Telit Wireless Solutions LE910C series Guide

LE910Cx - mPCIe
HW Design Guide
1VV0301510 Rev. 13 – 2021-07-07
Telit Technical Documentation

LE910Cx mPCIe Hardware Design Guide
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APPLICABILITY TABLE
PRODUCTS
LE910C1-NS
LE910C1-NA
LE910C1-NF
LE910C4-NF
LE910C1-AP
LE910C4-AP
LE910C1-EU
LE910C4-EU
LE910C1-EUX
LE910C1-SVX
LE910C1-SAX
LE910C1-SA
LE910C1-ST
LE910C1-SV
LE910C1-LA
LE910C4-LA
LE910C4-CN

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CONTENTS
APPLICABILITY TABLE 2
CONTENTS 3
1. INTRODUCTION 7
Scope 7
Audience 7
Contact Information, Support 7
Symbol Conventions 8
Related Documents 8
2. GENERAL PRODUCT DESCRIPTION 9
Overview 9
Product Variants and Frequency Bands 9
Target Market 10
Main Features 10
TX Output Power 11
RX Sensitivity 11
Mechanical Specifications 13
2.7.1. Dimensions 13
2.7.2. Weight 13
Temperature Range 13
3. PINS ALLOCATION 14
Pin-out 14
Pin-out for the Full Compatibility with PCI Express MiniCard
Specification. 16
4. POWER SUPPLY 20
Power Supply Requirements 20
Power Consumption 20
General Design Rules 20
4.3.1. Electrical Design Guidelines 21

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4.3.1.1. +5V Source Power Supply Design Guidelines 21
4.3.1.2. +12V Source Power Supply Design Guidelines 22
4.3.2. Thermal Design Guidelines 23
4.3.3. Power Supply PCB Layout Guidelines 24
VAUX Power Output 26
GNSS LNA BIAS 26
5. ELECTRICAL SPECIFICATION 28
Absolute Maximum Ratings – Not Operational 28
Recommended Operating Conditions 28
6. DIGITAL SECTION 29
Logic Levels 29
Power On 30
Unconditional Restart 32
Power OFF Procedure 35
Control Signals 36
6.5.1. WAKE_N 37
6.5.2. W_DISABLE_N 38
6.5.3. LED_WWAN_N 38
6.5.4. PERST_N 39
Hardware Interfaces 40
6.6.1. USB Port 40
6.6.2. Serial Port 41
6.6.2.1. Modem Serial Port 1 Signals 42
6.6.2.2. RS232 Level Translation 42
6.6.3. I2C – Inter-integrated Circuit 44
6.6.4. Digital Audio 44
SIM Interface 45
7. RF SECTION 47
Band Variants 47

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TX and RX Characteristics 47
Antenna Requirements 47
7.3.1. Antenna Connectors 47
7.3.2. Main GSM/WCDMA/LTE Antenna Requirements 48
7.3.3. Antenna Diversity Requirements 48
7.3.4. GNSS Antenna Requirements 49
7.3.4.1. Combined GNSS Antenna 50
7.3.4.2. Linear and Patch GNSS Antenna 50
8. MECHANICAL DESIGN 51
Mechanical Dimensions 51
8.1.1. Mechanical Drawing (with SIM Holder) 51
8.1.1.1. Top View 51
8.1.1.2. Bottom View 53
8.1.1.3. Side View 54
8.1.2. Mechanical Drawing (without SIM Holder) 55
8.1.2.1. Top View 55
8.1.2.2. Bottom View 56
8.1.2.3. Side View 57
9. APPLICATION PCB DESIGN 58
Recommended Footprint for the Application 58
10. EMC RECOMMENDATIONS 59
11. PACKAGING 60
Tray 60
Tray Packing 60
Packing Quantities 60
Tray Drawing 62
Moisture Sensitivity 63
12. CONFORMITY ASSESSMENT ISSUES 64

