TDK SmartMotion DK-20680HT Installation manual

AN-000323
InvenSense, Inc. reserves the right to change
specifications and information herein without
notice unless the product is in mass production
and the application note has been designated by
InvenSense in writing as subject to a specified
Product / Process Change Notification Method
regulation.
InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A
[phone]
invensense.tdk.com
Document Number: AN-000323
Revision: 1.2
Date: 10/05/2022
SmartMotion
Development Kit (DK) Ver. B
Hardware User Guide

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TABLE OF CONTENTS
1Overview................................................................................................................................................................3
2Introduction...........................................................................................................................................................4
2.1. Features Overview............................................................................................................................................ 4
2.2. Platform Overview............................................................................................................................................ 4
2.3. Quick Setup....................................................................................................................................................... 5
2.4. Updating SAMg55 firmware Hardware User Guide ......................................................................................... 6
3Sensors and Development Kits ..............................................................................................................................6
3.1. TDK Sensor to SAM G55 MCU Connection ....................................................................................................... 6
3.1.1. DK-20680HT .............................................................................................................................................6
3.1.2. DK-20680HP............................................................................................................................................. 6
3.1.3. DK-20680A ...............................................................................................................................................7
3.1.4. DK-20602 .................................................................................................................................................7
3.1.5. DK-20648 .................................................................................................................................................7
3.1.6. DK-40609-D..............................................................................................................................................8
3.1.7. DK-40605 .................................................................................................................................................8
3.1.8. DK-42605 .................................................................................................................................................8
3.2. Magnetic Sensors Connection .......................................................................................................................... 8
4The Smartmotion System Design...........................................................................................................................9
4.1. System Block Diagram ...................................................................................................................................... 9
4.2. Main MCU SAM G55 Resource Allocation........................................................................................................ 9
4.3. Jumper Settings .............................................................................................................................................. 10
5Revision History ...................................................................................................................................................11
6Declaration Disclaimer.........................................................................................................................................12

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1OVERVIEW
The TDK SmartMotion Platform Ver. B is a comprehensive development system for TDK InvenSense Motion Sensor
devices. The platform designed around the Microchip SAM G55 MCU can be used by customers for rapid
evaluation and development of InvenSense sensor-based solutions. The platform integrates an on-board
Embedded Debugger so external tools are not required to program or debug with the SAM G55 MCU. Each
InvenSense motion sensor has its own unique development kit (DK).
The TDK SmartMotion platform Ver. B comes with the necessary software including an InvenSense Motion Link, a
GUI-based development tool, and embedded Motion Drivers (eMD) for InvenSense motion sensors.
Embedded Motion Drivers (eMD) consists of a set of APIs to configure various aspects of the platform including
motion sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise
mode, and sensor interface to host (I2C, SPI). eMDs will also provide the following enhanced motion functions that
run on the MCU:
•Sensor Fusion
•Accelerometer and Gyroscope Calibration
•Android Functions: Game Rotation Vector, Gravity, Linear Acceleration
Motion Link is a GUI-based development tool included with the platform. It can be used to capture and
visualize the sensor data from the motion sensor.
The platform supports Atmel Studio and is compatible with Microchip Xplained Pro Extension boards. The
Xplained Pro extension series evaluation kits offer additional peripherals to extend the features of the board and
ease the development of customer designs.
The TDK SmartMotion Development Kit (DK) Ver. B supports multiple types of TDK IMUs. Table 1 lists the TDK
Sensor Development Kit (DK) ordering information. This user guide applies to the following development kits. Refer
to section 3.1 for more information.
SUPPORTED SENSOR
DK PART NUMBER
MOUNTED ON U#
IAM-20680HT
DK-20680HT
U1
IAM-20680HP
DK-20680HP
U1
IAM-20680
DK-20680A
U1
ICM-20602
DK-20602
U1
ICM-20648
DK-20648
U2
ICM-40609-D
DK-40609-D
U2
ICM-40605
DK-40605
U3
ICM-42605
DK-42605
U3
Table 1. Sensors and DKs

