Texas Instruments BQ79616EVM User manual

User’s Guide
BQ79616-Q1, BQ75614-Q1, and BQ79656-Q1
Evaluation Modules
Taylor Vogt
ABSTRACT
The BQ79616-Q1 and BQ75614-Q1 Evaluation Modules user's guide describes the general features, theory of
operation, hardware setup, and use of the BQ79616EVM and BQ75614EVM. Throughout this user's guide, the
abbreviations BMS021, EVM, and the term evaluation module are synonymous with the two different variants of
BMS021, BQ79616-Q1 Evaluation Module and BQ75614-Q1 Evaluation Module, unless otherwise noted. When
a difference is noted between the two variants, each variant will be differentiated as BQ79616EVM for the
BQ79616-Q1 Evaluation Module, and the BQ75614EVM for the BQ75614-Q1 Evaluation Module. These EVMs
are evaluation boards for the BQ79616-Q1 and BQ75614-Q1 devices for use in large format lithium-ion battery
pack applications to provide monitoring, protecting, balancing, and communications.
Table of Contents
1 General Description................................................................................................................................................................6
1.1 Key Features......................................................................................................................................................................6
1.2 Key Electrical Parameters..................................................................................................................................................6
2 Theory of Operation - Stackable BQ79616EVM................................................................................................................... 7
2.1 Single Board.......................................................................................................................................................................8
2.2 Stacked Systems............................................................................................................................................................... 8
2.3 Configuring the BQ79616-Q1 EVM to be used for Lower Cell Count Applications............................................................8
3 Theory of Operation - Standalone BQ75614EVM.................................................................................................................9
4 Connectors............................................................................................................................................................................ 11
4.1 Primary Input and Output Connectors..............................................................................................................................11
5 Quick Start Guide..................................................................................................................................................................15
5.1 Required Devices for using the Example Code............................................................................................................... 15
5.2 Power Connections.......................................................................................................................................................... 15
5.3 Connecting the EVM to TMS570 LaunchPad.................................................................................................................. 16
5.4 Stacking BQ79616EVMs..................................................................................................................................................16
5.5 Software........................................................................................................................................................................... 16
5.6 GUI...................................................................................................................................................................................17
6 Physical Dimensions............................................................................................................................................................18
6.1 Board Dimensions............................................................................................................................................................18
6.2 Board Mounting................................................................................................................................................................18
7 BQ79616EVM Schematic, Assembly, Layout, and BOM................................................................................................... 19
7.1 Schematic........................................................................................................................................................................ 19
7.2 Assembly..........................................................................................................................................................................23
7.3 Layout.............................................................................................................................................................................. 25
7.4 BQ79616EVM-021 Bill of Materials (BOM)...................................................................................................................... 33
8 BQ75614EVM Schematic, Assembly, Layout, and BOM................................................................................................... 40
8.1 Schematic........................................................................................................................................................................ 40
8.2 Assembly..........................................................................................................................................................................44
8.3 Layout.............................................................................................................................................................................. 45
8.4 BQ75614EVM Bill of Materials (BOM)............................................................................................................................. 46
9 BQ79656EVM Schematic, Assembly, Layout, and BOM................................................................................................... 52
9.1 Schematic........................................................................................................................................................................ 52
9.2 Assembly..........................................................................................................................................................................56
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9.3 Layout.............................................................................................................................................................................. 57
9.4 BQ79656EVM Bill of Materials (BOM)............................................................................................................................. 57
10 Revision History................................................................................................................................................................. 64
Trademarks
LaunchPad™ and Code Composer Studio™ are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
Trademarks www.ti.com
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General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
WARNING
Warning: To minimize risk of fire hazard, always verify and follow any specific safety instructions and
application considerations related to the batteries being used in conjunction with this EVM.
Always follow TI’s set-up and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help ensure
your personal safety and the safety of those working around you. Contact TI’s Product Information Center http://
support/ti./com for further information.
Save all warnings and instructions for future reference.
Failure to follow warnings and instructions may result in personal injury, property damage, or death due
to electrical shock and/or burn hazards.
The term TI HV EVM refers to an electronic device typically provided as an open framed, unenclosed printed-
circuit-board assembly. It is intended strictly for use in development laboratory environments, solely for qualified
professional users having training, expertise, and knowledge of electrical safety risks in development and
application of high-voltage electrical circuits. Any other use or application are strictly prohibited by Texas
Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.
1. Work Area Safety:
a. Keep work area clean and orderly.
b. Qualified observer(s) must be present any time circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related
apparatus used in a development environment exceeding 50 VRMS or 75 VDC must be electrically located
within a protected Emergency Power Off (EPO) protected power strip.
e. Use a stable and non-conductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No freehand
testing whenever possible.