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Declaration of Conformity 64
13. REFERENCE TABLE OF RF BANDS CHARACTERISTICS 65
14. PRODUCT AND SAFETY INFORMATION 67
Copyrights and Other Notices 67
14.1.1. Copyrights 67
14.1.2. Computer Software Copyrights 67
Usage and Disclosure Restrictions 68
14.2.1. License Agreements 68
14.2.2. Copyrighted Materials 68
14.2.3. High Risk Materials 68
14.2.4. Trademarks 69
14.2.5. 3rd Party Rights 69
14.2.6. Waiwer of Liability 69
Safety Recommendations 70
15. GLOSSARY 71
16. DOCUMENT HISTORY 72

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1. INTRODUCTION
Scope
This document describes some hardware solutions useful for developing a product with
the Telit xE910Cx Mini PCIe Adapter.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit xE910Cx Mini PCIe Adapter.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
•TS-[email protected]
•TS-[email protected]om
•[e-mail]
•[e-mail]
Alternatively, use:
https://www.telit.com/contact-us/
For detailed information about where you can buy the Telit modules or for
recommendations on accessories and components visit:
https://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates the user feedback on our information.

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Symbol Conventions
Danger:
This information MUST be followed or catastrophic
equipment failure or personal injury may occur.
Warning:
Alerts the user on
important steps about the module
integration.
Note/Tip:
Provides advice and suggestions that may be useful when
integrating the module.
Electro-static Discharge:
Notifies the user to take proper grounding
precautions before handling the product.
Table 1: Symbol Conventions
All dates are in ISO 8601 format, that is YYYY-MM-DD.
Related Documents
•LE910Cx Hardware User Guide, 1VV0301298
•LE920x4/LE910Cx AT Command User Guide, 80490ST10778A
•Telit EVB User Guide, 1VV0301249
•mPCIe IFBD HW USER GUIDE, 1VV0301483
•LE910/LE920 Digital Voice Interface Application Note, 80000NT11246A
•Event Monitor Application Note, 80000NT10028a
•PCI Express Mini Card Electromechanical Specification, Revision 2.1

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2. GENERAL PRODUCT DESCRIPTION
Overview
The aim of this document is to present the possible and recommended hardware
solutions useful for developing a product with the Telit LE910Cx-mPCIe module.
LE910Cx-mPCIe is the Telit platform for Mini PCIe applications, such as M2M
applications, table PC, based on the following technologies:
•LTE / WCDMA networks for data communication
•Designed for industrial grade quality
In its most basic use case, the LE910Cx-mPCIe can be applied as a wireless
communication front-end for mobile products, offering mobile communication features
to an external host CPU through its rich interfaces. LE910Cx-mPCIe can further support
customer software applications and security features. LE910Cx-mPCIe provides a
software application development environment with sufficient system resources for
creating rich on-board applications. With a dedicated application processor and
embedded security resources, product developers and manufacturers can create
products that guarantee fraud prevention and tamper evidence without additional effort
for additional security precautions. LE910Cx-mPCIe is available in hardware and band
variants as listed in Product Variants and Frequency Bands.
Product Variants and Frequency Bands
LE910Cx modules bands combinations are listed below:
Product
2G Band
3G Band
4G Band
Region
LE910C1-NA
2, 3, 5, 8
1, 2, 4, 5, 8
2, 4, 12
North America
LE910C1-AP
-
1, 5, 6, 8, 19
1, 3, 5, 8, 9, 18, 19, 26, 28
Asia-Pacific
LE910C4-AP
-
1, 5, 6, 8, 19
1, 3, 5, 8, 9, 18, 19, 26, 28
Asia-Pacific
LE910C1-NS
-
-
2, 4, 5, 12, 25, 26
North America - Sprint
LE910C4-NF
-
2, 4, 5
2, 4, 5, 12, 13, 14, 66, 71
North America
LE910C1-NF
-
2, 4, 5
2, 4, 5, 12, 13, 14, 66, 71
North America
LE910C1-EU
3, 8
1, 3, 8
1, 3, 7, 8, 20, 28A
Europe
LE910C4-EU
3, 8
1, 3, 8
1, 3, 7, 8, 20, 28A
Europe
LE910C4-EUX
3, 8
1, 3, 8
1, 3, 7, 8, 20, 28A
Europe
LE910C1-SA
-
-
2, 4, 12, 14, 66
North America – AT&T

