Tq Tqmlx2160a User manual

TQMLX2160A

User’s Manual

TQMLX2160A UM 0100

28.02.2022

TABLE OF CONTENTS

1. ABOUT THIS MANUAL................................................................................................................................................................................1

1.1 Copyright and license expenses.............................................................................................................................................................1

1.2 Registered trademarks...............................................................................................................................................................................1

1.3 Disclaimer......................................................................................................................................................................................................1

1.4 Imprint............................................................................................................................................................................................................1

1.5 Tips on safety................................................................................................................................................................................................2

1.6 Symbols and typographic conventions ...............................................................................................................................................2

1.7 Handling and ESD tips...............................................................................................................................................................................2

1.8 Naming of signals........................................................................................................................................................................................3

1.9 Further applicable documents / presumed knowledge .................................................................................................................3

2. BRIEF DESCRIPTION ....................................................................................................................................................................................4

3. OVERVIEW......................................................................................................................................................................................................5

3.1 Block diagram...............................................................................................................................................................................................5

3.2 System components...................................................................................................................................................................................5

4. ELECTRONICS................................................................................................................................................................................................6

4.1 Processor variants .......................................................................................................................................................................................6

4.2 Reset structure .............................................................................................................................................................................................7

4.2.1 TQMLX_RST# ................................................................................................................................................................................................7

4.2.2 HRESET# .........................................................................................................................................................................................................7

4.2.3 RESET_REQ#..................................................................................................................................................................................................7

4.2.4 LX_CPU_RESET_OUT#................................................................................................................................................................................7

4.2.5 JTAG_TRST# ..................................................................................................................................................................................................7

4.3 Boot source ...................................................................................................................................................................................................8

4.4 DDR4 SDRAM................................................................................................................................................................................................8

4.5 NOR flash, eMMC / SD card ......................................................................................................................................................................8

4.6 EEPROMs........................................................................................................................................................................................................9

4.6.1 EEPROM, 24LC64 .........................................................................................................................................................................................9

4.6.2 Temperature sensor with EEPROM, SE97B..........................................................................................................................................9

4.6.2.1 Temperature sensor, SE97B .....................................................................................................................................................................9

4.6.2.2 EEPROM, SE97B......................................................................................................................................................................................... 10

4.7 RTC................................................................................................................................................................................................................ 10

4.8 Secure Element ......................................................................................................................................................................................... 11

4.9 Interfaces .................................................................................................................................................................................................... 12

4.9.1 SerDes.......................................................................................................................................................................................................... 12

4.9.2 I2C bus.......................................................................................................................................................................................................... 13

4.9.3 UART............................................................................................................................................................................................................. 14

4.9.4 USB................................................................................................................................................................................................................ 14

4.9.5 RGMII............................................................................................................................................................................................................ 14

4.9.6 JTAG.............................................................................................................................................................................................................. 14

4.10 Power supply............................................................................................................................................................................................. 15

4.10.1 Input voltage ............................................................................................................................................................................................. 15

4.10.2 Voltage monitoring ................................................................................................................................................................................. 15

4.10.3 Power consumption................................................................................................................................................................................ 15

4.11 TQMLX2160A connectivity.................................................................................................................................................................... 15

4.11.1 Interface impedances ............................................................................................................................................................................. 15

4.11.2 SerDes track length.................................................................................................................................................................................. 16

4.11.3 Pin multiplexing ....................................................................................................................................................................................... 17

4.11.4 Pinout TQMLX2160A connectors........................................................................................................................................................ 18

5. MECHANICS................................................................................................................................................................................................ 23

5.1 TQMLX2160A assembly.......................................................................................................................................................................... 23

5.2 TQMLX2160A weight, dimensions...................................................................................................................................................... 24

5.3 TQMLX2160A connectors...................................................................................................................................................................... 26

5.4 Protection against external effects..................................................................................................................................................... 26

5.5 Thermal management............................................................................................................................................................................ 27

5.6 Structural requirements......................................................................................................................................................................... 27

5.7 Notes of treatment................................................................................................................................................................................... 27

6. SOFTWARE.................................................................................................................................................................................................. 27

7. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 28

7.1 EMC............................................................................................................................................................................................................... 28

7.2 ESD................................................................................................................................................................................................................ 28

