Texas Instruments DS560MB410EVM User manual

EVM User's Guide: DS560MB410
DS560MB410EVM
ABSTRACT
The DS560MB410 is a 4-channel linear redriver with the ability to extend the reach and robustness of high-
speed serial links for up to 56 Gbps PAM4 interfaces. The DS560MB410EVM evaluation board (hereafter
referred to as DS560MB410EVM) provides users with the ability to evaluate the performance and features of the
DS560MB410 device.
Figure 1-1. DS560MB410EVM
Table of Contents
1 Features...................................................................................................................................................................................3
2 Applications............................................................................................................................................................................ 3
3 Ordering Information..............................................................................................................................................................3
4 Setup........................................................................................................................................................................................3
4.1 Modes of Programmable Communication..........................................................................................................................3
4.2 Configuration Overview......................................................................................................................................................3
5 SigCon Architect.....................................................................................................................................................................4
5.1 Installation.......................................................................................................................................................................... 4
5.2 Configuration......................................................................................................................................................................6
5.3 High Level Page.................................................................................................................................................................9
5.4 Low Level Page................................................................................................................................................................13
5.5 EEPROM Page................................................................................................................................................................ 13
5.6 Eye Height Page.............................................................................................................................................................. 14
6 Common Problems and Suggested Solutions...................................................................................................................16
7 Bill of Materials..................................................................................................................................................................... 17
8 EVM Cable Assemblies........................................................................................................................................................ 22
9 Revision History................................................................................................................................................................... 23
List of Figures
Figure 1-1. DS560MB410EVM.................................................................................................................................................... 1
Figure 5-1. DS560MB410 Profile Installer................................................................................................................................... 5
Figure 5-2. DS560MB410 Profile License Agreement.................................................................................................................5
Figure 5-3. DS560MB410 Profile Installation Complete.............................................................................................................. 6
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Figure 5-4. DS560MB410 Profile Prior to Establishing Communication......................................................................................7
Figure 5-5. Establishing a Connection with the DS560MB410.................................................................................................... 8
Figure 5-6. Enabling Demo Mode................................................................................................................................................9
Figure 5-7. Device Status Tab................................................................................................................................................... 10
Figure 5-8. Block Diagram Tab...................................................................................................................................................11
Figure 5-9. Crosspoint Switch Tab.............................................................................................................................................12
Figure 5-10. Low Level Page.....................................................................................................................................................13
Figure 5-11. EEPROM Page......................................................................................................................................................14
Figure 5-12. Eye Height Page................................................................................................................................................... 15
Figure 8-1. Huber+Suhner 1x8 MXP Cable Assemblies............................................................................................................22
List of Tables
Table 3-1. DS560MB410 Ordering Information............................................................................................................................3
Table 4-1. Description of SMBus and EEPROM Connections.....................................................................................................3
Table 4-2. Test Point Connections (Output Voltage).................................................................................................................... 4
Table 5-1. Device Status Settings and Buttons..........................................................................................................................10
Table 5-2. Block Diagram Settings and Buttons.........................................................................................................................11
Table 5-3. Crosspoint Switch Settings and Buttons................................................................................................................... 12
Table 5-4. Eye Height Page Settings and Buttons.....................................................................................................................15
Trademarks
All trademarks are the property of their respective owners.
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1 Features
• 4-channel unidirectional redriver operating at rates up to 32 Gbps NRZ and 56 Gbps PAM4
• 3 channels are available through an H+S 1×8 MXP Cable and 1 channel is available through a 2.92 mm SMA
• Linear equalization supports link training protocols
• Programmed by on-board USB-to-I2C circuit (USB2ANY)
• Single supply operation: 2.5 V ± 5% supplied directly to IC
– 3.3 V ± 5% supplied to 3.3 V-to-2.5 V on-board LDO
2 Applications
• Backplane or Mid-plane reach extension (200G-KR4)
• SFP28, QSFP28, CFP2/CFP4, and CDFP
3 Ordering Information
Table 3-1. DS560MB410 Ordering Information
EVM ID DEVICE ID DEVICE PACKAGE
DS560MB410EVM DS560MB410 nfBGA (101)
Note
Huber+Suhner MXP cable assembles are not provided with this EVM. Users are expected to provide
cabling to connect to other boards and test equipment. For MXP cabling recommendations, refer to
Section 8.
