZZER
EXTRUN
DEG
EXE
-1910.877
BUZZER
EXTRUN
DEG
(Check
that
the
cursor
moves.)
E(
)
T
‘-K-'
II\
*
[E]
BUZZER
EXTRUN
DEG
UR
DEG
(—191(D.877
t
2
T
310
loeetl
BUZZER
EXTRUN
DEG
STAT
1.2
,0
BUZZER
EXTRUN
DEG
90
BUZZER
EXTRUN
DEG
90
E
00)
Page 16 of 27
BUZZER
HALE
B?
BUZZER
123EXE
C?
BUZZER
A
=
56088
BUZZER
A
=
B*C
BUZZER
Ready
P0
3
*
l>
BUZZER
TRACEON
Ready
P0)
BUZZER
Ready
P0
it
I»
O
U
rn
BUZZER
Ready
P0
Page 17 of 27
RUN
GRA
PRT
ON
BUZZER
\|/
,1\
BUZZER
\|I
0-W-
/«\
x|/
/I‘
“
[E3]
BUZZER
RA
MEM
e
L31
1
Q\_v_IW
BUZZER
BUZZER
ASMBL
Asmbl/Source/ca1
BUZZER
RUN
GRA
Ready
P@
Page 18 of 27
Operation
*
MODE
1
19
BEEP
1
EXE
POWER
SW
OFF/ON
Turn
the
contrast
volume.
Repeat
3
times.
Read
Out
BUZZER
RUN
GRA
Ready
P0
BUZZER
10
BEEP
1
WRT
GRA
BUZZER
20
GOTO10
WRT
GRA
BUZZER
RUN
GRA
(buzzer
sound)
BUZZER
Display
must
disappear.
Display
should
be
”Ready
P0.”
The
display
contrast
must
change.
Page 19 of 27
PCB
ASSEMBLY
VIEW
TOP
VIEW
as:
'
_‘
: }‘:':
’
‘
'
‘
,::|=!_-_l
‘V
V‘
E
...
V,>.
’
‘Q;
'
-
W
Page 20 of 27
PARTS
LIST
Electrical
Parts
’
Description
RS
Part
No.
Mfr's
Part
No.
CAPACITORS
C1’\:C4
Chip,
Ceramic,
100pF,
25V,
i5%,
CM21CH101J25V
ACF-1466
_‘
28907311
C5’\zC10
Chip,
Ceramic,
0.1}.tF,
15V,
+100%,
CM21YV104P15V
V
ACF-734.7
71032167
C11,
C12
Electrolytic,
22pF,
10V,
:t20%,
CE04C-1
A220MS7
\
CE-226MCBA
28047223
C13
Electrolytic,
100].tF,
10V,
i20°/o,
CE04C—1A101
MS
CE-107MCBA
28041047
|Cs
IC1
LSI,
CPU,
HD61747B2O
MX-7273
20018364
IC2
LSI,
CPU,
HD61747B25
MX-7274
20018801
|C3
LS1,
RAM,
HM6264ALFP-50
MX-7275
20011149
lC4
LS1,
MB64H193
MX-7276
20030453
lC5
IC,
TC4071
BF
MX-4245
21004359
PRINTED
CIRCUIT
BOARD
ASSEMBLIES
PC1
Assembly,
PCB-G707-1
82636701
PC2
Assembly,
PCB-G7
07-2
82636702
RESISTORS
R1’\zR9
Chip,
Ruthenium,
3.3
Kohm,
1/8W,
:l:5%,
CR32-108-332J-T-TP
ND-0230EBN
27930620
R10
Chip,
Ruthenium,
12
Kohm,
1/8W,
i5%,
CR32-108-123J-T-TP
ND-0288EBN
27930638
R11
Chip,
Ruthenium,
68
Kohm,
1/8W,
:l:2%,
CR32-108-683G-T-TP
ND-035'4CBN
27904530
R12
Chip,
Ruthenium,
220
ohm,
1/8W,
i10%,
CR32-108-221K-T-TP
ND-0149FBN
27904734
R13’\zR16
Chip,
Ruthenium,
3.9
Kohm,
1/8W,
i5%,
CR32-108-392J-T-TP
ND-0237EBN
27903835
R17’\zR21
Chip,
Ruthenium,
10
Kohm,
1/8W,
d:2%,
CR32-108-103G-T-TP
ND-0281CBN
27930603
R22
Chip,
Ruthenium,
22
Kohm,
1/8W,
i5%,
CR32-108-223J-T-TP
ND-0311EBN
27903740
R23
Chip,
Ruthenium,
2.2
Mohm,
1/8W,
:l:5%,
CR32-108-225J-T-TP
ND-0454EBN
27904761
R24
Chip,
Ruthenium,
100
ohm,
1/8W,
i10%,
CR32»108-101K—T-TP
ND-0132FBN
27904629
MISCELLANEOUS
D1’\zD3
Diode,
1S1588,
silicon
DX-0273
23003031
VR1
Volume,
for
contrast,
20
Kohm,
EV
L-AHAAO0B24
‘
AP-7004
27709486
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