Teledyne RCP2-1100 User manual

3 RU Chassis
Solid State Power Amplifier
Operations Manual
205356 REV T ECO 18284 08/09/2017
Teledyne Paradise Datacom Phone: [phone]
328 Innovation Blvd., Suite 100 Fax: [phone]
State College, PA 16803 USA Web: www.paradisedata.com
Email: [email protected]

2 205356 REV T 3 RU SSPA Chassis Operations Manual
Teledyne Paradise Datacom, a division of Teledyne Wireless LLC, is a single source for high power
solid state amplifiers (SSPAs), Low Noise Amplifiers (LNAs), Block Up Converters (BUCs), and Modem
products. Operating out of two primary locations, Witham, United Kingdom, and State College, PA, USA,
Teledyne Paradise Datacom has a more than 20 year history of providing innovative solutions to enable
satellite uplinks, battlefield communications, and cellular backhaul.
Teledyne Paradise Datacom Teledyne Paradise Datacom Ltd.
328 Innovation Blvd., Suite 100 2&3 The Matchyns, London Road, Rivenhall End
State College, PA 16803 USA Witham, Essex CM8 3HA England
[phone] (switchboard) [phone]
[phone] (fax) [phone] (fax)
Information in this document is subject to change without notice. The latest revision of this document
may be downloaded from the company web site: http://www.paradisedata.com.
Use and Disclosure of Data
The items described herein are controlled by the U.S. Government and authorized for export only to the
country of ultimate destination for use by the ultimate consignee or end-user(s) herein identified. They
may not be resold, transferred, or otherwise disposed of, to any other country or to any person other
than the authorized ultimate consignee or end-user(s), either in their original form or after being
incorporated into other items, without first obtaining approval from the U.S. government or as otherwise
authorized by U.S. law and regulations.
Proprietary and Confidential
The information contained in this document is the sole property of Teledyne Paradise Datacom. Any
reproduction in part or as a whole without the written permission of Teledyne Paradise Datacom is
prohibited.
All other company names and product names in this document are property of the respective
companies.
© 2017 Teledyne Paradise Datacom
Printed in the USA

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Section 1: General Information .............................................................................................11
1.0 Introduction .............................................................................................................11
1.1 Description ..............................................................................................................11
1.2 Specifications..........................................................................................................12
1.3 Equipment Supplied................................................................................................12
1.4 Inspection................................................................................................................ 12
1.5 Rack Mounting ........................................................................................................12
1.6 Shipment.................................................................................................................12
1.7 Safety Considerations............................................................................................. 12
1.7.1 High Voltage Hazards ..............................................................................13
1.7.2 High Current Hazards ..............................................................................13
1.7.3 RF Transmission Hazards........................................................................14
1.7.4 Electrical Discharge Hazards ...................................................................14
1.7.5 High Potential for Waveguide Arcing .......................................................14
1.8 Waveguide Pressurization and Dehydration...........................................................15
Section 2: Operation of Stand-Alone Unit............................................................................19
2.0 Introduction .............................................................................................................19
2.1 Description of Controls, Indicators and Connectors................................................19
2.1.1 Front Panel Features ...............................................................................19
2.1.1.1 Fault Condition LEDs.................................................................19
2.1.1.2 Standby Select Key ..................................................................19
2.1.1.3 Front Panel Display ...................................................................20
2.1.1.4 Navigation Keys ........................................................................20
2.1.1.5 Main Menu Key ........................................................................20
2.1.1.6 Local/Remote Key ....................................................................20
2.1.1.7 Mute/Unmute Key ..................................................................... 20
2.1.1.8 Input Sample Port (Optional) [N-type (F)]..................................20
2.1.1.9 Output Sample Port (N-type (F)) ............................................... 20
2.1.1.10 Removable Fan Assembly ......................................................20
2.1.1.11 Removable Power Supply Modules.........................................21
2.1.1.12 Front Panel Power Switch (Optional) ...................................... 21
2.1.2 Rear Panel Features ................................................................................21
2.1.2.1 AC Input Port (J10) [IEC 6100-3300 (F)]...................................21
2.1.2.2 DC Input with N+1 External Power Supply (J10) (Option).........22
2.1.2.3 R3 Input Port (J1) [Type N (F)]..................................................24
2.1.2.4 RF Output Port (J2) [Band specific]...........................................24
2.1.2.5 Switch Port (J3) [6-pin MS-type]................................................24
2.1.2.6 Serial Main (J4) [DB9 (F)]..........................................................25
2.1.2.7 Serial Local (J5) [DB9 (M)] ........................................................ 25
2.1.2.8 Program Port (J6) [DB25 (M)]....................................................25
2.1.2.9 Parallel I/O (J7) [DB37 (F)]........................................................25
2.1.2.9.1 Hardware Mute (Tx Enable)........................................27
2.1.2.10 Link Port (J8) [DB9 (M)]...........................................................27
2.1.2.11 Ethernet Port (J9) [RJ45].........................................................27
2.1.2.12 Removable Fan Assembly ......................................................28
Table of Contents