4 Setup
This section describes the jumpers and connectors on the EVM as well as how to connect, set up, and use the
DS560MB410EVM.
4.1 Modes of Programmable Communication
The DS560MB410EVM can be programmed in one of two modes, which are as follows:
1. SMBus target mode – provides full access to the DS560MB410 status and control settings through the
on-board USB2ANY. ADDR0 (J6) and ADDR1 (J11) headers are used to set the SMBus target address.
2. Controller mode – provides access to the DS560MB410’s EEPROM-programmable control settings through
an 8-pin EEPROM. A subset of SMBus register bits are writeable through the EEPROM. The EEPROM can
program up to 16 DS560MB410 devices.
For convenient use, a USB-to-mini USB cable provides a direct connection through the J27.
4.2 Configuration Overview
The following tables provide a description of the connectors on the DS560MB410EVM.
Table 4-1. Description of SMBus and EEPROM Connections
COMPONENT(S) NETS INCLUDED DESCRIPTION
J4 RXN2, RXP2, RXN1, RXP1, RXN0, RXP0 MXP high-speed differential input pairs
J5 TXP0, TXN0, TXP1, TXN1, TXP2, TXN2 MXP high-speed differential output pairs
J28, J30 RX3P, RX3N Channel 3 high-speed differential inputs SMAs
J29, J31 TX3P, TX3N Channel 3 high-speed differential outputs SMAs
J18 SDA, SCL, GND I2C/SMBus data, clock, and GND pins
J13 ADDR0 4-level strap pins used to set the SMBus address
J16 ADDR1
J19 EN_SMB 4-level input to select between SMBus
controller (float) or target mode (high)
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Table 4-1. Description of SMBus and EEPROM Connections (continued)
COMPONENT(S) NETS INCLUDED DESCRIPTION
J12 READ_EN_N Assert low to initiate EEPROM read in
SMBus controller mode (weak pull-up)
XU1 EEPROM 8-pin DIP Socket for EEPROM
J2 CAL_CLK_IN External 25 MHz Calibration Clock Input (for pin-
compatible Retimer only)
J1 CAL_CLK_OUT 25 MHz Calibration Clock Output (for pin compatible
Retimer only)
J9 VDD_3P3V 3.3 V for DC Power
J11 VDD_2P5V 2.5 V for DC Power
J7 GND Ground for DC Power
J22 USB Mini USB connection for EVM software control
Table 4-2. Test Point Connections (Output Voltage)
Component Name Description
TP1 GND Common Ground
TP2 VDD +2.5 V Input
TP5 GND Ground
TP3 VDD +3.3 V Input
5 SigCon Architect
The SigCon Architect software allows for simple configuration of the DS560MB410.
5.1 Installation
Prerequisites:
• SigCon Architect 3.0
1. Use your web browser to download the DS560MB410 SigCon Architect profile installer from the product
page on TI.com.
2. Once the installer has downloaded, extract the installer from the .zip file and run the executable file.
3. When the executable runs, a setup wizard will appear as shown in Figure 5-1. It is recommended to close
any running programs prior to proceeding.
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Figure 5-1. DS560MB410 Profile Installer
4. Read through the licensing agreement, and accept the terms of the agreement by selecting I Agree.
Figure 5-2. DS560MB410 Profile License Agreement
5. When complete, the user will be presented with an Installation completed window, shown in Figure 5-3.
Press Finish to continue. If Run SigCon Architect EVM GUI v3 is selected, then SigCon Architect 3.0 will
open.
