Trenton Systems BAM8270 User manual

BAM8270
Prepared by
Trenton Systems
1725 MacLeod Dr
Lawrenceville, GA 30043
Date: January 10, 2022
Model Number: BAM8270
Revision: 1
Manual

Section 0 / Table of Contents
1
BAM8270 Manual
Table of Contents
Preface ............................................................................................................................................................................................... 2
About Trenton Systems............................................................................................................................................................... 3
Warranty & Policies ...................................................................................................................................................................... 4
Handling Precautions................................................................................................................................................................... 7
Regulatory Compliance............................................................................................................................................................... 8
System Overview..........................................................................................................................................................................10
Technical Specifications ............................................................................................................................................................15

Section 1 / Background
2
BAM8270 Manual
Preface
Please Note: For the most up-to-date version of this manual, please visit our website at:
www.trentonsystems.com.
Trenton Systems, Inc. reserves the right to make changes to the product described in this manual at any
time and without notice. This product, including software and documentation, is the property of
Trenton Systems and/or its licensors, and is supplied only under a license. Any use or reproduction of
this product is not allowed, except as expressly permitted by the terms of said license.
IN NO EVENT WILL TRENTON SYSTEMS, INC. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,
SPECULATIVE, OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS
PRODUCT OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN
PARTICULAR, TRENTON SYSTEMS, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE,
OR DATA STORED OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING,
INTEGRATING, INSTALLING ,OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.
Contact Information
Trenton Systems, Inc.
1725 MacLeod Drive
Lawrenceville, GA 30043
[phone]
[email protected]m
[email protected]m
[e-mail]
www.trentonsystems.com

Section 1 / Background
3
BAM8270 Manual
About Trenton Systems
“Unbelievably light. Unquestionably
rugged. Undeniably powerful.”
BACKGROUND
Since its establishment in 1989, Trenton Systems has been the leading, high-performance computer
hardware and systems manufacturer dedicated to crafting application-specific solutions for the military,
industrial, and commercial markets. Our rugged computing solutions are designed and manufactured
in-house at our state-of-the-art facility in Lawrenceville, Georgia, which we relocated to in 2016 after
outgrowing our original facility in Gainesville. Versatile, adaptable, and built-to-last, our multi-faceted
computing solutions sport completely customizable, ultra-rugged designs, both inside and outside the
chassis.
EXPERIENCE
Trenton Systems is trusted by the world’s leading technology companies. Some of our happy customers
include Boeing, IBM, L3Harris, Northrop Grumman, Lockheed Martin and Raytheon. We also partner
with Intel via the Embedded and Communications Alliance, which provides us with access to Intel’s
roadmap, as well as with technical support directly from the company. Throughout the years, we’ve
been at the forefront of the industry in numerous capacities. As a founding member of the PCI
Industrial Manufacturers Group (PICMG), we redefined the industry in 1994 with our PICMG 1.0 form
factor, and redefined it again in 2005, when we wrote the PICMG 1.3 specification. In 2008, we
streamlined our design and manufacturing capabilities, allowing us to craft our systems fully in-house
and provide customers with a one-stop shop for all things Trenton rugged.
PHILOSOPHY
Trenton Systems believes in stress-testing and certifying its USA-made products to and beyond the
highest military and industrial standards. We believe in crafting solutions that last decades, rather than
just a few years. We believe in providing rapid and effective follow-up support so that our customers
don’t have to spend hours, days, or weeks trying to resolve a simple issue. At Trenton, we believe in
setting our customers up for success, both on and off the front lines.

