TUYA WB2L User manual

WB2L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. V1.0.0
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1 Product Overview
WB2L is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a
highly integrated RF chip (BK7231T) and several peripheral components, with an
embedded Wi-Fi network protocol stack and robust library functions. WB2L is embedded
with a low-power Arm Cortex-M4 MCU, 2 MB flash memory, and 256 KB static
random-access memory (SRAM), and has extensive peripherals.
WB2L is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and
TCP/IP protocols. You can develop embedded Wi-Fi products as required.
1.1 Features
 Embedded low-power 32-bit CPU, which can also function as an application
processor
 Clock rate: 120 MHz
 Working voltage: 3.0 V to 3.6 V
 Peripherals: five GPIOs
 Wi-Fi connectivity
 802.11b/g/n
 Channels 1 to 14 at 2.4 GHz
 WPA and WPA2 security modes
 Up to +17.5 dBm output power in 802.11b mode
 STA, AP, and STA+AP working modes
 Smart and AP network configuration modes for Android and iOS devices
 Onboard PCB antenna with a gain of 1 dBi
 Working temperature: –20°C to +105°C
Tuya WB2L Wi-Fi Module
Version: 1.0.0 Date: 2019-11-07 No.: 0000000004
Product
Manual
Global Intelligent Platform

WB2L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. V1.0.0
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 BT
 Support Bluetooth (V4.0)
 Maximum output power + 7dBm EIRP
 Onboard PCB antenna with a gain of 1 dBi
1.2 Applications
 Intelligent building
 Smart household and home appliances
 Smart socket and light
 Industrial wireless control
 Baby monitor
 Network camera
 Intelligent bus

WB2L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. V1.0.0
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Change History
No. Date Change Description Version After Change
1 2019-11-07 This is the first release. 1.0.0

WB2L Datasheet
Hangzhou Tuya Information Technology Co., Ltd. V1.0.0
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Contents
1 Product Overview ......................................................................................................... 1
1.1 Features ......................................................................................................... 1
1.2 Applications .................................................................................................... 2
2 Module Interfaces ......................................................................................................... 6
2.1 Dimensions and Footprint .............................................................................. 6
2.2 Interface Pin Definition ................................................................................... 6
2.3 Test Pin Definition .......................................................................................... 7
3 Electrical Parameters ................................................................................................... 8
3.1 Absolute Electrical Parameters...................................................................... 8
3.2 Electrical Conditions ...................................................................................... 8
3.3 RF Current Consumption ............................................................................... 9
3.4 Working Current ............................................................................................. 9
4 RF Features ................................................................................................................ 10
4.1 Basic RF Features ....................................................................................... 10
4.2 TX Performance ........................................................................................... 10
4.3 RX Performance .......................................................................................... 11
5 Antenna Information ................................................................................................... 11
5.1 Antenna Type ............................................................................................... 11
5.2 Antenna Interference Reduction .................................................................. 11
6 Packaging Information and Production Instructions................................................... 11
6.1 Mechanical Dimensions ............................................................................... 11
6.2 Recommended PCB Layout ........................................................................ 13
6.3 Production Instructions ................................................................................ 14
6.4 Recommended Oven Temperature Curve ................................................... 16
6.5 Storage Conditions ...................................................................................... 17
7 MOQ and Packing Information ................................................................................... 18
8 Appendix: Statement ....................................................................... 错误!未定义书签。

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Figures
Figure 2-1 WB2L front and rear views.......................................................................... 6
Figure 6-1 WB2L mechanical dimensions .................................................................. 12
Figure 6-2 Side view ................................................................................................... 12
Figure 6-3 WB2L pins ................................................................................................. 13
Figure 6-4 WB2L pin header dimensions ................................................................... 13
Figure 6-5 Layout of the PCB to which WB2L applies ............................................... 14
Figure 6-6 HIC for WB2L ............................................................................................ 15
Figure 6-7 Oven temperature curve ........................................................................... 16
Tables
Table 2-1 WB2L interface pins ..................................................................................... 6
Table 2-2 WB2L test pins .............................................................................................. 7
Table 3-1 Absolute electrical parameters ..................................................................... 8
Table 3-2 Normal electrical conditions ......................................................................... 8
Table 3-3 Current consumption during constant transmission and receiving .............. 9
Table 3-4 WB2L working current .................................................................................. 9
Table 4-1 Basic RF features ....................................................................................... 10
Table 4-2 Performance during constant transmission ................................................ 10
Table 4-3 RX sensitivity .............................................................................................. 11