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Figure 5-3. DS560MB410 Profile Installation Complete
5.2 Configuration
The Configuration Page is used for establishing communication with the DS560MB410. Figure 5-4 shows how
prior to establishing a connection with the DS560MB410, the other profile pages will be unselectable, indicated
by their gray color.
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Figure 5-4. DS560MB410 Profile Prior to Establishing Communication
5.2.1 Establishing a Connection
1. Connect the computer to the DS560MB410 through a USB2ANY device and USB cable. If using a
DS560MB410EVM, then this is accomplished by connecting the included USB cable to the EVM and
computer. If using a stand alone USB2ANY device, then a connection can be made between the I2C pins on
the USB2ANY and the SMBus pins on the DS560MB410. A common ground connection is also required.
2. Ensure the DS560MB410 is in SMBus Target mode.
3. Select appropriate SMBus address by using the Target Address menu.
4. Select appropriate USB2ANY by using the USB2ANY Details menu.
5. Click Apply to connect to the device. The status indicator at the bottom of SigCon Architect will turn green to
indicate a successful connection.
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Figure 5-5. Establishing a Connection with the DS560MB410
5.2.2 Enabling Demo Mode
Demo mode can be used to test out device behavior of the DS560MB410 profile without connecting a
DS560MB410.
1. Select the checkbox by Demo Mode in the top right corner of SigCon Architect.
2. Click the Apply button to enter Demo Mode.
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Figure 5-6. Enabling Demo Mode
5.3 High Level Page
The High Level Page is used to view channel status and configure commonly used channel settings. The
majority of device settings used in a typical use case can be configured through the High Level Page. Additional
device settings can be accessed through the Low Level Page.
5.3.1 Device Status
The Device Status tab shows a high level overview of the status of each channel in the DS560MB410. Although
a summary of channel settings can be viewed from this this tab, they cannot be changed from this tab. Channel
settings that are displayed in this tab can be changed from the Block Diagram tab.
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Figure 5-7. Device Status Tab
Table 5-1. Device Status Settings and Buttons
Seting or Button Name Behavior
Update Time Sets the time interval at which the device status is updated. This is only in use while
Continuous Status Update is checked.
Channel Select This setting is persistent when switching between the Device Status, Block Diagram, and
Crosspoint Switch tabs. This selection is only used in the Block Diagram tab.
Refresh From Device Reads register data from the device. This data will then be updated in the DS560MB410
Profile pages.
Reset Device Resets all device registers to their default values.
Load From File Opens a window allowing the user to select a file with register data. Once the appropriate file
is selected, register data from the file will be written to device registers.
Save To File Opens a window enabling the user to save device register data to their computer. This file
contains data for all of the device registers.
Continuous Status Update When checked, the registers from the device will be polled at the rate set by the Update
Time setting.
5.3.2 Block Diagram
The Block Diagram tab allows for configuration of channel registers that are pertinent to most use cases. Each
parameter can easily be adjusted by selecting the appropriate value from the drop down menus
It is important to select the appropriate channel through the Channel Select drop down menu in the top left prior
to adjusting the channel settings. Unapplied changes will not be saved when the channel is changed. To apply
changes, click Apply to Channel. To apply changes to all channels, click Apply to All Channels.
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Figure 5-8. Block Diagram Tab
Table 5-2. Block Diagram Settings and Buttons
Seting or Button Name Behavior
Update Time Sets the time interval at which the device status is updated.
Channel Select This setting is persistent when switching between the Device Status, Block Diagram, and
Crosspoint Switch tabs.
This setting is used to select which channel will be written to when Apply to Channel is
clicked.
Refresh From Device Reads register data from the device. This data will then be updated in the DS560MB410
Profile pages.
Reset Device Resets all device registers to their default values.
Load From File Opens a window allowing the user to select a file with register data. Once the appropriate file
is selected, register data from the file will be written to device registers.