Section 2 / Warranty & Policies
4
BAM8270 Manual
Warranty & Policies
WARRANTY
The following is an abbreviated version of Trenton Systems’ warranty policy for motherboard products.
For a complete warranty statement, contact Trenton Systems or visit our website at
www.trentonsystems.com.
Board-level products manufactured by Trenton Systems are warranted against material and
manufacturing defects for five years from date of delivery to the original purchaser. Buyer agrees that if
this product proves defective Trenton Systems, Inc. is only obligated to repair, replace, or refund the
purchase price of this product at Trenton Systems’ discretion. The warranty is void if the product has
been subjected to alteration, neglect, misuse, or abuse; if any repairs have been attempted by anyone
other than Trenton Systems, Inc.; or if failure is caused by accident, acts of God, or other causes beyond
the control of Trenton Systems, Inc. Trenton Systems, Inc. reserves the right to make changes or
improvements in any product without incurring any obligation to similarly alter products previously
purchased.
In no event shall Trenton Systems, Inc. be liable for any defect in hardware or software or loss or
inadequacy of data of any kind, or for any direct, indirect, incidental, or consequential damages arising
out of or in connection with the performance or use of the product or information provided. Trenton
Systems, Inc.’s liability shall in no event exceed the purchase price of the product.
RETURN POLICY
A Service Order Number, obtained from Trenton Systems prior to return, must accompany products
returned for repair. The customer must prepay freight on all returned items, and the customer is
responsible for any loss or damage caused by common carrier in transit. Items will be returned from
Trenton Systems via Ground, unless prior arrangements are made by the customer for an alternative
shipping method.
To obtain a Service Order Number, call us at [phone] or [phone], or open up a ticket at
https://www.trentonsystems.com/. We will need the following information:
Return company address and contact
Model name and model # from the label on the back of the product
Part Number and Serial number from the label on the product
Description of the failure and failure mode
The Part Number and Serial Number are listed on the chassis as shown here:

Section 2 / Warranty & Policies
5
BAM8270 Manual
Here is an Example label, which shows the Part Number, Revision, and Serial Number (S/N):
A Service Order Number will be issued. Mark the Service Order Number clearly on the outside of each
box, include a copy of the Service Order failure report for each board, and return the product(s) to our
Lawrenceville, GA facility:
Trenton Systems, Inc.
1725 MacLeod Drive
Lawrenceville, GA 30043
Attn: Repair Department
TRADEMARKS
IBM, PC/AT, VGA, EGA, OS/2 and PS/2 are trademarks or registered trademarks of International
Business Machines Corp.
Intel, Xeon, Intel Core, Intel AMT, Intel TXT, Intel Hyper-Threading Technology, and Intel
Virtualization Technology are trademarks or registered trademarks of Intel Corporation.

Section 2 / Warranty & Policies
6
BAM8270 Manual
Insyde is a trademark of Insyde Software, Inc.
MS-DOS and Microsoft are registered trademarks of Microsoft Corp.
PCI Express is a trademark of the PCI-SIG.
All other brand and product names may be trademarks or registered trademarks of their
respective companies.
LIABILITY DISCLAIMER
This manual is as complete and factual as possible at the time of printing; however, the information in
this manual may have been updated since that time. Trenton Systems, Inc. reserves the right to change
the functions, features, or specifications of their products at any time, without notice.
Copyright © 2019 by Trenton Systems, Inc. All rights reserved.
E-mail: [e-mail]
Web: www.trentonsystems.com

Section 3 / Handling Precautions
7
BAM8270 Manual
Handling Precautions
WARNING: This product has components that may be damaged by electrostatic
discharge.
To protect your motherboard from electrostatic damage, be sure to observe the following precautions
when handling or storing the system:
Keep the motherboard in its static-shielded bag until you are ready to perform your installation.
Handle the motherboard by its edges.
Do not touch the I/O connector pins.
Do not apply pressure or attach labels to the motherboard.
Use a grounded wrist strap at your workstation or ground yourself frequently by touching the
metal chassis of the system before handling any components. The system must be plugged into
an outlet that is connected to an earth ground.
Use antistatic padding on all work surfaces.
Avoid static-inducing carpeted areas.
Recommended Motherboard Storage Precautions
This SHB has components on both sides of the PCB. Some of these components are extremely small
and subject to damage if the board is not handled properly. It is important for you to observe the
following precautions when handling or storing the board to prevent components from being damaged
or broken off:
Store the board in padded shipping material or in an anti-static board rack.
Do not place an unprotected board on a flat surface.
WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly.
Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery
can result in an explosion.