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Product
2G Band
3G Band
4G Band
Region
LE910C1-ST
-
-
2, 4, 12, 66, 71
North America – T-Mobile
LE910C1-SV
-
-
4, 13
North America - Verizon
LE910C1-LA
2, 3, 5, 8
1, 2, 4, 5
1, 2, 3, 4, 5, 7, 28
Latin America
LE910C4-LA
2, 3, 5, 8
1, 2, 4, 5
1, 2, 3, 4, 5, 7, 28
Latin America
LE910C4-CN
3, 8 W: 1, 8
TDS: 34, 39
1, 3, 5, 8, 38, 39, 40, 41M China
LE910C1-SAX
-
-
2, 4/66, 12
North America - AT&T
LE910C1-SVX
-
-
4, 13
North America - Verizon
Table 2: Product Variants and their Frequency Bands
Refer to Chapter Reference Table of RF Bands Characteristics for detailed information
about frequencies and bands.
Target Market
LE910Cx-mPCIe can be used for wide variety of applications, where low power
consumption and low cost are required while achieving sufficient data rates:
•Mini PCIe applications
•Notebook PC
•M2M applications
Main Features
Function
Features
Modem
Multi-RAT cellular modem for voice and data communication
LTE FDD Catx data rates per the module variant used.
Carrier aggregation is not supported
GSM/GPRS/EDGE
WCDMA up to DC HSPA+, Rel.9
Regional variants with optimal choice of RF bands coverage of countries and MNOs
State-of-the-art GNSS solution with GPS/GLONASS/BeiDou/Galileo/QZSS receiver
Digital audio
subsystem
PCM/I2S digital audio interface
Up to 48 kHz sample rate, 16 bit words
USIM ports – dual
voltage
Class B and Class C support
Hot swap support
Clock rates up to 4 MHz
Application
processor
Application processor to run customer application code
32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating system
Flash + DDR are large enough to allow for customer’s own software applications

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Function
Features
Interfaces
USB2.0 – USB port is typically used for:
Flashing of firmware and module configuration
Production testing
Accessing the Application Processor’s file system
AT command access
High-speed WWAN access to external host
Diagnostic monitoring and debugging
Communication between Java application environment and an external host CPU
NMEA data to an external host CPU
Peripheral Ports – SPI, I2C, UART
GPIOs
Antenna ports
Form factor
Full-Mini Card 52 pin, 50.95mm x 30mm x 1mm
Environment and
quality requirements
The entire module is designed and qualified by Telit for satisfying the environment and
quality requirements.
Single supply module
The module generates all its internal supply voltages.
RTC
No dedicated RTC supply, RTC is supplied by VBATT
Table 3: Functional Features
TX Output Power
Technology
Power (dBm)
2G LB
32.5
2G HB
29.5
3G/TD-SCDMA
23.5
4G FDD
22.5 @1RB
Table 4: Transmission Output Power
RX Sensitivity
Typical sensitivity levels are as follows:
Mode
Primary
Diversity
SIMO
3GPP
PCS 1900
-107.0
-
-
-102
DCS 1800
-106.5
-
-
-102
GSM 850
-108.0
-
-
-102
EGSM 900
-107.0
-
-
-102
WCDMA 2100 – B1
-108.5
-109.5
-111.0
-106.7
WCDMA 1900 – B2
-109.0
-110.0
-111.5
-104.7