Save To File Opens a window enabling the user to save device register data to their computer. This file
contains data for all of the device registers.
Apply to Channel Applies channel settings to the channel selected by the Channel Select setting.
Apply to All Channels Applies channel settings to all device channels.
Power Down Channel Powers down channel that is currently selected by the Channel Select” setting. Corresponds
to channel register 0x04[6] and 0x04[3].
Power Down All Channels Powers down all channels. Corresponds to channel register 0x04[6] and 0x04[3].
Power Up Channel Powers up channel that is currently selected by the Channel Select” setting. Corresponds to
channel register 0x04[6] and 0x04[3].
Power Up All Channels Powers up all channels. Corresponds to channel register 0x04[6] and 0x04[3].
Driver VOD Sets the differential output voltage (VOD) for the selected channel. Select from 0-3.
Corresponds to channel register 0x06[7:6].
EQ Boost Code Enables compensation for insertion loss. Select from 0-30. Corresponds to channel register
0x10[5:0].
EQ Mode Enables selection of different equalization profiles depending on device use case. Select
either PCB EQ or Cable EQ. Corresponds to channel register 0x04[0].
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Table 5-2. Block Diagram Settings and Buttons (continued)
Seting or Button Name Behavior
Eye Expander Adjusts linearity of equalization to better tune for PAM4. Select from 0-3. Corresponds to
channel register 0x30[6:5].
DC Gain Add Adds drive current for tuning PAM4 linearity. Select from 0-1. Corresponds to channel
register 0x0B[6].
DC Gain Sub Subtracts drive current for tuning PAM4 linearity. Select from 0-1. Corresponds to channel
register 0x0B[5].
5.3.3 Crosspoint Switch
The Crosspoint Switch tab enables configuration of the device crosspoint. The crosspoint allows for channel
pairs to be switched between Through, Lane Crossing, and Fanout modes. To make changes in the crosspoint
page, Override MUXSEL[1:0] Pin Control must be selected. Once overridden, changes made to the crosspoint
configuration are automatically applied to the device, without the use of the Apply to Channel button.
Figure 5-9. Crosspoint Switch Tab
Table 5-3. Crosspoint Switch Settings and Buttons
Seting or Button Name Behavior
Update Time Sets the time interval at which the device status is updated.
Channel Select This setting is persistent when switching between the Device Status, Block Diagram, and
Crosspoint Switch tabs.
This setting is used to select which channel will be written to when Apply to Channel is
clicked.
Refresh From Device Reads register data from the device. This data will then be updated in the DS560MB410
Profile pages.
Reset Device Resets all device registers to their default values.
Load From File Opens a window allowing the user to select a file with register data. Once the appropriate file
is selected, register data from the file will be written to device registers.
Save To File Opens a window enabling the user to save device register data to their computer. This file
contains data for all of the device registers.
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Table 5-3. Crosspoint Switch Settings and Buttons (continued)
Seting or Button Name Behavior
Override MUXSEL[1:0] Pin Control Enables register control of the device crosspoint. This must be selected to make changes to
the crosspoint configuration.
Pair Select Selects the pair of channels that the Crosspoint Mode is applied to. Pair 0 corresponds to
channels 0-1. Pair 1 corresponds to channels 2-3.
Crosspoint Mode Selects the crosspoint configuration for the selected channels. User can select between
Through, Lane Crossing, and Fanout modes. When the Fanout mode is selected, it is
necessary to select which channel is being broadcasted.
Broadcast Channel Selects which channel is broadcasted while a crosspoint is in Fanout mode. After a selection
is made, it is necessary to click the Broadcast button for changes to apply.
5.4 Low Level Page
The Low Level Page allows for direct access to the device registers. Different groups of registers can easily be
jumped to by selecting a group from the Block Select menu.
