Texas Instruments bq30z554EVM User manual

User's Guide
SLUUA36–November 2012
bq30z554EVM SBS 1.1 Impedance Track™ Enabled
Battery Management Solution EVM
The bq30z554EVM is a complete evaluation system for the bq30z554/bq29412 battery management
solution. This system includes one bq30z554/bq29412 circuit module, a current sense resistor, two
thermistors, and a link to Windows®-based PC software.
The circuit module includes one bq30z554 IC, one bq29412 IC, and all other onboard components
necessary to monitor and predict capacity, perform cell balancing, monitor critical parameters, protect the
cells from overcharge, overdischarge, short circuit, and overcurrent in 2-series, 3-series, or 4-series cell Li-
Ion or Li-Polymer battery packs. The circuit module connects directly across the cells in a battery.
With the EV2300 or EV2400 interface board and software, users can read the bq30z554 data registers,
program the chipset for different pack configurations, log cycling data for further evaluation, and evaluate
the overall functionality of the bq30z554/bq29412 solution under different charge and discharge
conditions.
Contents
1 Features ...................................................................................................................... 2
2 bq30z554 Device-Based Circuit Module ................................................................................. 2
3 bq30z554 Circuit Module .................................................................................................. 3
4 Circuit Module Physical Layouts, Schematic and Bill of Materials ................................................... 3
5 EVM Hardware and Software Setup .................................................................................... 10
6 Troubleshooting Unexpected Dialog Boxes ............................................................................ 10
7 Hardware Connection ..................................................................................................... 10
8 Operation ................................................................................................................... 12
9 Calibration Screen ......................................................................................................... 15
10 Pro (Advanced) Screen ................................................................................................... 17
11 Seal/Authentication Screen .............................................................................................. 19
12 bqChem ..................................................................................................................... 20
13 Related Documentation from Texas Instruments ..................................................................... 21
List of Figures
1 bq30z554EVM Layout (Silkscreen)....................................................................................... 4
2 Top Assembly ............................................................................................................... 4
3 Top Layer .................................................................................................................... 5
4 Inner Layer 1 ................................................................................................................ 5
5 Inner Layer 2 ................................................................................................................ 5
6 Bottom Layer ................................................................................................................ 6
7 Bottom Assembly ........................................................................................................... 6
8 Schematic.................................................................................................................... 7
9 bq30z554 Circuit Module Connection to Cells and System Load/Charger ........................................ 11
10 SBS Data Screen.......................................................................................................... 13
11 Data Flash Screen, First-Level Safety Class .......................................................................... 14
12 Calibration Screen......................................................................................................... 16
13 Pro (Advanced) Screen................................................................................................... 18
Windows is a registered trademark of Microsoft Corporation.
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14 Seal/Authentication Screen .............................................................................................. 19
15 bqChem Screen ........................................................................................................... 20
List of Tables
1 Ordering Information........................................................................................................ 2
2 Bill of Materials.............................................................................................................. 8
3 Performance Specification Summary................................................................................... 10
4 Circuit Module to EV2300 or EV2400 Connections................................................................... 11
1 Features
• Complete evaluation system for the bq30z554 SBS 1.1-Compliant Advanced Gas Gauge with
Impedance Track™ technology, bq30z554 and bq29412 independent overvoltage protection integrated
circuit (IC)
• Populated circuit module for quick setup
• Link to software that allows data logging for system analysis
1.1 Kit Contents
• bq30z554/bq29412 circuit module
• Links to support documentation
1.2 Ordering Information
Table 1. Ordering Information
EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY
2-series, 3-series, or 4-
bq30z55EVM (PWR194) Li-Ion Any
series cell
2 bq30z554 Device-Based Circuit Module
The bq30z554/bq29412-based circuit module is a complete and compact example solution of a bq30z554
circuit for battery management and protection of Li-Ion or Li-Polymer packs. The circuit module
incorporates a bq30z554 battery monitor IC, bq29412 independent overvoltage protection IC, and all other
components necessary to accurately predict the capacity of 2-series, 3-series, or 4-series cells.