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2INTRODUCTION
2.1. FEATURES OVERVIEW
•Integrated TDK InvenSense motion sensor
•Support for a magnetic sensor with plug in daughter boards (DB)
•Microchip SAM G55 microcontroller with 512 KB flash
•On-board Embedded debugger (EDBG) for programming and debugging
•Built in FTDI USB to UART interface for fast motion sensor data transfer
•USB connectors for host interface to software debug and data logging
•Board power supply through USB
2.2. PLATFORM OVERVIEW
The TDK SmartMotion Platform Ver. B is a hardware unit for TDK sensor product evaluation and algorithm
software development. The platform offers flexible solutions for many different application developments. The
board shown in Figure 1 is the DK-20680HT board (with TDK sensor in slot U1).
Figure 1. The SmartMotion Platform Overview
Table 2 details the TDK SmartMotion Platform Ver. B connector and header reference names and descriptions.
CONNECTOR NAME
CONNECTOR
REF #
CONNECTOR FUNCTION DESCRIPTIONS
TDK Sensor Slot
U1
Populated for the following DK boards:
DK-20680HT
DK-20680HP
DK-20680A
DK-20602

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CONNECTOR NAME
CONNECTOR
REF #
CONNECTOR FUNCTION DESCRIPTIONS
TDK Sensor Slot
U2
Populated for the following DK boards:
DK-20648
DK-40609-D
TDK Sensor Slot
U3
Populated for the following DK boards:
DK-40605
DK-42605
TDK Sensor EVB
CN1
External TDK sensor EVB connector
Other Sensor DB
CN2/CN3
Daughter board connector for Mag sensor. I2C interface only.
TDK Sensor DB
CN4/CN5
Daughter board connector for TDK sensor. I2C and SPI interfaces.
External Battery
CN7
External battery
CN9
Not mounted. Used for internal testing
FTDI USB
CN6
USB connector for FTDI USB to serial UART interface
EDBG LEDs
D500/D501
EDBG LEDs. D500 is green and D501 is yellow
PWR Source Select
J1
Board power source selection
Sensor I2C Selection
J2
Select host I2C connections, for IMU and mag.
Enable FTDI UART
J3
Assign UART0 for FTDI or for use on J200 extension header
DB/EVB SPI/I2C
Selection
J7
Assign DB/EVB communication bus protocol, I2C or SPI
Extension 1
J200
Extension header 1. Has same function as J200 on Microchip’s Xplained-Pro
board. Refer to http://www.atmel.com/Images/Atmel-42389-SAM-G55-
Xplained-Pro_User-Guide.pdf for more details
J203
Not mounted. Extension header 2. Has same function as J203 on
Microchip’s Xplained-Pro board
MCU Erase
J300
MCU Erase is used to clear flash on the MCU SAM G55
SAMG55 USB
J301
MCU SAM G55 USB connector
EDBG USB
J500
EDBG MCU USB connector
User Button
SW300
User Button is connected to MCU GPIO, function is defined by the user
Reset Button
SW301
RESET Button: Hardware Reset for the Target MCU and EDBG MCU.
Table 2. Connectors
2.3. QUICK SETUP
1. Download and install MotionLink software.
2. Connect the FTDI USB (CN6) to PC and open MotionLink for quick testing, as shown in the block diagram
in Figure 2.
3. Click on Start MotionLink to get to the GUI window.
4. Refresh COM and if needed, connect EDBG USB (J500) to PC and Flash MCU Firmware.
5. Click on Select and Configure Sensor Board and find the correct part number.
6. Connect to the serial port and power on the board.
For further help, click on the Help button on the top bar for the MotionLink user manual or troubleshooting help.
Figure 2. Block diagram
TDK Sensor (EVB)
SPI Slave
Or
I2C Slave
DK-UNIVERSAL-I Board
CN1
CN6