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Mode
Primary
Diversity
SIMO
3GPP
WCDMA 1800 – B3
-107.0
-109.0
-109.0
-103.7
WCDMA AWS – B4
-109.0
-109.5
-111.5
-106.7
WCDMA 850 – B5
-109.5
-110.5
-112.0
-104.7
WCDMA 850 – B6
-109.5
-110.5
-112.0
-106.7
WCDMA 850 – B19
-109.5
-110.5
-112.0
-106.7
WCDMA 900 – B8
-109.0
-110.0
-111.5
-103.7
TDS CDMA 2000 – B34
-109.5 -
-
-105
TDS CDMA 1900 – B39
-109.5 -
-
-105
LTE 2100 – B1
-97.5
-98.0
-100.0
-96.3
LTE 1900 – B2
-96.5
-98.5
-98.5
-94.3
LTE 1800 – B3
-97.0
-99.0
-99.0
-93.3
LTE AWS – B4
-97.5
-98.5
-100.0
-96.3
LTE 850 – B5
-98.5
-100.0
-101.0
-94.3
LTE 2600 – B7
-97.0
-97.0
-99.0
-94.3
LTE 900 – B8
-98.0
-99.0
-100.5
-93.3
LTE 1800 – B9
-97.5
-98.5
-100.0
-95.3
LTE 700a – B12
-98.0
-99.0
-100.5
-93.3
LTE 700c – B13
-98.0
-99.0
-100.5
-93.3
LTE 700PS – B14
-97.5
-99.0
-100.0
-93.3
LTE 700b – B18
-98.5
-99.5
-101.0
-96.3
LTE 800 – B19
-98.5
-99.0
-101.0
-96.3
LTE 800 – B20
-98.5
-98.5
-101.0
-93.3
LTE 1900+ – B25
-96.0
-98.0
-98.0
-92.8
LTE 850+ – B26
-98.5
-99.5
-101.0
-93.8
LTE 700 – B28A/B
-98.0
-100.0
-101.0
-94.8
LTE AWS-3 – B66
-97.5
-98.5
-100.0
-95.8
LTE600 – B71
-97.5
-97.0
-100.0
-93.5
LTE TDD 2600 – B38
-97.5
-98.0
-100.0
-96.3
LTE TDD 1900 – B39
-98.0
-99.0
-100.5
-96.3
LTE TDD 2300 – B40
-96.5
-98.0
-99.0
-96.3
LTE TDD 2500 – B41M
-96.5
-97.5
-99.0
-94.3
Table 5: RX Sensitivity Levels

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Note:
The sensitivity level has a deviation of approximately +/- <2dB
per model, device and channel because the level shows typical value.
LTE level is measured at BW 10M.
Mechanical Specifications
2.7.1. Dimensions
The overall dimensions of LE910Cx-mPCIe family are:
•Length: 50.95 mm, +0/-0.3mm
•Width: 30 mm, +0/-0.3mm
•Thickness : 3.2 mm, +/-0.15mm (Version with SIM holder : 4.62 mm, +/-0.15mm)
2.7.2. Weight
The nominal weight of the module;
With SIM holder: 10.3 grams
Without SIM holder: 9.1 grams
Temperature Range
Mode
Temperature
Note
Operating Temperature
Range
–20°C ~ +55°C
The module is fully functional(*) in all the temperature
range, and it fully meets the 3GPP specifications.
–40°C ~ +85°C
The module is fully functional (*) in the whole
temperature range.
However, there may be some performance deviations in
this extended range from the 3GPP requirements,
which means that some RF parameters may deviate
from the 3GPP specification on the order of a few dB.
For example: the receiver sensitivity or maximum
output power may be slightly degraded
Storage and non-operating
Temperature Range
–40°C ~ +105°C
Table 6:Temperature Range (*) Functional: the module is able to make and receive voice calls, data
calls, SMS and make data traffic.