2.1 Circuit Module Connections
Contacts on the circuit module provide the following connections:
• Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)
• To the serial communications port (SMBC, SMBD, VSS)
• The system load and charger connect across PACK+ and PACK–
• To the system present pin (SYS PRES)
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2.2 Pin Descriptions
PIN NAME DESCRIPTION
1N –ve connection of first (bottom) cell
1P +ve connection of first (bottom) cell
2P +ve connection of second cell
3P +ve connection of third cell
4P +ve connection of fourth (top) cell
SMBC Serial communication port clock
SMBD Serial communication data port
VSS Pack negative terminal
PACK– Pack negative terminal
SYS PRES System present pin (if low, system is present)
PACK+ Pack positive terminal
3 bq30z554 Circuit Module
This section contains information on configuration and fuse-blowing tests for the bq30z554/bq29412
implementation.
3.1 Choosing Particular Precharge Mode
The bq30z554 contains an internal precharge FET; however, the default firmware configuration uses the
Charge FET for precharge. To evaluate the internal precharge FET, change the least two significant bits in
DF:Configuration:Charging Configuration to be 0,0. See the bq30z5x-R1 Technical Reference Manual
(SLUU852) for additional information.
3.2 Testing Fuse-Blowing Circuit
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is not
provided in the circuit. FET Q1 drives TP8 low if a fuse-blow condition occurs; monitoring TP8 can be
used to test this condition.
NOTE: Pull up TP8 to test the fuse circuit.
4 Circuit Module Physical Layouts, Schematic and Bill of Materials
This section contains the board layout, assembly drawings, schematic, and bill of materials for the
bq30z554/bq29412 circuit module.
4.1 Board Layout
This section shows the dimensions, PCB layers, and assembly drawing for the bq30z554 module.
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Figure 1. bq30z554EVM Layout (Silkscreen)
Figure 2. Top Assembly
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Figure 3. Top Layer
Figure 4. Inner Layer 1
Figure 5. Inner Layer 2
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Figure 6. Bottom Layer
Figure 7. Bottom Assembly
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C1
0.1uF
C3
0.1uF
R8 1K
R6 1K
R5 1K
R11 100
TP5
BAT
RT2
10K
TP8
FUSE
R32 50K
C21 0.1uF
C19 1.0uF
TP10
VCC
TP1
DSG
D3
1SS355
D2
MM3Z5V6C
R18 100
C22
0.1nF
R22 200
R20
3M
R25 1k
R26 100
C25
0.1uF
R21
10k
R1
100
TP2
GND
R3
100
TP43.3V
R9 1K
R7 1K
R12 100
R13 50K
R14
220K
R17
5.1K
C18 1.0uF
R15
5.1K
C16 0.1uF
R23 200
C17 0.1uF
R27 100
C24
0.1uF
R30 10K
C4
0.1uF
C2
0.1uF
1
2
TB1
RT1
10K
TP7
SRN
TP6
SRP C12 0.1uF
C15
0.1uF
D1 1SS355
R31
0
C11
0.1uF
C6
0.1uF
TP11
FUSEPIN
TP9CHG
R16
3M
R29
1M
C23
0.1nF
1
2
3
J3
1
2
J1
C20
1.0uF
Q4
2N7002K
TP3
2.5V
TP12
VOUT
R4
100
R2
100
1
2
3
TB2
C9
1.0uF
C13
0.1uF
1
OUT
2
VDD
3
CD
4
VD4
5GND
6VC3
7VC2
8VC1