Section 4 / Regulatory Compliance
8
BAM8270 Manual
Regulatory Compliance
DECLARATION OF CONFORMITY
FCC
This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference and (2) this device must
accept any interference received, including interference that might cause undesired operation.
CE
This equipment complies with all applicable European Union (CE) directives if it has a CE marking. For
this device to remain CE compliant, only CE compliant parts can be installed, and proper cables and
cabling techniques are required.
AGENCY APPROVALS
All standards should be at applicable revision levels at time of test.
Electromagnetic Emissions (EMI)
Designed to FCC Class A as a minimum.
Designed for CE Conformity to EN 55032:2015/A11:2020, EN 61000-3-2:2014, EN 61000-3-
3:2013, and EN 55035:2017/A11:2020 including EN 61000-4-2:2008, EN 61000-4-
3:2006/A1:2007/A2:2010, EN 61000-4-4:2012, EN 61000-4-5:20105, EN 61000-4-6:2008, and EN
61000-4-11:2004.
This product will be approvable for MIL-STD-461G to system test methods RE102, and CE102.
Safety
This product will be approvable for safety concerns and designed for EN 62368-1:2018.
Environmental
This product will be approvable for MIL-STD-810H High and Low-Temp Operating and Storage
system testing to test methods 501.7 and 502.7, Procedures I and II.
This product will be approvable for MIL-STD-810H Altitude Operational and Storage system
testing to test method 500.6, Procedures I and II.
We are planning to test:
OHumidity per MIL-STD-810H, Method 507.6, Procedure I with 90% RH max

Section 4 / Regulatory Compliance
9
BAM8270 Manual
OOperational Shock per MIL-STD-810H, Method 516.8, Procedure I, SRS Functional Test at
20G
OVibration per MIL-STD-810H, Method 514.8, Figure 514.8D-1 with 2.8 g max

Section 5 / System Overview
10
BAM8270 Manual
System Overview
Figure 1: BAM8270
Multi-layer construction for unstoppable
ruggedness using the newest Intel®
Xeon® Scalable Performance Processors.

Section 5 / System Overview
11
BAM8270 Manual
INTRODUCTION
It is important to be aware of the system considerations listed below before installing your BAM8270
(8270-xxx) motherboard. Overall system performance may be affected by incorrect usage of these
features.
DDR4 MEMORY
Trenton Systems recommends Registered ECC DDR4-3200 PC4-25600 or DDR4-2933 PC4-23400
memory modules for use on the BAM8270. The BAM8270 has been validated with up to 1.5TB of
memory across 24 ECC RDIMM slots using eight channels per CPU. Some processor models will only
support memory speeds up to 2933 MHz.
To maximize memory interface speed, populate each memory channel with DDR4 DIMMs having
the same interface speed. The motherboard will support DIMMs with different speeds, but the
memory channel interface will operate speed of the slowest DIMM.
All memory modules must be Registered.
Populate the memory sockets starting with P0-CH1-DIMM0. Refer to the BAM8270 board layout
drawing or the board silkscreen and populate the memory sockets using the population order
illustrated in the chart below:
POPULATION ORDER
CPU0
CPU1
1
P0-CH1-DIMM0
-
2
-
P1-CH1-DIMM0
3
P0-CH5-DIMM0
-
4
-
P1-CH5-DIMM0
5
P0-CH2-DIMM0
-
6
-
P1-CH2-DIMM0
7
P0-CH6-DIMM0
-
8
-
P1-CH6-DIMM0
9
P0-CH3-DIMM0
-
10
-
P1-CH3-DIMM0
11
P0-CH4-DIMM0
-
12
-
P1-CH4-DIMM0