4 205356 REV T 3 RU SSPA Chassis Operations Manual
2.2 Menus .....................................................................................................................28
2.2.1 System Information Sub-Menu.................................................................29
2.2.1.1 Sys Info Page 1 .........................................................................30
2.2.1.1.1 Clear Faults Menu ...................................................... 30
2.2.1.2 Sys Info Page 2 .........................................................................31
2.2.1.3 Sys Info Page 3 .........................................................................31
2.2.1.4 Sys Info Page 4 .........................................................................31
2.2.1.5 Sys Info Page 5 .........................................................................32
2.2.1.6 Sys Info Page 6 .........................................................................32
2.2.1.7 Sys Info Page 7 .........................................................................32
2.2.1.8 Sys Info Page 8 .........................................................................33
2.2.1.9 Sys Info Page 9 (version 6.00) ..................................................33
2.2.1.10 Sys Info Page 10 (version 6.00) ..............................................34
2.2.1.11 IP Info Page 1..........................................................................35
2.2.1.12 IP Info Page 2..........................................................................35
2.2.1.13 IP Info Page 3..........................................................................35
2.2.1.14 IP Info Page 4..........................................................................36
2.2.1.15 Firmware Info Page 1 ..............................................................36
2.2.1.16 Firmware Info Page 2 (version 4.0) .........................................36
2.2.1.17 Firmware Info Pages 3, 4, 5, 6 and 7 (version 4.0) .................36
2.2.1.18 Hardware Info Page 8 (version 6.00).......................................36
2.2.1.19 HPA Local Time Page 9 (version 6.00) ...................................36
2.2.1.20 HPA Run Time Page 10 (version 6.00) ...................................37
2.2.1.21 N+1 Master Info Page 1 .......................................................... 37
2.2.1.21.1 Clear Faults Menu .................................................... 38
2.2.1.22 N+1 Slave Info Page ............................................................... 38
2.2.1.22.1 Clear Faults Menu .................................................... 38
2.2.1.23 N+1 Master Info Page 2 .......................................................... 39
2.2.1.24 N+1 Master Info Page 3 .......................................................... 39
2.2.2 Communication Setup Sub-Menu ............................................................40
2.2.2.1 Protocol .....................................................................................40
2.2.2.2 Baud Rate .................................................................................40
2.2.2.3 System Address ........................................................................41
2.2.2.4 Interface ....................................................................................41
2.2.2.5 IP Setup.....................................................................................41
2.2.2.5.1 More (SNMP, IP and Web Settings).......................................42
2.2.2.5.2 More (Traps and Time Settings).............................................43
2.2.2.6 N+1 Control (Floating Master Mode) .........................................44
2.2.3 Operation Setup Sub-Menu .....................................................................46
2.2.3.1 Info ............................................................................................46
2.2.3.2 Buzzer .......................................................................................46
2.2.3.3 Mute ..........................................................................................46
2.2.3.4 Sys. Mode .................................................................................46
2.2.3.5 Attenuation ................................................................................47
2.2.3.6 RF Units ....................................................................................47
2.2.4 Fault Monitoring Setup Sub-Menu ...........................................................48
2.2.4.1 BUC Fault..................................................................................48
2.2.4.2 Auxiliary Faults ..........................................................................48
2.2.4.3 RF Switch Faults .......................................................................49
2.2.4.4 Fault Latch.................................................................................49

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2.2.4.5 Forward RF / Automatic Level Control ......................................49
2.2.4.5.1 Disable........................................................................49
2.2.4.5.2 Low RF ....................................................................... 49
2.2.4.5.3 High RF.......................................................................50
2.2.4.5.4 ALC On (Automatic Level Control) .............................50
2.2.4.5.5 Set Level.....................................................................51
2.2.4.5.6 Back............................................................................51
2.2.5 Options Sub-Menu ...................................................................................52
2.2.5.1 Backup User Settings................................................................52
2.2.5.2 Restore......................................................................................52
2.2.5.3 Lamp Test .................................................................................53
2.2.5.4 Password...................................................................................53
2.2.5.5 Fan Speed.................................................................................53
2.2.5.6 Reset .........................................................................................54
2.2.6 Redundancy Sub-Menu ...........................................................................55
2.2.6.1 Switching ...................................................................................55
2.2.6.2 Standby Select ..........................................................................55
2.2.6.3 Standby Mode ...........................................................................55
2.2.6.4 Status ........................................................................................55
2.2.6.5 Priority .......................................................................................56
2.2.6.6 N+1 System Operation Parameters ..........................................56
2.2.6.6.1 N+1 Array Size ...........................................................56
2.2.6.6.2 N+1 Address...............................................................56
2.2.6.6.3 Auto Gain Control ....................................................... 56
2.2.6.6.4 N+1 Info ......................................................................57
2.2.6.6.5 Module Eject...............................................................58
2.2.6.6.6 Back............................................................................58
2.3 N+1 Operational Basics (Single Unit) .....................................................................59
2.4 N+1 Operational Basics (Two or More Units) .........................................................59
2.4.1 Selecting the Master Module....................................................................59
2.4.2 Controlling System Operation ..................................................................60
2.4.3 N+1 Addressing........................................................................................61
2.4.4 Adjust System Gain..................................................................................61
2.4.5 N+1 Automatic Gain Control Option.........................................................61
2.4.6 N+1 RF Power Measurements.................................................................62
2.4.7 N+1 Fault Detection .................................................................................62
2.5 Reflected Power Option .......................................................................................... 64
2.5.1 Reflected Power Alarm ............................................................................64
Section 3: Troubleshooting and Maintenance.....................................................................65
3.0 Troubleshooting Faults ...........................................................................................65
3.0.1 Summary Fault.........................................................................................65
3.0.2 Voltage Fault ............................................................................................ 65
3.0.3 Temperature Fault....................................................................................65
3.0.4 Current Fault ............................................................................................66
3.0.5 Power Supply Fault ..................................................................................66
3.0.6 Fan Fault .................................................................................................. 66
3.0.7 Low RF Fault............................................................................................67
3.1 Modular SSPA Architecture ....................................................................................68
3.1.1 Removable Fans (Intake and Exhaust)....................................................68

