Telit Wireless Solutions LM960 Guide

[01.2019]
Mod.08
18 2019-01 Rev.0
LM960
Thermal Design Guide
1VV0301620 Rev. 1 – 2019-11-11

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 2of 22 2019-11-11
SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 3of 22 2019-11-11
USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 4of 22 2019-11-11
APPLICABILITY TABLE
PRODUCTS
LM960
LM960A18

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 5of 22 2019-11-11
Contents
NOTICE 2
COPYRIGHTS ................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
APPLICABILITY TABLE ................................................................................ 4
CONTENTS .................................................................................................... 5
1. INTRODUCTION .......................................................................... 6
2. THERMAL MODEL ...................................................................... 7
Temperature Sensor and Hotspot................................................. 7
2.1.1. Temperature Reading and Monitoring........................................... 7
Thermal Mitigation Algorithm ........................................................ 9
2.2.1. Thermal Mitigation Level Reading............................................... 10
2.2.2. How to Change Thermal Mitigation Level Range ........................ 12
Thermal Model -TBD .................................................................. 14
Temperature Range.................................................................... 15
Current consumption in each mode ............................................ 15
3. THERMAL DESIGN ................................................................... 17
Thermal Design Guidelines......................................................... 17
Thermal Design Solution............................................................. 18
4. DOCUMENT HISTORY .............................................................. 21

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 6of 22 2019-11-11
1. INTRODUCTION
The aim of this document is to provide thermal model and design guidelines useful for
developing a product with the Telit LM960.
Information – Proper thermal protection design protects against human
or component damage for worst-case conditions.
And it reduces the probability of failure and does not adversely affect
the use of the module, and greatly extends the operation time with
maximum performance.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 7of 22 2019-11-11
2. THERMAL MODEL
Temperature Sensor and Hotspot
LM960 has three thermistors inside the module. The internal temperature can be
monitored by the AT command.
<LM960 Temp Sensor & Hotspot>
As you can see in the figure above, there are three temperature sensors (TSENS2,
PA_THERM0, PA_THERM1) inside the LM960. And it can be read by the internal
temperatures using the AT#TEMPSENS command.
2.1.1. Temperature Reading and Monitoring
AT#TEMPSENS command provides several methods to read the internal temperature like
instantaneous or periodic reporting and to monitor the internal temperature using URC
and GPIO.
#TEMPSENS – Temperature monitor
AT#TEMPSENS=
<mod>[,<interval
>
Set command sets the operation of the internal temperature
monitor.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 8of 22 2019-11-11
#TEMPSENS – Temperature monitor
[,<action>
,<low_temp>
,<high_temp>
[,<gpio>]]]
Parameters:
<mod>
0 – disables the periodic reporting (factory default)
1 – enables the periodic reporting
2 – instantaneous reporting of the Temperature
Note: the module cannot enter sleep when <mod>=1.
<interval>- duration in seconds of the interval between next
measurement. It has meaning only if <mod> is 1.
The unsolicited message is in the format:
#TEMPSENS: <sensor>,<value>
where:
<sensor> - temperature sensor name
<value> - actual temperature expressed in Celsius degrees
<action>
1 - (01) - it enables the presentation of the temperature monitor
URC periodically. If <action> is not specified, this is
default.
2 - (10) - it enables the presentation of the temperature notification
URC, whenever the module internal temperature
reaches either <low_temp> or <high_temp> levels.
4 - (100) - output pin <gpio> is tied HIGH when set temperature
bounds are reached; when the temperature is back to
normal the output pin <gpio> is tied LOW. It is
mandatory to set the <gpio> parameter too to set this
<action>.
The notification message is in the format:
#TEMPNOTI: <level>,<value>
where:
<level> - threshold level
-1 - <low_temp> set temperature lower bound
0 - normal temperature
1 - <high_temp> set temperature upper bound
Note: Possible values for the parameter <action> are form 1 to 7
(001, 010, 011, 100, 101, 110 and 111)