Section 5 / System Overview
12
BAM8270 Manual
13
P0-CH0-DIMM0
-
14
-
P1-CH0-DIMM0
15
P0-CH7-DIMM0
-
16
-
P1-CH7-DIMM0
17
P0-CH2-DIMM1
-
18
-
P1-CH2-DIMM1
19
P0-CH6-DIMM1
-
20
-
P1-CH6-DIMM1
21
P0-CH0-DIMM1
-
22
-
P1-CH0-DIMM1
23
P0-CH4-DIMM1
-
24
-
P1-CH4-DIMM1
Using a balanced memory population approach ensures maximum memory interface performance.
A “balanced approach” means using an even number of DIMMs on the BAM8270 motherboard
whenever possible.
The memory DIMMs on the motherboard connect directly to the CPU and at least one memory
module must be installed in one of the DIMM0 slots for P0.
For each channel on the BAM8270, DIMM0 must be installed with memory before DIMM1 may be
used.
INTEL® OPTANE™ PERSISTENT MEMORY
The Trenton Systems BAM8270 motherboard has been validated with 128GB Intel® Optane™ Persistent
Memory modules. The modules have population rules which are required to enumerate and boot
properly. Channels are handled separately and denoted by ‘CHX’ on the board’s silkscreen. Slots are
denoted by ‘DIMM0/DIMM1’, and not all channels will utilize a DIMM1/Slot 1 connection. The following
table lists the combinations of DDR4 DIMMs and Optane PMMs that can be inserted for each channel.
SLOT 0 MODULE
SLOT 1 MODULE
DDR4 DIMM
DDR4 DIMM

Section 5 / System Overview
13
BAM8270 Manual
DDR4 DIMM
Optane PMM
DDR4 DIMM
-
Optane PMM
-
SATA RAID OPERATION (WINDOWS O/S SETUP)
The Intel® C621A Platform Controller Hub (PCH) used on the motherboard features Intel® Rapid
Storage Technology (Intel® RST) and requires unique drivers. These drivers can be found on our
product downloads page here.
BIOS
The BAM8270 features the InsydeH20® UEFI BIOS from Insyde. The BIOS setup menu can be accessed
by striking the Esc key while the system is booting. Advanced setup can be configured here, including
peripheral management and boot priority.
OPERATING SYSTEMS
Trenton Systems has tested the BAM8270 motherboard with a wide variety of contemporary operating
systems including Linux (Red Hat RHEL 8.0, Ubuntu 20.04 and SUSE), Windows® 10, Windows® 2016
Server, and Windows® 2019 Server.