Figure 5-10. Low Level Page
Selecting a register will allow the user to read and write data to the register. This can be done by entering
hexadecimal register data into the Data input box. Register data can also be changed by selecting different
configurations under Register Data. After changing register data, it is important to write the data back to the
register. This needs to be done prior to selecting another register, otherwise the change will not be persistent.
For alterations to the channel registers, it is possible to broadcast a change to all channels by first making
changes to the register data and then using the Broadcast button. This will write the register data to the
corresponding register of each channel.
5.5 EEPROM Page
The EEPROM Page allows for generation and modification of an EEPROM hex file. This file can be loaded onto
an EEPROM device and used with the DS560MB410 while the redriver is in Controller mode.
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To generate an EEPROM configuration, first configure the DS560MB410 redriver using the High Level Page
and Low Level Page. Then press Update Slot from Device. This will update the selected EEPROM slot with the
device configuration. Multiple redrivers can have independent configurations in a single EEPROM hex file. Each
independent configuration is represented by the Slot #. After updating the slot from the device, the EEPROM hex
file can be saved by pressing the Write to EEPROM Hex button.
A hex file can be loaded and modified using the EEPROM Page as well. This can be done by loading the hex file
using the Load from Hex File button. Then, press Update Device from Slot to update the redriver settings from
the selected EEPROM hex file. After doing this, modifications can be made using the High Level Page and Low
Level Page. After making modifications, press Update Slot from Device to update the selected EEPROM slot
with the modified device configuration. The EEPROM hex file can then be saved using the Write to EEPROM
Hex button.
Figure 5-11. EEPROM Page
5.6 Eye Height Page
The DS560MB410 eye height monitor is an on-chip tool to help determine the ideal CTLE boost index range
for NRZ and PAM4 signals. This eye height monitor provides information about the eye height across a range
of EQ Boost Codes. For each EQ Boost Code, an internal DAC is swept through 64 steps. At each step, the
number of times the signal crosses the DAC voltage in a given time interval is recorded. This is recorded in
channel registers 0x22-0x25. The eye openings, shown in white, the on Eye Height Page correspond to DAC
voltages where the number of crossings did not change much between consecutive DAC values. From this data,
an optimum EQ Boost Code is recommended.
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Figure 5-12. Eye Height Page
Table 5-4. Eye Height Page Settings and Buttons
Setting or Button Name Behavior
Channel Select Selects channel that eye height sweep is performed on.
Signal Type Selects either PAM4 and NRZ, adjusts the algorithm used to recommend an optimum EQ
Boost Code based on selection.
EQ Boost Code Selects the range of EQ Boost Codes that are swept. Reducing the range will decrease the
eye height sweep time.
Apply to All Channels If “Set EQ Boost Code …” option is selected, after a sweep is complete, clicking this button
will set EQ Boost Code of all channels to the optimum value based on sweep data.
Apply to Channel No action in Eye Height Page.
Refresh From Device Reads register data from the device. This data will then be updated in the DS560MB410
Profile pages.
Reset Device Resets all device registers to their default values.
Load From File Opens a window allowing the user to select a file with register data. Once the appropriate file
is selected, register data from the file will be written to device registers.
Save To File Opens a window enabling the user to save device register data to their computer. This file
contains data for all of the device registers.
DAC Step Size (mV) Selects the step size of the internal DAC. Effectively sets the vertical eye measurement limit.
Sweep Parameter Starts sweep of DAC values and EQ Boost Codes to collect eye height data.
Stop Sweep Stops sweep.
Set EQ Boost Code to suggested Optimal
Value
If selected, then after a sweep completes, the optimal EQ Boost Code will be written to the
currently selected channel.
Recompute VEO Recomputes VEO based on data and Signal Type.
Export Processed Data Exports processed data to excel.
Export Raw Hit Data Exports raw hit data to excel.
Clear Plot Clears plot.
