Telit wireless solutions Me910x1 Guide

ME910X1 – mPCIe

HW Design Guide

1VV0301642 Rev. 2 – 2022-01-14

Telit Technical Documentation

ME910C1 mPCIe HW Design Guide

1VV0301642 Rev. 2 Page 2of 56 2022-01-14

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APPLICABILITY TABLE

PRODUCTS

ME910C1-WW

ME910G1-WW

ME910C1 mPCIe HW Design Guide

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CONTENTS

APPLICABILITY TABLE 2

CONTENTS 3

1. INTRODUCTION 6

Scope 6

Audience 6

Contact Information, Support 6

Symbol Conventions 7

Related Documents

1ME910C1 Hardware User Guide 1VV0301351

2ME910C1 AT Command User Guide 80529ST10815A

3mPCIe_IFBD_HW_USER_GUIDE 1VV0301483

4PCI Express Mini Card Electromechanical Specification Revision 2.1

5ME910G1 Hardware User Guide 1VV0301593

6ME910G1 AT Command User Guide 80617ST10991A

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2. GENERAL PRODUCT DESCRIPTION

Overview

This document presents possible and recommended hardware solutions useful for

developing a product with the Telit ME910X1-mPCIe module.

ME910X1-mPCIe is Telit platform for Mini PCIe applications, such as M2M applications,

table PC, based on the following technologies:

•LTE / WCDMA networks for data communication

•Designed for industrial grade quality

In its most basic use case, the ME910X1-mPCIe can be applied as a wireless

communication front-end for mobile products, offering mobile communication features

to an external host CPU through its rich interfaces. ME910X1-mPCIe can further support

customers’ software applications and security features. ME910X1-mPCIe provides a

software application development environment with sufficient system resources to

create rich on-board applications. Thanks to a dedicated application processor and

embedded security resources, product developers and manufacturers can create

products that guarantee fraud prevention and tamper evidence without extra effort for

additional security precautions.

ME910X1-mPCIe hardware is available in different board and band variants as listed in

the chapter §2.2 Product Variants and Frequency Bands

Product Variants and Frequency Bands

ME910X1 modules bands combinations are listed below:

Product

2G Band

4G Band

Region

ME910C1-NA

2, 4, 12 North America

ME910C1-WW

2, 3, 5, 8 1, 3, 5, 8, 18, 19, 26, 28 World Wide

ME910G1-WW

2, 3, 5, 8 B1, B2, B3, B4, B5, B8, B12, B13,

B18, B19, B20, B25, B26, B27,

B28, B66, B71, B85

World Wide

Table 1 Product Variants and Frequency Bands

Refer to Chapter §14 Reference Table of RF Bands Characteristics for details information

about frequencies and bands.

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Target Market

ME910X1-mPCIe can be used for wide variety applications, where low power consumption

and low cost are required while sufficient data rates are achieved:

•Applications using the mPCIe connector

•Notebook PC

•M2M applications

Main Features

Function

Features

Modem

•

Multi-RAT cellular modem for voice and data communication

•LTE FDD Catx data rates per the module variant used.

•Carrier aggregation is not supported

•GSM/GPRS/EDGE (when available)

•Regional variants with optimal choice of RF bands

•coverage of countries and MNOs

•State-of-the-art GNSS solution with

GPS/GLONASS/BeiDou/Galileo/QZSS receiver

USIM ports – dual voltage

•Class B and Class C support

•Hot swap support

•Clock rates up to 4 MHz

Application processor

Application processor to run customer application code

• Flash + DDR are large enough to allow for customer’s own software applications

Interfaces

•

USB2.0 – USB port is typically used for:

• Flashing of firmware and module configuration

• Production testing

• Accessing the Application Processor’s file system

• AT command access

• High-speed WWAN access to external host

• Diagnostic monitoring and debugging

• Communication between Java application environment and an external host

CPU

• NMEA data to an external host CPU

•Peripheral Ports – I2S, UART

•GPIOs

•Antenna ports

Form factor

Full-Mini Card 52 pin, 50.95mm x 30mm x 1mm.

Environment and

quality requirements

The entire module is designed and qualified by Telit for satisfying the environment and

quality requirements.

Single supply module

The module generates all its internal supply voltages.