Section 5 / System Overview
14
BAM8270 Manual
MODEL NUMBER
BAM8270
PROCESSORS
Intel® Xeon® 3rd Generation Scalable Performance
Processors
CPU TDP support up to 205W
FCLGA4189 Socket
CPU
Core
Speed
Memory
Speed
Cores/
Threads
TDP
Gold
6330
2.0 GHz 2933 MHz 28/56 205 W
Gold
6338T
2.1 GHz 3200 MHz 24/48 165 W
Gold
6336Y
2.4 GHz 3200 MHz 24/48 185 W
Gold
6326
2.9 Ghz 3200 MHz 16/32 185 W
Gold
5318Y
2.1 GHz 2933 MHz 24/48 165 W
Gold
5320T
2.3 GHz 2933 MHz 20/40 150 W
Gold
5317
3.0 GHz 2933 MHz 12/24 150 W
Gold
5315Y
3.2 GHz 2933 MHz 8/16 140 W
Silver
4316
2.3 GHz 2667 MHz 20/40 150 W
Silver
4314
2.4 GHz 2667 MHz 16/32 135 W
Silver
4310
2.1 GHz 2667 MHz 12/24 120 W
Silver
4310T
2.3 GHz 2667 MHz 10/20 105 W
MEMORY
Slots: 24x DDR4 RDIMM sockets
Capacity: Up to 1.5TB
Type: 2933 or 3200 ECC DDR4 RDIMM
DIMM Sizes:128GB, 64GB, 32GB, 16GB, 8GB
Error Detection:Corrects single-bit errors and
detects double-bit errors using ECC memory
ON-BOARD DEVICES
Chipset: Intel® C621
IPMI: Support for Intelligent Platform Management
Interface v2
oIPMI 2.0 with virtual media over LAN and KVM-
over-LAN support
oASPEED AST2500 BMC
SATA: 6x SATA3 (6 Gbps)
USB: 1x Quad USB3 headers (4 ports)
1x on-board USB3 header (2 ports)
Network Controllers:
o1x Intel® i350 Dual Gigabit Ethernet
oSupports 10BASE-T, 100BASE-TX, and 1000BASE-T,
RJ-45 output
Graphics: ASPEED AST2500 BMC; VGA
1920x1200@60Hz 32bpp
PWM: 7x PWM Fan Headers
INPUT / OUTPUT
USB: 6x USB 3.0 Ports
LAN:
o2x RJ-45 Gigabit Ethernet LAN ports
2x RJ-45 Shared IPMI LAN port
Serial:1x RS232 DB9 Serial Port
Display: 1x VGA Port 1920x1200@60Hz 32bpp
SYSTEM BIOS
BIOS Type:128 Mb SPI NOR Flash with INSYDE BIOS
BIOS Features:
Plug and Play (PnP)
TPM 2.0
PCI 2.2
ACPI 1.0 / 2.0
USB Keyboard Support
SMBIOS 2.3
UEFI
MANAGEMENT
AST2500 Baseband Management Controller: rKVM, System
Monitoring, Out of Band Management, On-board TPM 2.0
ENVIRONMENTALS
Operating Temperature: 0°C - 50°C
Storage Temperature: -40°C - 70°C
Operating Humidity: 8% - 90% Non-Condensing
Non-operating Humidity: 5% - 95% Non-Condensing

Section 7 / Technical Details
15
BAM8270 Manual
Technical Specifications
PROCESSORS
Intel® Xeon® Scalable Processors (3rd Generation)
Processor plugs into an FCLGA4189 socket
Available models:
Model Cores TDP Cache Size Base Processor
Frequency
Maximum Memory
Speed
6330 28 205 W 42 MB 2.00 GHz 2933 MHz
6338T 24 165 W 36 MB 2.10 GHz 3200 MHz
6336Y 24 185 W 36 MB 2.40 GHz 3200 MHz
6326 16 185 W 24 MB 2.90 GHz 3200 MHz
5318Y 24 165 W 36 MB 2.10 GHz 2933 MHz
5320T 20 150 W 30 MB 2.30 GHz 2933 MHz
5317 12 150 W 18 MB 3.00 GHz 2933 MHz
5315Y 8 140 W 12 MB 3.20 GHz 2933 MHz
4316 20 150 W 30 MB 2.30 GHz 2667 MHz
4314 16 135 W 24 MB 2.40 GHz 2667 MHz
4310 12 120 W 18 MB 2.10 GHz 2667 MHz
4310T 10 105 W 15 MB 2.30 GHz 2667 MHz
Additional CPU options available upon request. Contact Trenton Systems for more information.
SUPPORTED INTEL®PROCESSOR TECHNOLOGIES - TECHNOLOGIES VARY BETWEEN CPU MODELS