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Figure 3. DK-UNIVERSAL-I connected to EVB
2.4. UPDATING SAMG55 FIRMWARE HARDWARE USER GUIDE
The TDK SmartMotion Platform Ver. B is compatible with Microchip’s SAM G55 Xplained Pro for updating and
flashing the firmware. Follow this link to download the Atmel Xplained Pro user guide, starting from page 5:
http://www.atmel.com/Images/Atmel-42389-SAM-G55-Xplained-Pro_User-Guide.pdf
Connect the EDBG (Atmel Embedded Debugger) USB port with USB cable to PC. To set up the board, click on
Device Programming (Ctrl + Shift + P): and select EDBG as the Tool.
3SENSORS AND DEVELOPMENT KITS
3.1. TDK SENSOR TO SAM G55 MCU CONNECTION
3.1.1. DK-20680HT
The DK-20680HT is the development kit for TDK IAM-20680HT.
The IAM-20680HT is a 6-axis MotionTracking™ for Automotive non-safety applications that combines a 3-axis
gyroscope and a 3-axis accelerometer in a thin 3x3x0.75mm3(16-pin LGA) package.
Please refer to the datasheet for the sensor details.
The IAM-20680HT sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.
3.1.2. DK-20680HP
The DK-20680HP is the development kit for TDK IAM-20680HP.
The IAM-20680HP is a 6-axis MotionTracking™ for Automotive non-safety applications that combines a 3-axis
gyroscope and a 3-axis accelerometer in a thin 3x3x0.75mm3(16-pin LGA) package.
Please refer to the datasheet for the sensor details.
The IAM-20680HP sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.

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3.1.3. DK-20680A
The DK-20680A is the development kit for TDK IAM-20680.
The IAM-20680 is a 6-axis MotionTracking™ for in-cabin Automotive applications that combines a 3-axis gyroscope
and a 3-axis accelerometer in a small 3x3x0.75mm3(16-pin LGA) package.
Please refer to the datasheet for the sensor details.
The ICM-20602 sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.
3.1.4. DK-20602
The DK-20602 is the development kit for TDK ICM-20602.
The ICM-20602 is a 6-axis MotionTracking™ device that combines a 3-axis gyroscope and a 3-axis accelerometer in a
small 3x3x0.75mm3(16-pin LGA) package.
Please refer to the datasheet for the sensor details.
The ICM-20602 sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.45V.
3.1.5. DK-20648
The DK-20648 is the development kit for TDK ICM-20648.
The ICM-20648 is a 6-axis MotionTracking™ device that combines a 3-axis gyroscope, 3-axis accelerometer, and a
Digital Motion Processor™ (DMP™) in a 3x3x0.9mm3(24-pin QFN) package.
Please refer to the datasheet for the sensor details.
The ICM-20602 sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.

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3.1.6. DK-40609-D
The DK-40609-D is the development kit for TDK ICM-40609-D.
The ICM-40609-D is a 6-axis MotionTracking™ device that combines a 3-axis gyroscope and a 3-axis accelerometer in
a small 3x3x0.91mm3(24-pin LGA) package.
Please refer to the datasheet for the sensor details.
The ICM-40609-D sensor can be connected to SAMG55 MCU I2C or SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.
3.1.7. DK-40605
The DK-40605 is the development kit for TDK ICM-40605.
The ICM-40605 is a 6-axis MotionTracking™ device that combines a 3-axis gyroscope and a 3-axis accelerometer in a
small 2.5x3x0.91mm3(14-pin LGA) package.
Please refer to the datasheet for the sensor details.
The ICM-20602 sensor can be connected to SAMG55 MCU SPI.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.
3.1.8. DK-42605
The DK-42605 is the development kit for TDK ICM-42605.
The ICM-40605 is a 6-axis MotionTracking™ device that combines a 3-axis gyroscope and a 3-axis accelerometer in a
small 2.5x3x0.91mm3(14-pin LGA) package.
Please refer to the datasheet for the sensor details.
The ICM-42605 sensor can be connected to SAMG55 MCU I2C, SPI, or I3C.
The sensor I2C slave address is 0x69, and its SPI /CS = NPCS1.
The VDDIO voltage level ranges from 1.71V to 3.6V.
3.2. MAGNETIC SENSORS CONNECTION
Third party magnetic sensors can be connected to the same SAM G55 MCU I2C bus with TDK sensor through DB,
assuming it has a different slave address.
CN2/CN3 are designed for the magnetic sensor DB plug in. It only supports I2C, not SPI.