6 205356 REV T 3 RU SSPA Chassis Operations Manual
3.1.1.1 Fan and Heatsink Maintenance.................................................69
3.1.2 SSPA Module Removal............................................................................70
3.1.3 Power Supply Module Removal ...............................................................71
3.1.3.1 External N+1 Redundant Power Supply....................................71
3.1.4 Removable Controller Card (Rear Panel) ................................................ 72
3.1.3 Firmware Upgrade Procedure..................................................................73
3.1.3.1 Required Hardware ...................................................................73
3.1.3.2 Required Software.....................................................................73
3.1.3.3 Web Upgrade Procedure...........................................................74
3.1.3.4 USB Port Upgrade Procedure ...................................................76
3.2 Changing N+1 Hierarchy.........................................................................................77
3.2.1 Changing Hierarchical Order of Slave Units.............................................77
3.2.2 Exchange N+1 Privileges Between Master and Slave Units....................77
3.2.3 Add an SSPA Unit to the System.............................................................78
Section 4: Operation of a 1:1 Redundant System ..............................................................79
4.0 Introduction .............................................................................................................79
4.1 Hardware ................................................................................................................80
4.1.1 Power Supply ...........................................................................................81
4.1.2 RF Switch.................................................................................................81
4.1.3 Switch Connector .....................................................................................81
4.1.4 Link Cable ................................................................................................ 82
4.2 Installation and SSPA configuration .......................................................................83
4.2.1 Configuring HPA to Work in 1:1 Redundant Mode (Internal Control).......83
4.2.1.1 Setting SSPA1 to Work in 1:1 Mode..........................................83
4.2.1.2 Setting SSPA1 Switching Mode ................................................ 84
4.2.1.3 Setting SSPA1 Unit Status ........................................................ 84
4.2.2 Online / Standby Amplifier Selection........................................................84
4.2.3 Auto Versus Manual Switching Mode ......................................................85
4.2.4 Physically Rotating Transfer Switch.........................................................85
4.2.5 Switchover Muting....................................................................................85
4.2.6 Parallel Port Special Functions ................................................................86
Section 5: Operation of a 1:2 Internal Redundant System ................................................87
5.0 Introduction .............................................................................................................87
5.1 Required Hardware.................................................................................................88
5.2 Power Supply..........................................................................................................89
5.3 RF Switches............................................................................................................89
5.4 Switch Connector....................................................................................................89
5.5 Link Cable ...............................................................................................................90
5.6 Installation and SSPA Configuration.......................................................................92
5.6.1 Installation ................................................................................................ 92
5.6.1.1 Configuring HPA to Work in 1:2 Mode (Internal Control)...........92
5.6.1.2 Setting HPA1 Switching Mode...................................................92
5.6.1.3 Setting HPA1 Unit Status ..........................................................92
5.6.2 Setting SSPA’s Polarization Priority.........................................................93
5.7 Online/Standby Amplifier Selection.........................................................................93
5.8 Auto Versus Manual Switching Mode .....................................................................94
5.9 Physically Rotating Transfer Switch........................................................................94
5.10 Parallel Port Special Functions ............................................................................. 94