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6 Common Problems and Suggested Solutions
PROBLEM ADDITIONAL INFORMATION POSSIBLE SOLUTIONS
Cannot power on the EVM
2.5 Volt Power mode
D2 LED is off
• J8: jumper pins 1-2 tied.
• J10: jumper pins should be set to float.
• Verify configuration with GUI.
3.3 Volt Power mode
D1 LED is off
• J8: remove jumper shunt; this shunt needs to be removed to
enable 2.5 V regulator.
• J10: jumper pins 9-10, 7-8, 5-6, 3-4, and 1-2 tied to connect
the regulator output to the DS560MB410 VDD supply.
Cannot connect to the
device in SMBus Target
Mode
SigCon Architect is operating in Demo Mode
• Verify the jumper settings are correct.
• Verify the target address is set to 0x30 for SMBus target
mode.
• Verify the device is powered on.
• Update Firmware on EVM using USB2ANY Explorer.
Never used SigCon Architect, and cannot
establish connection with device
• Reinstall SigCon Architect. It is essential SigCon Architect is
closed during any portion of the installation process.
Oscilloscope’s Eye
Diagram is not as
expected
Pattern does not lock on oscilloscope
• Transmit a signal from the pattern generator (for example,
BERT) with a different PRBS pattern. Once initial pattern
lock is established, re-attempt desired pattern.
• Transmit a signal from the pattern generator (for example,
BERT) with a lower frequency. Once initial pattern lock is
established, re-attempt desired frequency.
Eye diagram does not pass mask • Vary EQ Boost Settings.
Cannot burn EEPROM
Hex File to EEPROM with
SigCon Architect
• SigCon Architect can only be used to generate the Hex File.
Another interface adapter must be used to burn the Hex File
to the EEPROM. (for example, AARDVARK or equivalent ).
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7 Bill of Materials
The following table represents the bill of materials (BOM) for the DS560MB410EVM.
# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
1 16 C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12,
C13, C14, C15, C16
0.22 µF GRM033R60J224ME9
0
CAP, CERM, 0.22 µF, 6.3 V, ±
20%, X5R, 0201
2 1 C17 0.1 µF GCM155R71C104KA5
5D
CAP, CERM, 0.1 µF, 16 V, ±
10%, X7R, 0402
3 1 C24 1 µF CL03A105MP3NSNC CAP CER 1 µF 10 V 20%
X5R 0201
4 6 C25, C26, C27, C29, C30, C31 0.1 µF GRM033R6YA104KE1
4D
CAP CER 0.1 µF 35 V 10%
X5R 0201
5 1 C28 10 µF CL05A106MP5NUNC CAP, CERM, 10 µF, 10 V, ±
20%, X5R, 0402
6 1 C32 1 µF C1608X7R1E105K080
AB
CAP, CERM, 1 µF, 25 V, ±
10%, X7R, 0603
7 1 C33 47 µF GRM32ER71A476KE1
5L
CAP, CERM, 47 µF, 10 V, ±
10%, X7R, 1210