7.3 Operational safety and personal security......................................................................................................................................... 28

7.4 Climatic and operational conditions.................................................................................................................................................. 28

7.5 Reliability and service life....................................................................................................................................................................... 28

8. ENVIRONMENT PROTECTION................................................................................................................................................................ 29

8.1 RoHS ............................................................................................................................................................................................................. 29

8.2 WEEE®.......................................................................................................................................................................................................... 29

8.3 REACH®........................................................................................................................................................................................................ 29

8.4 EuP ................................................................................................................................................................................................................ 29

8.5 Battery.......................................................................................................................................................................................................... 29

8.6 Packaging ................................................................................................................................................................................................... 29

8.7 Other entries.............................................................................................................................................................................................. 29

9. APPENDIX ................................................................................................................................................................................................... 30

9.1 Acronyms and definitions...................................................................................................................................................................... 30

9.2 References.................................................................................................................................................................................................. 31

TABLE DIRECTORY

Table 1: Terms and Conventions ............................................................................................................................................................................2

Table 2: Boot source selection.................................................................................................................................................................................8

Table 3: eMMC_SEL0/1 signals................................................................................................................................................................................8

Table 4: eMMC Modes................................................................................................................................................................................................9

Table 5: TQMLX2160A-specific data in the EEPROM ..................................................................................................................................... 10

Table 6: SerDes Block 1 muxing options........................................................................................................................................................... 12

Table 7: SerDes Block 2 muxing options........................................................................................................................................................... 12

Table 8: SerDes Block 3 muxing options........................................................................................................................................................... 12

Table 9: I2C addresses.............................................................................................................................................................................................. 13

Table 10: TQMLX2160A power consumption @ 5 V......................................................................................................................................... 15

Table 11: TQMLX2160A interface impedances.................................................................................................................................................. 15

Table 12: SerDes track length and estimated insertion loss.......................................................................................................................... 16

Table 13: Pinout connector X1................................................................................................................................................................................ 18

Table 14: Pinout connector X2................................................................................................................................................................................ 19

Table 15: Pinout connector X3................................................................................................................................................................................ 21

Table 16: Labels on TQMLX2160A ......................................................................................................................................................................... 23

Table 17: TQMLX2160A side view dimensions.................................................................................................................................................. 24

Table 18: Connector assembled on TQMLX2160A........................................................................................................................................... 26

Table 19: Carrier board mating connectors........................................................................................................................................................ 26

Table 20: Climate and operational conditions................................................................................................................................................... 28

Table 21: Acronyms.................................................................................................................................................................................................... 30

Table 22: Further applicable documents............................................................................................................................................................. 31

FIGURE DIRECTORY

Figure 1: Block diagram TQMLX2160A (simplified)............................................................................................................................................5

Figure 2: Block diagram LX2160A ............................................................................................................................................................................6

Figure 3: Block diagram LX2120A ............................................................................................................................................................................6

Figure 4: Block diagram LX2080A ............................................................................................................................................................................6

Figure 5: Block diagram Reset structure ................................................................................................................................................................7

Figure 6: Block diagram NOR flash interface ........................................................................................................................................................8

Figure 7: Block diagram I2C1 EEPROM interface .................................................................................................................................................9

Figure 8: Block diagram RTC interface................................................................................................................................................................. 10

Figure 9: Block diagram SEC interface................................................................................................................................................................. 11

Figure 10: Block diagram I2C bus 1 structure on TQMLX2160A ..................................................................................................................... 13

Figure 11: Block diagram JTAG interface............................................................................................................................................................... 14

Figure 12: TQMLX2160A assembly, top................................................................................................................................................................. 23

Figure 13: TQMLX2160A assembly, bottom......................................................................................................................................................... 23

Figure 14: TQMLX2160A dimensions, side view................................................................................................................................................. 24

Figure 15: TQMLX2160A dimensions, top view .................................................................................................................................................. 25

Figure 16: TQMLX2160A dimensions, top view through TQMLX2160A...................................................................................................... 25

REVISION HISTORY

Rev. Date Name Pos. Modification

0100 28.02.2022 Kreuzer First edition

ABOUT THIS MANUAL

1.1

This User’s Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective

manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be calculated / declared

separately.