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4THE SMARTMOTION SYSTEM DESIGN
This section is a system design overview and addresses MCU SAM G55 resource allocation.
4.1. SYSTEM BLOCK DIAGRAM
The on-board EDBG MCU AT32UC3A4256HHB-C1UR allows the user to do main MCU SAM G55 debug, trace, and
programming without using external tools. Figure 4 shows the system block diagram.
Figure 4. System Block Diagram
4.2. MAIN MCU SAM G55 RESOURCE ALLOCATION
SAM G55 RESOURCE
USAGE
UART 0
(PA9/10/25/26)
The UART0 is connected to FTDI input by default. In the use case of Extension-1
on J200, the UART0 to FTDI connection can be disconnected through jumper J3.
TW6 (I2C)
(PB8/9)
TDK sensor is connected to this master I2C. On board sensor slave address =
0x69. Sensors on DB and EVB have slave address = 0x68.
SPI5
(PA05/PA11/12/13/14)
The SPI5 master is connected to TDK IMU sensor.
On board IMU /CS = PNCS1, EVB/DB IMU /CS = PNCS0.
GPIO (INTs)
PB03/PB15/PA30/PA20/PA15
The GPIOs are used for sensor interrupt inputs and other intelligent functions.
Refer to the table in Figure 3.
TW4 (I2C)
The master I2C communicates with EDBG MCU slave I2C.
UART6
The UART6 is used for EDBG DGI-UART interface.
UART7
The UART7 is used for EDBG CDC-UART interface.
Table 3. SAM G55 Resource Allocation

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4.3. JUMPER SETTINGS
JUMPER
DESCRIPTION
J1
J1 is used for board power source selection. Only one jumper is allowed to be closed
1. Pin 1/2: Closed – board power from external battery (CN7)
2. Pin 3/4: Closed – board power from EDBG USB connector (J500)
3. Pin 5/6: Closed – board power from FTDI USB connector (CN6)
4. Pin 7/8: Closed – board power from SAM G55 USB connector (J301)
J2
J2 is used to assign SAM G55 master I2C to slave devices
1. 1/2 and 3/4: Closed – SAM G55 I2C master for onboard IMU Sensor
2. 5/6 and 7/8: Closed – SAM G55 I2C master for other sensors daughter boards connected via CN2
and CN3 (e.g., Magnetic sensor, etc.)
J3
J3 is used to choose UART0 for FTDI or the extension 1 headers (J200)
1. Close all 4 jumpers (1/2, 3/4, 5/6 and 7/8) (Default) – SAM G55 UART0 for FTDI
2. Open all 4 jumpers – SAM G55 UART0 for extension 1 header (J200)
J7
J7 is used for I2C or SPI selection for DB/EVB communication
1. Short: SPI
2. Open: I
2
C
Table 4. Jumper Settings

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5REVISION HISTORY
REVISION DATE REVISION DESCRIPTION
10/22/2021 1.0 Initial Release
08/30/2022 1.1
Additional Automotive products support included. Following sections
reviewed: Table 1, 3.1.2, 3.1.3, 3.1.4, 3.1.5
10/05/2022 1.2
Added DK-20602, DK-20648, DK-20680A, DK-20680HP, DK-40605, DK-
42605, DK-40609-D
Updated figure, connection labels, and hardware guide instructions for
clarity; removed schematics

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6DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but
cannot guarantee accuracy or completeness. Conformity documents substantiating the specifications and component
characteristics are on file. InvenSense subcontracts manufacturing, and the information contained herein is based on
data received from vendors and suppliers, which has not been validated by InvenSense.

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This information furnished by InvenSense or its affiliates (“TDK InvenSense”) is believed to be accurate and reliable. However, no responsibility
is assumed by TDK InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use.
Specifications are subject to change without notice. TDK InvenSense reserves the right to make changes to this product, including its circuits
and software, in order to improve its design and/or performance, without prior notice. TDK InvenSense makes no warranties, neither expressed
nor implied, regarding the information and specifications contained in this document. TDK InvenSense assumes no responsibility for any claims
or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is
not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or
otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. TDK InvenSense sensors should not be used or sold
in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life-
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2021—2022 InvenSense. All rights reserved. InvenSense, SmartMotion, MotionProcessing, MotionProcessor, SensorStudio, UltraPrint,
MotionTracking, CHIRP Microsystems, SmartBug, SonicLink, Digital Motion Processor, AAR, and the InvenSense logo are registered trademarks
of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of the respective
companies with which they are associated.
©2021—2022 InvenSense. All rights reserved.