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Section 6: L-Band Operation .................................................................................................95
6.0 Block Up Converter Overview.................................................................................95
6.1 ZBUC Converter Features ......................................................................................97
6.2 ZBUC Converter Theory of Operation ....................................................................97
6.3 Smart Reference Technology .................................................................................98
6.3.1 Specifications for Internal Crystal Reference ...........................................98
6.4 Typical System Configuration .................................................................................99
6.5 IFL Cable Considerations .......................................................................................99
Section 7: Remote Control Interface...................................................................................101
7.0 Overview ...............................................................................................................101
7.1 Remote Control - Parallel .....................................................................................103
7.1.1 Control Outputs .....................................................................................103
7.1.2 Control Inputs ........................................................................................103
7.2 Serial Communication Protocol.............................................................................104
7.2.1 Header Sub-Packet................................................................................104
7.2.1.1 Frame Sync Word ...................................................................104
7.2.1.2 Destination Address ................................................................104
7.2.1.3 Source Address.......................................................................104
7.2.2 Data Packet............................................................................................105
7.2.2.1 Protocol ID...............................................................................105
7.2.2.2 Request ID ..............................................................................105
7.2.2.3 Command................................................................................105
7.2.2.4 Data Tag..................................................................................106
7.2.2.5 Error Status / Data Address.....................................................106
7.2.2.6 Data Length.............................................................................107
7.2.2.7 Data Field ................................................................................107
7.2.3 Trailer Packet ......................................................................................... 108
7.2.3.1 Frame Check...........................................................................108
7.2.4 Timing issues .........................................................................................108
7.2.5 Serial Communications Protocol ............................................................109
7.3 Access SSPA Subsystem through Packet Wrapper Technique ...........................115
7.4 Example 1 Check SSPA settings..........................................................................116
7.5 Terminal Mode Serial Protocol for Paradise Datacom SSPA ...............................118
7.6 Ethernet Interface ................................................................................................. 120
7.6.1 IPNet Interface .......................................................................................120
7.6.1.1 General Concept .....................................................................120
7.6.1.2 Setting IPNet Interface ............................................................122
7.6.1.3 Using the Rack Mount Web Interface......................................123
7.6.2 SNMP Interface......................................................................................125
7.6.2.1 Interface ..................................................................................125
7.6.2.2 SNMP V3 Issues in Teledyne Paradise Datacom SSPAs.......125
7.6.2.3 SNMP MIB tree .......................................................................128
7.6.2.4 Description of MIB Entities ......................................................129
7.6.2.5 Configuring SSPA to Work with SNMP Protocol .....................134
7.6.2.6 Connecting to a MIB Browser.................................................. 135
7.6.3 Extended SNMP Operation....................................................................137
7.6.3.1 Extended SNMP MIB Tree ......................................................138
7.6.3.2 Extended SNMP MIB Tree Elements in Detail ........................140

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Appendix A: Ethernet Interface Quick Set-Up ...................................................................141
Appendix B: Proper 10/100 Base-T Ethernet Cable Wiring ..............................................145
Appendix C: RM SSPA Control with Paradise Datacom Universal M&C.........................149
Appendix D: Automatic Level Control................................................................................153
Appendix E: Documentation................................................................................................155
List of Figures
Figure 1-1: Degradation of Breakdown Power by VSWR .............................................17
Figure 2-1: 3RU SSPA Chassis Front Panel ................................................................19
Figure 2-2: C-Band SSPA Rear Panel..........................................................................21
Figure 2-3: 3RU SSPA Chassis with 1RU N+1 Redundant Power Supply ................... 22
Figure 2-4: Terminal Block............................................................................................23
Figure 2-5: Power Supply Alarm Cable Connection .....................................................23
Figure 2-6: Front Panel Menu Structure .......................................................................28
Figure 2-7: System Information Menu Structure ...........................................................29
Figure 2-8: Slave Unit Display ......................................................................................38
Figure 2-9: Communication Setup Sub-Menu...............................................................40
Figure 2-10: Operation Setup Sub-Menu......................................................................46
Figure 2-11: Fault Monitoring Setup Sub-Menu............................................................48
Figure 2-12: Options Sub-Menu....................................................................................52
Figure 2-13: Redundancy Sub-Menu............................................................................55
Figure 2-14: N+1 Info Menu..........................................................................................57
Figure 2-15: Front Panel Display, Master Unit (Online Indicator Illuminated)...............60
Figure 2-16: Front Panel Display, Slave Unit (Online Indicator Dark)...........................60
Figure 3-1: Front Panel Fault Display ...........................................................................65
Figure 3-2: Unscrew Thumb Screws on Fan Tray and Slide Tray from Chassis ..........68
Figure 3-3: Unplug Quick Connector ............................................................................68
Figure 3-4: Unscrew Four Thumb Screws on Rear Panel Fan Assembly ....................68
Figure 3-5: Disconnect Power Connector to Remove Fan Tray ...................................68
Figure 3-6: Example of Dust Blocking Heatsink Fins....................................................69
Figure 3-7: Heatsink Fins Cleared of Debris.................................................................70
Figure 3-8: Module Placement......................................................................................70
Figure 3-9: Remove Power Supply Module ..................................................................71
Figure 3-10: Loosen Retaining Thumb Screws.............................................................72
Figure 3-11: Remove Card to Access Programming Connectors.................................72
Figure 3-12: Web Upgrade Authentication Window......................................................74
Figure 3-13: Firmware Upload Form.............................................................................74
Figure 3-14: Proceed With Upgrade Prompt.................................................................75
Figure 3-15: Upload Process Message.........................................................................75
Figure 3-16: Upload Completed Message ....................................................................75
Figure 3-17: Windows Device Manager > Ports ...........................................................76
Figure 3-18: Command Window Showing Program Prompts .......................................76
Figure 4-1: Block Diagram, 1:1 Redundant System......................................................79
Figure 4-2: RM SSPA 1:1 Redundant Systems ............................................................80
Figure 4-3: Outline Drawing, Switch Connector Cable .................................................81
Figure 4-4: Outline Drawing, Link Port Cable ...............................................................82
Figure 4-5: Cable Connection Between SSPAs and Waveguide Switch ......................83
Figure 4-6: “Unit 1” Indicator from Front Panel .............................................................84
Figure 5-1: Block Diagram, 1:2 Redundant System......................................................87
Figure 5-2: Outline Drawing, Switch Connector Cable .................................................89