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3. PINS ALLOCATION
Pin-out
Pin
Signal
I/O
Function
Type
Comment
Power Supply
2
3V3_AUX
-
3.3V Main Power Supply
Power
39
3V3_AUX
-
3.3V Main Power Supply
Power
41
3V3_AUX
-
3.3V Main Power Supply
Power
52
3V3_AUX
-
3.3V Main Power Supply
Power
4
GND
-
Ground
9
GND
-
Ground
15
GND
-
Ground
18
GND
-
Ground
21
GND
-
Ground
26
GND
-
Ground
27
GND
-
Ground
29
GND
-
Ground
34
GND
-
Ground
35
GND
-
Ground
37
GND
-
Ground
40
GND
-
Ground
43
GND
-
Ground
50
GND
-
Ground
USB Interface
36
USB D-
I/O
USB differential Data (-)
38
USB D+
I/O
USB differential Data (+)
Digital Voice Interface (DVI)
45
PCM_CLK
I/O
Digital Audio Interface (BIT Clock)
1.8V
47
PCM_TX O
Digital Audio Interface (TX Out of the
card)
1.8V
49
PCM_RX
I
Digital Audio Interface (RX Into the card)
1.8V
51
PCM_SYNC
I/O
Digital Audio Interface (Frame_Sync)
1.8V
16
REF_CLK
O
Reference clock for external Codec
1.8V

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Pin
Signal
I/O
Function
Type
Comment
SIM Card Interface
8
SIMVCC I/O External SIM signal – Power supply for
the SIM
1.8 / 3V
10
SIMIO
I/O
External SIM signal - Data I/O
1.8 / 3V
12
SIMCLK
O
External SIM signal – Clock
1.8 / 3V
14
SIMRST
O
External SIM signal – Reset
1.8 / 3V
UART
3
UART_RX
I
Serial data input (RX) from DTE
1.8V
5
UART_TX
O
Serial data output (TX) to DTE
1.8V
17
UART_RTS O Output Request To Send signal (RTS) to
DTE
1.8V
19
UART_CTS I Input for Clear To Send signal (CTS) from
DTE
1.8V
Miscellaneous Functions
1
WAKE_N O Active low output signal used to wake up
the system from stand-by
3.3V
20
W_DISABLE_N I Active low signal for wireless disabling
(Flight mode)
3.3V
22
PERST_N I Active low functional reset input to the
card
3.3V
28
VAUX_PWRMON O Supply output for external accessories /
Power ON monitor
1.8V
42
LED_WWAN_N O
Active low, open drain signal for WWAN
LED driving, used to provide module’s
status indication
3.3V
30
I2C_SCL I/O I2C clock 1.8V Internally Pull Up
2.2kΩto 1.8V
32
I2C_SDA I/O I2C Data 1.8V Internally PU 2.2kΩ
to 1.8V
48
GPS_LNA_EN O Enables the external regulator for GPS
LNA
1.8V
Reserved
6
Reserved
-
7
Reserved
-
11
Reserved
-
13
Reserved
-
23
Reserved
-

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Pin
Signal
I/O
Function
Type
Comment
24
Reserved
-
25
Reserved
-
31
Reserved
-
33
Reserved
-
44
Reserved
-
46
Reserved
-
Table 7: Pin-out Information
Warning
: There are two different types of mPCIe modules; LE910Cx
mPCIe V1 and LE910Cx mPCIe V2. Two types of mPCIe modules have
different pinout on PCM signals but the rest of the pins are exactly the
same.
LE910Cx mPCIe V2 was developed to provide improved thermal
performance with the large solder resist opening area on the bottom
side of the module. For more details, refer to :
80576DSW10190A LE910Cx mPCIe HW Release notes.
mPCIe Pin-out
mPCIe V1
mPCIe V2
47
PCM_RX PCM_TX
49
PCM_TX PCM_RX
Warning
: Reserved pins must be left floating.
Pin-out for the Full Compatibility with PCI Express MiniCard
Specification.
Some pins of the LE910Cx mPCIe are different from the pin-out defined by the PCI
Express miniCard specification to support various functions of Telit.
But full compatibility with both PCI Express miniCard specification and Telit’s older xE910
mPCIe models was required. To meet this requirement, this model was developed.