2. Electrical Safety:As a precautionary measure, it is always a good engineering practice to assume that the
entire EVM may have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs, and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-
energized.
b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,
measurement equipment hook-ups and other application needs, while still assuming the EVM circuit and
measuring instruments are electrically live.
c. Once EVM readiness is complete, energize the EVM as intended.
WARNING
WARNING: while the EVM is energized, never touch the EVM or its electrical circuits as
they could be at high voltages capable of causing electrical shock hazard.
3. Personal Safety:
a. Wear personal protective equipment, for example, latex gloves or safety glasses with side shields or
protect EVM in an adequate lucent plastic box with interlocks from accidental touch.
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4. Limitation for Safe Use:
a. EVMs are not to be used as all or part of a production unit.
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The following warnings and cautions are noted for the safety of anyone using or working close to the BQ79616
EVM. Observe all safety precautions.
!
Caution Do not leave EVM powered when unattended.
Danger High
Voltage
The BQ79616EVM is rated as a high voltage EVM, but it is not required to operate this EVM at high
voltage. If you apply high voltage to this board, all terminals should be considered high voltage.
spacer
Electric shock is possible when connecting the board to live wire. The board should be handled
with care by a professional.
spacer
For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly
recommended.
CAUTION
The circuit module has signal traces, components, and component leads on the bottom of the board.
This may result in exposed voltages, hot surfaces, or sharp edges. Do not reach under the board
during operation.
CAUTION
The circuit module may be damaged by overtemperature. To avoid damage, monitor the temperature
during evaluation and provide cooling, as needed, for your system environment.
CAUTION
Some power supplies can be damaged by application of external voltages. If using more than 1
power supply, check your equipment requirements and use blocking diodes or other isolation
techniques, as needed, to prevent damage to your equipment.
CAUTION
The communication interface is not isolated on the EVM. Be sure no ground potential exists between
the computer and the EVM. Also be aware that the computer will be referenced to the Battery-
potential of the EVM.
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1 General Description
TI's BMS021 Battery Management System (BMS) is an evaluation board for the BQ7961X-Q1 family of devices
for use in large format lithium-ion battery pack applications to provide monitoring, protecting, balancing, and
communications. There are two variants of the evaluation board, the BQ79616EVM and the BQ75614EVM.
Each BQ79616EVM can manage up to 16 cells (80-V max) for Li-ion battery applications. Up to 35
BQ79616EVM modules can be stacked, for packs up to 560 series cells.
Each BQ75614EVM can manage 14 or 16 cells (80-V max) for Li-ion battery applications. The standalone
BQ75614EVM module includes integrated current sense.
Each system provides fast cell balancing, diagnostics, and module to controller communication. Independent
protection circuitry is also provided. Please see the BQ79616-Q1 or BQ75614-Q1 data sheet for more details on
each respective part.
Each EVM is equipped with precision measurement and synchronous communication to enable a master
controller to perform State of Charge (SOC) and State of Health (SOH) estimation. Highly-accurate cell voltages
and a fast sampling time for the entire battery pack allows more efficient operation of battery modules and more
accurate SOC and SOH calculations. Communication with stacked BQ79616EVMs is via an isolated daisy-chain
differential bus. For the standalone BQ75614EVM, SOC and SOH are further assisted by an integrated current
sense ADC.
Control a single EVM or multiple stacked EVMs using a PC-hosted GUI. Communication between the PC and
the base device in a stack of BQ79616EVM (or a single standalone BQ75614EVM device) is via a USB2ANY
UART interface. For a stack of BQ79616EVM devices, communication between all other EVMs in the stack
occurs via the isolated, daisy-chain differential communication bus. The PC GUI allows configuration of the
EVMs to monitor cells and other analog data channels, control balancing, and monitor details of any faults.
1.1 Key Features
This EVM includes the following features:
• Internal passive cell balancing
• Isolated differential daisy chain communications with optional ring architecture
• Flexible architecture for 6 to 16 cell applications
• UART interface
• High-accuracy cell voltage measurement
• Diagnostics
• 8 multipurpose GPIOs
• Resistor ladder to simulate cell voltages
• Supports Bus Bar Connection/Measurement
• High-accuracy current sense measurement (only available on the BQ75614EVM).
1.2 Key Electrical Parameters
The following table identifies the key electrical parameters:
Parameter Value
Maximum battery pack voltage (stacked EVMs) 2400 V
Maximum operating voltage 80 V (depends on series R3, R4 value)
Minimum operating voltage 9 V (depends on series R3, R4 value, by default use at least 18V)
Maximum cell open circuit voltage 5 V
Ambient temperature –40 °C to 105 °C
Nominal operating temperature –20 °C to 60 °C
Cell balancing current Approximately 200 mA @ 80 °C
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2 Theory of Operation - Stackable BQ79616EVM
Figure 2-1 shows the system stack diagram.
