Texas Instruments BQ25306EVM User manual

User’s Guide
BQ25306 (BMS005) Evaluation Module
ABSTRACT
This user's guide provides detailed testing instructions for the BQ25306 evaluation module (EVM). Also included
are descriptions of the necessary equipment, equipment setup, procedures, the printed-circuit board layouts,
schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM, BQ25306EVM, BMS005, BMS005-004 and the term
evaluation module are synonymous with the BQ25306 evaluation module, unless otherwise noted.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Features............................................................................................................................................................................. 2
1.2 I/O Descriptions..................................................................................................................................................................2
2 Test Setup and Results.......................................................................................................................................................... 3
2.1 Equipment.......................................................................................................................................................................... 3
2.2 Equipment Setup................................................................................................................................................................3
2.3 Test Procedure................................................................................................................................................................... 4
3 PCB Layout Guideline............................................................................................................................................................ 5
4 Board Layout, Schematic, and Bill of Materials...................................................................................................................6
4.1 Board Layout......................................................................................................................................................................6
4.2 Schematic.......................................................................................................................................................................... 9
4.3 Bill of Materials.................................................................................................................................................................10
5 Revision History................................................................................................................................................................... 13
List of Figures
Figure 2-1. Original Test Setup for BMS005-004.........................................................................................................................3
Figure 2-2. BQ25306EVM 1-Cell Efficiency.................................................................................................................................5
Figure 2-3. BQ25306EVM 2-Cell Efficiency.................................................................................................................................5
Figure 4-1. Top Overlay............................................................................................................................................................... 6
Figure 4-2. Top Solder................................................................................................................................................................. 6
Figure 4-3. Top Layer...................................................................................................................................................................7
Figure 4-4. Bottom Layer............................................................................................................................................................. 7
Figure 4-5. Bottom Solder............................................................................................................................................................7
Figure 4-6. Bottom Overlay..........................................................................................................................................................8
Figure 4-7. BQ25306 Schematic................................................................................................................................................. 9
List of Tables
Table 1-1. Device Data Sheets.................................................................................................................................................... 2
Table 1-2. EVM I/O Connections................................................................................................................................................. 2
Table 1-3. EVM Jumper and Shunt Installation............................................................................................................................2
Table 2-1. Precharge Current Measurement............................................................................................................................... 4
Table 2-2. Fast Charge Current Measurement............................................................................................................................ 4
Table 4-1. BQ25306 Bill of Materials......................................................................................................................................... 10
Trademarks
All trademarks are the property of their respective owners.
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BQ25306 (BMS005) Evaluation Module 1
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1 Introduction
The BQ25306EVM is an evaluation kit for the BQ25306 integrated battery charge management IC.
1.1 Features
For detailed features and operation, refer to Table 1-1 for a list of devices and their data sheets.
Table 1-1. Device Data Sheets
Device Data Sheet EVM Label Variant
BQ25306 SLUSDC7 BQ25306EVM BMS005-004
The BMS005 evaluation module (EVM) is a complete charger module for evaluating an integrated, standalone,
synchronous buck battery charger using any of the devices listed above.
1.2 I/O Descriptions
Table 1-2 lists the input and output connections available on this EVM and their respective descriptions.
Table 1-2. EVM I/O Connections
Jack Description
J1(1) –GND Ground
J1(2) –EXT_TS Connect to thermistor of external battery
J1(3) – BATTERY Positive rail of the charger battery input, connected to the positive
terminal of the external battery
J2(1) –GND Ground
J2(2) –VIN Positive rail of the charger input voltage
Table 1-3 lists the jumper and shunt installations available on this EVM and their respective descriptions.
Table 1-3. EVM Jumper and Shunt Installation
Jack Description BQ25306 Setting
SH-JP1 EN pull-up rail selection.
1-2 pulls EN up to external VDD (EN_CTRL either REGN or external voltage source depending on
JP3 configuration.)
2-3 pulls EN down to GND.
JP1 2-3 Installed
SH-JP2 POL pull-up rail selection.
1-2 POL pull down to GND.
Shunt Not Installed
SH-JP3 EN external VDD rail selection (EN_CTRL)
1-2 pulls EN_CTRL to external voltage supply connected to JP3-1
2-3 pulls EN_CTRL to REGN
Shunt Not Installed
SH-JP4 Set charge regulation voltage of BQ25306 to 4.2V Installed
SH-JP5 Set charge regulation voltage of BQ25306 to 8.4V Shunt Not Installed
SH-JP6 VSET Short to GND.
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP7 VSET Resistor pull down to GND of 10.2kΩ
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP8 VSET Resistor pull down to GND of 51.1kΩ
For charge regulation voltage corresponding to this setting, refer to datasheet of the respective
battery charger IC shown in Table 1-1.
Jumper Not Installed
SH-JP9 ICHG Resistor pull down to GND with 40.2kΩ to set charge current to 1A.
Populate both SH-JP9 and SH-JP10 to program 3A charge current.
Installed
SH-JP10 ICHG Resistor pull down to GND with 20kΩ to set charge current to 2A.
Populate both SH-JP9 and SH-JP10 to program 3A charge current.
Shunt Not Installed
For recommended operating conditions, refer to data sheet of the respective battery charger IC shown in Table
1-1.
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2 Test Setup and Results
2.1 Equipment
This section includes a list of supplies required to perform tests on this EVM.
1. Power Supply #1 (PS1): A power supply capable of supplying 5 V at 3 A is required. While this part can
handle larger voltage and current, it is not necessary for this procedure.
Power Supply #2 (PS2): A power supply capable of supplying 5 V at 1 A is required.
2. Loads: Load #1 (4-Quadrant Supply, Constant Voltage < 4.5 V): A "Kepco" Load, BOP, 20-5M, DC 0 to ±20
V, 0 to ±5 A (or higher)
Alternative Option: A 0–20V/0–5 A, > 30-W DC electronic load set in a constant voltage loading mode
3. Meters: (4x) "Fluke 75" multimeters, (equivalent or better).
4. No software is required to test this part.
2.2 Equipment Setup
1. Review EVM connections in Table 1-2.
2. Set PS1 for 5-V DC, 2-A current limit and then turn off the supply.
3. Set PS2 for 3-V DC, 2-A current limit and then turn off the supply.
4. Connect the output of PS1 to J2 (VBUS and PGND) as shown in Figure 2-1.
5. Connect a voltage meter across TP4 (VBUS) and TP9 (PGND), or across J2.
6. Turn on Load #1, set to constant voltage mode, and output to 2.5-V. Disable Load. Connect Load to J1-3
(BAT ) and J1-1 (PGND) as shown in Figure 2-1.
7. Connect one voltage meter across TP5 (BAT) and TP11 (PGND), or across J1-3 and J1-1 as shown in Figure
2-1.
8. Connect one voltage meter across TP2 (PMID) and TP10 (PGND)
9. Connect the output of PS2 to TP7 (TS) and TP12 (PGND) as shown in Figure 2-1
10.Install shunts as shown in Table 1-3.
Power Supply
#1
Load #1
GND
GND
V
V
+
-+
-
Power Supply
#2
GND
V
+
-
Figure 2-1. Original Test Setup for BMS005-004
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2.3 Test Procedure
2.3.1 Initial Settings
Use the following steps for enable the EVM test setup:
Make sure Section 2.1 steps have been followed. Turn on PS1
•Measure → VPMID (PMID-TP2 and PGND-TP10) = 5.00V ± 0.3V
• Completely disconnect PS1 from J2 if different voltage value is seen on PMID
Note
Completely disconnect Load #1 from BATTERY connections if different value is seen.
2.3.2 Precharge Mode Verification
Enable Load #1 and take measurements as follows
1. Measure → VBAT (BAT-TP5 and PGND-TP11) = 2.5V ± 0.1V
2. Observe → STAT LED (D2) on
3. Measure → IBAT for respective battery charger IC from Table 2-1
Table 2-1. Precharge Current Measurement
BQ25306EVM
IBAT 100mA ± 50mA
2.3.3 Fast Charge Mode Verification
1. Change Load #1 to 3.8V and take measurements as follows:
a. Measure → VBAT (BAT-TP5 and PGND-TP11) = 3.8V ± 0.1V
b. Observe → STAT LED (D2) on
c. Measure → IBAT for respective battery charger IC from Table 2-2
Table 2-2. Fast Charge Current Measurement
BQ25306EVM
IBAT 1000mA ± 100mA
2.3.4 Battery Temperature Monitoring Verification
1. Connect PS2 across TS-TP7 and PGND-TP12. Turn on PS2 and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 3V ± 0.1V
b. Observe → STAT LED (D2) on
c. Measure → IBAT for respective battery charger IC from Table 2-2
2. Change PS2 to 4V and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 4V ± 0.1V
b. Observe → STAT LED (D2) blinking at 1Hz to indicate a fault
c. Measure → IBAT = 0A ± 10mA
d. Battery charger is operating in COLD
i. For more information on TS threshold refer to Table 1-1
3. Change PS2 to 1V and take measurements as follows:
a. Measure → VTS (TS-TP7 and PGND-TP12) = 1V ± 0.1V
b. Observe → STAT LED (D2) blinking at 1Hz to indicate a fault
c. Measure → IBAT = 0A ± 10mA
d. Battery charger is operating in HOT
i. For more information on TS threshold refer to Table 1-1
2.3.5 Evaluation Results
This section contains efficiency data for BQ25306 at both 1-cell and 2-cell Li-ion battery configuration,
specifically on the BQ25306EVM.
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Charge Current (A)
Charge Efficiency (%)
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3
75
80
85
90
95
100
Char
VBUS = 5V
VBUS = 9V
VBUS = 12V
VBUS = 15V
Figure 2-2. BQ25306EVM 1-Cell Efficiency
Charge Current (A)
Charge Efficiency (%)
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3
80
85
90
95
100
Char
VBUS = 10V
VBUS = 12V
VBUS = 15V
Figure 2-3. BQ25306EVM 2-Cell Efficiency
2.3.6 Helpful Tips
1. BQ25306EVM is configured by default to operate with TS in normal range. If external thermistor is available,
connect external thermistor at J1(2)-EXT_TS and J1(1)-PGND, and remove R14.
2. The leads and cables to the various power supplies, batteries and loads have resistance. The current meters
also have series resistance. The charger dynamically reduces charge current depending on the voltage
sensed at its VBUS pin (using the VINDPM feature), BAT pin (as part of normal termination), and TS pin
(through its battery temperature monitoring feature via battery thermistor). Therefore, voltmeters must be
used to measure the voltage as close to the IC pins as possible instead of relying on the digital readouts of
the power supply.
3. When using a source meter that can source and sink current as your battery simulator, TI highly recommends
adding a large (1000+ μF) capacitor at the EVM BATTERY and GND connectors in order to prevent
oscillations at the BAT pin due to mismatched impedances of the charger output and source meter input
within their respective regulation loop bandwidths. Configuring the source meter for 4-wire sensing eliminates
the need for a separate voltmeter to measure the voltage at the BAT pin.
When using 4-wire sensing, always ensure that the sensing leads are connected in order to prevent
accidental overvoltage by the power leads.
3 PCB Layout Guideline
Minimize the switching node rise and fall times for minimum switching loss. Proper layout of the components
minimizing high-frequency current path loop is important to prevent electrical and magnetic field radiation and
high-frequency resonant problems. This PCB layout priority list must be followed in the order presented for
proper layout:
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1. Place the input capacitor as close as possible to the PMID pin and GND pin connections and use the shortest
copper trace connection or GND plane.
2. Place the inductor input terminal as close to the SW pin as possible. Minimize the copper area of this trace to
lower electrical and magnetic field radiation but make the trace wide enough to carry the charging current. Do
not use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any
other trace or plane.
3. Put an output capacitor near to the inductor and the IC. Tie ground connections to the IC ground with a short
copper trace connection or GND plane.
4. Place decoupling capacitors next to the IC pins and make the trace connection as short as possible.
5. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB ground.
Ensure that there are sufficient thermal vias directly under the IC connecting to the ground plane on the other
layers.
6. The via size and number should be enough for a given current path.
7. For more layout guidelines and recommendations refer to the datasheet of the respective battery charger IC
8. See the EVM design for the recommended component placement with trace and via locations. For the QFN
information, refer to Quad Flatpack No-Lead Logic Packages Application Report and QFN and SON PCB
Attachment Application Report.
4 Board Layout, Schematic, and Bill of Materials
4.1 Board Layout
The board layout is shown in Figure 4-1 to Figure 4-6.
Figure 4-1. Top Overlay
Figure 4-2. Top Solder
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Figure 4-3. Top Layer
Figure 4-4. Bottom Layer
Figure 4-5. Bottom Solder
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Figure 4-6. Bottom Overlay
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4.2 Schematic
The BQ25306 schematic is shown in Figure 4-7.
1
2
J2
VSET_FB
REGN
VSET_FB
Green
1
2
D2
LED
STAT
TS
VBUS
PMID
BAT STAT
BTST
TS
GND
BAT
ICHG
SW
0.047uF
C2
10uF
C5
10uF
C4
REGN
BAT
TP4
5010
TP5
5014
TP6
5012
TP7
5012
TP10
5011
TP12
5011
TP9
5019
TP11
5019
0
R2
GND
STAT
GND GND
GND
ICHG
2.2uF
C6
2.2uF
C7
2.2uF
C11
1
2
3
J1
ICHG
STAT
GND
SW
EXT_TS
GND
BAT
VSET_FB
0.01uF
C10
VBUS
PMID
VSET_FB
REGN VBUS
4.20VBAT
TP3
TP2
TP1
FB_GND
1
2
3
JP1
EN
EN
POL
POL
TP8
5012
FB_GND
VSET_FB
10µF
C8
10µF
C9
EN_CTRL
VBUS
1
STAT
3
ICHG
4
FB
9
POL 5
BAT 10
TS 7
FB_GND 8
EN
6
SW 14
GND 11
GND 12
SW 13
BTST 15
REGN
2
PMID
16
PAD 17
BQ25306RTER
U1
0.1uF
C3
GND
GND
GND
GND
GND
REGN
TS
1
2
3
JP3
EN_CTRL
REGN
GND
1
2
JP4
1
2
JP5
1
2
JP9
EXT_TS
1
2
JP7
1
2
JP8
1
2
JP6
1
2
JP10
0
R8
1
2
JP2
40.2k
R10
20.0k
R11
10.2k
R3
51.1k
R4
30.9k
R13
10.2k
R14
5.23k
R7
2.20k
R9
1.33M
R6
200k
R12
562k
R5
BAT
1.00
R1
510pF
C1
30V
D1
GND
L1
470pF
C12
Figure 4-7. BQ25306 Schematic
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4.3 Bill of Materials
The BQ25306 BOM is listed in Table 4-1.
Table 4-1. BQ25306 Bill of Materials
Designator Quantity Value Description Package
Reference Part Number Manufacturer Alternate Part Number(1)
Alternate
Manufacturer(1)
!PCB1 1 Printed Circuit Board BMS005 Any
C2 1 0.047µF CAP, CERM, 0.047 µF, 25 V, ±10%,
X7R, 0402 0402 GRM155R71E473K A88D MuRata
C5 1 10µF CAP, CERM, 10 µF, 16 V, ±20%,
X7R, 0805 0805 EMK212BB7106M G-T Taiyo Yuden
C6 1 2.2µF CAP, CERM, 2.2 µF, 35 V, ±10%,
X5R, 0603 0603 GRM188R6YA225K A12D MuRata
C8 1 10µF CAP, CERM, 10 µF, 25 V, ±10%,
X5R, 0805 0805 CC0805KKX5R8BB 106 Yageo
C11 1 2.2µF CAP, CERM, 2.2 µF, 16 V, ±10%,
X5R, 0402 0402 GRM155R61C225K E11D MuRata
C12 1 470pF CAP, CERM, 470 pF, 50 V, ±10%,
X7R, AEC-Q200 Grade 1, 0402 0402 GCM155R71H471K A37D MuRata
D2 1 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.25 X
0.075, Clear 75x250 mil SJ5382 3M
J1 1 Terminal Block Receptacle, 3x1,
3.81mm, R/A, TH Term Block, 3 pos 1727023 Phoenix Contact
J2 1 Conn Term Block, 2POS, 3.81mm,
TH
2POS Terminal
Block 1727010 Phoenix Contact
JP1, JP3 2 Header, 100mil, 3x1, Tin, TH Header, 3 PIN,
100mil, Tin PEC03SAAN Sullins Connector Solutions
JP2, JP4, JP5,
JP9, JP10 5 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector Solutions
L1 1 2.2uH SMD power inductor, 2.2uH, 35mΩ
DCR SMT_4MM_4MM MAPM0420LA2R2 M-LF Microgate
LBL1 1
Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per
roll
PCB Label 0.650 x
0.200 inch THT-14-423-10 Brady
R2 1 0 RES, 0, 5%, 0.063 W, 0402 0402 RC0402JR-070RL Yageo America
R5 1 562k RES, 562 k, 1%, 0.063 W, AEC-
Q200 Grade 0, 0402 0402 CRCW0402562KF KED Vishay-Dale
R6 1 1.33M RES, 1.33 M, 1%, 0.063 W, AEC-
Q200 Grade 0, 0402 0402 CRCW04021M33F KED Vishay-Dale
R7 1 5.23k RES, 5.23 k, 1%, 0.063 W, AEC-
Q200 Grade 0, 0402 0402 CRCW04025K23F KED Vishay-Dale
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