8 1 C34 22 µF T495C226K010ATE30
0
CAP, TA, 22 µF, 10 V, ± 10%,
0.3 Ω, SMD
9 1 C35 10 µF GRM21BR61E106KA7
3L
CAP, CERM, 10 µF, 25 V, ±
10%, X5R, 0805_140
10 2 C36, C38 1 µF GRM188R61E105KA1
2D
CAP, CERM, 1 µF, 25 V, ±
10%, X5R, 0603
11 1 C37 10 µF GRM21BR71A106KE5
1L
CAP, CERM, 10 µF, 10 V, ±
10%, X7R, 0805
12 1 C39 0.1 µF C1005X7R1H104K050
BB
CAP, CERM, 0.1 µF, 50 V, ±
10%, X7R, 0402
13 4 C40, C47, C52, C53 0.1 µF 0603YC104JAT2A CAP, CERM, 0.1 µF, 16 V,
±5%, X7R, 0603
14 1 C41 2.2 µF 0805YD225KAT2A CAP, CERM, 2.2 µF, 16 V,
±10%, X5R, 0805
15 1 C42 0.01 µF C1608X7R1H103K080
AA
CAP, CERM, 0.01 µF, 50 V,
±10%, X7R, 0603
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# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
16 1 C43 22 µF EEE-1AA220WR CAP ALUM 22 µF 10 V 20%
SMD
17 2 C44, C46 220 pF 06035A221FAT2A CAP, CERM, 220 pF, 50 V,
±1%, C0G/NP0, 0603
18 1 C45 1 µF C2012X7R1C105K125
AA
CAP CER 1 µF 16 V 10%
X7R 0805
19 2 C48, C49 30 pF GRM1885C2A300JA01
D
CAP, CERM, 30 pF, 100 V,
±5%, C0G/NP0, 0603
20 1 C50 0.47 µF GRM188R71A474KA6
1D
CAP, CERM, 0.47 µF, 10 V,
±10%, X7R, 0603
21 1 C51 2200 pF C0603X222K5RACTU CAP, CERM, 2200 pF, 50 V,
±10%, X7R, 0603
22 2 D1, D2 Red LS L29K-G1J2-1-Z LED, Red, SMD
23 4 D3, D4, D5, D6 Green APHD1608LCGCK LED, Green, SMD
24 1 D8 7.5 V 1SMB5922BT3G Diode, Zener, 7.5 V, 550 mW,
SMB
25 1 D9 Green SSF-LXH305GD-TR LED, Green, SMD
26 1 FB1 60 Ω BK1608HS600-T Ferrite Bead, 60 Ω at 100
MHz, 0.8 A, 0603
27 2 J1, J2 142-0701-201 142-0701-201 Connector, TH, SMA
28 4 J28, J29, J30, J31 0732520091 0732520091 CONN 2.92MM JACK STR
50 Ω SMD
29 1 J3 TSW-103-07-G-D 61300621121 Header, 100mil, 3x2, Gold,
TH
30 2 J4, J5 1X8A_81_MXP-S50-0-2/111_NE 1X8A_81_MXP-
S50-0-2/111_NE
Straight PCB plug Pin-in-
hole/SMT
31 1 J6 TSW-102-07-G-D 61300421121 Header, 100mil, 2x2, Gold,
TH
32 1 J7 7007 7007 Binding Post, BLACK, TH
33 1 J8 5-146278-2 5-146278-2 Header, 100mil, 2x1, Tin, TH
34 2 J9, J11 7006 7006 Binding Post, RED, TH
35 1 J10 61301021121 61301021121 Header, 2.54 mm, 5x2, Gold,
TH
Bill of Materials www.ti.com
18 DS560MB410EVM SNLU296A – DECEMBER 2022 – REVISED DECEMBER 2022
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# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
36 4 J12, J13, J16, J19 87227-6 87227-6 Header, 100mil, 6x2, Gold,
TH
37 1 J14 61300311121 61300311121 Header, 2.54 mm, 3x1, Gold,
TH
38 2 J15, J24 PEC02DAAN PEC02DAAN Header, 100mil, 2x2, Tin, TH
39 1 J17 TSW-110-07-G-D 61302021121 Header, 100mil, 10x2, Gold,
TH
40 1 J18 61300411121 61300411121 Header, 2.54 mm, 4x1, Gold,
TH