RTC

No dedicated RTC supply, RTC is supplied by 3V3_AUX

Table 2: Main features

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TX Output Power

Technology

Power (dBm)

2G LB

32 (when available)

2G HB

(when available)

4G FDD

23 @1RB

Table 3: TX Output Power

RX Sensitivity

Technology

Sensitivity (dBm)

-107 (when available)

4G FDD (BW=5 MHz)

-102

Table 4: RX Sensitivity

Mechanical Specifications

2.7.1. Dimensions

The overall dimensions of ME910X1-mPCIe family are:

•Length: 50.95 mm, +0/-0.3mm

•Width: 30 mm, +0/-0.3mm

•Thickness : 3.2 mm, +/-0.15mm (Version with SIM holder : 4.78 mm, +/-0.15mm)

2.7.2. Weight

The nominal weight of the mPCIe card is about 7 grams.

Temperature Range

Case

Range

Note

Operating Temperature

Range

–20°C ~ +55°C

The module is fully functional(*) in all the temperature range, and

it fully meets the 3GPP specifications.

–40°C ~ +85°C

The module is fully functional (*) in all the temperature range.

However, there may be some performance deviations in this

extended range relative to 3GPP requirements, which means that

some RF parameters may deviate from the 3GPP specification in

the order of a few dB.

For example: receiver sensitivity or maximum output power may be

slightly degraded

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Case

Range

Note

Storage and non-

operating Temperature

Range

–40°C ~ +105°C

Storage temperature is not intended for mPCIe in his transport

tray, wich cannot be heated over 65°C.

Table 5: Temperature range

Note:

(*) Functional: the module is able to make and receive calls,

data connection and SMS.

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3. PINS ALLOCATION

Pin-out

ME910X1 mPCIe Pinout follows the mPCIe specification [4]

Signal

I/O

Function

Type

Comment

Power Supply

3V3_AUX

3.3V Main Power Supply

Power

3V3_AUX

3.3V Main Power Supply

Power

3V3_AUX

3.3V Main Power Supply

Power

3V3_AUX

3.3V Main Power Supply

Power

GND - Ground

GND

Ground

GND

Ground

GND

Ground

GND

Ground

USB Interface

USB D-

I/O

USB differential Data (-)

USB D+

I/O

USB differential Data (+)

UART

UART_RX

Serial data input (RX) from DTE

1.8V

See note

UART_TX

Serial data output (TX) to DTE

1.8V

See note

UART_RTS O Output Request To Send signal

(RTS) to DTE

1.8V See note

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Signal

I/O

Function

Type

Comment

UART_CTS I Input for Clear To Send signal

(CTS) from DTE

1.8V See note

I2S – Digital Voice Interface (DVI)

PCM_CLK I/O

Digital Audio Interface (BIT

Clock)

1.8V

Only for ME910G1-WW

RESERVED for others

PCM_TX O Digital Audio Interface (TX Out

of the card)

1.8V Only for ME910G1-WW

RESERVED for others

PCM_RX I

Digital Audio Interface (RX Into

the card)

1.8V

Only for ME910G1-WW

RESERVED for others

PCM_SYNC I/O

Digital Audio Interface

(Frame_Sync) 1.8V Only for ME910G1-WW

RESERVED for others

REF_CLK O

Reference clock for external

Codec

1.8V Reserved

SIM Card Interface

SIMVCC I/O External SIM signal

SIM Power Supply

1.8 / 3V

SIMIO I/O External SIM signal

Data I/O

1.8 / 3V

SIMCLK O External SIM signal

Clock

1.8 / 3V

SIMRST O

External SIM signal

Reset

1.8 / 3V

Miscellaneous Functions

WAKE_N O Active Low output signal Wake

Up signal to the host system

3V3_AUX

1V5 O 1V5 Power Supply Power Not Used

W_DISABLE_N I

Active Low Input Signal:

· Shutdowns

· Wireless disabling (Flight

mode)

3V3_AUX Already has an internal 100K PU

to 3V3_AUX

PERST_N I Active Low Input Signal

· Shutdowns

3V3_AUX Should be externally

PU to 3V3_AUX

3V3 - 3.3V Digital Power Supply Power Not Used

1V5

1V5 Power Supply

Power

Not Used

LED_WWAN_N O

Open Drain circuitry

LED driving, for module’s

status indication

LED should be PU externally in

series to 3V3_AUX

1V5

1V5 Power Supply

Power

Not Used

Reserved

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Signal

I/O

Function

Type

Comment

Reserved

Reserved -

Table 6: Pin-out

Warning:

Reserved pins must be left flowting

Warning:

3V3 and 1V5 Power Supply at Connector are not used in the

board.