Figure 2-1. System Block Diagram - BQ79616
The BMS system is designed to prolong the useful life of lithium-ion cells in battery packs through passive
balancing. The battery pack is broken into a series of modules, each of which contains up to 16 cells. This
system will monitor voltages of individual battery cells and dissapate individual cell voltages through the use of
internal CB FETs. The BMS allows battery-powered electric machines to use smaller battery packs and use
fewer charging cycles to perform the same amount of work. It also improves the overall lifetime of Li-ion battery
packs by preventing under- and overvoltage damage from occurring.
The typical BMS system with stacked modules has three main sub-systems, as shown in Figure 2-1:
• Host controller - in this case a TMS570 LaunchPad™
• A BQ79616-Q1 configured as an isolated communication bridge device - a BQ79600EVM or another
BQ79616EVM can support this
• BQ79616EVM based modules attached to cells - these can be stacked up to35 total (including the bridge
device)
All commands and data are communicated with a host via either a UART or daisy-chain communication
connection. The BQ79616 will remain idle until a command is received from the host. The BQ79616 can support
a host PC or microcontroller (via the UART connection header) or a daisy-chain interface from a BQ79616-Q1
implemented as a communication bridge.
The typical flow is for the host to go through the following simplified sequence:
1. Wakeup the BQ79616EVM board by sending a WAKEUP pulse when using the UART interface, or sending a
WAKE tone when using the BQ79616EVM in a stack of other BQ79616EVM boards for a large battery pack
or a BQ79616-Q1 configured as a bridge. Initialize the BQ79616-Q1 to be ready for use.
2. Send a sample command to the BQ79616-Q1 to read the cell measurement results.
3. The host will use the cell measurement data to calculate an average and determine the highest or lowest
cells and determine the cells that should be balanced.
4. If no stop command is sent, the BQ79616-Q1 has a built-in timeout (set by the user), after which time the
discharge will be stopped automatically.
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5. The host can then decide to repeat the process (back to step 2) or send commands to shutdown the
BQ79616EVM and return later.
2.1 Single Board
As a single board the BMS can passively balance up to 16 cells, up to 80 V of total voltage. Communication to
the BQ79616EVM is handled by the daisy-chain communications bus from another BQ79616-Q1 or the UART
host interface.
2.2 Stacked Systems
The boards may be stacked in daisy chain to accomodate larger battery packs than the 16 channels provide on
a single board. Communication to the BQ79616EVM is handled by the daisy-chain communications bus from
another BQ79616-Q1.
2.3 Configuring the BQ79616-Q1 EVM to be used for Lower Cell Count Applications
The BQ79616-Q1 EVM can be configured to support lower cell count applications, especially for users designing
with the BQ79614-Q1/BQ79612-Q1 devices. For these cases, the EVM comes fitted with placeholder 0 ohm
resistors for shorting together the VC and CB pins of the topmost cells. These can be found in the schematic at
the bottom of this user guide, with a note "Resistors for Lower Cell Count Applications". The user will need to
populate the 0 ohm resistors depending the use of 12 or 14 cells. For 14, the user would populate only R24,
R28, R22, and R26 whereas for 12 the user would populate all 8 of the resistors (R24, R28, R22, R26, R21,
R23, R25, R27). The GUI is also implemented with a feature to change the active cell configuration. Navigate to
the cell monitor page to "View Poll Settings" and then select their desired active cell configuration by using the
dropdown selection below the "No. of cells" column.
Theory of Operation - Stackable BQ79616EVM www.ti.com
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3 Theory of Operation - Standalone BQ75614EVM
Figure 3-1 shows the system block diagram.
Figure 3-1. System Block Diagram - BQ75614
The BMS system is designed to prolong the useful life of lithium-ion cells in battery packs through passive
balancing, and provide enhanced SOC and SOH measurements using integrated current sense measurement.
The device can monitor a battery pack which contains up to 16 cells, or up to 14 cells with the ability to measure
fuse and relay voltages. This system will monitor voltages of individual battery cells and dissapate individual cell
voltages through the use of internal CB FETs. The BMS allows battery-powered electric machines to use smaller
battery packs and use fewer charging cycles to perform the same amount of work. It also improves the overall
lifetime of Li-ion battery packs by preventing under- and overvoltage damage from occurring.
The typical BMS system with integrated current sense has two main sub-systems, as shown in Figure 3-1:
• Host controller - in this case a TMS570 LaunchPad™
• BQ75614EVM module attached to cells, and communicating with the host
• Optional: a digital isolator between the host domain and the BQ75614EVM domain
All commands and data are communicated with a host via UART. The BQ75614-Q1 will remain idle until a
command is received from the host. The BQ75614EVM can support a host PC or microcontroller (via the UART
connection header).
