TDK SmartMotion DK-UNIVERSAL-I Installation manual

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InvenSense, Inc. reserves the right to change
specifications and information herein without
notice unless the product is in mass production
and the application note has been designated by
InvenSense in writing as subject to a specified
Product / Process Change Notification Method
regulation.
InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A
[phone]
invensense.tdk.com
Document Number: AN-000368
Revision: 1.0
Date: 05/27/2022
SmartMotion Development Kit (DK)
DK-UNIVERSAL-I
Hardware User Guide

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TABLE OF CONTENTS
1Overview................................................................................................................................................................3
2Introduction...........................................................................................................................................................4
2.1. Features Overview............................................................................................................................................ 4
2.2. Platform Overview............................................................................................................................................ 4
3Quick Setup............................................................................................................................................................ 5
3.1. Using MotionLink Software .............................................................................................................................. 5
3.2. Connectors ....................................................................................................................................................... 5
3.3. Jumper Settings ................................................................................................................................................ 6
4Advanced Information...........................................................................................................................................7
4.1. Updating SAMG55 Firmware Hardware User Guide ........................................................................................ 7
4.2. TDK Sensor to SAM G55 MCU Connection ....................................................................................................... 7
4.3. Connecting Other Sensors................................................................................................................................ 7
5The Smartmotion System Design...........................................................................................................................8
5.1. System Block Diagram ...................................................................................................................................... 8
5.2. Main MCU SAM G55 Resource Allocation........................................................................................................ 8
6Revision History ..................................................................................................................................................... 9
7Declaration Disclaimer.........................................................................................................................................10

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1OVERVIEW
The TDK SmartMotion DK-UNIVERSAL-I is a comprehensive development system for TDK InvenSense Motion
Sensor devices. The platform designed around the Microchip SAM G55 MCU can be used by customers for rapid
evaluation and development of InvenSense sensor-based solutions. The platform integrates an on-board
Embedded Debugger so external tools are not required to program or debug with the SAM G55 MCU. Each
InvenSense motion sensor has its own unique development kit (DK).
The TDK SmartMotion DK-UNIVERSAL-I comes with the necessary software, including an InvenSense Motion Link, a
GUI-based development tool, and embedded Motion Drivers (eMD) for InvenSense motion sensors.
Embedded Motion Drivers (eMD) consists of a set of APIs to configure various aspects of the platform including
motion sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise
mode, and sensor interface to host (I2C, SPI). eMDs will also provide the following enhanced motion functions that
run on the MCU:
•Sensor Fusion
•Accelerometer and Gyroscope Calibration
•Android Functions: Game Rotation Vector, Gravity, Linear Acceleration
Motion Link is a GUI-based development tool included with the platform. It can be used to capture and
visualize the sensor data from the motion sensor.
The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. The
Xplained Pro extension series evaluation kits offer additional peripherals to extend the features of the board and
ease the development of customer designs.
The TDK SmartMotion Development Kit (DK) DK-UNIVERSAL-I supports multiple types of TDK IMUs and pressure
sensors.

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2INTRODUCTION
2.1. FEATURES OVERVIEW
•Integrated TDK InvenSense motion sensor
•Support for a magnetic sensor with plug in daughter boards (DB)
•Microchip SAM G55 microcontroller with 512 KB flash
•On-board Embedded debugger (EDBG) for programming and debugging
•Built in FTDI USB to UART interface for fast motion sensor data transfer
•USB connectors for host interface to software debug and data logging
•Board power supply through USB
2.2. PLATFORM OVERVIEW
The TDK SmartMotion Development Kit (DK) DK-UNIVERSAL-I is a hardware unit for TDK sensor product evaluation
and algorithm software development. The platform offers flexible solutions for many different application
developments.
Figure 1. The SmartMotion DK-UNIVERSAL-I Board

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3QUICK SETUP
3.1. USING MOTIONLINK SOFTWARE
1. Download and install MotionLink software.
2. Connect the FTDI USB (CN6) to PC and open MotionLink for quick testing, as shown in the block diagram
in Figure 2.
3. Click on Start MotionLink to get to the GUI window.
4. Refresh COM and if needed, connect EDBG USB (J500) to PC and Flash MCU Firmware.
5. Click on Select and Configure Sensor Board and find the correct part number.
6. Connect to the serial port and power on the board.
For further help, click on the Help button on the top bar for the MotionLink user manual or troubleshooting help.
Figure 2. Block diagram
Figure 3. DK-UNIVERSAL-I connected to EVB
3.2. CONNECTORS
Table 1 details the TDK SmartMotion Platform Ver. I connector and header reference names and descriptions.
CONNECTOR NAME
CONNECTOR
REF #
CONNECTOR FUNCTION DESCRIPTIONS
TDK Sensor EVB Connector
CN1
External TDK sensor EVB connector
Other Sensor DB
CN2/CN3
Daughter board connector for Mag sensor. I2C interface only
TDK Sensor DB
CN4/CN5
Daughter board connector for TDK sensor. I2C and SPI interfaces
FTDI USB
CN6
USB connector for FTDI USB to serial UART interface
JTAG Connector for SAMG55
CN7/CN8
JTAG Connector for SAMG55 debugging
EDBG LEDs
D500/D501
EDBG LEDs. D500 is green and D501 is yellow
Sensor I2C Selection
J1
Select host I2C connections, for IMU sensor and other sensors
PWR Source Select
J2
Board power source selection
VDDIO Voltage Select
J3
Selects voltage level between 3.3V, 1.8V, 1.2V for VDDIO
Test pins
J4
Digital signal test pins
Extension 1
J200
Extension header 1. Has same function as J200 on Microchip’s Xplained-
Pro board. Refer to http://www.atmel.com/Images/Atmel-42389-SAM-
G55-Xplained-Pro_User-Guide.pdffor more details
SAMG55 USB
J301
MCU SAM G55 USB connector
TDK Sensor (EVB)
SPI Slave
Or
I2C Slave
DK-UNIVERSAL-I Board
CN1
CN6