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2 Module Interfaces
2.1 Dimensions and Footprint
WB2L has two rows of pins with a 2±0.1 mm pin spacing.
The WB2L dimensions (H x W x D) are 2.8±0.15 mm x 17.3±0.35 mm x 15±0.35 mm.
Figure 2-1 shows the WB2L front and rear views.
Figure 2-1 WB2L front and rear views
2.2 Interface Pin Definition
Table 2-1 WB2L interface pins
Pin No. Symbol I/O Type Function
1 PWM2 I/O Hardware PWM pin, which is connected to
BT_ACTIVE/PWM2 (pin 24) on the internal IC
2 PWM1 I/O Hardware PWM pin, which is connected to
WIFI_ACTIVE/PWM1 (pin 23) on the internal IC
3 PWM0 I/O Hardware PWM pin, which is connected to CLK13M/PWM0
(pin 22) on the internal IC

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Pin No. Symbol I/O Type Function
4 PWM5 I/O Hardware PWM pin, which is connected to IRDA/PWM5 (pin
15) on the internal IC
5 PWM4 I/O Hardware PWM pin, which is connected to LPO_CLK/PWM4
(pin 16) on the internal IC
6 GND P Power supply reference ground pin
7 3V3 P Power supply pin (3.3 V)
Note: P indicates power supply pins, and I/O indicates input/output pins.
2.3 Test Pin Definition
Table 2-2 WB2L test pins
Pin No. Symbol I/O Type Function
N/A GND P Power supply reference ground pin
N/A RST Input Hardware reset pin (It is at a high level by
default and is active at a low level.)
N/A U1_TXD I/O UART1_TX, which is used as a user-side
serial interface pin
N/A U1_RXD I/O UART2_RX, which is used as a user-side
serial interface pin
N/A U2_TXD I/O Log TX pin
N/A U2_RXD I/O Log RX pin
N/A F_SCK I/O Clock pin when data is downloaded from
the flash memory
N/A F_CSN I/O Command enabling pin when data is
downloaded from the flash memory
N/A F_SI I/O Data input pin when data is downloaded
from the flash memory
N/A F_SO I/O Data output pin when data is downloaded
from the flash memory
Note: Test pins are not recommended.

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3 Electrical Parameters
3.1 Absolute Electrical Parameters
Table 3-1 Absolute electrical parameters
Parameter Description Minimum
Value
Maximum
Value
Unit
Ts Storage
temperature
–40 105 °C
VBAT Power supply
voltage
3.0 3.6 V
Static electricity voltage
(human body model)
Tamb = 25°C N/A 2 kV
Static electricity voltage
(machine model)
Tamb = 25°C N/A 0.5 kV
3.2 Electrical Conditions
Table 3-2 Normal electrical conditions
Parameter Description Minimum
Value
Typical
Value
Maximum
Value
Unit
Ta Working temperature –40 N/A 105 °C
VBAT Power supply voltage 3.0 3.3 3.6 V
VIL I/O low-level input –0.3 N/A VCC x 0.25 V
VIH I/O high-level input VCC x 0.75 N/A VCC V
VOL I/O low-level output N/A N/A VCC x 0.1 V
VOH I/O high-level output VCC x 0.8 N/A VCC V
Imax I/O drive current N/A N/A 12 mA