They can be left conneceted or not connected to any existing power.

Note:

UART pins are available only in following P/N

MEPCHC1WW05T080100

MEPCIC1WW04T070100

MEPCIC1WW05T100G00

MEPCIG1WW02T030400

MEPCIG1WW03T040400

MEPCHG1WW03T040400

MEPCIG1WW03T040C00

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4. POWER SUPPLY

The power supply circuitry and board layout are a very important part in the full product

design and strongly reflect on the product overall performances, so please read carefully

the requirements and guidelines that will follow for a proper design.

Power Supply Requirements

The external power supply must be connected to 3V3_AUX signal and must fulfil the

following requirements:

Parameter

Values

Nominal Supply Voltage

3.3V

Supply Voltage Range

3.0V ~ 3.6V

Max ripple on module input supply

30mV

Table 7: Power Supply Requirements

Note:

The Operating Voltage Range MUST never be exceeded; care

must be taken when designing the power supply section

of the

application to avoid having an excessive voltage drop.

If the voltage drop exceeds the limits it could cause a Power Off of the

module.

The Overshoot voltage (regarding to the

MAX Extended Operating

Voltage) and drop in voltage (regardingto the MIN Extended Operating

Voltage) MUST never be exceeded.

The “Extended Operating Voltage Range” is intended as the worse case

between this document and those related to the module mounted and

can only be used in non standard mPCIe application, custom design,

with completely assumption and application of the HW User Guide [1]

[5]suggestions.

Power Consumption

For the complete power consumption specification, please refer to the specific Module’s

HW User Guide [1] [5].

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General Design Rules

The principal guidelines for the Power Supply Design embrace three different design

steps:

•The electrical design

•The thermal design

•The PCB layout.

4.3.1. Electrical Design Guidelines

The electrical design of the power supply depends strongly from the power source where

this power is drained.

•+5V input (typically PC internal regulator output)

•+12V input (typically automotive)

+5V Source Power Supply Design Guidelines

•The desired output for the power supply is 3.3V. Since there is not much

difference between the input and the output voltage values, and a linear

regulator can be used.

•When using a linear regulator, a proper heat sink shall be necessary in order to

dissipate the generated heat.

•Since 5V is generally supplied directly from USB, be careful not to have more

than 10uF at input and that USB supplies an appropriate amount of current,

about 1A.

•A Bypass low ESR capacitor of adequate capacity must be provided in order to

cut the current absorption peaks close to the Module, a 100μF capacitor is

usually suitable.

•Make sure the low ESR capacitor on the power supply output rated at least 10V.

An example of linear regulator with 5V input and 3A@3V3 output is shown here below.

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Figure 1: Linear regulator with 5V input and 3.3V output

+12V Source Power Supply Design Guidelines

•The desired output for the power supply is 3.3V. Due to the large difference

between the input and output voltage values together with the current sinked,

the linear regulator in the example above is capable but not efficient at high

current sink and should not be used. A switching power supply will be

preferable due to its better efficiency.

•When using a switching regulator, a 500kHz or more switching frequency

regulator is preferable because of its smaller inductor size and its faster

transient response. This allows the regulator to respond quickly to the current

peaks absorption.

•In any case the frequency and Switching design selection is related to the

application to be developed since the switching frequency could also generate

EMC interferences.

•For car PB battery the input voltage can rise up to 15.8V and this should be kept

in mind when choosing components: all components in the power supply must

withstand this voltage.

•A Bypass low ESR capacitor of adequate capacity must be provided in order to

cut the current absorption peaks, a 100μF capacitor is usually suitable.

•Make sure the low ESR capacitor on the power supply output is rated at least

10V.

•For Car applications, a spike protection diode should be inserted close to the

power input, in order to clean the supply from spikes.

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An example of switching regulator with VIN=4V-36V input and 2.5A@3V3 output is shown

here below.