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 9of 22 2019-11-11
#TEMPSENS – Temperature monitor
<low_temp> - Temperature Lower Bound
(-40 – 0, Celsius Degrees)
<high_temp> -Temperature Upper Bound
(0 – 100, Celsius Degrees)
<gpio> - GPIO number. Valid range is any GPIO pin as described in
#GPIO command. This parameter is needed and required
only if <action>=4, 5, 6 or 7 are enabled.
AT#TEMPSENS? Read command reports the current parameter settings in the
format:
#TEMPSENS:
<mod>,<interval>[,<action>,<low_temp>,<high_temp>,[<gpio>]]
AT#TEMPSENS=
?
Test command reports supported range of values for parameters
<mod>,<interval>,<action>,<low_temp>,<high_temp> and
<gpio>.
Example AT#TEMPSENS=2
#TEMPSENS: TSENS2,29
#TEMPSENS: PA_THERM0,30
#TEMPSENS: PA_THERM1,30
OK
Thermal Mitigation Algorithm
LM960 has built-in thermal mitigation algorithm to reduce the probability of failure and
extend the operation time with maximum performance.
The thermal mitigation algorithm operates according to the internal temperature value
read through the three temperature sensors.
Thermal mitigation algorithm limits the performance(DL/UL throttling, Tx power back off,
call drop.. etc) when the temperature is above a defined certain level.
Thermal Mitigation Level
Temperature sensors have several thermal mitigation levels. Each level has predefined
actions as below table and it work in sensor individually.
Performs following actions according to mitigation level to reduce/control temperature.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 10 of 22 2019-11-11
Sensor Level Action Comment
PA_THERM 0 - Normal
1 Enable UL data throttling Start throttling the uplink data rate by
reporting a smaller buffer status
report.
2 Enable MTPL back-off Limit maximum Tx power (23dBm)
3 Lmitied service mode Call released.
TSENS 0 - Normal
1 Start DL data throttling #3DL CA drops to 1DL (PCC only)
3 Limited service mode Call released.
After entering mitigation level 3, limited service mode is released after PA_THERM and
TSENS sensor reaches mitigation level 0. That is, the sensor reading falls below the level
1 clear thresholds.
2.2.1. Thermal Mitigation Level Reading
AT#TMLVL command used for read current thermal mitigation level of each temperature
sensors.
#TMLVL – Thermal Mitigation Level
AT#TMLVL=<devi
ce_id>
Set command reports a current thermal mitigation level of specific
<device_id>.
Parameters:
<device_id> - which device to get mitigation level
1 – TSENS2
2 – PA_THERM
The report message is in the format:
#TMLVL: <level>
Where:
<level> - thermal mitigation level
0 – normal
1 – level1
2 – level2
3 – level3

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 11 of 22 2019-11-11
#TMLVL – Thermal Mitigation Level
Note : level2 is shown only with PA_THERM device.
AT#TMLVL? Read command reports a current thermal mitigation level of all
devices in the format:
#TMLVL: TSENS2,<level>
#TMLVL: PA_THERM,<level>
AT#TMLVL=? Test command returns the supported range of values for parameter
<device_id>.
Example AT#TMLVL?
#TMLVL: TSENS2,1
#TMLVL: PA_THERM,1
OK
AT#TMLVL=2
#TMLVL: 1
OK

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 12 of 22 2019-11-11
2.2.2. How to Change Thermal Mitigation Level Range
Thermal mitigation level range could be modified through thermal engine configuration file.
For using ADB on Windows OS
Download the ADB tool through google (Can be skipped if you already have).
http://adbshell.com/downloads
Check ADB device detection.
Connect USB to Windows Laptop.
Run Command Prompt or PowerShell of Windows in downloaded ADB tool
directory.
adb devices
If ADB detection success, you can see the specific device id. In case of detection
failed, please do next step.
Register Telit USB VID to ADB tool (This step needs only once at one Laptop.
If ADB detection filed, please do following commands.
echo 0x1BC7 >> %HOMEPATH%\.android\adb_usb.ini
adb kill-server
adb devices

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 13 of 22 2019-11-11
After do commands, you can see ADB device that attached on Laptop.
Change thermal engine configuration file
Current thermal engine configuration file can be got from LM960 through ADB command.
adb pull /etc/thermal-engine.conf
Open and edit the thermal-engine.conf file.
Put the modified thermal-engine.conf file to LM960.
adb push thermal-engine /etc
Please do reboot LM960 to apply your changes.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 14 of 22 2019-11-11
Thermal Model -TBD
Thermal Model is evaluated by thermal simulation and RF test with thermal chamber.
<Equivalent thermal resistance model>
The two-resistor compact model is calculated according to JEDEC standard.
ƟJT is the thermal resistance from junction to the top side: 9 °C/W
ƟJA is the thermal resistance from the top side to the air side: 22 °C/W
ƟJB is the thermal resistance from junction to the bottom side: 7 °C/W
ƟBA is the thermal resistance from the bottom to the air side: 19 °C/W
**Measure condition:
- Thernal resistances were measured in 100mm * 90mm * 1mm FR4 Evaluation
board
- Network condition
Downlink 4*4MIMO 1.2Gbps throughput (B2, B66C)
Uplink QPSK and maximum power status
And we also provide the FloTHERM detail
modeling file for help
customers to design and simulate their design easily.
Thermal simulation was performed with Flotherm V12.1
If you want to get the thermal simulation file, please contact Telit
Technical Support at
•[e-mail]
•[e-mail]
•TS-[email protected]
•TS-[email protected]

