
User’s Guide
TPS62869EVM-118 Evaluation Module
ABSTRACT
This user's guide describes the characteristics, operation, and use of TI's evaluation module (EVM) for the
TPS628691, TPS628692, TPS628681, TPS628682 devices. The TPS62869EVM-118 (BSR118) facilitates the
evaluation of the TPS62869 family of 6-A, step-down converter with DCS-Control™in a small 1.5-mm by 2.5-mm
QFN package solution. The EVM creates output voltages between 0.4V and 1.675V with 1% accuracy output
voltages from higher input voltages between 2.4 V and 5.5 V, to a regulated 0.9V output voltage. The TPS62869
family is a highly efficient and tiny solution for point-of-load (POL) converters for space-constrained applications,
such as artificial intelligence chips, camera modules, solid state drives (SSDs), and optical modules.
Table of Contents
1 Introduction.............................................................................................................................................................................2
1.1 Performance Specification................................................................................................................................................. 2
1.2 Modifications...................................................................................................................................................................... 2
2 Setup........................................................................................................................................................................................2
2.1 Input/Output Connector Descriptions................................................................................................................................. 2
2.2 Hardware Setup................................................................................................................................................................. 2
3 TPS62869EVM-118 Test Results............................................................................................................................................3
4 Board Layout...........................................................................................................................................................................3
5 Schematic and List of Materials............................................................................................................................................ 6
5.1 Schematic.......................................................................................................................................................................... 6
5.2 List of Materials.................................................................................................................................................................. 6
6 Software User Interface..........................................................................................................................................................7
6.1 Software Setup...................................................................................................................................................................7
6.2 Interface Hardware Setup.................................................................................................................................................. 7
6.3 User Interface Operation....................................................................................................................................................7
7 Revision History......................................................................................................................................................................9
List of Figures
Figure 4-1. Top Assembly............................................................................................................................................................ 3
Figure 4-2. Top Layer...................................................................................................................................................................3
Figure 4-3. Signal Layer 1........................................................................................................................................................... 4
Figure 4-4. Signal Layer 2........................................................................................................................................................... 4
Figure 4-5. Signal Layer 3........................................................................................................................................................... 4
Figure 4-6. Signal Layer 4........................................................................................................................................................... 5
Figure 4-7. Bottom Layer............................................................................................................................................................. 5
Figure 5-1. TPS62869EVM-118 Schematic.................................................................................................................................6
Figure 6-1. Quick Connection Overview ..................................................................................................................................... 7
Figure 6-2. GUI Home Screen..................................................................................................................................................... 8
Figure 6-3. GUI Settings Screen..................................................................................................................................................9
List of Tables
Table 1-1. Performance Specification Summary..........................................................................................................................2
Table 5-1. TPS628691ARQY List of Materials.............................................................................................................................6
www.ti.com Table of Contents
SLUUC88B – MARCH 2021 – REVISED NOVEMBER 2021
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