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The typical flow is for the host to go through the following simplified sequence:
1. Wakeup the BQ75614EVM board by sending a WAKEUP pulse when using the UART interface.
2. Send a sample command to the BQ75614-Q1 to read the cell measurement results and current
measurement results.
3. The host will use the cell measurement data to calculate an average and determine the highest or lowest
cells and determine the cells that should be balanced. The host will use the current measurement data to
estimate SOC and SOH.
4. If no stop command is sent, the BQ75614-Q1 has a built-in timeout (set by the user), after which time the
discharge will be stopped automatically.
5. The host can then decide to repeat the process (back to step 2) or send commands to shutdown the
BQ75614EVM and return later.
As a single standalone board, the BQ75614EVM can passively balance up to 16 cells, up to 80 V of total
voltage. Communication to the BQ75614EVM is handled by the UART host interface.
Theory of Operation - Standalone BQ75614EVM www.ti.com
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4 Connectors
4.1 Primary Input and Output Connectors
4.1.1 Jumper Placements
Below is a table explaining each of the jumpers available for the user's flexibility.
Pinheader Contacts Jumper Connection Populated by Default?
J1 1-2 Rx direct connection to CVDD No
J2 1-2 NFAULT connection to Digital
Isolator
Yes
J4 1-2 GPIO1 connection to 10k pullup
and thermistor
Yes
J5 1-2 TSREF pullup to GPIOs Yes
J6 1-2 LED connection on AVDD to
indicate the device is awake
Yes
J14 1-2 PWR/BAT connection to CELL16 Yes
J16 1-2 CELL0 connection to GND Yes
J18 1-2 CVDD connection to Digital
Isolator
Yes
J21 1-2 RX to Dig Isolator Connection Yes
4.1.2 Battery Connector
The live battery cell connections are made from connector J15. Cell voltage measurements and balancing
currents use these connections. Alternatively, the user can simulate cell voltages using the on board resistor
ladder across each of the cells which can be utilized by closing switches S1 and S2 and applying a DC voltage
across the VSTACK test point and GND. Short unused channels to the top cell connection in the wiring harness
to support fewer than 16 cells. At the minimum, the user must support 6 cells.
Figure 4-1. Molex 50-57-9422 (Reference Image Only)
Table 4-1. Connector Information
Designator Manufacturer Part Number Mating Connector
J15 Molex Manufacturer:0705550056
Digi-Key: 0705550056-ND
Manufacturer:50-57-9422
Digi-Key:WM2920-ND
Table 4-2. Pin Description
Pin Name Comments
1 CELL0/GND Negative terminal of CELL1, Connected directly to AVSS GND of device
2 CELL16 Positive terminal of CELL16, Direct connection to BAT, LDOIN
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Table 4-2. Pin Description (continued)
Pin Name Comments
3 CELL0 Negative terminal of CELL1, Connected directly to AVSS GND of device
4 CELL0S Negative terminal of CELL1, Actual sense connnection for VC0 path
5 CELL1 Positive terminal of CELL1, negative terminal of CELL2
6 CELL2 Positive terminal of CELL2, negative terminal of CELL3
7 CELL3 Positive terminal of CELL3, negative terminal of CELL4
8 CELL4 Positive terminal of CELL4, negative terminal of CELL5
9 CELL5 Positive terminal of CELL5, negative terminal of CELL6
10 CELL6 Positive terminal of CELL6, negative terminal of CELL7
11 CELL7 Positive terminal of CELL7, negative terminal of CELL8
12 CELL8 Positive terminal of CELL8, negative terminal of CELL9
13 CELL9 Positive terminal of CELL9, negative terminal of CELL10
14 CELL10 Positive terminal of CELL10, negative terminal of CELL11
15 CELL11 Positive terminal of CELL11, negative terminal of CELL12
16 CELL12 Positive terminal of CELL12, negative terminal of CELL13
17 CELL13 Positive terminal of CELL13, negative terminal of CELL14
18 CELL14 Positive terminal of CELL14, negative terminal of CELL15
19 CELL15 Positive terminal of CELL15, negative terminal of CELL16
20 CELL16S Positive terminal of CELL16, actual sense connection to VC16 path
21 CELL16 Positive terminal of CELL16, Direct connection to BAT, LDOIN
22 CELL0/GND Negative terminal of CELL1, Connected directly to AVSS GND of device
4.1.3 Host Interface
The 10-pin J17 - Serial connector is used to connect the EVM to a PC running the GUI or to a host controller.
Texas Instruments recommends using the USB2ANY that is available to order through TI.com,which includes the
proper 10 pin cable.