3 RU SSPA Chassis Operations Manual 205356 REV T 9
Figure 5-3: Outline Drawing, Link Port Cable ...............................................................90
Figure 5-4: 1:2 System Wiring Diagram........................................................................91
Figure 5-5: “Unit 1” Indicator from Front Panel .............................................................93
Figure 6-1: Configurator, 3RU Rack Mount SSPA, BUC Options.................................95
Figure 6-2: Schematic, Optional Block Up Converter ...................................................96
Figure 6-3: Block Diagram of Block Up Converter / SSPA System...............................96
Figure 6-4: SSPB Chassis with Evolution Series Modem............................................99
Figure 8-1: Remote Control Interface Stack ...............................................................101
Figure 7-2: Parallel I/O Form C Relay ........................................................................103
Figure 7-3: Basic Communication Packet...................................................................104
Figure 7-4: Header Sub-Packet .................................................................................. 104
Figure 7-5: Data Sub-Packet ...................................................................................... 105
Figure 7-6: Trailer Sub-Packet....................................................................................108
Figure 7-7: Packet Wrapper Technique ...................................................................... 115
Figure 7-8: Terminal Mode Session Example.............................................................119
Figure 7-9: UDP Redirect Frame Example .................................................................121
Figure 7-10: Web Interface Login Window..................................................................123
Figure 7-11: RM SSPA Web Interface, Status Tab.....................................................124
Figure 7-12: GetIF Application Parameters Tab .........................................................135
Figure 7-13: Getif MBrowser Window, With Update Data in Output Data Box ........... 135
Figure 7-14: Getif MBrowser Window, Setting settingValue.5 to a Value of ‘1’ ..........136
Figure A-1: TCP/IP Properties Window ......................................................................141
Figure B-1: Modular Plug Crimping Tool.....................................................................145
Figure B-2: Transmission Line ....................................................................................145
Figure B-3: Ethernet Cable Pin-Outs ..........................................................................147
Figure B-4: Ethernet Wire Color Code Standards.......................................................147
Figure B-5: Wiring Using 568A Color Codes ..............................................................147
Figure B-6: Wiring Using 568A and 568B Color Codes ..............................................147
Figure C-1: New Rack Mount SSPA Dialog Window ..................................................149
Figure C-2: SSPA Status Window ..............................................................................150
Figure C-3: SSPA Faults Window...............................................................................150
Figure C-4: SSPA Settings Window............................................................................151
Figure C-5: IP Setup Window .....................................................................................151
Figure C-6: N+1 Settings and Conditions Window......................................................152

10 205356 REV T 3 RU SSPA Chassis Operations Manual
List of Tables
Table 1-1: Recommended Output Power Thresholds for Waveguide Pressurization... 16
Table 1-2: De-rating of Waveguide Components Relative to Straight Waveguide .......16
Table 2-1: Switch Port (J3) Pin Outs.............................................................................24
Table 2-2: Serial Main (J4) Pin Outs.............................................................................25
Table 2-3: Parallel Connector (37 socket D connector) Pin Outs .................................26
Table 2-4: Ethernet Port (J9) Pin Outs..........................................................................27
Table 4-1: RF Switch Connector Wiring........................................................................81
Table 4-2: Link Port (J8) Pin Outs.................................................................................82
Table 4-3: Parallel connector (37 socket D connector), Highlighting 1:1 Functions .....86
Table 5-1: RF Switch Connector Wiring........................................................................89
Table 5-2: Link Cable Wiring.........................................................................................90
Table 6-1: ZBUC Converter Frequency Bands .............................................................97
Table 6-2: ZBUC Converter Local Oscillator Phase Noise ...........................................97
Table 6-3: Common Coaxial Cable Characteristics ......................................................99
Table 8-1: Interfaces Enabled Based on Chosen Interface Setting Selection ............102
Table 7-2: Command Byte Values ..............................................................................105
Table 7-3: Data Tag Byte Values................................................................................106
Table 7-4: Error Status Byte Values ...........................................................................107
Table 7-5: Request Frame Structure ..........................................................................108
Table 7-6: Response Frame Structure........................................................................108
Table 7-7: System Setting Details...............................................................................109
Table 7-8: System Threshold Addressing Details (Read Only) ..................................112
Table 7-9: System Conditions Addressing Details......................................................113
Table 7-10: OSI Model for RM SSPA Ethernet IP Interface .......................................121
Table 7-11: Detailed SNMP Settings ..........................................................................130
Table 7-12: Detailed SNMP Thresholds .....................................................................132
Table 7-13: Detailed SNMP Conditions ......................................................................133