1.2

Registered trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User’s Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by a third

party.

1.3

Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User’s Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against TQ-Systems

GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information given in this

User’s Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven intentional

or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User’s Manual or parts of it without

special notification.

Important Notice:

Before using the Starterkit MBLX2160A or parts of the schematics of the MBLX2160A, you must evaluate it and determine if it is

suitable for your intended application. You assume all risks and liability associated with such use. TQ-Systems GmbH makes no

other warranties including, but not limited to, any implied warranty of merchantability or fitness for a particular purpose. Except

where prohibited by law, TQ-Systems GmbH will not be liable for any indirect, special, incidental or consequential loss or damage

arising from the usage of the Starterkit MBLX2160A or schematics used, regardless of the legal theory asserted.

1.4

Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308–0

Fax: +49 8153 9308–4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5

Tips on safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.6

Symbols and typographic conventions

Table 1: Terms and Conventions

Symbol Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.7

Handling and ESD tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMLX2160A and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.8

Naming of signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked with

a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.9

Further applicable documents / presumed knowledge

•

Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

•

Specifications of the components used:

The manufacturer’s specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that must be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•

Chip errata:

It is the user’s responsibility to make sure all errata published by the manufacturer of each component are taken note of.

The manufacturer’s advice should be followed.

•

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

The following documents are required to fully comprehend the following contents:

•MBLX2160A circuit diagram

•MBLX2160A User’s Manual

•LX2160A documentation

•U-Boot documentation: www.denx.de/wiki/U-Boot/Documentation

•Yocto documentation: www.yoctoproject.org/docs/

•TQ-Support Wiki: Support-Wiki TQMLX2160A

BRIEF DESCRIPTION

This User’s Manual describes the hardware of the TQMLX2160A,

Rev. 01xx

and refers to some software settings.

A certain TQMLX2160A derivative does not necessarily provide all features described in this User’s Manual.

This User’s Manual does also not replace the LX2160A documentation (1), (2). The information provided in this User’s Manual is

only valid in connection with the tailored boot loader, which is preinstalled on the TQMLX2160A, and the BSP provided by TQ-

Systems. See also chapter 6.

The TQMLX2160A is a universal Minimodule based on the ARM®NXP CPUs LX2080A, LX2120A or LX2160A.

These CPUs have up to 16 Cortex®-A72 cores with QorIQ technology. The TQMLX2160A extends the TQ-Systems GmbH product

range and offers an outstanding computing performance. A suitable CPU derivative can be selected for each requirement.

All essential CPU pins are routed to the TQMLX2160A connectors. There are therefore no restrictions using the TQMLX2160A with

respect to an integrated design. Furthermore all components required for the CPU to function like DDR4 SDRAM, eMMC, power

supply and power management are integrated on the TQMLX2160A.

The main TQMLX2160A characteristics are:

•LX CPUs with 8 / 12 / 16 cores

•Size 126 mm x 78 mm

•Up to 64 Gbyte DDR4 SDRAM with ECC

•Up to 64 Gbyte eMMC NAND flash

•Up to 512 Mbyte QSPI / Octal-NOR flash

•64 Kbit EEPROM

•Voltage supervision

•Real-Time-Clock

•Secure Element

•Temperature sensor

•All essential CPU pins are routed to the TQMLX2160A connectors

•Single 5 V power supply

The MBLX2160A serves as carrier board and reference platform for the TQMLX2160A.

OVERVIEW

3.1

Block diagram

Temp. Sensor

RTC

EEPROM

System

Controller

Muxing

Layerscape CPU

LX2160A

LX2120A

LX2080A

Module Connector

DDR4

DDR4 #1 64 bit + ECC

DDR4

DDR4 #2 64 bit + ECC

NOR Flash #1

NOR Flash #2

eMMC

Voltage

Monitoring Power

Supply

CPLD

Temp. Sensor

EEPROM

Clock

Module Connector

Secure Element

Figure 1: Block diagram TQMLX2160A (simplified)

3.2

System components

The TQMLX2160A provides the following key functions and characteristics:

•LX2160A / LX2120A / LX2080A CPU with up to 16 cores

•DDR4 SDRAM at two controllers

•eMMC NAND flash 5.1

•2x QSPI NOR flash

•EEPROM (optional)

•Real-Time clock (optional)

•Secure Element chip (optional)

•Oscillators

•Temperature sensor

•Housekeeping via system controller / CPLD

oVoltage supervision

oPower sequencing

oTemperature supervision

oError log

All essential CPU pins are routed to the TQMLX2160A connectors. There are therefore no restrictions for customers using the

TQMLX2160A with respect to an integrated customised design.

All TQMLX2160A versions are fully pin-compatible and therefore interchangeable.

The functionality of the different TQMLX2160A is mainly determined by the features provided by the respective CPU.

ELECTRONICS

4.1

Processor variants

Three different LX CPU derivatives can be assembled on the TQMLX2160A.

Figure 2: Block diagram LX2160A

(Source: NXP)

Figure 3: Block diagram LX2120A

(Source: NXP)

Figure 4: Block diagram LX2080A

(Source: NXP)

4.2

Reset structure

The following block diagram illustrates the Reset circuitry on the TQMLX2160A.

LX2160A

RESET

RESET_REQ#

System Controller

RESET_REQ_OUT#

HRESET# HRESET_OUT#

JTAG_TRST#

Status

LED

TQMLX_RST#

LX_CPU_RESET_OUT#

HRESET_IN#

Module

Connector

PORESET#

TRST_CPU#

Figure 5: Block diagram Reset structure

4.2.1 TQMLX_RST#

TQMLX_RST# is the reset signal to control the whole TQMLX2160A module. Coming from the module connector, it will be able to

hold system controller in reset. If the signal TQMLX_RST# is set to high by the base board, the system controller will start the

module.

By default TQMLX_RST# is connected with a pulldown (47-100K), so that the module does not start by itself as soon as the supply

voltage is applied. Furthermore a small RC filter is provided at TQMLX_RST#.

A 5 V tolerant buffer is provided. Thus the module can be activated from the base board also with the 5V VIN voltage (e.g. via

pullup or directly) and no further voltage is needed for starting.

4.2.2 HRESET#

HRESET# (1.8V) has a pullup and is connected to the system controller and with DDR4_RST#.

A second, downstream driver is used to provide the signal at the TQMLX2160A connector. A level conversion from 1.8 V to 3.3 V

is done.

4.2.3 RESET_REQ#

The reset request signal of the LX2160A has a pullup (1.8 V) and after the level conversion to 3.3 V it is made available to the

system controller as well as to the TQMLX2160A connector. To avoid faulty circuits on the base board, buffers are

interconnected.

4.2.4 LX_CPU_RESET_OUT#

LX_CPU_RESET_OUT# serves as status signal to the base board that the LX CPU is still held in reset. The signal is controlled from

the system controller. The state of the signal is indicated by a red LED.

4.2.5 JTAG_TRST#

The TRST# from the JTAG debugger is not connected directly to the CPU, but to the system controller. The reason for this is that

TRST# must be controlled together with PORESET# at startup. For the JTAG access it is necessary to separate PORESET# and

TRST# depending on the debugger and for the boundary scan test TRST# must be controlled independently of PORESET#.

4.3

Boot source

The boot source of the TQMLX2160A is selected with signals BOOT_SRC[2:0]. Pull-Ups to 3.3 V are provided on the TQMLX2160A.

Table 2: Boot source selection

BOOT_SRC2 (X2-A34) BOOT_SRC1 (X2-A33) BOOT_SRC0 (X2-A32) Boot source

1 1 1 NOR flash

1 1 0 SD card

1 0 1 eMMC

1 0 0 I²C

0 1 1 XSPI – NAND 2 KB

0 1 0 XSPI – NAND 4 KB

0 0 1 Hard Coded Option

0 0 0 TBD

4.4

DDR4 SDRAM

The LX2160A features two DDR4 controllers. Both controllers have a 72 bit interface (64 bit + 8 bit ECC) each.

ECC is an assembly option and is assembled as an additional DDR4 SDRAM device.

Up to 64 Gbyte of DDR4 SDRAM with a transfer rate of 2800 MT/s can be assembled on the TQMLX2160A.

4.5

NOR flash, eMMC / SD card

The LX2160A provides two SPI interfaces XSPI1_A and XSPI1_B. XSPI1_B is multiplexed with SDHC2. A NOR Flash Swap function

(NOR_SWAP#) is implemented: XSPI1_A CS0# and CS1# can be swapped without the CPU registering this.

The SDHC2 / eMMC interface is configured with the eMMC_SEL0/1 signals. These signals are preconfigured on the TQMLX2160A

with a pullup to 3.3V. The eMMC_SEL configuration cannot be changed during runtime.

LX2160A

XSPI_A

XSPI_B /

SDHC2

NOR Flash #1 NOR Flash #2

XSPI_B

eMMC

Module

Connector

Figure 6: Block diagram NOR flash interface

Table 3: eMMC_SEL0/1 signals

eMMC_SEL1 eMMC_SEL0 Configuration

0 0 SDHC2 entirely at the module connector

0 1 eMMC on TQMLX2160A connected with 4 bit data + 2 × I2C (I2C_7 and I2C_8)

1 0 (Undefined)

1 1 eMMC on TQMLX2160A connected with 8 bit data (default)

The TQMLX2160A supports the following eMMC transfer modes:

Table 4: eMMC Modes

Mode

1-bit support

4-bit support

8-bit support

LX2160A

eMMC 5.1

LX2160A

eMMC 5.1

LX2160A

eMMC 5.1

DS (Default Speed)

Yes

HS (High Speed)

Yes

HS200

Yes

HS400

Yes

DDR

Yes

4.6

EEPROMs

The TQMLX2160A provides two EEPROMS:

•A 64 Kbit serial EEPROM type 24LC64

•A 2 Kbit (256 × 8 Bit) serial EEPROM type SE97B, combined with a temperature sensor

Write

Protection

LX2160A

I2C1

EEPROM

Customer data

EEPROM

TQ data

3.3V

Module

Connector

Figure 7: Block diagram I2C1 EEPROM interface

4.6.1 EEPROM, 24LC64

The TQMLX2160A provides a 64 Kbit serial EEPROM type 24LC64. The EEPROM is connected to I2C1 of the LX2160A.

WP of the M24LC64 is pulled low on the TQMLX2160A, thus write access is permitted. See also Figure 7.

The I2C address of the EEPROM is 0x50 / 101 0000b

Other I2C addresses see chapter 4.9.2.

4.6.2 Temperature sensor with EEPROM, SE97B

4.6.2.1 Temperature sensor, SE97B

A temperature sensor SE97B is assembled on the TQMLX2160A, which measures the environmental temperature.

The temperature sensor is connected to I2C1 and has I2C address 0x1F / 001 1111b

Other I2C addresses see chapter 4.9.2.

The accuracy of the temperature sensor is as follows:

•Max. ±1 °C between +75 °C and +95 °C

•Max. ±2 °C between +40 °C and +125 °C

•Max. ±3 °C between –40 °C and +125 °C

Signal EVENT_TEMPSENSOR# of the temperatures sensor is routed to the TQMLX2160A connector X3-B99.

The signal has an Open Drain output, an optional Pull-Up to 3.3 V can be assembled on the TQMLX2160A.

4.6.2.2 EEPROM, SE97B

The SE97B is connected to the I2C1 bus of the LX2160A and contains a 2 Kbit (256 × 8 Bit) EEPROM.

In this EEPROM TQMLX2160A-specific data is stored, see Table 4. The user can also store own data in this EEPROM.

The EEPROM is divided into two parts. The lower 128 bytes (00h to 7Fh) can be Permanent Write Protected (PWP) or Reversible

Write Protected (RWP) by software. The upper 128 bytes (80h to FFh) are not write protected and can be used for general

purpose data storage. The EEPROM can be accessed with the following two I2C addresses.

•EEPROM (Normal Mode): 0x57 / 101 0111b

•EEPROM (Protected Mode): 0x37 / 011 0111b

Other I2C addresses see chapter 4.9.2.

In the EEPROM, TQMLX2160A-specific data is stored. It is, however, not essential for the correct operation of the TQMLX2160A.

The user can delete or change the data, but this is not recommended.

In the following table, the parameters stored in the EEPROM are shown.

Table 5: TQMLX2160A-specific data in the EEPROM

Offset Payload (byte) Padding (byte) Size (byte) Type Remark

0x00

Variable Variable 32(10) Binary Hard Reset Configuration Word (HRCW), (optional)

0x20

6(10) 10(10) 16(10) Binary MAC address

0x30

8(10) 8(10) 16(10) ASCII Serial number

0x40

Variable Variable 64(10) ASCII Order code

0x80

– – 8,064(10) – (Unused)

4.7

RTC

An optional RTC type PCF85063A can be assembled on the TQMLX2160A.

RTC signal CLKOUT (32 kHz) is routed to the TQMLX2160A connector (X3-B97).

The RTC can be supplied via VBAT_RTC from the base board. VBAT_RTC = 0.9 V to 5.5 V.

CLKOUT is deactivated when the TQMLX2160A is not supplied with VIN.

LX2160A I2C1

RTC

CLKOUT

INT#

I²C

VDD VBAT_RTC

3.3 V

Module

Connector

CLKOE

3.3 V RTC_INT_OUT#

RTC_CLKOUT

Figure 8: Block diagram RTC interface

The RTC has I2C address 0x51 / 101 0001b

Other I2C addresses see chapter 4.9.2.

4.8

Secure Element

An optional Secure Element type SE050C2HQ1 can be assembled on the TQMLX2160A.

The device is connected to the CPU as shown in the following Figure.

IO1

LX2160A

Secure Element

Chip (SEC)

I2C1

CPLD EN

IO1

IO2

CLK

RST#

100 kΩ

LB X3-A103

X3-A104

X3-A106

X3-A107

X3-A108

X3-A109

Module

Connector

Figure 9: Block diagram SEC interface

The SEC has I2C address 0x48 / 100 1000b

Other I2C addresses see chapter 4.9.2.

4.9

Interfaces

4.9.1 SerDes

The LX2160A provides three SerDes blocks with eight lanes each.

No AC coupling capacitors are assembled on the TQMLX2160A. These have to be populated on the carrier board.

The following tables show the SerDes muxing options.

Table 6: SerDes Block 1 muxing options

Front Side Left SERDES1 (×8)

0 1 2 3 4 5 6 7

H G F E D C B A

1 PCIe.1 ×4 PCIe.2 ×4

2 SGMII.3 SGMII.4 SGMII.5 SGMII.6 PCIe.2 ×4

3 USXGMII / XFI.3 USXGMII / XFI.4 USXGMII / XFI.5 USXGMII / XFI.6 PCIe.2 ×4

4 SGMII.3 SGMII.4 SGMII.5 SGMII.6 SGMII.7 SGMII.8 SGMII.9 SGMII.10

5 PCIe.1 ×4 USXGMII / XFI.7 USXGMII / XFI.8 USXGMII / XFI.9 USXGMII / XFI.10

6 USXGMII / XFI.3 USXGMII / XFI.4 SGMII.3 SGMII.3 SGMII.7 SGMII.8 SGMII.9 SGMII.10

7 USXGMII / XFI.3 USXGMII / XFI.4 USXGMII / XFI.5 USXGMII / XFI.6 SGMII.7 SGMII.8 SGMII.9 SGMII.10

8 USXGMII / XFI.3 USXGMII / XFI.4 USXGMII / XFI.5 USXGMII / XFI.6 USXGMII / XFI.7 USXGMII / XFI.8 USXGMII / XFI.9 USXGMII / XFI.10

9 PCIe.1 ×1 SGMII.4 SGMII.5 SGMII.6 PCIe.2 ×1 SGMII.8 SGMII.9 SGMII.10

10 PCIe.2 ×1 (gen 1,2)

USXGMII / XFI.4 USXGMII / XFI.5 USXGMII / XFI.6 PCIe.2 ×1 (gen 1,2)