Figure 4-2. Samtec Inc. TSW-105-08-L-D-RA (Reference Image Only)
Table 4-3. Connector Information
Designator Manufacturer Part Number Mating Connector
J17 Samtec Inc. Manufacturer: TSW-105-08-L-
D-RA
10 pin ribbon connector packaged with USB2ANY
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Table 4-4. Pin Description
Pin Name
1 NC
2 NC
3 nFAULT signal from BQ79616-Q1 or BQ75614-Q1
4 NC
5 GND
6 USB2ANY 3.3V
7 USB2ANY TX ( RX of BQ79616-Q1 or BQ75614-Q1 )
8 USB2ANY RX ( TX of BQ79616-Q1 or BQ75614-Q1 )
9 NC
10 NC
4.1.4 GPIO or Thermistor Inputs
There are 8 GPIO pins which can either be floated, connected to a thermistor and 10k pullup, or be forced to
certain voltage for a measurement. This can be determined by using the J4 header as shown below. Insert a
shunt from pins 1 and 2 to connect GPIO1 to the thermistor, pins 3 and 4 to connect GPIO2 and so on for the
other GPIOs. Jumper J5 must also be connected to pull the GPIOs up to the TSREF reference voltage for
ratiometric NTC measurements.
Figure 4-3. Sullins Connector Solutions PEC08DAAN (Reference Image Only)
Table 4-5. Connector Information
Designator Manufacturer Part Number Mating Connector
J4 Sullins Connector
Solutions
Manufacturer: PEC08DAAN N/A
Table 4-6. Pin Description - J4
Pin Name Comments
1 GPIO1 GPIO1 Pin of BQ79616-Q1 or BQ75614-Q1
2 GPIO1_R Connection for GPIO1 to 10k pullup and thermistor
3 GPIO2 GPIO2 Pin of BQ79616-Q1 or BQ75614-Q1
4 GPIO2_R Connection for GPIO2 to 10k pullup and thermistor
5 GPIO3 GPIO3 Pin of BQ79616-Q1 or BQ75614-Q1
6 GPIO3_R Connection for GPIO3 to 10k pullup and thermistor
7 GPIO4 GPIO4 Pin of BQ79616-Q1 or BQ75614-Q1
8 GPIO4_R Connection for GPIO4 to 10k pullup and thermistor
9 GPIO5 GPIO5 Pin of BQ79616-Q1 or BQ75614-Q1
10 GPIO5_R Connection for GPIO5 to 10k pullup and thermistor
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Table 4-6. Pin Description - J4 (continued)
Pin Name Comments
11 GPIO6 GPIO6 Pin of BQ79616-Q1 or BQ75614-Q1
12 GPIO6_R Connection for GPIO6 to 10k pullup and thermistor
13 GPIO7 GPIO7 Pin of BQ79616-Q1 or BQ75614-Q1
14 GPIO7_R Connection for GPIO7 to 10k pullup and thermistor
15 GPIO8 GPIO8 Pin of BQ79616-Q1 or BQ75614-Q1
16 GPIO8_R Connection for GPIO8 to 10k pullup and thermistor
4.1.5 High-Side and Low-Side Communications
There are two sets of 4-position molex connectors available on each BQ79616EVM board. These are not
available on the BQ75614EVM. These provide high-side (J11) and low-side (J10) communications between
stacked EVM devices.
Table 4-7. Connector Information
Designator Manufacturer Part Number Mating Connector
J10/J11 Molex Manufacturer:
0705510038
Digi-Key: WM14059-ND
Manufacturer:
0050579404
Digi-Key: WM2902-ND
Table 4-8. Pin Description - J10
Pin Name Comments
1 COML_N COM lowside negative
2 COML_P COM lowside positive
3 N/A Unused
4 N/A Unused
Table 4-9. Pin Description - J11
Pin Name Comments
1 N/A Unused
2 N/A Unused
3 COMH_P COM highside positive
4 COMH_N COM highside negative
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5 Quick Start Guide
This section includes hardware setup instructions, connection procedures, and software and GUI instructions.
Figure 5-1. Basic EVM Setup using DC Voltage with Resistor Ladder
5.1 Required Devices for using the Example Code
The system example code is implemented using the TMS570LS12 LaunchPad™ board (TMS570LS1224 MCU)
and the BMS021 via Code Composer Studio.
The part numbers of the evaluation modules are LAUNCHXL2-TMS57012 and BQ79616EVM-021 (for
BQ79616-Q1 evaluation) or BQ75614EVM-021 (for BQ75614-Q1 evaluation). These boards are available from
the TI eStore (https://estore.ti.com/) or from your local TI sales representative. For more details and information
related to the LaunchPad modules, see the specific module user's guide.
5.2 Power Connections
If powering the EVM using the included resistor ladder as cells, simply ensure that the power supply positive
terminal is connected to the "VSTACK" or "PWR" testpoints provided on the board, and the power supply
negative terminal is connected to the "GND" or "Cell0" testpoints provided on the board, or any "GND" standoff
provided.
If not using the resistor ladder, the power supply positive terminal must be connected to the "PWR" testpoint, and
the power supply negative terminal must be connected to the "Cell0" testpoint.
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Also ensure that headers J16 and J14 are both jumpered, to allow for power and ground to be supplied from the
"battery stack" (resistor ladder).
5.2.1 On-Board Resistor Ladder - Power Supply
Each EVM utilizes an on-board resistor ladder to simplify the evaluation process. Each of the sixteen resistors is
nominally 100 Ω, resulting in roughly one-sixteenth of the module voltage at each cell connection. For the
BQ75614EVM, this will instead be one-fourteenth the module voltage as the board does not use the top two
cells. By default, all actuators of S1, S2 are positioned closest to the IC, which is the "ON" or "closed" state. In
this state, all of the resistors are connected to the EVM sense and balance connections and allow easy start up
with a DC voltage connection across VSTACK and GND.
To simulate connected cells to the sense and balance connections (using a power supply), ALL switch actuators
on S1, S2 must be moved away from the module connector J15 if not already done. Moving the actuators in this
manner connects the EVM to the resistor ladder, and allows for simulated cell measurements.
5.2.2 Using Actual Battery Cells
When using actual battery cells, disconnect the resistor ladder by moving ALL switch actuators on S1, S2 to the
"OFF" or open position (away from the IC and towards J15).
5.3 Connecting the EVM to TMS570 LaunchPad
The EVMs are connected using a standard wire jumper; Table 5-1 shows the connections between the two
EVMs. By default, the TMS570 LaunchPad is powered by the USB port on the host computer.
Table 5-1. *Connections Between EVM and TMS570 LaunchPad
Connection Name EVM TMS570 LaunchPad
TX J17 Pin J2 pin 3 (UARX)
RX J17 J2 pin 4 (UATX)
nFAULT J17 J2 pin 5 (PA7)
GND J17 J3 pin 2 (GND)
5.4 Stacking BQ79616EVMs
Note
NOTE: This section does not apply to BQ75614EVMs.
The BQ79616EVMs are connected using 4-position Molex connectors. There is a high side (J11) and low side
(J10) communication connector available on each device. By default the isolation filters for the vertical interface
are set to cap only configuration. The user may change this by populating/depopulating components. For
example, the user can depopulate resistors R69, R79, R72, and R74 to use the on board choke in series with
the capacitors. There are also footprints to populate a transformer on the bottom of the pcb board. More details
can be found in the schematic near the bottom of this user guide.
Table 5-2. Connections Between High-Side/Low-Side BQ79616EVMs
Connection Name BQ79616EVM High Side BQ79616EVM Low Side
COMH_N/COML_N J11 pin 4 J10 pin 1
COMH_P/COML_P J11 pin 3 J10 pin 2
5.5 Software
The software provides a command API and drivers that are capable of implementing the examples provided in
BQ79616-Q1 Software Design Reference.
The example code only provides a control interface to the BQ79616-Q1 and does not provide any other
communications interface to the outside world. The customer is expected to develop their own communication
implementation. Examples of communications interfaces available to the TMS570 are SPI, CAN, or UART. For
Quick Start Guide www.ti.com
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the TMS570 example code, UART is the communication protocol used between the microcontroller and
BQ79616-Q1 device.
This firmware provided with this application note provides source code examples of the command sequences
described in the BQ79616-Q1 Software Design Reference.
Importing a project into Code Composer Studio™:
1. Launch the provided file: BQ79616-Q1 Example Code 0.1 Installer.exe and extract files to the default path
provided ( C:\ti\bq79616-Q1 Example Code 0.1 ).
2. Launch Code Composer Studio (CCS):
Start → Programs → Texas Instruments → Code Composer Studio v8 → Code Composer Studio v8
3. When it launches, CCS requests a workspace is selected, choose “C:\myWorkspace”. Once CCS loads, go
to:
Project → Import CSS Projects... → Select search-directory
4. In Select search-directory, browse to the folder:
C:\ti\bq79616-Q1 Example Code 0.1
5. In Discovered projects:, check BQ79616-Q1 example code
5.6 GUI
For initial evaluation, it may be more beneficial to use the graphical user's interface (GUI), which provides a
"point and click" interface to become familiar with the BQ79616-Q1 or BQ75614-Q1. During the initial sampling
phase, please contact your local TI FAE to get the latest GUI version.
To get started with the GUI, please refer to the BQ79616 GUI User Guide (SLUUC36) document.
5.6.1 GUI UART Connection
The physical setup for the GUI is the same as for the microcontroller, but will instead use an USB2ANY interface
and 10 pin cable for the UART connections on J17. The USB2ANY has a USB Mini-B connector on the right
side. Plug the provided USB cable (or any USB cable with a Mini-B connector) into the USB2ANY. Plug the other
end of the cable (USB ‘A’) into the computer. Then connect the10 pin connector cable to J4 of the USB2ANY
(middle most connector) and must have the key side facing upwards when connecting to the EVM header J17.
Please refer to the picture below and this is explained in more detail in the USB2ANY user guide: http://
www.ti.com/lit/ug/snau228/snau228.pdf and the BQ79616-Q1 GUI User Guide (SLUUC36).
www.ti.com Quick Start Guide
SLUUC37B – JULY 2019 – REVISED OCTOBER 2020
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6 Physical Dimensions
6.1 Board Dimensions
Board dimensions: 4.400 in × 5.500 in
Board height:
• Top - Tallest component (GPIO, Shunts) is 0.35 in (8.8 mm) above PCB.
• Bottom - Tallest component if populated (Transformers) is 0.41 in (10.5 mm) above PCB (Depopulated by
default).
6.2 Board Mounting
Figure 6-1 illustrates the EVM dimension drawing.
Figure 6-1. Board Dimensions
Physical Dimensions www.ti.com
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7 BQ79616EVM Schematic, Assembly, Layout, and BOM
Provided are the BQ79616EVM schematic, assembly, layout and BOM in their respective sections.
7.1 Schematic
PWR
CB1
CB14
CB15
CB16
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
COMLN
COMLP
COMHN
COMHP
CB0
BBP_CELL
BBN_CELL
bq79616
BMS021E3_bq79616.SchDoc
Hardware
BMS021E3_EVM_Hardware.SchDoc
VC16
VC15
VC14
VC13
VC12
VC11
VC10
VC9
VC8
VC7
VC6
VC5
VC4
VC3
VC2
VC1
VC0
CB16
CB15
CB14
CB13
CB12
CB11
CB10
CB9
CB8
CB7
CB6
CB5
CB4
CB3
CB2
CB1
PWR
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
CELL7
CELL8
CELL9
CELL10
CELL11
CELL12
CELL13
CELL14
CELL15
CELL16S
CB0
CELL0
VSTACK
Battery Connector
BMS021E3_VC_CB.SchDoc
COMLP
COMHN
COMLN
COMHP
Daisy Chain Isolation
BMS021E3_Communications.SchDoc
CELL1
CELL2
CELL3
CELL4
CELL5
CELL6
CELL7
CELL8
CELL9
CELL10
CELL11
CELL12
CELL13
CELL14
CELL15
CELL16S
CELL0
BBP_CELL
BBN_CELL
VSTACK
Cell Simulator
BMS021E3_CellSimulator.SchDoc
Figure 7-1. BQ79616EVM Schematic Block Diagram
www.ti.com BQ79616EVM Schematic, Assembly, Layout, and BOM
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ALL DECOUPLING
CAPS ARE AS
CLOSE TO THE
CHIP AS POSSIBLE
GND tied to CELL0
at connector via a
thick trace.
GPIO6
GPIO7
GPIO8
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
COMHP
CB16
COMHN
COMLP
COMLN
NFAULT
TX
RX
BBN
BBP
VC16
VC15
VC14
VC13
VC12
VC11
VC10
VC9
VC8
VC7
VC6
VC5
VC4
VC3
VC2
VC1
VC0
DVDD
CVDD
AVDD
REFHP
BAT
LDOIN
NPNB
NEG5V
TSREF
BQ79616PAPQ1
GPIO5 57
GPIO4 58
GPIO1 61
GPIO6 56
BBN
63 BBP
64
62 FAULT
GPIO7 55
GPIO2 60
GPIO3 59
7VC14
8
CB13
VC12
11
6
CB14
VC11
13
CB10 14
CB11 12
5VC15
CB12 10
9VC13
VC9
17
CB8 18
VC7
21
CB9 16
VC6
23
CB5 24
CB6 22
VC10
15
CB7 20
VC8
19
REFHP
37
AVDD
38
40
COMLP
REFHM 36
42
COMHN
43
COMHP
41
COMLN
VC0
35
44 NEG5V
AVSS 39
LDOIN
47
NPNB
48
TSREF
51
CVSS 46
TX
53
GPIO8 54
RX
52
CVDD
45
DVSS 50
DVDD
49
VC4
27
CB3 28
VC2
31
CB4 26
VC1
33
CB0 34
CB1 32
VC5
25
CB2 30
VC3
29
1BAT
3VC16
4
CB15 2
CB16
PAD 65
U1
10nF
C5
GND
GND
1µF
C6
1µF
C9
4.7µF
C7
1µF
C8
1µF
C2
GND
GND
GND
GND
0.1uF
C3
GND
GND
VC0
VC1
VC2
VC3
VC4
VC5
VC6
VC7
VC8
VC9
VC10
VC11
VC12
VC13
VC14
VC15
VC16
CB0
CB1
CB2
CB3
CB4
CB5
CB6
CB7
CB8
CB9
CB10
CB11
CB12
CB13
CB14
CB15
CB16
COMHP
COMHN
COMLP
COMLN
30.0
PWR
R5
Green
PWR
1
2
D1
1
2
J6
GND
1.0k
R121
GND
LDOIN
100
R3
200
R4
0.22µF
C1
GND
PWR
NPN Power Supply
TP14
GND
GND
TP13
GND
DVDD BBN NFAULT
Test Points
TP1
TSREF
TP2
LDOIN
TP3
NEG5V
TP4
NPNB
TP5
CVDD
TP6
AVDD
TP7
REFHP
TP8
BAT
TP43
NFAULT
TP11
BBN
TP10
BBP
TP9
DVDD
BBN
BBP
402
R9
402
R12
0.47uF
C10
0
R24
DNP
0
BBN_CELL
BBP_CELL
BBP_CELL
BBN_CELL
R23
DNP
0
R28
0DNP
R27
DNP
VC16 VC15 VC14 VC13 VC12
0
R22
DNP
0
R26
DNP
CB16 CB15
0
R21
DNP
0
R25
DNP
CB14 CB13 CB12
Resistors for Lower Cell Count
Applications (614, 612)
BBP/BBN Bus Bar
TP16
TP17
0
R13
0
DNP
R10
DNP
BBN
BBP
0.47uF
DNPC11
TP19
SRN_S
TP18
SRP_S
SRP/SRN
Current Sense
GPIO8_R
GPIO5_R
GPIO6_R
GPIO7_R
GPIO4_R
GPIO3_R
GPIO2_R
GPIO1_C
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
J4
GPIO8
GPIO6
GPIO7
GPIO5
GPIO4
GPIO2
GPIO1
GPIO3
2
1
J5
TSREF
Jumpers to connect GPIOs to
resistor divider and thermistor for
temperature measurements.
Jumpers to connect TSREF to
ratiometric circuit.
Low side NTC circuit.
10k
t°
RT7
10k
t
°
RT5
10k
t
°
RT4
10k
t
°
RT2
10k
t
°
RT6
10k
t
°
RT1
10k t
°
RT8
10k
t°
RT3
10.0k
R11
10.0k
R19
10.0k
R8
10.0k
R18
10.0k
R7
10.0k
R16
10.0k
R15
10.0k
R14
GND
PULLUP
PULLUP
GPIO1_R
GPIO2_R
GPIO3_R
GPIO4_R
GPIO5_R
GPIO6_R
GPIO7_R
GPIO8_R
GPIOs
C12DNP 1uF
100k
R20
DNP
3
DNP
1
Q2
2,4
NPNB
R17
DN0 P
23
1
Q1
NPNB
BATREFHP
BBP
AVDD
TSREF LDOIN NEG5V NPNB
CVDD
GND
TP15
GND
GND
5
4
3
2
1
6
J3
UART Communication
1
J3 Pin Desc ription
5 TX - to microcontroller UART RX
4 RX - to microcontroller UART TX
2 FAULTn - to microcontroller GP IO
1 GND - shared GND with microcontroller
2
J1
TX
1
2
J2
100k
R2
CVDD
NFAULT
100k
R120
1
3
5
7
9
J17A
100
R119
RX_C
2
4
6
8
10
J17B
0.1uF
C59
0.1uF
C4
GND
RX
INA
3
J17 Pin Des cription
8 TX - to microcontroller UART RX
7 RX - to microcontroller UART TX
3 FAULTn - to microcontroller GP IO
5 GND - shared GND with microcontroller
6 USB2ANY 3.3V
INB
4
INC 12
IND 11
OUTA 14
OUTB 13
OUTC
5
OUTD
6
7EN1 EN2 10
1VCC1 VCC2 16
GND1
29
GND2
8GND1 GND2 15
U2
ISO7342CQDWRQ1
GND_ISO
0.1uF
C57
0.1uF
C58
USB2ANY_TX_3.3
100k
R123
GND_ISO
1.0k
R128 GPIO1_R
TP42
TX
TP12
RX
CVDD
NFAULT_C
CVDD_CO
NFAULT_C
USB2ANY_3.3V
USB2ANY_T X_3.3
USB2ANY_RX_3.3
USB2A NY_3 .3V
CVDD_CO
TX
RX_CO
NF_J
GND
GND_ISO
RX
TX
USB2A NY_R X_3.3
USB2ANY_3.3V
1
2
J18
GND
GND
1
2
J21
RX
1uF
C60
GND
TP44
GPIO1_R
24V
1
3
2
D3
NF_J
Figure 7-2. BQ79616EVM Schematic Part 1
BQ79616EVM Schematic, Assembly, Layout, and BOM www.ti.com
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