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 15 of 22 2019-11-11
Temperature Range
The allowable maximum operating temperature is +105°C which can be read by
AT#TEMPSENS. It is not recommended to operature LM960 above the allowable
maximum operating temperature.
Operating Condition
Condition Min Typ Max
The Temperature read by
AT#TEMPSENS - - +105°C
Current consumption in each mode
LM960 Current Consumption
Mode Average [Typ.] Mode Description
IDLE Mode
CFUN=1 20mA No call connection
USB3.0 is connected to a host
Power Saving Mode (PSMWDISACFG=1, W_DISABLE_N:Low)
CFUN=4 2.5mA Tx and Rx are disabled; module is not
registered on the network (Flight mode)
WCDMA 3mA DRx7 (1.28 sec DRx cycle)
LTE 3.3mA Paging cycle #128 frames (1.28 sec DRx
cycle)
Operative Mode (LTE)
Non-CA mode
(1DL / 1UL) 600mA Non-CA, Band 2, Single carrier, BW 5MHz, 23dBm, 1RB
2DL CA with 2x2
MIMO / 2UL CA 900mA
CA_2A-5A, 2x2 MIMO, Full RB, 256QAM DL
/ 64QAM UL (FDD 300Mbps DL / 150Mbps
UL)
5DL CA with 2x2
MIMO / 1UL 1000mA
CA_2A-5B-66A-66A, 2x2 MIMO, Full RB,
256QAM DL / 64QAM UL (FDD 1Gbps DL /
75Mbps UL)
3DL CA with 4x4
MIMO / 1UL 1200mA
CA_2A-66C, 4x4 MIMO, Full RB, 256QAM
DL / 64QAM UL (FDD 1.2Gbps DL / 75Mbps
UL)
Operative Mode (WCDMA)
WCDMA Voice 750 mA WCDMA voice call (Tx = 23 dBm)

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 16 of 22 2019-11-11
Mode Average [Typ.] Mode Description
WCDMA HSPA
(22 dBm) 650 mA WCDMA data call (DC-HSDPA up to 42 Mbps, Max Throughput)
* Worst/best case current values depend on network configuration
** Loop-back mode in call equipment
*** 3.3 voltage / room temperature
Information – The electrical design for the power supply must ensure
a peak current output of at least 2A.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 17 of 22 2019-11-11
3. THERMAL DESIGN
This chapter provides the thermal design guide for customer to help their thermal design.
Thermal Design Guidelines
To enhance heat dissipation:
•Ensure that the air flow around the LM960 is sufficient. (Spread the heat)
- Balance the heat flow between front and back of the PCB
- Insulate hot spots on the device skin from hot areas below
•Separate hottest components (Spread the heat)
•Optimize the ground plane and connections. (Spread the heat)
- Use larger copper weight for a solid ground plane layer
- Connect each ground pad of LM960 directly.
•Use Thermal Interface Material. (Spread the heat)
- Eliminate air gaps between the top/bottom of LM960 and heat spreaders;
use TIM under compression and thermal grease for better thermal
conduction
- Use large surface areas with high thermal conductivity
•Use phase change material or heat pipes. (Absorb the heat)
•Keep the TCXO or any XO away from heat sources/gradients near the LM960.
•If the thermal conductive material is attached between LM960 and the customer
board, the heat dissipation is better for multilayer PCB.
•Attach the conductive material and heat sink at top and bottom side of module for
the heat dissipation.

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 18 of 22 2019-11-11
Thermal Design Solution
There are the 1.2 W/m-k thermal conductive materials between main chipset and shield
cover of the LM960 for the better heat dissipation.
<LM960 Side View>
RF and Baseband areas must be heat dissipation.
<LM960 Shield Cover with TIM (Bottom View)>
<Copper Pad Location on Bottom of LM960>

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 19 of 22 2019-11-11
There is the large solder resist opening area on the back of LM960 for the better heat
dissipation to heat sinks which are on a customer’s application board.
This chapter defines the heat sink or TIM for your application as a basic element of the
heat sink design. LM960 is able to get very hot when operating at the upper limit of its
range.
A heat sink or TIM is a component that is attached to a module for the sake of transferring
heat from the device into the surrounding environment. This environment is most
commonly air, but it can also be other fluids. Heat sinks are typically made of aluminum or
copper. It expedites the heat transfer to the surrounding fluid.
<Thermal Solution on Both sides>
The best method is that attaching a heat sink on top and a TIM on bottom side.
Inevitable environment where heat sink or TIM cannot be attached to both sides, it is able
to attach a heat sink or TIM only one side, but this is not the best option.
We recommend that you attach a TIM pad to the bottom side of customer PCB.
Please refer to the figure as below.
<Heat Sink on Top Side>

LM960 Thermal Design Guide
1VV0301620 Rev. 1 Page 20 of 22 2019-11-11
<TIM on Bottom Side>
Information – If ignore the above contents, network connection might
be terminated due to overheating. When the temperature drops, it will
be restart the network connection.