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CONNECTOR NAME
CONNECTOR
REF #
CONNECTOR FUNCTION DESCRIPTIONS
EDBG USB
J500
EDBG MCU USB connector
User Button
SW300
User Button is connected to MCU GPIO, function is defined by the user
Reset Button
SW301
RESET Button: Hardware Reset for the Target MCU and EDBG MCU
Table 1. Connectors
3.3. JUMPER SETTINGS
JUMPER
DESCRIPTION
J1
The J1 is used to select which sensor will be connected to the SAMG55 master I2C. Only two jumper shunts
are allowed.
Jumper shunts on pin-1/2 and 3/4: IMU Sensor primary I2C is connected to SAMG55 I2C master
Jumper shunts on pin-5/6 and 7/8: Other Sensor I2C is connected to SAMG55 I2C master. In this
configuration TDK IMU Sensor is connected to SAMG55 SPI master.
J2
The J2 is for board power source selection. Only one jumper shunt is allowed.
Jumper shunt on pin-1/2: board power is from EDBG USB on J500
Jumper shunt on pin-3/4: board power is from FTDI USB on CN6
Jumper shunt on pin-5/6: board power is from SAMG55 USB on J30
J3
J3 is for system VDDIO level selection.
Jumper shunts on pin-1/2: VDDIO=3V3
Jumper shunts on pin-3/2: VDDIO=1V8
Jumper shunts on pin-4/2: VDDIO=1V2
J4
J4 have digital signals as test points.
Pin-1: SPI /CS
Pin-2: SPI SCLK, I2C SCL
Pin-3: SPI MOSI, I2C SDA
Pin-4: SPI MISO, I2C AD0
Pin-5: INT1
Pin-6: INT2
Pin-7: GND
Table 2. Jumper Settings

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4ADVANCED INFORMATION
4.1. UPDATING SAMG55 FIRMWARE HARDWARE USER GUIDE
The TDK SmartMotion Development Kit DK-UNIVERSAL-I is compatible with Microchip’s SAMG55 Xplained Pro for
updating and flashing the firmware. Follow this link to download the Atmel Xplained Pro user guide, starting from
page 5:
http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdf
Connect the EDBG (Atmel Embedded Debugger) USB port with USB cable to PC.
4.2. TDK SENSOR TO SAM G55 MCU CONNECTION
The DK-UNIVERSAL-I is the development kit for DB (sensor daughter board) and EVB (sensor evaluation board).
There is no sensor mounted on the DK-UNIVERSAL-I board. CN1 for EVB and CN4/CN5 for DB are mounted on
board for people to evaluate sensors (on EVB, DB, or standalone) separately. Figure 4 shows the pin out for CN1,
where an external EVB can be mounted.
Figure 4. Pin out of CN1 (Connector to EVB)
4.3. CONNECTING OTHER SENSORS
Third party sensors can be connected to the same SAM G55 MCU I2C bus with TDK sensor through DB, assuming it
has a different slave address.
CN2/CN3 are designed for other sensor DB plug in. It only supports I2C, not SPI.

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5THE SMARTMOTION SYSTEM DESIGN
This section is a system design overview and addresses MCU SAM G55 resource allocation.
5.1. SYSTEM BLOCK DIAGRAM
The on-board EDBG MCU AT32UC3A4256HHB-C1UR allows the user to do main MCU SAM G55 debug, trace, and
programming without using external tools. Figure 5 shows the system block diagram.
Figure 5. System Block Diagram
5.2. MAIN MCU SAM G55 RESOURCE ALLOCATION
SAM G55 RESOURCE
USAGE
UART 0
(PA9/10/25/26)
The UART0 is connected to FTDI input by default. In the use case of Extension-1
on J200, the UART0 to FTDI connection can be disconnected through jumper J3.
TW6 (I2C)
(PB8/9)
TDK sensor is connected to this master I2C. On board sensor slave address =
0x69. Sensors on DB and EVB have slave address = 0x68.
SPI5
(PA05/PA11/12/13/14)
The SPI5 master is connected to TDK IMU sensor.
On board IMU /CS = PNCS1, EVB/DB IMU /CS = PNCS0.
GPIO (INTs)
PB03/PB15/PA30/PA20/PA15
The GPIOs are used for sensor interrupt inputs and other intelligent functions.
Refer to the table in Figure 5.
TW4 (I2C)
The master I2C communicates with EDBG MCU slave I2C.
UART6
The UART6 is used for EDBG DGI-UART interface.
UART7
The UART7 is used for EDBG CDC-UART interface.
Table 1. SAM G55 Resource Allocation

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6REVISION HISTORY
REVISION DATE REVISION DESCRIPTION
05/27/2022 1.0 Initial Release

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7DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but
cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component
characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on
data received from vendors and suppliers, which has not been validated by InvenSense.

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Specifications are subject to change without notice. TDK InvenSense reserves the right to make changes to this product, including its circuits
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