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1.0 Introduction
This section provides the general information for the Teledyne Paradise Datacom
Compact Rack Mount (CRM) Series Solid State Power Amplifier (SSPA) Chassis. This
includes a description of the unit and safety precautions for operation of the unit.
1.1 Description
The Teledyne Paradise Datacom Compact Rack Mount (CRM) Series SSPA Chassis
was specially designed to accommodate applications where rack space is at a
premium. At only 3RU in height and a depth of 24 inches (610 mm) the CRM Series
SSPA Chassis is perfect for use in Satellite News Gathering or flyaway applications.
A rich feature set has been maintained, despite the small size of the chassis. For field
maintainability, this chassis features:
• Front and rear panel removable fan trays
• Front panel removable power supply modules
• Rear panel removable controller card assembly
• Front panel RF output sample port
This chassis includes a wide array of standard interfaces:
• Front Panel Local Interface and Status Indicators
• RS232/RS485 (4-wire) Serial Communication (with either Windows-
based M&C or third-party M&C drivers available)
• Ethernet Port (SNMP, UDP Serial Programming, Web Browser Interface)
• Parallel I/O (Form C Contact Outputs, Opto Isolated Inputs)
Optional interfaces include:
• Remote Control Panel (using the optional 1RU RCP2-1000-RM)
The chassis’ microprocessor monitors various voltages, currents and temperatures
within the unit for a full fault analysis. The user also may select additional faults related
to the RF output level, an optional reflected RF power level and operating temperature.
An internal attenuator allows up to 20.0 dB of attenuation to be applied to the RF
signal. Temperature compensation limits the amplifier’s output response from varying
significantly over the operating temperature. Also, the system contains input and
output sample ports.
Section 1: General Information

12 205356 REV T 3 RU SSPA Chassis Operations Manual
1.2 Specifications
Refer to the specification sheet in Appendix E for complete specifications.
1.3 Equipment Supplied
The following equipment is supplied with each unit:
• SSPA Chassis RM (3 RU high)
• Power Cord
• Rack Slides
• Operations Manual, 3RU Solid State Power Amplifier Chassis [205356]
1.4 Inspection
When the unit is received, an initial inspection should be completed. First ensure that
the shipping container is not damaged. If it is, have a representative from the shipping
company present when the container is opened. Perform a visual inspection of the
equipment to make sure that all items on the packing list are enclosed. If any damage
has occurred or if items are missing, contact:
Teledyne Paradise Datacom LLC
328 Innovation Blvd., Suite 100
State College, PA 16803 USA
Phone: [phone]
Fax: [phone]
1.5 Rack Mounting
The SSPA Chassis is designed to fit in a standard 19” (483 mm) wide EIA rack. The
unit is 3 rack units or 5.22 inches (133 mm) high by 24.13 inches (613 mm) deep.
1.6 Shipment
To protect the SSPA Chassis during shipment, use high quality commercial packing
methods. When possible, use the original shipping container and its materials. Reliable
commercial packing and shipping companies have facilities and materials to adequate-
ly repack the instrument.
1.7 Safety Considerations
Potential safety hazards exist unless proper precautions are observed when working
with this unit. To ensure safe operation, the user must follow the information, cautions
and warnings provided in this manual as well as the warning labels placed on the unit
itself.

3 RU SSPA Chassis Operations Manual 205356 REV T 13
1.7.1 High Voltage Hazards
High Voltage, for the purpose of this section, is any voltage in excess of 30V. Voltages
above this value can be hazardous and even lethal under certain circumstances. Care
should be taken when working with devices that operate at high voltage.
• All probes and tools that contact the equipment
should be properly insulated to prevent the operator
from coming in contact with the voltage.
• The work area should be secure and free from non-
essential items.
• Operators should never work alone on high voltage
devices. There should always be another person pre-
sent in the same work area to assist in the event of
an emergency.
• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.
• An AC powered unit will have 115 VAC or 230 VAC entering through the
AC power connector. Caution is required when working near this con-
nector, the AC circuit breaker, or the internal power supply.
1.7.2 High Current Hazards
Many high power devices are capable of producing large
surges of current. This is true at all voltages, but needs to
be emphasized for low voltage devices. Low voltage
devices provide security from high voltage hazards, but also
require higher current to provide the same power. High
current can cause severe injury from burns and explosion.
The following precautions should be taken on devices
capable of discharging high current:
• Remove all conductive personal items (rings, watches, medals, etc.)
• The work area should be secure and free of non-essential items.
• Wear safety glasses and protective clothing.
• Operators should never work alone on high risk devices. There should
always be another person present in the same area to assist in the event
of an emergency.
• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.
Large DC currents are generated to operate the RF Module inside of the enclosure.
Extreme caution is required when the enclosure is open and the amplifier is operating.
Do not touch any of the connections on the RF modules when the amplifier is operat-
ing. Current in excess of 60 Amperes may exist on any one connector.