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Some pins of LE910Cx mPCIe which are different from the PCI Express miniCard
specification have been changed to reserved. For more details, refer to the following Pin-
out.
Pin
Signal
I/O
Function
Type
Comment
Power Supply
2
3V3_AUX
-
3.3V Main Power Supply
Power
39
3V3_AUX
-
3.3V Main Power Supply
Power
41
3V3_AUX
-
3.3V Main Power Supply
Power
52
3V3_AUX
-
3.3V Main Power Supply
Power
4
GND
-
Ground
9
GND
-
Ground
15
GND
-
Ground
18
GND
-
Ground
21
GND
-
Ground
26
GND
-
Ground
27
GND
-
Ground
29
GND
-
Ground
34
GND
-
Ground
35
GND
-
Ground
37
GND
-
Ground
40
GND
-
Ground
43
GND
-
Ground
50
GND
-
Ground
USB Interface
36
USB D-
I/O
USB differential Data (-)
38
USB D+
I/O
USB differential Data (+)
SIM Card Interface
8
SIMVCC
I/O
External SIM signal – Power supply for the SIM
1.8 / 3V
10
SIMIO
I/O
External SIM signal - Data I/O
1.8 / 3V
12
SIMCLK
O
External SIM signal – Clock
1.8 / 3V
14
SIMRST
O
External SIM signal – Reset
1.8 / 3V
Miscellaneous Functions

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Pin
Signal
I/O
Function
Type
Comment
1
WAKE_N O Active low output signal used to wake up the
system from stand-by
3.3V
20
W_DISABLE_N I Active low signal for wireless disabling
(Flight mode)
3.3V
22
PERST_N
I
Active low functional reset input to the card
3.3V
42
LED_WWAN_N O
Active low, open drain signal for WWAN LED
driving, used to provide module’s status
indication
3.3V
Reserved
3
Reseved
-
5
Reseved
-
6
Reserved
-
7
Reserved
-
11
Reserved
-
13
Reserved
-
16
Reserved
-
17
Reseved
-
19
Reseved
-
23
Reserved
-
24
Reserved
-
25
Reserved
-
28
Reserved
-
30
Reserved
-
31
Reserved
-
32
Reserved
-
33
Reserved
-
44
Reserved
-
45
Reseved
-
46
Reserved
-
47
Reserved
-
48
Reserved
-
49
Reserved
-
51
Reserved
-
Table 8: Pin-out PCI Express MiniCard Specification

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Note
: For more details about the new models, please contact to Telit
Technical Support:
• TS-[email protected]
• TS-[email protected]om
• [e-mail]
• TS-SR[email protected]

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1VV0301510 Rev. 13 Page 20 of 73 2021-07-07
Not Subject to NDA
4. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the complete
product design and they strongly reflect on the overall performance of the product, so
please read carefully the requirements and the guidelines that will follow for a proper
design.
Power Supply Requirements
The external power supply must be connected to VBATT signal and must fulfil the
following requirements:
Power Supply
Value
Nominal Supply Voltage
3.3 V
Supply Voltage Range
3.1 ~ 3.6 V
Max ripple on module input supply
30 mV
Table 9: Power Supply Requirements
Note
: The Operating Voltage Range MUST never be exceeded; care
must be taken when designing the power section of the application
to avoid having an excessive voltage drop.
If the voltage drop exceeds the limits, it could cause the module to
Power Off.
The overshoot voltage (regarding MAX Extended Operating Voltage)
and drop in voltage (regarding MIN Extended Operating Voltage)
MUST never be exceeded;
The “Extended Operating Voltage Range” can only be used with the
complete assumption and application of the HW User guide
suggestions.
Power Consumption
For the complete power consumption specification, please refer to the specific Module’s
Hardware User guide listed in 1.5 Related Documents
General Design Rules
The main guidelines for the Power Supply Design embrace three different design steps: