TriStar M100LFG-TT-A User manual

OWNER’S MANUAL
M100LFG-TT-A
Tri-Star Technologies
Laser Wire Marker
Rev. 4.4, June 2014
Tri-Star Technologies
2201 Rosecrans Ave.
El Segundo, CA 90245
USA
Tel: [phone]
Fax: [phone]
www.tri-star-technologies.com

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any means, electronic, mechanical, photocopying, recording or otherwise, without written
permission from Tri-Star Technologies.
Contents
1. INTRODUCTION ...................................................................................................................... 4
2. SAFETY ..................................................................................................................................... 5
2.1 Hazards associated with laser equipment.............................................................................. 5
2.2 Hazards associated with wire cutting equipment .................................................................. 8
3. UV Laser Marking...................................................................................................................... 9
4. Equipment Description ............................................................................................................ 15
4.1 Laser ................................................................................................................................... 17
4.2 Laser Cooling System.......................................................................................................... 19
4.3 Beam Scanning System ....................................................................................................... 20
4.4 Wire Pulling Mechanism and Coiling Pan .......................................................................... 21
4.5 Operator Work Station......................................................................................................... 24
5. Wire Processing ........................................................................................................................ 25
6. Installation................................................................................................................................. 26
7. Maintenance and Troubleshooting........................................................................................... 27
8. Spare Parts List ........................................................................................................................ 28
9. Software User Guide................................................................................................................. 29
9.1 Setup.................................................................................................................................... 35
9.2 Default Font......................................................................................................................... 36
9.2 Offsets.................................................................................................................................. 37
9.3 Parameters ........................................................................................................................... 38
9.4 Scanner Settings .................................................................................................................. 39
9.5 Laser Parameters and Energy Offset Screens ................................................................ 41
9.6. Import/Export ..................................................................................................................... 43
9.7 Barcodes .............................................................................................................................. 45
9.8 About................................................................................................................................... 46
10. Marking parameters. .......................................................................................................... 48
10.1 Laser Power....................................................................................................................... 48
10.2 Scanner parameters............................................................................................................ 48
10.3 Font and character size. ..................................................................................................... 49
10.4 Laser beam footprint (dot size).......................................................................................... 51
10.5 Contrast and the wire types. .............................................................................................. 53

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11. Laser shipping instruction...................................................................................................... 54
12. Electrical Diagrams............................................................................................................ 57
13. List of Appendices........................................................................................................... 579

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1. INTRODUCTION
The M100LFG-TT-A is a computer-controlled, Ultra-Violet Laser Wire and Cable Marker
and Processor. The system marks the wire pulled from a spool then cuts and coils it to specified
lengths. Precise heavy-duty pulling mechanism consists of two working in sync stepping motors
and pneumatic cutter. The cut wire exits the machine and is automatically coiled for easy handling.
XY scanning beam technology allows marking with different fonts, sizes, orientations and print
densities. Standard software package has number of fonts for English language, barcode 3 of 9 and
some other symbols. Special symbols and foreign languages may be supported per user request.
The M100LFG-TT-A is fully programmable. The program routines include set up and
adjustments of pulling and cutting processes, laser and scanner parameters, marking patterns, etc.
When malfunctions occur, the process stops automatically and specified error message appears
on the screen.
A marking task consists of entering message, separate space between the messages and
cutting length for each wire, and also selecting a font, size and print density. The task is loaded
to a dedicated computer from keyboard, CD, memory stick, or through the Local Area Network.
Then it can be stored in the system memory and accessed any time needed.
These features enable the M100LFG-TT-A to automatically mark large batches of wires
for mass production. They also enable cost-effective production for individual harnesses without
expensive machine changes between kits.

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permission from Tri-Star Technologies.
2. SAFETY
This chapter briefly describes safety issues associated with M100LFG-TT-A Laser Wire
Marker and provides guidelines to operate the machine in a safe manner.
WARNING !!! Only qualified personnel should have access to the machine.
The user must be familiar with all technical aspects of the machine’s operation and have
a good knowledge of the operating software. Service and maintenance of M100LFG-TT-A
require proper technical training and understanding of potential hazards to which personnel may
be exposed. This manual is intended to be a supplement but not a replacement to this training.
2.1 Hazards associated with laser equipment
M100LFG-TT-A contains internal and external interlocks to assure safe operating
conditions. Normally the laser beam is completely enclosed within a cabinet. The laser shuts off
automatically if any door or cover is open.
Service work, performed by OEM, including installation and calibration procedures, may
require access to the laser and other optical components. The unenclosed beam should be
contained within a specified region by adequate control measures. Temporary control area may
be required to prevent personnel in the vicinity of the laser or its emitted beams from radiation
exposure. Consideration should be given to direct, reflected and scattered radiation.
Warning !!! M -100LFG-TT-A contains CLASS IV High Power Laser.
Direct beam contact or exposure to diffuse reflection is
hazardous to the eyes and skin and can also be a fire hazard
Warning !!! All installation and maintenance procedures should be
conducted by specially trained personnel
Warning !!! Always work in low power mode when dealing with open laser
radiation
Warning !!! Always wear laser safety glasses when working with an open
laser beam

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Laser Safety Labels and Their Locations:
Warning Logotype
LASERRADIATION
AVOID EYEOR SKINEXPOSURE
TO DIRECT OR SCATTERED RADI ATION
CLASS IV LASER PRODUCT
Max. Output Energy (mJ) 0.1
Max. Output Power (W) 2.1
Wavelength (nm) 355
CLASS IV LASER PRODUCT
Certification Label
ThisLaserMarker
manufacturedbyTri-StarTechnologies
2201RosecransAve,ElSegundo,CA90245
complieswith21CFRsubchapterJ
atthedateofmanufacturing
Interlock Label
Laserradiationwhenopenandinterlockdefeated
AVOIDEYEORSKINEXPOSURE
TODIRECTORSCATTEREDRADIATION

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The invisible ultra-violet pulses of coherent light emitted from this laser are capable of
inflicting permanent eye damage and total blindness. The beam can burn skin tissue and may
cause ignition of chemicals on some common materials. If at all possible, laser work should be
performed in a light tight enclosure with safety interlocks.
Electrical hazards (e.g. electric shock) may occur from contact with exposed power
supply or device control conductors operating at potentials of 50 V and above. These exposures
can occur during laser set-up or installation, maintenance and service, or any other time when
equipment protective covers are removed to allow access to active components.
Air contaminants may be generated when Class IV laser beams interacts with matter.
When the target irradiance reaches a given threshold (107W/cm2), target materials including
plastics, composites, metals and tissues may liberate airborne contaminants such as metallic
fumes and dust, metallic oxide fumes, chemical and gaseous vapours, etc. Some of the
compounds include: polycyclic aromatic hydrocarbons from poly-(methyl methacrylate) type
polymers, hydrogen cyanide and benzene from aromatic polyamide fibres, benzene from
polyvinyl chloride, fused silica from quartz, etc. Three major control measures to reduce the
concentration of air contaminants are exhaust ventilation, respiratory protection, and isolation of
the process.
To operate the M100LFG-TT-A in a safe manner:
•Permit only authorized personnel to operate the laser.
•Ensure that all personnel wear adequate eye protection during laser maintenance.
•Install appropriate signs and labels at site of laser operations.
•Use a continuing laser safety educational program for personnel operating the system
or others in the vicinity of the laser.
•Enclose the entire laser beam path when possible.
•Do not to operate without protective covers.
•Do not work with unenclosed laser beams at nominal mode.
•Do not exceed limit laser parameters specified in manual.
•Use beam shutters and laser output filters or beam traverse and elevation stops to
restrict beam interception on outdoor devices.
•Use dark, absorbing, diffuse fire-resistant targets and backstops where feasible. Avoid
exposure to scattered laser light reflected from optic elements, beam splitters,
entrance windows, beam analyzers, etc.
•Do not operate without grounding.
•Do not to introduce any changes into electric line or power supply.
•In the event of medical emergency, contact a doctor immediately.
REFERENCES:
1American National Standard for Safe Use of Lasers (ANSI Z136.1-1993)
2Laser Safety Guide, LIA, 1993
3LIA Guide to Non-beam Hazards Associated with Laser Use, LIA, 1999
4Guide for the Selection of Laser Eye Protection, LIA, 1996
5OSHA Instruction Pub 8-1.7
6IES 825, Radiation Safety of laser products, Equipment Classification,
Requirements and User’s Guide; Laser Safety Guide, Laser Institutes of America.

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permission from Tri-Star Technologies.
2.2 Hazards associated with wire cutting equipment
There are several potentially hazardous areas associated with cutting and stripping
equipment. These include exposed electrical current parts, the cutting and stripping blades area,
any moving parts of the machine such as wire feeding mechanisms, pulling rollers, swivel guide
and cutting head, and compressed air connections and nozzles.
It is dangerous to touch current-carrying parts. For service and maintenance purposes,
housings and covers may be removed only when the machine is stopped and main power is
switched off.
There is potential danger of being cut in the area around the blades. Always turn off the
machine before working on the cutting head or blades.
There is potential danger of being pinched in the area around the moving parts of the
machine. Always turn off the machine before working on the moving parts.
Only properly trained personnel familiar with all safety procedures are permitted to
operate the M100LFG-TT-A. Maintain and service the system.
Prevent unauthorized use of the system. It could be dangerous if improperly operated by
untrained personnel.

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permission from Tri-Star Technologies.
3. UV Laser Marking
Direct printing on wires and cables with Ultra-violet (UV) lasers has been extensively
tested and accepted within the aerospace industry both by OEMs and by the end users. It is
covered by a number of documents and standards issued by SAE International
(http://www.sae.org/ AIR5558, AIR5468B, AS5649) and reflected in the production
specification of large and small frame aircrafts for commercial, industrial, and military use. The
OEM list includes Boeing, Airbus, Lockheed Martin, Sikorsky, Gulfstream, Bombardier, Pilatus,
and many others. It is also used by the governmental agencies such as DOD, NASA, FAA, etc.
The end users employ UV laser marking machines during the scheduled maintenance and repair
procedures.
UV laser leaves permanent indelible high resolution marks on the substrate surface
without altering material properties. Some commonly used pigments such as Titanium Dioxide,
change color upon short but intensive UV exposure. The same effect occurs when those additives
are imbedded into the substrate. Ideally, laser radiation does not react with primary material and
freely goes through the substrate surface. However pigment particles distributed in the bulk
strongly absorb the beam. The absorbed energy modifies pigment structure and appearance
including the color. Due to the strong absorption most of the beam energy dissipates within a few
surface layers. Thus, only a small fraction of pigment particles (~ 1%) gets involved into the
transformation. Typical concentration of additives is about 2-3wt%, therefore total amount of
modified material in the substrate is extremely low (~0.03%). The depth of marking is inversely
proportional to the concentration of additives and usually does not exceed 25 m. Very short
laser pulses (~10ns) prevent regular heat exchange between the additives and surrounding
material and limit any structural and/or chemical modifications only to the pigment particles
themselves.
Titanium dioxide (TiO2)is a white color pigment added to the wire insulation materials
as well as to different formulations of paints, coatings, and plastics primarily for color changing
purposes. For industrial applications it is mostly produced as powder of white color submicron
particles or slurry. UV laser irradiation of substrates containing TiO2 causes distinct darkening of
exposed areas when originally white TiO2 particles turn blue/black.
The change of color can be explained by the transformation of laser irradiated TiO2
particles into the other Oxygen deficient forms of Titanium Oxides that have different colors
varying from nearly transparent off-white to a dark blue/black. This process is practically
irreversible and provides both chemical and mechanical permanency to the mark.
Only the wire insulations doped with TiO2can be reliably marked with UV laser. The
marking contrast depends both on laser intensity and concentration of TiO2 in the wire jacket.
The contrast does increase with laser intensity to a certain point when all pigment particles in the
surface layer turn black. On the other hand, low concentration of the TiO2 in the formulation
results in the poor marking contrast. In this case the legibility can be improved by making the
marking characters bigger and bolder. M100LFG-TT-A has a wide range of adjustability and is
capable of producing a legible marking even on the wires with relatively low concentration of
TiO2. Detailed description of the font optimization procedures is given in the chapter 10.
Table 1 specifies typical contrast levels achievable by direct UV laser printing on the
wire constructions commonly used in the aerospace industry. Fig.3.1-4 show examples of solid
and dot-matrix marking made by Tri-Star Technologies UV lasers on ETFE and PTFE insulated

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permission from Tri-Star Technologies.
wires. The marking stays intact even after extensive accelerated thermal aging. The darkening
zone extends 10-20um under the surface ensuring that marking cannot be altered or removed
without physically destroying the top layer of the insulation.
Table 1.1.UV Laser Markable Wires and Cables
Wire Specification
Color
Insulation
Marking
Contrast
BMS 13-48
White
Extruded XLETFE
Excellent
BMS 13-58
Gray
PTFE Tape wrap
Good
BMS 13-60
White
PTFE Tape wrap
Good
BMS 13-60
Green
PTFE Tape wrap
Marginal
M22759/05,06,08
White
Extruded PTFE
Poor
M22759/07
White
Extruded PTFE
Marginal
M22759/09,10,11,12,
20,21,22,23,28,29,30,31
White
Extruded TFE
Marginal
M22759/16,17,18,19
White
Extruded ETFE
Good
M22759/32,33,35,41,42,44,45,46
White
Extruded XLETFE
Very Good
M22759/34,43
White
Extruded XLETFE
Excellent
M22759/80,81,82,83,84,85,86,87,88,89,90
,91,92
White
PTFE Tape wrap
Good
M85485/5,6,9,10
Violet
Extruded XLETFE
Very
Good
M25038
White
PTFE Tape wrap
Poor
M27500 SP2S23
White
Extruded XLETFE
Very
Good
M27500/20 L3T08
White
Extruded PVDF
Excellent
M27500/20 P2G23
White
PVC/ NYLON
Very
Good
M27500/22 C1G23
White
PVC/GLASS/NYLON
Very
Good
M27500/22 SP5S23
White
Extruded XLETFE
Very
Good
M27500/24 C3G23
White
PVC/GLASS/NYLON
Very
Good
M81044
White
Extruded PVDF
Excellent

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Fig.3.1. UV Laser Marking on TiO2doped ETFE insulation before (bottom) and
after (top) accelerated thermal aging (168hours at 200 oC). Wire diameter is 1.15
mm, laser fluence is 1J/cm2. Magnification is 15x and 65x. Solid marking
corresponds to M100L masking system. Dot matrix marking corresponds to
M100LFG-TT-A scanning beam system.

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Fig.3.2. UV Laser marking penetration into TiO2doped ETFE insulation at 65x and
500x magnification. Wire diameter is 1.15 mm, visible marking depth is 15  m,
laser fluence is 1J/cm2.

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Fig.3.3. UV Laser Marking on TiO2doped PTFE insulation before (bottom) and
after (top) accelerated thermal aging (168hours at 310 oC). Wire diameter is 1.30
mm, laser fluence is 0.8 J/cm2.Magnification is 15x and 65x. Solid marking
corresponds to M100L masking system. Dot matrix marking corresponds to
M100LFG-TT-A scanning beam system.

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Fig.3.4. UV Laser marking penetration into TiO2doped PTFE insulation at 65x and
500x magnification. Wire diameter is 1.30 mm, visible marking depth is 8  m,
laser fluence is 0.8J/cm2

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4. Equipment Description
M100LFG-TT-A UV laser marking system (Fig.4.1) is a completely integrated tabletop
portable unit comprised of the following basic assemblies:
1. Laser
2. Controllers and electronics
3. Beam Scanning System
4. Wire Pulling Mechanism and Coiling Pan
5. Operator Work Station
6. Wire pre-feed (optional).
Warning !!! M -100LFG-TT-A contains a CLASS IV High Power Laser.
Direct beam contact or exposure to diffuse reflection is
hazardous to the eyes and skin and can also be a fire hazard
Fig4.1. M100LFG-TT-A
In proper operational condition, all laser radiation is completely enclosed inside the
cabinet in compliance with laser safety standards (ANSI Z136.1-1993). The system has a number
of internal locking devices, which automatically shut down the laser if the door is open.
The cabinet can be easily opened from any side for convenient access to all system
components during installation and maintenance procedures.