41 1 J20 5103308-1 5103308-1 Header (shrouded), 100mil,
5x2, Gold, TH
42 1 J21 TSW-104-07-G-D 61300821121 Header, 100mil, 4x2, Gold,
TH
43 1 J22 1734035-2 1734035-2 CONN MINI USB RCPT RA
TYPE B SMD
44 3 J23, J25, J26 61300211121 61300211121 Header, 2.54 mm, 2x1, Gold,
TH
45 1 J27 TSW-102-07-G-S 61300211121 Header, 100mil, 2x1, Gold,
TH
46 1 Q1 50 V BSS138 MOSFET, N-CH, 50 V, 0.22
A, SOT-23
47 2 R1, R2 10.0k CRCW040210K0FKED RES, 10.0 k, 1%, 0.063 W,
0402
48 1 R3 750 RNCP0603FTD750R RES, 750, 1%, 0.1 W, 0603
49 1 R4 360 RC0603JR-07360RL RES, 360, 5%, 0.1 W, 0603
50 10 R5, R25, R29, R33, R36, R38, R39, R40, R50, R64 4.7k CRCW04024K70JNED RES, 4.7 k, 5%, 0.063 W,
0402
51 2 R6, R8 100 CRCW0402100RFKED RES, 100, 1%, 0.063 W, 0402
52 14 R7, R51, R52, R53, R54, R55, R56, R57, R58, R59,
R60, R61, R62, R63
0 RC0402JR-070RL RES, 0, 5%, 0.063 W, 0402
53 5 R9, R11, R21, R27, R44 249 CRCW0402249RFKED RES, 249, 1%, 0.063 W, 0402
54 8 R10, R16, R20, R22, R28, R31, R32, R35 1.0k CRCW04021K00JNED RES, 1.0 k, 5%, 0.063 W,
0402
www.ti.com Bill of Materials
SNLU296A – DECEMBER 2022 – REVISED DECEMBER 2022
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DS560MB410EVM 19
Copyright © 2022 Texas Instruments Incorporated

# QUANTITY REFERENCE VALUE PART NUMBER DESCRIPTION
55 3 R12, R13, R14 2.7k CRCW04022K70JNED RES, 2.7 k, 5%, 0.063 W,
0402
56 1 R15 10k CRCW040210K0JNED RES, 10 k, 5%, 0.063 W,
0402
57 5 R17, R18, R19, R24, R26 2.7k CRCW04022K70JNED RES, 2.7 k, 5%, 0.063 W,
0402
58 3 R23, R30, R34 20k CRCW040220K0JNED RES, 20 k, 5%, 0.063 W,
0402
59 1 R37 10.0k CRCW060310K0FKEA RES, 10.0 k, 1%, 0.1 W, 0603
60 2 R41, R42 33 CRCW040233R0JNED RES, 33 Ω, 5%, 0.063W,
0402
61 1 R43 1.5k CRCW04021K50JNED RES, 1.5 kΩ, 5%, 0.063W,
0402
62 1 R45 10k CRCW060310K0JNEA RES, 10 k, 5%, 0.1 W, 0603
63 2 R46, R49 33k CRCW040233K0JNED RES, 33 kΩ, 5%, 0.063W,
0402
64 1 R47 1.2Meg CRCW06031M20JNEA RES, 1.2Meg Ω, 5%, 0.1W,
0603
65 1 R48 200 CRCW0603200RFKEA RES, 200 Ω, 1%, 0.1W, 0603
66 1 S1 KSR221GLFS KSR221GLFS Switch, SMD
67 2 TP1, TP5 Black 5001 TEST POINT PC MINI .040"D
BLACK
68 3 TP2, TP3, TP6 Red 5000 TEST POINT PC MINI .040"D
RED
69 1 TP4 White 5002 TEST POINT PC MINI .040"D
WHITE
70 1 U1 TPS73533DRBR TPS73533DRBR C REG LDO 3.3 V 0.5 A
8SON
71 1 U2 TPS75725KTTRG3 TPS75725KTTRG3 IC REG LDO 2.5 V 3 A
DDPAK
72 1 U3 TXS0108EPW TXS0108EPW IC 8-BIT VOLTAGE-LEVEL
TRANSLATOR
Bill of Materials www.ti.com
20 DS560MB410EVM SNLU296A – DECEMBER 2022 – REVISED DECEMBER 2022
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Copyright © 2022 Texas Instruments Incorporated