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1.7.3 RF Transmission Hazards
RF transmissions at high power levels may cause eyesight damage and skin burns.
Prolonged exposure to high levels of RF energy has been linked to a variety of health
issues. Please use the following precautions with high levels of RF power.
• Always terminate the RF input and output connector
prior to applying prime AC input power.
• Never look directly into the RF output waveguide
• Maintain a suitable distance from the source of the
transmission such that the power density is below
recommended guidelines in ANSI/IEEE C95.1. The
power density specified in ANSI/IEEE C95.1-1992 is
10 mW/cm2. These requirements adhere to OSHA
Standard 1910.97.
• When a safe distance is not practical, RF shielding should be used to
achieve the recommended power density levels.
1.7.4 Electrical Discharge Hazards
An electric spark can not only create ESD reliability problems, it can also cause serious
safety hazards. The following precautions should be followed when there is a risk of
electrical discharge:
• Follow all ESD guidelines
• Remove all flammable material and solvents from the
area.
• All probes and tools that contact the equipment
should be properly insulated to prevent electrical dis-
charge.
• The work area should be secure and free from non-
essential items.
• Operators should never work alone on hazardous equipment. There
should always be another person present in the same work area to assist
in the event of an emergency.
• Operators should be familiar with procedures to employ in the event of an
emergency, i.e., remove all power, CPR, etc.
1.7.5 High Potential for Waveguide Arcing
As with all systems which utilize high power signals within
waveguide, the potential exists for an electric arc to form.
To minimize this risk, Teledyne Paradise Datacom re-
quires all waveguide be pressurized and dehydrated.

3 RU SSPA Chassis Operations Manual 205356 REV T 15
1.8 Waveguide Pressurization and Dehydration
When working with high power amplifier systems that operate into waveguide, the in-
advertent creation of arcs is always a concern. An arc in waveguide is the air discharge
breakdown due to the ionization of the air molecules by electrons. This breakdown in
waveguide occurs when the rate of electron production becomes greater than the loss
of electrons to diffusion to the surrounding walls.
It is extremely difficult to precisely predict the power levels at which the breakdown oc-
curs. It is dependent on a variety of factors but the primary factors are:
• Waveguide temperature and atmospheric pressure
• Components in the Waveguide Transmission System such as: Flanges,
Bends, Tees, Combiners, Filters, Isolators, etc.
• Load VSWR presented to the amplifier.
When operating such a high power amplifier system it is imperative that the waveguide
transmission system be dehydrated and pressurized. Operation with an automatic air
dehydrator will provide dry pressurized air to ensure that condensation cannot form in
the waveguide. Also the higher the pressure that can be maintained in the waveguide;
the higher the power handling is in the waveguide system. Most commonly available
air dehydrators are capable of providing pressures of 0.5 to 7.0 psig (25-362 mmHg).
At low power levels (uniform field distribution), low pressure can give good results. For
non-uniform conditions, highly localized breakdown can occur. In this case the wave-
guide system will require much higher pressure. This occurs with bends, waveguide
flange joints. If line currents flow across a small gap introduced by poor tolerances,
flange mismatch, poorly soldered bends, field strengths in excess of that in the main
line can occur in the gap. Pressurization with air or high dielectric gases can increase
the power handling by factors of 10 to 100.
In High Power Amplifier systems an arc will travel from where it is ignited back to the
amplifier. Typical arc travel speed is on the order of 20 ft/sec. Increasing the wave-
guide pressure can reduce the speed of arc travel. It is difficult to get an accurate cal-
culation of the amount of pressurization needed, but it is a good practice to get as
much pressure as your system can handle. All high power systems that meet the crite-
ria of Table 1-1 are pressure tested at the factory to 1.5 psig. As a guide we recom-
mend using the power levels in Table 1-1 as the threshold levels where special atten-
tion should be given to dehydration and the overall simplification of waveguide system
design.