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permission from Tri-Star Technologies.
Warning !!! All installation and maintenance procedures should be
conducted by specially trained personnel.
Warning !!! Always work in low power mode when dealing with open laser
radiation.
Warning !!! Always wear laser safety glasses when working with
unenclosed laser beam.
The operator workstation consists of a laptop computer. It is connected to the main
cabinet through I/O ports.
The M100LFG-TT-A prints messages on a wide variety of wires. The message can
contain any symbols in any font in any language in any size and orientation. Consult factory for
specific applications. Standard system specification is listed below.
M100LFG-TT-A System Specifications
Laser wavelength 355 nm
Laser average power >1.2 W
Pulse length 5 nsec
Nominal repetition rate 50, 000 Hz
Dot size 30-70µm depending on the wire
Production rate up to 60 ft/min
Wire gauges 24 to 6
Input voltage 90-240, 50-60 Hz VAC
Physical dimensions 40 x 30 x 22” without cart
Weight 150lb
Ambient temperature 18-35C
Power Consumption <500W

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4.1 Laser and optical system.
Laser is mounted on the metal base plate on the frame inside the cabinet (Fig.4.2). The
connection cables run from the laser to the power supply and to PLC. The air-cooling heat
exchanger is attached to the bottom of the laser base plate. The heat exchanger has thermo-
conductive layer and fan to maintain the stable laser output.
Optical system is 3X telescope. It provides the laser beam shape is necessary for marking.
Laser Power supplies. Laser cables and controls.
Fig.4.2. Laser with power supply.
Laser
Optical system
Heat exchanger

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The laser is externally controlled by the PLC and scanner board. All laser parameters are
downloaded from the computer.
Warning !!! Do not press any buttons on the laser unless instructed by
authorized personnel.

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4.2 Laser Cooling System
Thermal management of the laser head is key to achieving
proper system performance, including cold-start performance. At normal
ambient operating temperature (25°C), the laser head generates
about 90 W of heat (but up to 160 W) that must be dissipated by the
heatsink to which the laser head is mounted. Heatsink (P/N EXPL-XP-HTSNKA)
includes a fan for use with the laser head. The auxiliary fan
attached to the heatsink is controlled through the laser. A temperature sensor
inside the housing continuously measures the base plate temperature,
and its feedback is part of an active servo-loop that is used to set the fan
speed.
The laser system provides the drive current for all of the active components
inside of the laser head, including the thermoelectric coolers (TEC), the
diode laser, the Q-switch driver, the microprocessors and non-volatile
memory. It also provides the communication and control interface for the
user.
The laser requires a 24 ±2 Vdc, 7 A electrical source. The laser system has
been certified to comply with the requirements of the RoHS Directive (the
Restriction of Hazardous Substances) of the European Union.

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4.3 Beam Scanning System
Scanning system consists of the Scanalone Board, Scanner, and focusing objective
(Fig.4.5). Scanner with objective are mounted on the front panel of the laser and do not require
any alignments. Scanner is powered by the separate +/-15VDC power supply. The board is
connected to the scanner, laser Q-SW control, PLC, 24VDC power supply, and via USB cable to
the computer. Optimized for a high speed marking, M100LFG software transforms the required
printing information into the set of command downloaded into the Scanalone Board that controls
both the scanner and the laser
Fig.4.5. Beam Scanning System.
Detailed description of Scanner and Scanalone Board is given in Appendixes C and D
respectively.
Scanner
Objective
Q-SW
control
Scanner
Control
s
24VDC
To PLC
ScanBusy
From PLC
New Message