Section 7 / Technical Details
16
BAM8270 Manual
Intel Speed Select Technology – Core Power: Enables flexibility for workloads that benefit from
higher base frequency on a subset of the processor’s cores. While the max turbo frequency across the
cores remain constant across the cores, a subset of the cores can be assigned as to run at a higher base
frequency than specified, while the other cores run at lower base frequency.
Intel® Speed Select Technology – Turbo Frequency: Enables flexibility for workloads that benefit
from higher turbo frequency on a subset of the processor’s cores. While the base frequency remains
constant across the cores, a subset of the cores can be assigned to run at a higher turbo frequency than
specified, while the other cores run at lower turbo frequency.
Intel® Deep Learning Boost (Intel® DL Boost): A new set of embedded processor technologies
designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural
Network Instruction (VNNI) that significantly increases deep learning inference performance over
previous generations.
Intel® Speed Select Technology - Base Frequency: Enables users to increase guaranteed base
frequency on certain cores (high priority cores) in exchange for lower base frequency on remaining
cores (low priority cores). Improves overall performance by boosting frequency on critical cores.
Intel® Resource Director Technology (Intel® RDT): Intel® RDT brings new levels of visibility and
control over how shared resources such as last-level cache (LLC) and memory bandwidth are used by
applications, virtual machines (VMs), and containers.
Intel® Speed Shift Technology: Intel® Speed Shift Technology uses hardware-controlled P-states to
deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads,
such as web browsing, by allowing the processor to more quickly select its best operating frequency
and voltage for optimal performance and power efficiency.
Intel® Turbo Boost Technology 2.0: Intel® Turbo Boost Technology dynamically increases the
processor's frequency as needed by taking advantage of thermal and power headroom to give you a
burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading (Intel® HT): Intel® Hyper-Threading Technology (Intel® HT Technology)
delivers two processing threads per physical core. Highly threaded applications can get more work
done in parallel, completing tasks sooner.
Intel Virtualization Technology (Intel® VT-x): Intel® Virtualization Technology (VT-x) allows one
hardware platform to function as multiple “virtual” platforms. It offers improved manageability by
limiting downtime and maintaining productivity by isolating computing activities into separate
partitions.
Intel Virtualization Technology for Directed I/O (Intel® VT-d): Intel® Virtualization Technology for
Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i)
virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve

Section 7 / Technical Details
17
BAM8270 Manual
security and reliability of the systems and also improve performance of I/O devices in virtualized
environments.
Intel® VT-x with Extended Page Tables (EPT): Intel® VT-x with Extended Page Tables (EPT), also
known as Second Level Address Translation (SLAT), provides acceleration for memory intensive
virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the
memory and power overhead costs and increases battery life through hardware optimization of page
table management.
Intel® Transactional Synchronization Extensions: Intel® Transactional Synchronization Extensions
(Intel® TSX) are a set of instructions that add hardware transactional memory support to improve
performance of multi-threaded software.
Intel Trusted Execution Technology (Intel® TXT): Intel® Trusted Execution Technology for safer
computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the
digital office platform with security capabilities such as measured launch and protected execution. It
enables an environment where applications can run within their own space, protected from all other
software on the system.
Intel Turbo Boost Technology 2.0: Intel® Turbo Boost Technology dynamically increases the
processor's frequency as needed by taking advantage of thermal and power headroom to give you a
burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Advanced Encryption Standard New Instructions (Intel® AES-NI): Seven new instructions
available in the Skylake-S micro-architecture makes pervasive encryption in an IT environment possible
while enabling implementation that is faster and more affordable by providing advanced data
protection and greater hardware platform security.
Intel® Crypto Acceleration: Intel® Crypto Acceleration reduces the performance impact of pervasive
encryption and increases the performance of encryption-intensive workloads including SSL web serving,
5G infrastructure, and VPN/firewalls.
Intel® Total Memory Encryption (TME): Total Memory Encryption helps protect data against
exposure via physical attack on memory, such as cold-boot attacks.
SERIAL INTERCONNECT INTERFACE
PCI Express® 4.0, 3.0, 2.0, and 1.1 compatible.
SERIAL INTERCONNECT SPEEDS
PCI Express 4.0 - 16.0 GHz per lane
PCI Express 3.0 – 8.0GHz per lane