Figure 2 Switching regulator with 4V-36V input and 3.3V output

4.3.2. Thermal Design Guidelines

The thermal design of the application board and the power supply heat sink should be

done with the following specifications:

•Typical LTE average current consumption during ME910X1 mPCIe transmission

at maximum Power level and minimum input volage: 700 mA

•Average current during idle (USB enabled): 30 mA

•Average current during idle (USB disabled): 5 mA

•Average current during airplane mode (USB disabled): 2 mA

Considering the very low current during Idle, especially if the Power Saving function is

enabled, it is possible to consider from the thermal point of view that the device absorbs

a significant current mainly during the Data session. In LTE mode, the ME910X1 mPCIe

emits RF signals continuously during transmission. Therefore, special attention must be

paid to how to dissipate the heat generated.

The ME910X1 mPCIe card is designed to distribute the heat from the module IC’s to the

entire PCB increasing as much as possible the heat dissipation.

For best performance, the application board copper layers should be used to dissipate

the heat out of the mPCIe card.

To ensure proper thermal flow from the mPCIe card to the application board, the mPCIe

card bottom side should be thermally connected to the application’s board top side via an

appropriate thermal pad.

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The area that the thermal pad is attached to on the application board must be designed

as a large ground pad (with the solder mask exposed).

Note:

The average consumption during transmissions depends on

the input voltage and the power level at which the device is requested

to transmit by the network. The average current consumption hence

varies significantly.

4.3.3. Power Supply PCB Layout Guidelines

Some ME910X1 versions have GSM capabilities. The GSM system is designed in such a

way that the RF transmission is not continuous, otherwise it is packed into bursts at a

base frequency of about 216 Hz, and the related current peaks can be as high as about

2.4A. The average current should be considered 1A. Therefore the power supply must be

designed in order to withstand with these current peaks and average without large

voltage drops; this means that both the electrical design and the board layout must be

designed for this current flow. If the voltage drop during the peak current absorption is

too high, the device may even shutdown due to the input supply voltage drop.

Note:

The electrical design for the Power supply should be made so

that it is capable of a peak current output of at least 2.4 A.

As seen on the electrical design guidelines the power supply shall have a low ESR

capacitor on the output to help during the current peaks and protect the supply, especially

DC/DC, from positive and negative spikes. Negative spikes can demage the module. The

placement of this component is crucial for the correct functioning of the circuitry. A

misplaced component can be useless or can even decrease the power supply

performances.

•The Bypass low ESR capacitor must be placed close to the Telit ME910X1-mPCIe

power input pads or in the case the power supply is a switching type it can be

placed close to the inductor to cut the ripple provided the PCB trace from the

capacitor to the ME910X1-mPCIE is wide enough to ensure a dropless connection

even during the 2A current peaks.

•A protection diode must be placed close to the input connector where the power

source is drained.

•The PCB traces from the input connector to the power regulator IC must be wide

enough to ensure that no voltage drops occurs when a 2A current peak is

absorbed.

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•Any PCB power traces to the ME910X1-mPCIE and the Bypass capacitors must be

wide enough to ensure no significant voltage drops occurs. This is for the same

reason as previous point. Try to keep this trace as short as possible.

•To reduce the EMI due to switching, it is important to keep the mesh involved very

small; therefore the input capacitor, the output diode (if not embodied in the IC)

and the regulator must form a very small loop. This is done in order to reduce the

radiated field (noise) at the switching frequency (100-500 kHz usually).

•A ground island around Switching regulator components on top layer but well

connected to the common system ground plane in inner layer can help to reduce

noise distribution and consequent spurious generation.

•The placement of the power supply on the board should be done in such a way as

to guarantee that the high current return paths in the ground plane are not

overlapped to any noise sensitive circuitry as the microphone amplifier/buffer or

earphone amplifier.

•The power supply input cables should be kept separate from noise sensitive lines

such as microphone/earphone cables.

•The insertion of an EMI filter on 3V3_AUX pins is suggested in those designs where

antenna is placed close to battery or supply lines.

A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N FBMH1608HM101

can be used for this purpose, they are good low band pass filter with frequency cut

about 100MHz.

The below figure shows the recommended circuit:

Figure 3: Power supply EMI filtering recommended circuit

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