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3.3 RF Current Consumption
Table 3-3 Current consumption during constant transmission and receiving
Working
Status
Parameter
Typical
Value
Maximum
Value Unit
Mode Rate TX Power/
Receiving
TX
802.11b 11 Mbit/s +17 dBm 295 354 mA
802.11g 54 Mbit/s +13.5 dBm 266 300 mA
802.11n MCS7 +13 dBm 260 290 mA
RX
802.11b 11 Mbit/s Constant
receiving
98 100 mA
802.11g 54 Mbit/s Constant
receiving
98 100 mA
802.11n MCS7 Constant
receiving
98 100 mA
3.4 Working Current
Table 3-4 WB2L working current
Working
Mode
Working Status (Ta = 25°C) Average
Value
Maximum
Value
Unit
EZ The module is in EZ mode, and the Wi-Fi
indicator blinks quickly.
98 100 mA
AP The module is in AP mode, and the Wi-Fi
indicator blinks slowly.
53 125 mA
Connected The module is connected to the network,
and the Wi-Fi indicator is steady on.
60 170 mA
Disconnected The module is disconnected from the
network, and the Wi-Fi indicator is steady
off.
40 88 mA

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4 RF Features
4.1 Basic RF Features
Table 4-1 Basic RF features
Parameter Description
Frequency band BT:2.400 GHz to 2.4835 GHz
WIFI:2.412 GHz to 2.484 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14，Ch1-11 for
US/CA,Ch1-13 for EU/CN)
BT standard BT 4.0
Data transmission rate
802.11b: 1, 2, 5.5, or 11 (Mbit/s)
802.11g: 6, 9, 12, 18, 24, 36, 48, or 54 (Mbit/s)
802.11n: HT20 MCS0 to MCS7
802.11n: HT40 MCS0 to MCS7
Antenna type Onboard PCB antenna with a gain of 1 dBi
4.2 TX Performance
Table 4-2 Performance during constant transmission
Parameter Minimum
Value
Typical
Value
Maximum
Value
Unit
Average RF output power,
802.11b CCK mode
11 Mbit/s N/A 17 N/A dBm
Average RF output power,
802.11g OFDM mode
54 Mbit/s N/A 13.5 N/A dBm
Average RF output power,
802.11n OFDM mode
MCS7 N/A 12 N/A dBm
Frequency error –10 N/A +10 ppm

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4.3 RX Performance
Table 4-3 RX sensitivity
Parameter Minimum
Value
Typical
Value
Maximum
Value Unit
PER < 8%, 802.11b
DSSS mode 11 Mbit/s N/A –85 N/A dBm
PER < 10%, 802.11g
OFDM mode 54 Mbit/s N/A –72 N/A dBm
PER < 10%, 802.11n
OFDM mode MCS7 N/A –68 N/A dBm
5 Antenna Information
5.1 Antenna Type
WB2L uses an onboard PCB antenna or external antenna with an I-PEX connector.
5.2 Antenna Interference Reduction
To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB
antenna, it is recommended that the antenna be at least 15 mm away from other metal
parts.
To prevent adverse impact on the antenna radiation performance, avoid copper or traces
along the antenna area on the PCB.
For details about the onboard PCB antenna area on WB2L, see Figure 6-1.
6 Packaging Information and Production Instructions
6.1 Mechanical Dimensions
The PCB dimensions (H x W x D) are 2.8±0.15 mm x 17.3±0.35 mm x 15±0.35 mm.

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Figure 6-1 WB2L mechanical dimensions
Figure 6-2 Side view

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6.2 Recommended PCB Layout
Figure 6-3 WB2L pins
WB2L can be mounted onto a PCB by using an SMT placement machine or connected to
the PCB through a pin header. Figure 6-4 shows the pin header dimensions.
Figure 6-4 WB2L pin header dimensions

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Figure 6-5 Layout of the PCB to which WB2L applies
6.3 Production Instructions
1. Use an SMT placement machine to mount the stamp hole module that Tuya produces
onto the PCB within 24 hours after the module is unpacked and the firmware is
burned. If not, vacuum pack the module again. Bake the module before mounting it
onto the PCB.
(1) SMT placement equipment
i. Reflow soldering machine
ii. Automated optical inspection (AOI) equipment
iii. Nozzle with a 6 mm to 8 mm diameter
(2) Baking equipment
i. Cabinet oven
ii. Anti-static heat-resistant trays
iii. Anti-static heat-resistant gloves
2. Storage conditions for a delivered module are as follows:
(1) The moisture-proof bag is placed in an environment where the temperature is
below 30°C and the relative humidity is lower than 70%.

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(2) The shelf life of a dry-packaged product is six months from the date when the
product is packaged and sealed.
(3) The package contains a humidity indicator card (HIC).
Figure 6-6 HIC for WB2L
3. Bake a module based on HIC status as follows when you unpack the module
package:
(1) If the 30%, 40%, and 50% circles are blue, bake the module for 2 consecutive
hours.
(2) If the 30% circle is pink, bake the module for 4 consecutive hours.
(3) If the 30% and 40% circles are pink, bake the module for 6 consecutive hours.
(4) If the 30%, 40%, and 50% circles are pink, bake the module for 12 consecutive
hours.
4. Baking settings:
(1) Baking temperature: 125±5°C
(2) Alarm temperature: 130°C
(3) SMT placement ready temperature after natural cooling: < 36°C
(4) Number of drying times: 1
(5) Rebaking condition: The module is not soldered within 12 hours after baking.
5. Do not use SMT to process modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads are
exposed to the air for over three months, they will be oxidized severely and dry joints
or solder skips may occur. Tuya is not liable for such problems and consequences.
6. Before SMT placement, take electrostatic discharge (ESD) protective measures.
7. To reduce the reflow defect rate, draw 10% of the products for visual inspection and
AOI before first SMT placement to determine a proper oven temperature and
component placement method. Draw 5 to 10 modules every hour from subsequent

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batches for visual inspection and AOI.
6.4 Recommended Oven Temperature Curve
1. Perform SMT placement based on the following reflow oven temperature curve. The
highest temperature is 245°C.
Figure 6-7 Oven temperature curve

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6.5 Storage Conditions

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7 MOQ and Packing Information
MOQ and Packing Information
Product
Model MOQ Packing Method
Number of
Modules in Each
Reel Pack
Number of Reel
Packs in Each Box
WB2L 4000
Carrier tape
and reel
packing
1000 4

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8 Appendix: Statement
Federal Communications Commission (FCC) Declaration of Conformity
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
This device complies with Part 15 of the FCC Rules.Operation is subject to the following
two conditions: (1) This device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation.
Note: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules.These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
—Reorient or relocate the receiving antenna.
—Increase the separation between the equipment and receiver.
—Connect the equipment into an outlet on a circuit different from that to which
the receiver is connected.
—Consult the dealer or an experienced radio/TV technician for help.
Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
rolled environment. This equipment should be installed and operated with minimum
distance 20cm between the radiator and your body.
Important Note
This radio module must not installed to co-locate and operating simultaneously with other
radios in host system except in accordance with FCC multi-transmitter product procedures.
Additional testing and equipment authorization may be required to operating
simultaneously with other radio.
The availability of some specific channels and/or operational frequency bands are country
dependent and are firmware programmed at the factory to match the intended destination.

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The firmware setting is not accessible by the end user.
The host product manufacturer is responsible for compliance to any other FCC rules that
apply to the host not covered by the modular transmitter grant of certification. The final
host product still requires Part 15 Subpart B compliance testing with the modular
transmitter installed.
The end user manual shall include all required regulatory information/warning as shown in
this manual, including: This product must be installed and operated with a minimum
distance of 20 cm between the radiator and user body.
This device have got a FCC ID：2ANDL-WB2L.The final end product must be labeled in a
visible area with the following: “Contains Transmitter Module FCC ID:2ANDL-WB2L”
This device is intended only for OEM integrators under the following conditions:
1) The antenna must be installed such that 20cm is maintained between the antenna and
users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required.
However, the OEM integrator is still responsible for testing their end-product for any
additional compliance requirements required with this module installed.
Declaration of Conformity European notice
The device could be used with a separation distance of 20cm to the human body.
This product must not be disposed of as normal household waste, in
accordance with EU directive for waste electrical and electronic
equipment (WEEE- 2012/19/EU). Instead，it should be disposed of by
returning it to the point of sale, or to a municipal recycling collection point.
Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that
this module product is in compliance with essential requirements and
other relevant provisions of Directive 2014/53/EU,2011/65/EU.A copy of
the Declaration of conformity can be found at https://www.tuya.com