Section 7 / Technical Details
18
BAM8270 Manual
PCI Express 2.0 – 5.0GHz per lane
PCI Express 1.1 - 2.5GHz per lane
SERIAL INTERCONNECT CONFIGURATION
The BAM8270 comes with five 16-lane PCIe slots and six 8-lane PCIe slots. The following table displays
the configuration of slots within the system. All slots are PCIe 4.0 compatible:
Board Silkscreen
Label
CPU
BIOS Port
Board Silkscreen Reference
Designator
Lane Width
PCIE1
Socket 0
Port 5A
PE3
16
PCIE2
Port 4C
PE2C
8
PCIE3
Port 2A
PE1
16
PCIE4
Port 4A
PE2A
8
PCIE5
Port 1A
PE0
16
PCIE6
Socket 1
Port 5A
PE3A
8
PCIE7
Port 4A
PE2
16
PCIE8
Port 5C
PE3C
8
PCIE9
Port 2A
PE1
16
PCIE10
Port 1C
PE0C
8
PCIE11
Port 1A
PE0A
8
PLATFORM CONTROLLER HUB (PCH)
Intel® C621 Platform Controller Hub (Lewisburg)
MEMORY INTERFACE
The System BIOS automatically detects memory type, size, and speed. The BAM8270 features eight
memory channels of registered DDR4 with up to 2 DIMMs for select channels for a maximum of 24
DIMMs and 1.5TB of memory (across two CPUs). Each CPU socket supports up to twelve registered ECC
PC4-25600 or ECC PC4-23400 standard memory RDIMMs. The peak memory interface transfer rate per
channel is 3200MT/s when using PC4-25600 DIMMs and 2933MT/s when using PC4-23400 DIMMs.
INTERRUPTS
The motherboard is fully PC compatible with interrupt steering for PCI plug and play compatibility.

Section 7 / Technical Details
19
BAM8270 Manual
BIOS (FLASH)
The BAM8270 board uses an InsydeH20® UEFI BIOS from Insyde. The BIOS features built-in advanced
CMOS setup for system parameters, peripheral management for configuring on-board peripherals and
other system parameters. The BIOS resides in two 512Mb Macronix MX25L51245G SPI Serial EEPROMs.
Should you have a custom BIOS request please contact us for assistance.
ETHERNET INTERFACES
The BAM8270 supports four Ethernet interfaces using two physical ports.
•The interfaces are implemented using two Intel® i350 Dual Gigabit Ethernet Controllers.
•Each physical port is shared with the BMC via NC-SI (network controller sideband interface).
All interfaces support 10/100/1000Base-T Ethernet modes and are compliant with the IEEE 802.3
Specification.
The main components of the Ethernet interfaces are:
Intel® i350 controllers for 10/100/1000-Mb/s Ethernet.
Integrated RJ-45/Magnetics module connectors on the motherboard's I/O bracket for direct
connection to the network. The connectors require category 5 (CAT5) unshielded twisted-pair (UTP)
2-pair cables for a 100-Mb/s network connection or category3 (CAT3) or higher UTP 2-pair cables
for a 10-Mb/s network connection. Category 5e (CAT5e) or higher UTP 2-pair cables are
recommended for a 1000-Mb/s (Gigabit) network connection.
MAC addresses on the board are mapped to the interfaces following the table below:
MAC1
I350 Gbit – Top Port
MAC2
I350 Gbit – Bottom Port
MAC3
BMC – Top Port
MAC4
BMC – Bottom Port
Link status and activity LEDs on the I/O bracket for status indication (See Ethernet LEDs and
Connectors later in this chapter.)
SATA INTERFACES
There are 6 Serial ATA (SATA) interfaces available on the BAM8270 motherboard. All of the SATA
interfaces are driven with a built-in SATA controller from the Intel® C621 PCH. The board’s SATA ports
can support up to six independent storage devices such as hard disks, solid state drives, and CD/DVD-
RW devices at data rates up to 600 MB per second on each port. The board’s PCH features the Intel ®
Rapid Storage Systems functionality, which allows a third BIOS-selectable SATA controller configuration
that enables RAID array configurations capable of supporting RAID 0, 1, and 10 implementations.