U1
BQ29412DCT
C8
0.1uF
C7
0.1uF
C5
0.1uF
C10
0.22uF
1
2
3
F1
C14
0.1uF
Q2
Si7114DN
Q5 FDS4435BZ
R28 300
1W
R24 10K
A
A'
B
B'
SW1
R19
5.1K
1
2
3
4
J2
R10
.010 75ppm
Q1
FDN339AN
Q3
Si7114DN 1VBUS
2D-
3D+
4ID
5GND
6
CASE
7
CASE
J4
1CHG
2BAT
3VC1
4VC2
5VC3
6VC4
7VSS
8TS1
9SRP
10 SRN
11 TS2
12 ~PRES
13 SMBD
14 NC
15 SMBC 16
PGIO
17
NC
18
NC
19
NC
20
NC
21
RBI
22
REG25
23
VSS
24
REG33
25
PTC
26
FUSE
27
VCC
28
GPOD
29
PACK
30
DSG
U2
BQ30Z554DBT
R33 10k
TP13
PGIO
4P
REG33
SMBC
SMBD
4P
REG25
REG33
REG25
I2C_VOUT
PACK+
I2C_VOUT
SMBC SMBD
PACK+
www.ti.com Circuit Module Physical Layouts, Schematic and Bill of Materials
Figure 8. Schematic
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4.2 Bill of Materials
Table 2. Bill of Materials
Count Reference Design Value Description Size Part Number Manufacturer
18 C1-8 C11-17 C21 C24 0.1uF Capacitor, Ceramic, 50 V, X7R, 20% 0603 Std Any
C25
4 C9 C18-20 1.0uF Capacitor, Ceramic, 25 V, X7R, 20% 0805 Std Any
1 C10 0.22uF Capacitor, Ceramic, 25 V, X7R, 20% 0603 Std Any
2 C22 C23 0.1nF Capacitor, Ceramic, 50 V, X7R, 20% 0603 Std Any
2 D1 D3 1SS355 Diode, Switching, 90V, 225 mA Ifm, High speed SOD-323 1SS355TE-17 Rohm
1 D2 MM3Z5V6C Diode, Zener, 5.6V, 200mw SOD-323 MM3Z5V6C Fairchild
0 F1 Fuse, Chemical, Thermal, xxA SFDxxx Sony
1 J1 PTC36SAAN Header, Male 2-pin, 100mil spacing, (36-pin strip) 0.100 inch x 2 PTC36SAAN Sullins
1 J2 22-05-3041 Header, Friction Lock Ass'y, 4-pin Right Angle, 0.400 x 0.500 22-05-3041 Molex
1 J3 PTC36SAAN Header, Male 3-pin, 100mil spacing, (36-pin strip) 0.100 inch x 3 PTC36SAAN Sullins
1 J4 56579-0519 Connector, USB, Mini AB 5-pins 0.354 X 0.307 Inches 56579-0519 Molex
9 R1-4 R11-12 R18 R26- 100 Resistor, Chip, 1/16-W, 5% 0603 Std Std
27
6 R5-9 R25 1K Resistor, Chip, 1/16-W, 5% 0603 Std Std
1 R10 .010 75ppm Resistor, Chip, 0.010 Ohms, 1-W, xx% 2512 WSL2512R0100FEA Vishay
2 R13 R32 50K Resistor, Chip, 1/16-W, 5% 0603 Std Std
1 R14 220K Resistor, Chip, 1/16-W, 5% 0603 Std Std
3 R15 R17 R19 5.1K Resistor, Chip, 1/16-W, 5% 0603 Std Any
2 R16 R20 3M Resistor, Chip, 1/16-W, 5% 0603 Std Std
2 R21 R33 10k Resistor, Chip, 1/16-W, 5% 0603 Std Std
2 R22-23 200 Resistor, Chip, 1/16-W, 5% 0603 Std Std
2 R24 R30 10K Resistor, Chip, 1/16-W, 5% 0603 Std Std
1 R28 300 Resistor, Chip, 1W, 5% 2512 Std Any
1 R29 1M Resistor, Chip, 1/16W, 5% 0603 Std Any
1 R31 0 Resistor, Chip, 1/16-W, 5% 0603 Std Std
1 SW1 EVQ-PLHA15 Switch, Push button, Momentary, 1P1T, 50-mA, 12-V 0.200 x 0.200 inch EVQ-PLHA15 Panasonic
1 TB1 ED1514 Terminal Block, 2-pin, 6-A, 3.5mm 0.27 x 0.25 ED555/2DS OST
1 TB2 ED1515 Terminal Block, 3-pin, 6-A, 3.5mm 0.41 x 0.25 ED555/3DS OST
2 RT1-2 10K Thermistor, 10K ohms 0.095 X 0.150 "CH25-3H103 or
103AT- Semitec
2"
1 TP2 GND Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone
1 TP8 FUSE Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone
1 TP13 PGIO Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 inch 5002 Keystone