USXGMII / XFI.8 USXGMII / XFI.9 USXGMII / XFI.10

11 PCIe.1 ×2 SGMII.5 SGMII.6 PCIe.2 ×2 SGMII.9 SGMII.10

12 PCIe.1 ×4 PCIe.2 ×2 SGMII.9 SGMII.10

100GE.1

100GE.2

14 100GE.1 PCIe.2 ×4

15 50GE.1 50GE.2 PCIe.2 ×4

16 50GE.1 25GE.5 25GE.6 PCIe.2 ×4

17 25GE.3 25GE.4 25GE.5 25GE.6 PCIe.2 ×4

18 USXGMII / XFI.3 USXGMII / XFI.4 25GE.5 25GE.6 USXGMII / XFI.7 USXGMII / XFI.8 USXGMII / XFI.9 USXGMII / XFI.10

19 USXGMII / XFI.3 USXGMII / XFI.4 25GE.5 25GE.6 40GE.2

20 40GE.1 40GE.2

21 25GE.3 25GE.4 25GE.5 25GE.6 PCIe.2 ×2 25GE.9 25GE.10

22 USXGMII / XFI.3 USXGMII / XFI.4 USXGMII / XFI.5 USXGMII / XFI.6 PCIe.2 ×2 USXGMII / XFI.9 USXGMII / XFI.10

Table 7: SerDes Block 2 muxing options

Front Side Right SERDES2 (×8)

0 1 2 3 4 5 6 7

A B C D E F G H

1 PCIe.3 ×2 (gen 1,2) SATA.1 SATA.2 PCIe.4 ×4 (gen 1,2)

2 PCIe.3 ×8

3 PCIe.3 ×4 PCIe.4 ×4

4 PCIe.3 ×4 (gen 1,2) PCIe.4 ×2 (gen 1,2) SATA.1 SATA.2

5 PCIe.3 ×4 SATA.3 SATA.4 SATA.1 SATA.2

6 PCIe.3 ×4 (gen 1,2) SGMII.15 SGMII.16 USXGMII / XFI.13 USXGMII / XFI.14

7 PCIe.3 ×1 (gen 1,2)

SGMII.12 SGMII.17 SGMII.18 PCIe.4 ×1 (gen 1,2)

SGMII.16 USXGMII / XFI.13 USXGMII / XFI.14

8 X X SATA.1 SATA.2 SATA.3 SATA.4 USXGMII / XFI.13 USXGMII / XFI.14

9 SGMII.11 SGMII.12 SGMII.17 SGMII.18 SGMII.15 SGMII.16 SGMII.13 SGMII.14

10 SGMII.11 SGMII.12 SGMII.17 SGMII.18 PCIe.2 ×4

11 PCIe.3 ×1 SGMII.12 SGMII.17 SGMII.18 PCIe.4 ×1 SGMII.16 SGMII.13 SGMII.14

12 SGMII.11 SGMII.12 SGMII.17 SGMII.18 PCIe.4 ×2 (gen 1,2) SATA.1 SATA.2

PCIe.3 ×4

PCIe.4 ×2

SGMII.13

SGMII.14

14 PCIe.3 ×2 SGMII.17 SGMII.18 PCIe.4 ×2 SGMII.13 SGMII.14

Table 8: SerDes Block 3 muxing options

Back Side SERDES3 (×8)

0 1 2 3 4 5 6 7

A B C D E F G H

1 PCIe.5 ×8

2 PCIe.5 ×4 PCIe.6 ×4

4.9.2 I2C bus

The LX2160A provides up to six I2C buses. All I2C devices on the TQMLX2160A are connected to the I2C1 bus. Therefore the I2C1

bus cannot be multiplexed to any other function.

LX2160A

RTC

EEPROM

System

Controller Temp

Sensor

I2C1

Optional

external

Pull-Ups

I2C1_MOD

3.3 V

TPM

Secure

Element

I2C1_CPU

3.3 V

1.8 V

Module

Connector

Level Shifter

1.8 V ↔ 3.3 V

1.8 V

Figure 10: Block diagram I2C bus 1 structure on TQMLX2160A

4.7 kΩPull-Ups at the I2C bus are assembled on the TQMLX2160A. More devices can be connected to the bus but then additional

external Pull-Ups may be required on account of the higher capacitive load.

Table 9: I2C addresses

Device Function 7-bit address Remark

24LC64 EEPROM

0x50 / 101 0000b

–

STM32 System Controller

0x11 / 001 0001b

Should not be altered

PCF85063A RTC

0x51 / 101 0001b

–

SE050 Secure Element

0x48 / 100 1000b

–

SE97B

Temperature sensor

0x1F / 001 1111b

Access to temperature registers

EEPROM

0x57 / 101 0111b

R/W access in Normal Mode

EEPROM

0x37 / 011 0111b

R/W access in Protected Mode

Note: I2C erratum A-010650

Please take note of NXP’s I2C erratum A-010650 when using I2C buses.

A workaround is available for the I2C_1 bus, to which all devices on the module are connected.

GPIO3_DAT11 / IRQ11 is used for this. Therefore this GPIO is not available for general purpose.

Due to the numerous multiplexing options for the other five possible I2C buses, this workaround is not

used for these five I2C busses. If these I2C buses are to be used on the baseboard, the workaround

must be implemented.

4.9.3 UART

(TBD)

4.9.4 USB

The LX2160A features two USB 3.0 controllers with integrated PHYs. All signals are routed directly to the TQMLX2160A

connectors. For the signals USB1_TX_P/N and USB_2_TX_P/N 100 nF AC coupling capacitors are populated on the TQMLX2160A.

Therefore only AC coupling capacitors are required on the carrier board at the corresponding RX lines. These should be placed as

close as possible to the device.

4.9.5 RGMII

Both RGMII interfaces EC1 and EC2 are directly routed to the TQMLX2160A connectors. The I/O signals have 1.8 V level.

The signals EC1_TX_EN (GPIO4_DAT4) and EC2_TX_EN (GPIO4_DAT16) are equipped with 1 kΩ Pull-Downs on the TQMLX2160A.

4.9.6 JTAG

The JTAG interface is routed to the connectors. Signals TCK, and TRST# have Pull-Ups to 1.8 V on the TQMLX2160A.

LX2160A

Module

Connector

TRST# X2-B108

System

Logic

X2-B105

TDI X2-B106

TDO

TMS X2-B107

X2-B109

TCK

1.8V

X2-A109

VREF

Figure 11: Block diagram JTAG interface

4.10

Power supply

4.10.1 Input voltage

The TQMLX2160A requires a 5 V supply with a maximum tolerance of ±5 %.

4.10.2 Voltage monitoring

All voltages generated on the TQMLX2160A are monitored.

4.10.3 Power consumption

The given power consumptions have to be seen as typical values. The power consumption of the TQMLX2160A strongly

depends on the application, the mode of operation, the environmental temperature, and the operating system.

The power supply of the carrier board should be designed for an output power of up to 60 watts.

The following table shows typical power consumption of the TQMLX2160A under various operating conditions. with TQ cooling

solution.

Table 10: TQMLX2160A power consumption @ 5 V

Mode of operation TQMLX2080A TQMLX2120A TQMLX2160A Tamb

U-Boot, idle (TBD) (TBD) 36 W

+25 °C

U-Boot, memory test (TBD) (TBD) 38 W

Linux, idle (TBD) (TBD) 22 W

Linux, 100 % CPU load (TBD) (TBD) 48 W

U-Boot, idle (TBD) (TBD) 38 W

+85 °C

Linux, idle (TBD) (TBD) 24 W

Linux, 100 % CPU load (TBD) (TBD) 50 W

Attention: Destruction or malfunction, TQMLX2160A heat dissipation

The TQMLX2160A belongs to a performance category in which a cooling system is essential.

It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)

depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,

airflow, and software).

Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,

heatsink) as well as the maximum pressure on the LX2160A must be taken into consideration when

connecting the heat sink.

The LX2160A is the highest component on the TQMLX2160A. Inadequate cooling connections

can lead to overheating of the TQMLX2160A and thus malfunction, deterioration or destruction.

4.11

TQMLX2160A connectivity

4.11.1 Interface impedances

Usually all signals have a single-ended impedance of nominal 50 Ω with a tolerance of ±10 %. Depending on the signal, the

following impedances are used on the TQMLX2160A and recommended for the carrier board:

Table 11: TQMLX2160A interface impedances

Interface Impedance TQMLX2160A Recommendation for carrier board

USB 3.0 90 Ω, differential 90 Ω ±15 %, differential

SerDes 1 100 Ω, differential 100 Ω ±10 %, differential

SerDes 2 100 Ω, differential 100 Ω ±10 %, differential

SerDes 3 90 Ω, differential 90 Ω ±10 %, differential

The layout guidelines of the corresponding standards are to be taken note of for the mainboard design.

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