16 205356 REV T 3 RU SSPA Chassis Operations Manual
It is a common misconception to look up the maximum theoretical power handling of a
particular type of waveguide and assume that this is the maximum power handling.
This may be the case for a straight waveguide tube with ideal terminations but these
values must be significantly de-rated in practical systems. Phase combined amplifier
systems can be particularly sensitive to the potential for waveguide arcing. This is due
to the numerous bends, magic tees, multiple waveguide flange joints, and other wave-
guide components. Table 1-2 shows the power handling capability of some popular
waveguide components normalized to the waveguide power rating. From this table, we
can see how a practical waveguide system’s power handling will de-rate significantly.
Most waveguide systems have many of these components integrated before reaching
the antenna feed. It is not uncommon for a Satcom waveguide network to de-rate to
5% of the straight waveguide power rating.
The load VSWR also has an impact on the breakdown threshold in waveguide net-
works. Standing waves degrade the power handling of any transmission line network.
The graph of Figure 1-1 shows the rapid degradation of waveguide breakdown vs.
load VSWR. The chart shows that for a 2.0:1 load VSWR, the breakdown potential will
be half of what it would be with a perfectly matched load. This can degrade even more
when high Q elements such as band pass filters are included in the waveguide net-
work.
Satcom Band Frequency Range Amplifier Output Power Waveguide
S Band 1.7-2.6 GHz > 10 kW WR430
C-Band 5.7 - 6.7 GHz > 2 kW WR137
X-Band 7.9-8.4 GHz > 1kW WR112
Ku-Band 13.75-14.5 GHz > 500W WR75
Ka-Band 27-31 GHz > 100W WR28
Table 1-1: Recommended Output Power Thresholds
for Waveguide System Pressurization
Waveguide Component Relative Power Rating
H Plane Bend 0.6 to 0.9
E Plane Bend 0.97
90oTwist 0.8 to 0.9
Magic Tee 0.80
E-Plane Tee 0.06
H-Plane Tee 0.80
Cross Guide Coupler 0.21
Table 1-2: Relative De-rating of Popular Waveguide
Components Relative to Straight Waveguide

3 RU SSPA Chassis Operations Manual 205356 REV T 17
There are many factors to consider with high power amplifier systems in terms of the
output waveguide network. Especially when using HPA systems with output power
levels of Table 1-1, it is imperative to ensure that the output waveguide network is
pristinely clean and dry. An appropriate dehydrator should be used with capability of
achieving adequate pressure for the system’s output power. Take extra precaution to
make sure that any waveguide flange joints that are not already in place at the factory
are properly cleaned, gasket fitted, and aligned. A properly designed and maintained
waveguide network will ensure that no arcing can be supported and will provide many
years of amplifier service life.
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0
PowerDegradationRatio
LoadVSWR
DegradationofBreakdownPowerbyVSWR
Figure 1-1: Degradation of Breakdown Power by VSWR

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3 RU SSPA Chassis Operations Manual 205356 REV T 19
2.0 Introduction
This section contains operating information including a description of the front panel
indicators and controls, and I/O connectors and their functions.
2.1 Description of Controls, Indicators and Connectors
2.1.1 Front Panel Features
Figure 2-1 shows an illustration of the front panel view of a standard 3RU Rack Mount
chassis. The front panel features the prime power connection, a removable Monitor &
Control Card Assembly, removable fan assemblies, and the RF input and output ports.
2.1.1.1 Fault Condition LEDs
The RM SSPA has five fault condition LEDs on left side of the front panel which reflect
some of the HPA major faults plus the summary fault state.
2.1.1.2 Standby Select Key
The LED in this key illuminates when an HPA in a redundant system is Online, and
otherwise acts as a power ON indicator for a standalone HPA. Pressing this key will
put the Online HPA in a redundant system into Standby mode. Pressing this key has
no effect on a standalone HPA, and on the Standby HPA in a redundant system.
Section 2: Operation of Stand-Alone Unit
Figure 2-1: 3RU SSPA Chassis Front Panel
HPAC3-250
250W C-BAND
RF INPUT
SAMPLE
RF INPUT
SAMPLE
PARADISE
DATACOM
RF OUTPUT
SAMPLE
RF OUTPUT
SAMPLE
Fault Condition LEDs
Standby Select key
40x2 Display Local/Remote key
Mute/Unmute key
Main Menu key
Navigation keys
RF Output Sample Port
RF Input Sample Port (optional) Removable Fan Assembly
Removable Power Supply
Removable Power Supply
(in higher power units)
Power Switch
(optional)

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2.1.1.3 Front Panel Display
The front panel 40x2 character display allows the user to get detailed information
about state of the HPA and provides easy customization of operation through an
interactive menu structure.
2.1.1.4 Navigation Keys
The Up, Down, Left, Right and Enter keys on the right side of the front panel allow the
user to navigate through the menu selections displayed on the front panel display.
2.1.1.5 Main Menu Key
Provides a shortcut to the SSPA main menu.
2.1.1.6 Local/Remote Key
Allows the user to disable or enable the local control keypad console. If the SSPA is in
“Remote Only” mode, the unit will not react on any keystrokes except the “Local/
Remote” key.
2.1.1.7 Mute/Unmute Key
Provides an easy way to change the Mute state of the SSPA. Muting the amplifier via
the front panel requires 100 msec maximum (50 msec minimum). See Section
2.1.2.9.1 for a description of alternative muting methods.
2.1.1.8 Input Sample Port (Optional) [N-type (F)]
An optional RF input sample port is located on the lower left corner of the SSPA front
panel. This provides a -10 dBc coupled sample of the RF input signal. It is a N-type (f)
connector.
2.1.1.9 Output Sample Port (N-type (F))
The Output RF Sample Port connector is located on the right lower corner of the HPA
front Panel. This provides a -40 dBc coupled sample of the RF output signal. A
calibration sticker is located above the N-type (f) connector.
2.1.1.10 Removable Fan Assembly
The front panel fan assembly can be removed for maintenance. See Section 3. The
three-fan assembly operates at 20 VDC.