1 Q1 FDN339AN MOSFET, N-ch, 20-V, 3A, 0.05-Ohms SOT23 FDN339AN Fairchild
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Table 2. Bill of Materials (continued)
Count Reference Design Value Description Size Part Number Manufacturer
2 Q2-3 Si7114DN MOSFET, Fast Switching, NChan, 30V, 18.3A, 7.5millohm PWRPAK 1212 Si7114DN-T1-E3 Vishay
1 Q4 2N7002K MOSFET, Nch, 60V, 300 mA, 2-Ohms SOT23 2N7002K-T1-E3 Vishay
1 Q5 FDS4435BZ MOSFET, Pch, -30V, -8.8A, 20-milliohm SO8 FDS4435BZ Fairchild
1 U1 BQ29412DCT IC, Voltage Protection for 2, 3, 4 Cell Lion , 2nd Protection, 4.45 SSOP-08 BQ29412DCT TI
v OVP
1 U2 BQ30Z554DBT IC, 2-Series, 3-Series, and 4-Series Li-Ion Battery Pack TSSOP-38 BQ30Z554DBT TI
Manager
1 -- PCB PWR194 Std
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4.3 bq30z554/bq29412 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq30z554/bq29412 circuit module.
Table 3. Performance Specification Summary
Specification Min Typ Max Units
Input voltage Pack+ to Pack– 5 15 25 V
Charge and discharge current 0 2 7 A
5 EVM Hardware and Software Setup
This section describes how to install the bq evaluation software, and how to connect the different
components of the EVM.
5.1 System Requirements
The bq evaluation software (EVSW) requires Windows 2000, Windows XP, Windows Vista, or Windows 7.
5.2 Software Installation
NOTE: To get the latest software archive, contact the Texas Instruments field representative
assigned to work with this device.
To install the EVSW, do the following:
1. Save the archive to a temporary directory.
2. Double-click on the executable filename, and follow the installer instructions to complete the EVSW
installation.
If the EV2300 or EV2400 was not previously installed: After EVSW installation, a TI USB DRIVER
INSTALLER pops up. Click Yes for the agreement message and follow its instructions.
3. Plug the EV2300 or EV2400 into a USB port.
6 Troubleshooting Unexpected Dialog Boxes
Users downloading the files must be logged in as the administrator, or must have privileges to install new
programs.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operating
system policy.
7 Hardware Connection
The bq30z554EVM-001 comprises two hardware components: the bq30z554/bq29412 circuit module and
the EV2300 or EV2400 PC interface box.
7.1 Connecting the bq30z554/bq29412 Circuit Module to a Battery Pack
Figure 9 shows how to connect the bq30z554/bq29412 circuit module to the cells and system
load/charger.
The cells must be connected in the following order:
1. 4-Cell Pack: 1N (BAT–), 1P, 2P, 3P, then 4P (see Section 2.2 for definitions)
2. 3-Cell Pack: 1N (BAT–), 1P, 2P, and then connect 4P and 3P together
3. 2-Cell Pack: 1N (BAT–), 1P, and then connect 4P, 3P, and 2P together
To start charge or discharge test, connect the SYS PRES pin to the Pack– pin to set SYS PRES state. To
test sleep mode, disconnect the SYS PRES pin.
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