
Table of Contents
ii TLA721 Benchtop & TLA7XM Expansion Mainframe Service Manual
Mainframe Removal and Installation Procedures 6--5...............
Equipment Required 6--5..............................................
Install Empty Slot Panel Fillers 6--6.....................................
Blower Assembly 6--7................................................
Removing the Enhanced Monitor Board 6--10..............................
Power Supply 6--12...................................................
Mainframe Cover 6--13................................................
Card Guides 6--14....................................................
Nut Rails 6--16.......................................................
Temperature Sense Board 6--17..........................................
EMI DIN Shields 6--19................................................
Backplane 6--20......................................................
Special Configuration Options 6--23......................................
Benchtop Controller Removal and Installation Procedures 6--25.......
Equipment Required 6--25..............................................
Replaceable Hard Disk Drive 6--26.......................................
Injector/Ejector Handles 6--28...........................................
Covers 6--29.........................................................
Front Panel and Hard Disk Drive Interface Board 6--30.......................
Fixed Hard Drive 6--34................................................
CD-ROM Drive 6--36.................................................
Button Battery 6--37..................................................
Main Memory 6--38...................................................
Floppy Disk Drive 6--39...............................................
Expansion Module Removal and Installation Procedures 6--45.........
Equipment Required 6--45..............................................
Ejector Handles 6--46.................................................
Expansion Module Cover 6--47..........................................
Expansion Module Circuit Board 6--48....................................
Soldered-On Components 6--49..........................................
Troubleshooting 6--51...........................................
Service Level 6--52...................................................
Check for Common Problems 6--52......................................
Isolating System Problems 6--56.........................................
Eliminate other Problem Sources 6--59....................................
Diagnostics 6--59.....................................................
BIOS Error Messages 6--62.............................................
TLA Startup Sequence 6--65............................................
Troubleshoot the Benchtop Controller 6--66................................
Troubleshoot the Mainframe 6--68.......................................
Troubleshoot the Expansion Mainframe 6--71..............................
Adjustments after Repair 6--72..........................................
Repackaging Instructions 6--73...................................
Packaging 6--73......................................................
Shipping to the Service Center 6--73......................................
Options
Service Options 7--1..................................................
Product Options 7--2.................................................
Power Cord Options 7--2..............................................